JPH0729818A - Substrate treating apparatus - Google Patents

Abstract

PURPOSE:To provide a substrate treating apparatus in which a fluid for treating the surface of a substrate can be fed uniformly onto the surface of the substrate through a simple structure. CONSTITUTION:A section 16 for conducting an introduction port 14 and a delivery port has first and second storage sections 18, 20 disposed in series along the flow of fluid flowing from the introduction port 14 toward the delivery port. Each of the storage sections 18, 20 has width enlarging toward the delivery port side. An interrupting section 22 is disposed oppositely to the introduction port 14 in the conducting section 16 in order to regulate the flow of fluid such that the fluid is not fed directly to the second storage section 20 from the introduction port 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for supplying a predetermined fluid to the surface of a substrate to perform a predetermined treatment on the surface of the substrate.

[0002]

2. Description of the Related Art In a semiconductor manufacturing process or a liquid crystal manufacturing process, a semiconductor wafer, a glass rectangular substrate for liquid crystal, a printed circuit board, etc. (hereinafter referred to as "fluid" collectively) are manufactured by a liquid or gas (hereinafter referred to as "fluid"). Hereinafter, a substrate processing apparatus for performing various kinds of processing on the surface of a "substrate") is used. This type of substrate processing apparatus is provided with a surface treatment nozzle. For example, various processing liquids for etching, development, peeling, etc. are supplied from the surface treatment nozzle to the surface of the substrate to perform a predetermined treatment, or air or Various gases such as nitrogen gas are supplied from the surface treatment nozzle to the surface of the substrate to perform a predetermined treatment.

By the way, in order to perform good substrate processing by the substrate processing apparatus, it is necessary to uniformly supply the fluid to the surface of the substrate. Therefore, conventionally, various substrate processing apparatuses equipped with nozzles capable of uniformly supplying a fluid have been known. For example, Japanese Unexamined Patent Publication No. 5-13320 discloses a developing device that performs a developing process on a semiconductor wafer that has been exposed with a predetermined pattern after being coated with a resist solution. In order to uniformly supply the developing solution to the entire surface of the wafer, the developing solution (substrate processing apparatus) stores the developing solution supplied from the developing solution supply pipe in the liquid storage portion and faces the surface of the semiconductor wafer closely. A large number (several hundreds) of pores (diameter of about 0.1-1.0 mm, pitch of 0.1-1.0 m) formed on the protrusions.
A nozzle for supplying the developing solution to the semiconductor wafer by bleeding the developing solution stored in the liquid storage portion is provided from about m).

[0004]

However, in the surface treatment nozzle having the above structure, it is necessary to form a large number of pores in the protruding portion, which is difficult to process. For example,
According to the embodiment described in the above publication, a diameter of 0.2
It is necessary to form 270 mm mm pores at a pitch of 0.6 mm.

Further, if a processing error occurs in the diameter and pitch of the pores, the fluid cannot be supplied uniformly, so it is necessary to form the pores without causing the processing error. It is difficult to form the pores while satisfying the above conditions in the production of the surface treatment nozzle, resulting in an increase in production cost.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus capable of uniformly supplying a fluid for processing a substrate surface to the substrate surface with a simple structure. .

[0007]

According to a first aspect of the present invention, a substrate is horizontally supported by a supporting unit, and a fluid is supplied to the surface of the substrate by moving the fluid supplying unit and the substrate relatively. In order to achieve the above-mentioned object, a substrate processing apparatus for performing a predetermined process, the fluid supply means, an inlet for introducing the fluid, and an outlet for ejecting the fluid toward the surface of the substrate. And a communication part that communicates so that the width increases from the introduction port to the discharge port and that supplies the fluid introduced through the introduction port to the discharge port. ing.

