JPS63226928A - Semiconductor manufacturing system - Google Patents

Abstract

PURPOSE:To obtain a system which realizes the stable mixed properties by a simple structure and without shifting a nozzle when two or more kinds of chemical liquids are mixed and dosed, by a method wherein two or more pipes are connected to the nozzle for dosing the chemical liquids so that the two or more kinds of chemical liquids can be dosed. CONSTITUTION:Two or more pipes are connected to a nozzle 1, for dosing a chemical liquid, used to dose the chemical liquid to the surface of a semiconductor wafer 3 so that two or more kinds of chemical liquids can be dosed. For example, a nozzle 1, for dosing a chemical liquid, used to dose the chemical liquid to a wafer 3 is installed in the center of the wafer 3; valves 2a-2d are installed at pipes to feed different chemical liquids A-D so that they can be actuated independently of one another; individual pipes are connected to the nozzle 1 after the discharge sides of the valves 2a-2d have been collected into one. By this setup, it is possible to dose two or more kinds of chemical liquids by using the simple nozzle of single structure without shifting the nozzle and by only increasing the number of pipes. In addition, when the two or more kinds of chemical liquids are mixed and dosed, the stable mixed properties can be obtained.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to semiconductor manufacturing equipment, particularly in surface treatment steps such as applying 7-photoresist to wafers and developing after exposure.
The present invention relates to an improvement of a chemical liquid discharge nozzle used in a chemical liquid supply line.

[Conventional technology]

In order to manufacture semiconductor devices such as ICs and LSIs, a scrubber is used to clean the wafer, a coater is used to apply photoresist to the wafer after cleaning, and a circuit pattern is transferred onto the wafer coated with photoresist. Various semiconductor manufacturing equipment such as an aligner for transferring the circuit pattern and a developer for developing the wafer onto which the circuit pattern has been transferred are used.

In the coater, the wafer carried by a carriage (wafer transport device) is adsorbed and held by a chuck, and then photoresist is dropped onto the wafer from a supply nozzle, the chuck is rotated by a rotating shaft, and the wafer is placed on the wafer. 7 Otoresist is applied uniformly over the surface.

Figure 2 shows a conventional semiconductor device fjt of this type.
In the figure, (1a) and (1b) are nozzles for discharging chemical liquid,
enemy).

(2b) is a chemical solution A in each of the above nozzles (1a) and (1b);
Pulp installed in the pipe that supplies B, (8)
is a wafer.

Conventional semiconductor manufacturing equipment is configured as described above, and chemical solution A
When using nozzle (1b)? 'Move the wafer (8) manually or automatically to the center and open the valve (2a). In addition, when using chemical solution B, nozzle (1a)
in the same way to the center of the wafer (8), and remove the pulp (
Open 2b).

[Problem that the invention seeks to solve]

Conventional semiconductor manufacturing equipment as described above uses one dedicated nozzle for one chemical solution, so it is necessary to move the nozzle each time the type of chemical solution changes, resulting in time loss and high costs. There are problems such as.

Therefore, some proposals have been made to configure a plurality of channels within a single nozzle, as shown in Japanese Patent Application Laid-open No. 60-210843, but the number of chemical solutions Since a flow path must be formed at the same time, the nozzle structure becomes complicated and costs increase, and when discharging a mixture of multiple chemical solutions, it is not always possible to obtain favorable mixing properties. be.

The present invention was made to solve these problems, and is a semiconductor manufacturing device that has a simple structure, does not move the nozzle, and can obtain stable mixing properties when mixing and discharging a plurality of chemical solutions. The purpose is to obtain.

[Means for solving problems]

The semiconductor manufacturing apparatus according to the present invention is capable of discharging a plurality of chemical solutions by connecting a plurality of pipes to a chemical solution discharge nozzle.

[Effect]

In this invention, since a plurality of pipes are connected to the chemical liquid discharge nozzle, different chemical liquids from each pipe are discharged from a single nozzle. Therefore, there is no need to complicate the nozzle structure according to the number of chemical solutions, and when multiple chemical solutions are mixed and discharged, each chemical solution is mixed on the upstream side of the nozzle, so the mixing properties are stabilized. be able to.

〔Example〕

FIG. 1 shows a semiconductor manufacturing apparatus according to an embodiment of the present invention, and in the figure, the same reference numerals as in FIG. 2 indicate the same or corresponding parts. (1) is a nozzle for discharging a chemical solution onto a wafer (8), and is placed at the center of the wafer (8). (2a), (2b), (2c), and (2a) are different. The pipes for supplying the chemical solutions A, B, e, and D are connected to the next pulp, so that they operate independently of each other, and each of the pipes is connected to the pulp (2a), (2b).

(2c) and (2d) are combined into one on the outlet side and connected to the nozzle (1).

In the semiconductor manufacturing apparatus configured as described above, chemical solutions A, B, 1. ! , D, the corresponding valves (2a), (2b), (2c),
Open (2d).

Then, the chemical solutions A, B, (?, D) are discharged from the nozzle (1) onto the wafer (8).

For example, when mixing and discharging chemical solutions A and B,
When pulps (2a) and (2b) are opened at the same time, both chemical solutions A and B meet on the outlet side of valves (2a) and (2b) and are mixed.Then, they are sent to nozzle (1) and wafer (8). )
It is discharged to n. Therefore, stable mixing properties can be obtained.

In the above example, four chemical solutions A, B, and U are used.

Although case D has been shown, it can be similarly applied to cases below or above n, and there is no need to change the structure of the nozzle (1) at all.

〔Effect of the invention〕

As explained above, this invention connects multiple pipes to the chemical liquid discharge nozzle to enable the discharge of multiple chemical liquids, so there is no need to move the nozzle, and the number of pipes can be increased or decreased. Multiple chemical solutions can be ejected using a simple nozzle with a single structure. Further, when a plurality of chemical solutions are mixed and discharged, there are effects such as stable mixing properties can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of a semiconductor manufacturing apparatus showing an embodiment of the present invention, and FIG. 2 is a diagram corresponding to FIG. 1 showing a conventional semiconductor manufacturing apparatus. (1) Two nozzles (2a), (2b), (2c), (2a): Valve (
8): Wafer In each figure, the same reference numerals indicate the same or corresponding parts.

Claims (2)

[Claims] (1) A semiconductor manufacturing device equipped with a chemical liquid discharge nozzle that discharges a chemical liquid onto a semiconductor wafer surface, characterized in that a plurality of pipes are connected to the chemical liquid discharge nozzle to enable discharge of a plurality of chemical liquids. Semiconductor manufacturing equipment. (2) The semiconductor manufacturing apparatus according to claim 1, wherein each pipe has a pulp that operates independently of each other.