JPH07294949A - Processing method for electrode terminal - Google Patents

Abstract

PURPOSE:To reduce the whole of processing stages by removing short-circuit electrodes by laser beam machining to minimize the stage of machining and omitting the washing stage. CONSTITUTION:With respect to a liquid crystal display device D obtained from a large-area liquid crystal panel by division, an edge 25 of a glass plate G2 where a short-circuit electrode 22 is formed is chamfered by grinding. Since a glass end face 24 is accurately broken differently from break of an ear part having a narrow width, grinding of the glass end face 24 and a corner 26 is unnecessary and it is sufficient if only the edge 25 is ground, and dry grinding can be adopted. Thereafter, an area (q) on the outside (the side including the short-circuit electrode 22) of a line 23 traversing the end parts of electrode terminals 21 is irradiated with ArF laser. Thus, only the electrode 22 on the area (q) is removed by the decomposition and peeling action obtained by excimer laser irradiation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing method for forming and finishing electrode terminals by removing short-circuit electrodes which short-circuit each electrode terminal of a liquid crystal display.

[0002]

2. Description of the Related Art FIGS. 1 and 2 are a plan view and a side view of a liquid crystal display D divided into individual units from a large area liquid crystal panel. In this liquid crystal display D, two glass plates G ₁ and G ₂ are bonded at a predetermined gap with a sealant V that also serves as a spacer, and a liquid crystal L is sealed in the gap. Transistors 20 forming individual liquid crystal elements are formed on the glass plate G ₂ on the lower surface, and each of the transistors 20 is formed on the protruding portion (ear) Q of the glass plate G ₂ for external connection. The electrode terminals 21 are led out, and the electrode terminals 21 are short-circuited with each other by the short-circuit electrode 22 so that the transistor is not broken down by static electricity. At the time of use, a break is made along the line 23 in order to cut off the portion of the ear where the short-circuit electrode 22 is formed over the width W. The conventional processing method will be described with reference to FIG.

With respect to the liquid crystal display D shown in FIG. 3 (A), as shown in FIG. 3 (B), a scribe line 23 is engraved so as to cross the end of each electrode terminal 21, and
As shown in FIG. 6C, the portion of the ear where the short circuit electrode 22 is formed by cutting along the scribe line 23 is cut off. Next, as shown in FIG. 3D, the end face 24 of the glass plate G ₂ on which the electrode terminals 21 are formed is polished, and the edge 25 of the glass plate G _{2 on} the surface on which the electrode terminals 21 are formed is chamfered. (Chamfering of thread), and corner polishing is performed on the corner 26. The end face 24 is grounded because the edge width W is small, and thus the break may not be performed accurately. A wet polishing machine is used because a large amount of polishing has a bad thermal effect.

[0004]

As described above, in the conventional electrode terminal treatment, the scribe line is inserted by the scriber, the ear is removed by the break machine, and the polishing is then performed by the wet polisher. Many labor-intensive steps were required, such as cleaning the abrasive particles, glass dust, and other dust generated by this processing with pure water, and finally performing dry finishing.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an electrode terminal treatment method which can omit the machining process of scribing and breaking and simplify the processing.

[0006]

The first invention is a method of treating electrode terminals of a liquid crystal display obtained by dividing a liquid crystal panel having a large area. The edge of the glass edge of the surface where the short-circuit electrode that short-circuits the electrode terminals is formed is thread chamfered with a dry grinder instead of the method of treating the electrode terminal by cutting off the edge. After the processing, the short-circuit electrode is irradiated with a laser, and the short-circuit electrode is removed by the decomposition and peeling action of the short-circuit electrode to complete the treatment of the electrode terminal.

According to the second aspect of the present invention, in a method of treating electrode terminals of a liquid crystal display obtained by dividing a large-area liquid crystal panel, a glass end portion of a short-circuiting electrode which short-circuits the electrode terminals is cut off. In place of the electrode terminal treatment method, the short-circuit electrode that short-circuits the electrode terminals is irradiated with a laser to remove the short-circuit electrode by the decomposition and peeling action, and the heat that the laser has It is characterized in that the processing of the electrode terminals is completed by melting the edge portion of the glass on the surface where the short-circuit electrode is formed by energy and performing the thread chamfering finish.

[0008]

According to the first aspect of the present invention, when the short-circuit electrode is irradiated with an excimer laser having a wavelength of 193 nm at the location of the short-circuit electrode, for example, by using ArF discharge gas, only the short-circuit electrode is separated and separated. Since it is removed, the step of cutting off the glass of the electrode portion, which is required in the conventional processing method, can be omitted.