According to the second aspect of the present invention, the substrate is horizontally supported by the supporting means, and the fluid supplying means and the substrate are moved relatively to each other, thereby supplying a predetermined fluid to the surface of the substrate to perform a predetermined treatment. In order to achieve the above object, the substrate processing apparatus performs the fluid supply means, an inlet for introducing the fluid, an outlet for ejecting the fluid toward the substrate surface, and the inlet. The communication part that communicates with the discharge port and supplies the fluid introduced through the introduction port to the discharge port, and the fluid introduced into the introduction port are directly supplied to the discharge port. In order to limit the above, it is constituted by a surface treatment nozzle having a blocking section provided facing the introduction port in the communication section.

According to the third aspect of the present invention, the substrate is supported horizontally by the supporting means, and the fluid supplying means and the substrate are moved relatively to each other, thereby supplying a predetermined fluid to the surface of the substrate to perform a predetermined treatment. In order to achieve the above object, the substrate processing apparatus performs the fluid supply means from an inlet through which the fluid is introduced, an outlet through which the fluid is ejected toward the substrate surface, and the inlet. A communication unit that communicates with a plurality of storage units arranged in series toward the discharge port, and supplies the fluid introduced through the introduction port to the discharge port through the plurality of storage units in order. And a surface treatment nozzle having.

According to a fourth aspect of the present invention, the substrate is horizontally supported by the supporting means, and the fluid supplying means and the substrate are moved relatively to each other, thereby supplying a predetermined fluid to the surface of the substrate to perform a predetermined treatment. In order to achieve the above object, in the substrate processing apparatus, the fluid supply means introduces an inlet for the fluid, an outlet for ejecting the fluid toward the substrate surface, and an inlet for introducing the fluid. The fluid introduced through the introduction port is communicated through a plurality of reservoirs that are arranged in series toward the discharge port, and the widths of the respective reservoirs are wider as the discharge port advances from the introduction port to the discharge port. In order to restrict the communication part that supplies the discharge port via the plurality of storage parts in order and the fluid introduced into the introduction port from being directly supplied to the discharge port, Provided opposite to the inlet It is constituted by a surface treatment nozzle having a shut-off portion.

[0011]

According to the present invention, the fluid introduced through the introduction port is supplied to the discharge port through the communication portion whose width increases from the introduction port to the discharge port.

Further, the shutoff portion is provided in the communication portion so as to face the introduction port, and restricts the fluid introduced into the introduction port from being directly supplied to the discharge port.

Further, the communication part for communicating the introduction port and the discharge port is composed of a plurality of storage parts arranged in series from the introduction port to the discharge port, and the fluid introduced into the introduction port. Is supplied to the discharge port via the plurality of storage units in order.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, a substrate processing apparatus 1 according to an embodiment of the present invention includes a substrate supporting portion 5 capable of adsorbing and supporting a square glass substrate 3 by a vacuum chuck, and a substrate supported by the substrate supporting portion 5. 3 is provided with a surface treatment nozzle 2 (hereinafter simply referred to as a nozzle) that supplies a developing solution. The nozzle 2 is configured to be able to move along the upper surface of the substrate 3 in the longitudinal direction of the substrate 3 and supply the developing solution to the entire surface of the substrate.

FIG. 2 is an exploded perspective view showing an embodiment of the substrate processing apparatus according to the present invention. Further, FIG. 3 is a sectional view of the nozzle. In this nozzle 2, the substantially U-shaped packing member 4 has its open portion 4a facing downward,
The packing member 4 and the nozzle bodies 6 and 8 are integrated by being sandwiched by the nozzle bodies 6 and 8. Therefore, as shown in FIG. 3, a gap (that is, a discharge port) 10 is formed at the tip of the nozzle bodies 6 and 8 so that the fluid can be discharged toward the substrate (not shown).

Further, a pipe member 12 is provided in a substantially central portion on the outer side surface of the nozzle body 6, and the pipe member 12 is provided.
A fluid can be supplied to the nozzle body 6 through the inlet 14 at the tip of the. Here, the fluid introduced through the introduction port 14 passes through a communication portion 16 (details will be described below) formed in a state where the packing member 4 and the nozzle bodies 6 and 8 are integrated. Is supplied to the discharge port 10,
It is discharged onto the surface of the substrate (not shown).

