JPH0729585Y2 - EMI countermeasure circuit board connection structure - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a connection structure for an EMI countermeasure circuit board, and in particular, connects EMI countermeasure circuit boards arranged at intervals in the plane direction with a connector. EMI countermeasure circuit board connection structure

[Prior art]

The applicant of the present application has proposed a circuit board for EMI countermeasures having a new structure based on a new idea in Japanese Patent Laid-Open No. 62-213192. In this circuit board for EMI measures, an insulating resin layer is formed so as to cover the conductive pattern on the insulating substrate, and another conductive layer is formed thereon by, for example, printing copper ink, and the other conductive layer is formed. It is connected to the ground pattern included in the conductive pattern.

[Problems to be solved by the device]

If you use the above-mentioned circuit board for EMI countermeasures, you can considerably suppress the EMI noise components generated in the board itself, but when connecting the boards with connectors, the EMI of the metal covers of the male connector and the female connector If the connection to the conductive layer of the countermeasure circuit board is incomplete, start from there.
The EMI component sometimes leaked. That is, unless the metal covers of the two connectors are completely connected to the conductive layers of the respective EMI countermeasure circuit boards, the conductive layers of the respective EMI countermeasure circuit boards, that is, the ground potentials are different, and current flows according to the potential difference. , So that the EMI component is radiated at the connector part. Therefore, in this case, even if the two boards to be connected are EMI countermeasure circuit boards, EMI could not be sufficiently reduced.

Therefore, a main object of the present invention is to provide a connection structure of an EMI countermeasure circuit board which can sufficiently reduce EMI even when connected by a connector.

[Means for Solving the Problems]

Briefly, the present invention provides a first conductive pattern formed on at least one main surface thereof, a first insulating layer formed on the first conductive pattern, and a first insulating layer formed on the first insulating pattern. A first EMI countermeasure circuit board including a first conductive layer formed and connected to a ground portion included in the first conductive pattern; a second conductive pattern formed on at least one main surface thereof; A second insulating layer formed on the second conductive pattern and a second insulating layer formed on the second insulating layer;
Second connected to the ground part included in the conductive pattern of
A second EMI countermeasure circuit board including a conductive layer, a male connector having connector pins fixed to one main surface of the first EMI countermeasure circuit board and connected to an appropriate first conductive pattern, A first metal cover whose base end is connected to the first conductive layer and whose open end is formed so as to cover the side surface of the male connector, and which is fixed on one main surface of the second EMI countermeasure circuit board. A female connector having connector terminals connected to an appropriate second conductive pattern and receiving pins of the male connector, covering a side surface of the female connector and forming a first surface on the side surface.
A second metal cover to which the open end of the metal cover is covered and connected, and a spring on the second conductive layer formed under the second metal cover and formed on the second circuit board for EMI countermeasures. It is a connection structure of an EMI countermeasure circuit board including a plurality of comb-shaped terminals for pressure contact.

[Action]

Since the comb-shaped terminal is pressed against the conductive layer of the other circuit board for EMI countermeasures by its own spring property, the electrical connection between the metal cover of the female connector and the conductive layer becomes stable. Therefore, the conductive layers of the two EMI countermeasure circuit boards are reliably connected through the first metal cover of the male connector and the second metal cover of the female connector. Therefore, the conductive layers of both EMI countermeasure circuit boards, that is, the ground, have the same potential. Therefore, the radiation of the EMI component due to the different ground potentials of the two EMI countermeasure circuit boards is prevented.

[Effect of device]

According to this invention, since the connection between the metal cover of the connector and the ground is stable and reliable, the conductive layer of each EMI-preventing circuit board, that is, the ground potential can be made the same potential. It is possible to prevent the EMI component generated on the circuit board from being radiated through the connector portion.

The above-mentioned objects, other objects, features and advantages of the present invention will become more apparent from the detailed description of the embodiments below with reference to the drawings.

〔Example〕

As shown in FIG. 1, the two EMI countermeasure circuit boards (hereinafter, simply referred to as “boards”) 12 and 14 are arranged at regular intervals in the plane direction. It should be noted that in this embodiment, the substrates 12 and 14 described above are disclosed in Japanese Patent Laid-Open No.
Uses the circuit board for EMI measures disclosed in No. 2. Therefore, although the detailed description of the structure of the substrate itself is omitted, the first conductive layer 16 constituting the circuit pattern is formed on both sides of each of the substrates 12 and 14, and an appropriate shape is formed on the first conductive layer 16. And an insulating resin layer 18 formed on the insulating resin layer 18, and a second conductive layer 20 formed on the insulating resin layer 18 substantially on the front surface and made of, for example, copper ink.