The communication section 16 has first and second storage sections 18 and 20, and they are arranged in series along the flow of the fluid flowing from the introduction port 14 toward the discharge port 10. . As shown in FIG. 4, the first storage section 18 is
One is connected to the hollow part of the pipe member 12, and
The width W18 thereof advances from the introduction port 14 to the ejection port 10 side, that is, becomes wider in the direction of arrow P. Also,
The width W of the second storage section 20 is also similar to the above.
20 spreads as it goes to the discharge port 10 side (in the direction of arrow P).

Further, in this embodiment, as shown in FIG. 2, a cutoff portion 22 is provided in the communication portion 16 so as to face the inlet port 14, and the fluid introduced through the inlet port 14 directly The flow of the fluid is regulated so that it is not supplied to the discharge port 10 side.

Next, the operation of the surface treatment nozzle 2 configured as described above will be described focusing on the flow of fluid.
First, as shown by the arrow R1 in FIGS. 2 and 3, when the fluid is introduced into the nozzle 2 through the introduction port 14, it is stored in the first storage section 18. At this time, as described above, the first
Since the width W18 of the storage portion 18 of the fluid is widened toward the discharge port 10 side, as shown by the arrow R2 in FIG. 1, the fluid diffuses into the first storage portion 18 and the pressure of the fluid becomes uniform. To do.

Then, the fluid in the first reservoir 18 flows into the second reservoir 20 arranged on the discharge port 10 side (arrow R3). In this embodiment, by providing the blocking portion 22, it is possible to regulate the flow of the fluid that is about to flow directly into the second storage portion 20 at the shortest distance of the fluid from the introduction port 14. , An excellent rectifying effect can be obtained. This is because the pressure of the fluid that is about to flow directly into the second storage portion 20 in this manner has a relatively higher pressure than that of the fluid that has diffused into the storage portion 18, and When the fluid directly flows into the storage section 20, the pressure distribution of the fluid flowing into the storage section 20 becomes non-uniform, but by providing the blocking section 22, the flow of the fluid can be regulated and the pressure distribution becomes uniform. This is because it can be realized.

Further, the fluid flowing into the second storage portion 20 is stored in the storage portion 20, and then passes through the discharge port 10 as shown by an arrow R4 in FIG.
Is discharged toward. The storage section 20 also has the same shape as the first storage section 18,
The fluid that has flowed in diffuses throughout, and the pressure of the fluid becomes uniform.

As described above, in this embodiment, the communication section 1
By forming the storage portions 18 and 20 constituting 6 so that the widths W18 and W20 thereof widen as they move from the inlet 14 toward the outlet 10 (first pressure equalizing means),
Further, by providing the blocking portion 22 in the communicating portion 16 so as to face the inlet 14 (second pressure equalizing means), a plurality of storage portions 18, 20 are further provided in series (third pressure equalizing means). ), The flow is rectified in the communication part 16 and the discharge port 1
The discharge pressure of the fluid from 0 is kept constant. Therefore, the fluid can be uniformly discharged onto the substrate surface with a simple configuration.

In the above embodiment, the first to third pressure equalizing means are combined to rectify the fluid, but the individual means may be used for equalizing, or they may be equalized. You may combine the conversion means arbitrarily.

In the present embodiment, the nozzle has been described as moving on the upper surface of the substrate to supply the developing solution. However, the invention is not limited to this. For example, the nozzle may be fixed and the substrate may be moved. Can be moved, that is, the nozzle and the substrate can be moved relative to each other so that the developing solution is spread over the entire surface of the substrate.

Further, the processing substrate is not limited to the rectangular glass substrate, and at least one of the nozzle and the wafer is relatively rotated with the center of the wafer as a rotation axis while discharging the developing solution from the nozzle of this embodiment. If the developing solution is spread over the entire wafer surface, it is possible to supply the developing solution to the circular semiconductor wafer surface.

The nozzle of the present invention can be used not only for supplying a developing solution but also for coating a photoresist solution, supplying a cleaning solution, and the like, and is not limited to a liquid, such as ozone. It can also be used to supply gas.

[0027]

As described above, according to the present invention, the width of the fluid introduced through the following three configurations, that is, the width of the fluid introduced from the inlet is expanded as it goes from the inlet to the outlet. A configuration (first configuration) for supplying the fluid to the discharge port side through the communicating portion, a fluid provided in the communication portion facing the introduction port, and introduced into the introduction port is directly supplied to the discharge port. The shutoff unit (second configuration) that restricts the flow rate and the communication unit (third configuration) that includes a plurality of storage units that are arranged in series from the inlet port to the discharge port, either alone or in combination. Since the surface treatment nozzle is configured, the fluid can be uniformly supplied to the substrate surface with a simple configuration.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of a substrate processing apparatus according to the present invention.

FIG. 2 is an exploded perspective view showing an embodiment of a nozzle.

FIG. 3 is a sectional view of a nozzle.

FIG. 4 is a cross-sectional view of a nozzle body showing a shape of a first storage portion.

FIG. 5 is a cross-sectional view of a nozzle body showing a shape of a second storage portion.

[Explanation of symbols]

 10 Discharge port 14 Inlet port 16 Communication part 18, 20 Storage part

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01L 21/304 341 N

Claims (4)

[Claims] 1. A substrate processing apparatus for horizontally supporting a substrate by a supporting means and relatively moving a fluid supply means and the substrate to supply a predetermined fluid to the surface of the substrate to perform a predetermined processing. The fluid supply means is configured to communicate with an introduction port through which the fluid is introduced, a discharge port that discharges the fluid toward the substrate surface, and a width that increases from the introduction port toward the discharge port. A substrate processing apparatus, comprising: a surface treatment nozzle having a communication part that supplies the fluid introduced through the introduction port to the discharge port. 2. A substrate processing apparatus for horizontally supporting a substrate by a supporting means and relatively moving a fluid supply means and the substrate to supply a predetermined fluid to the surface of the substrate to perform a predetermined processing. , The fluid supply means, an introduction port into which the fluid is introduced, a discharge port that discharges the fluid toward the substrate surface, the introduction port and the discharge port communicate with each other, and through the introduction port A communication part for supplying the introduced fluid to the discharge port, and a restricting part for directly supplying the fluid introduced into the introduction port to the discharge port, to the introduction port in the communication part. A substrate processing apparatus comprising: a surface processing nozzle having a blocking portion provided facing each other. 3. A substrate processing apparatus for horizontally supporting a substrate by a supporting means and moving a fluid supplying means and the substrate relatively to supply a predetermined fluid to the surface of the substrate to perform a predetermined processing. The fluid supply means includes an inlet for introducing the fluid, an outlet for ejecting the fluid toward the substrate surface, and a plurality of reservoirs arranged in series from the inlet to the outlet. A surface treatment nozzle that communicates with the discharge port and supplies the fluid introduced through the introduction port to the discharge port through the plurality of storage units in order. Processing equipment. 4. A substrate processing apparatus for horizontally supporting a substrate by a supporting means and moving a fluid supply means and the substrate relatively to supply a predetermined fluid to the surface of the substrate to perform a predetermined processing. The fluid supply means is provided with an introduction port through which the fluid is introduced, a discharge port through which the fluid is discharged toward the substrate surface, and a series arranged from the introduction port toward the discharge port. Communication is performed through a plurality of reservoirs whose width increases from the inlet to the outlet,
A communication unit that supplies the fluid introduced into the introduction port to the discharge port through the plurality of storage units in order, and the fluid introduced into the introduction port is directly supplied to the discharge port. In order to limit the above, a substrate processing apparatus having a surface treatment nozzle having a blocking section provided facing the introduction port in the communication section.