A male connector 22 is fixed to one substrate 12, and its connector pin 22a is connected to an appropriate circuit pattern included in the first conductive layer 16 although not shown. This male connector
The connector pin 22a of 22 is covered with a metal cover 24. The upper end of the metal cover 24 is bent into an "L" shape, and a part thereof is connected to the second conductive layer 20, that is, the ground. The curved portion 24a at the bottom of the metal cover 24 is a female connector 2 described later.
6 extends so as to be in contact with the upper portion of the metal cover 30 and is provided with elasticity so as to be pressed against the side surface of the metal cover 30.

A female connector 26 is fixed to the other substrate 14, and its connector terminals 26a are connected to appropriate circuit patterns (not shown) included in the first conductive layer 16. Board 14
A solder layer 28 is formed in the vicinity of the female connector 26 on the second conductive layer 20 on the surface facing the substrate 12.

The female connector 26 includes a metal cover 30 that surrounds the above-mentioned connector terminals 26a, and comb-shaped terminals 30a, 30a, ... As shown in FIG. Each comb-shaped terminal 30a is curved outward as shown in FIG. 1 so that it has spring properties. The tip of the comb-shaped terminal 30a is pressed onto the solder layer 28 by the spring force. Therefore, the comb-shaped terminal 30a and the solder layer 28 are reliably connected.
That is, the solder layer 28 has elasticity because it is made of a relatively soft solder, and in combination with the spring property of the comb-shaped terminal 30a,
The connection between the comb-shaped terminal 30a and the solder layer 28, that is, the second conductive layer 20 is stable. Therefore, the second conductive layer 20 of the substrate 12
That is, the ground and the ground of the substrate 14 are completely connected through the metal covers 24 and 30 and the solder layer 28. Therefore, the ground potentials of both substrates 12 and 14 become the same potential, and therefore the radiation of the EMI component due to the potential difference between the grounds is suppressed.

It should be noted that if the spacing between the comb-shaped terminals 28a is too large, the EMI component may leak from that portion, so an appropriate spacing must be set depending on the frequency.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing an embodiment of the present invention. FIG. 2 is an illustrative view showing a comb-shaped terminal. In the figure, 12 and 14 are substrates, 16 is a first conductive layer, 18
Is an insulating resin layer, 20 is a second conductive layer, 22 is a male connector,
24 is the metal cover of the male connector, 26 is the female connector, 28
Is a solder layer, 30 is a metal cover of a female connector, and 30a is a comb terminal.

Claims (2)

[Scope of utility model registration request] 1. A first conductive pattern formed on at least one main surface thereof, a first insulating layer formed on the first conductive pattern, and formed on the first insulating layer. A first EMI countermeasure circuit board including a first conductive layer connected to a ground portion included in the first conductive pattern; a second conductive pattern formed on at least one main surface thereof; A second insulating layer formed on the second conductive pattern and a second conductive layer formed on the second insulating layer and connected to a ground portion included in the second conductive pattern. A second EMI countermeasure circuit board; a male connector having connector pins fixed to the one main surface of the first EMI countermeasure circuit board and connected to an appropriate first conductive pattern; Connected to the first conductive layer and A first metal cover whose end is formed to cover a side surface of the male connector, fixed to one main surface of the second EMI countermeasure circuit board and connected to an appropriate second conductive pattern A female connector having connector terminals for receiving the pins of the male connector; covering a side surface of the female connector;
A second metal cover, which is connected to cover the open end of the metal cover, and a second metal cover formed under the second metal cover.
A connection structure for an EMI countermeasure circuit board, comprising a plurality of comb-shaped terminals for spring-pressure contact with the second conductive layer formed on the EMI countermeasure circuit board. 2. The circuit board for EMI countermeasure according to claim 1, wherein a solder layer is further formed on the second conductive layer, and the plurality of comb-shaped terminals are pressed against the solder layer by spring pressure. Connection structure.