According to the second aspect of the present invention, for example, when a discharge gas of KrF is used and an excimer laser having a wavelength of 248 nm is irradiated, the short-circuit electrode is removed by the decomposition and peeling action, and the wavelength is long. (From infrared)
The edge of the end portion is melted by the heat processing effect of the strong laser irradiation, and the same effect as that of the thread chamfering is obtained, so that mechanical edge processing can be omitted.

[0010]

EXAMPLE FIG. 4 shows a laser processing machine (manufactured by Sumitomo Heavy Industries, Ltd., model number IN) suitable for carrying out the processing method of the present invention.
It is a control block diagram of DEX200). Reference numeral 1 is a centralized controller that controls the machine as a whole. Reference numeral 2 denotes a laser oscillator, which can selectively supply the discharge gas in a combination of Ar-F or Kr-F by switching the cock of the external cylinder. The laser beam from the laser oscillator 2 has an elliptical cross section, and the mask module 3 is provided to obtain a slit-shaped laser beam from the laser beam, which is located in the laser optical path from the laser oscillator 2. . Reference numeral 4 denotes a mirror, which directs the laser light in the horizontal direction that has passed through the mask module 3 toward a work (liquid crystal display) 6 on the XY table 5. An image lens is provided in the optical path between the mirror 4 and the work 6 to adjust the focus of the slit-shaped beam so that the beam has a desired processing beam size. 8 is an image lens 7
Is a Z-axis moving mechanism for vertically moving. 9
Is a CCTV (camera) installed above the mirror 4, and captures the processing status of the work 6. 10 is CCTV 9
It is a monitor that displays the processing status and various processing data by.

Here, as discharge gas, rare gases such as Kr, Ar,
A laser processing machine using F will be described. CO ₂ lasers, which are commonly used for industrial purposes, have a large output (about 1 kW) and a wavelength in the infrared region, and perform metal processing by thermal processing such as melting and vaporization, while this laser processing machine A small output (several tens of W) and a laser with a wavelength in the ultraviolet range (excimer laser) have a non-thermal decomposition and peeling action by a photochemical reaction (explosion of molecular bonds), which has little thermal effect on ceramics and glass. Highly accurate processing.

The electrode terminal treatment method according to the first aspect of the present invention, which is performed by using the ArF gas in the above laser processing apparatus, will be described with reference to FIG. Obtained by dividing from a large-area liquid crystal panel (A)
The liquid crystal display D shown in FIG.
The chamfering process is performed on the end edge 25 of the glass plate G ₂ on which 2 is formed by polishing. In this case, the glass end face 2
4 is precisely broken unlike the break for the narrow ear, so that the end face 24 and the corner 2
The polishing of 6 is not performed, and only the edge 25 may be polished, so that dry polishing can be performed.

After that, ArF laser irradiation is performed on the region q outside the line 23 (the side including the short-circuit electrode 22) that crosses the end of each electrode terminal 21. The irradiation data at this time is: wavelength: 193 nm output energy: 100 mJ / pulse maximum pulse repetition rate: 200 pps beam size: 6 mm x 12 mm. This beam size is applied to the workpiece 6 using the mask module 3 and the image lens 7. The irradiation area (processing size) of the laser is reduced to 0.5 mm × 2 mm, and this irradiation area is moved at a moving speed of 100 mm / sec to the area q
The XY table 5 was driven so as to scan above. Only the electrode 24 on the region q was removed as shown in (C) by the decomposition and peeling action obtained by the excimer laser irradiation.

It should be noted that, in FIG. 1, the ear width W to be cut off and discarded needs to have a certain width during the breaking step, but the ear width W'removed this time in FIG. 5 is short-circuited. Since the minimum width required for forming the electrode 22 is sufficient, glass material can be saved.

Next, the method of treating the electrode terminals of the second aspect of the present invention using KrF gas will be described with reference to FIG. In the liquid crystal display D shown in FIG. 7A obtained by dividing a liquid crystal panel having a large area, KrF laser irradiation is performed on a region q outside the line 23 that crosses the end of each electrode terminal 21. The irradiation data at this time is: wavelength: 248 nm output energy: 250 mJ / pulse maximum pulse repetition rate: 200 pps beam size: 8 mm x 25 mm. This beam size is applied to the workpiece 6 using the mask module 3 and the image lens 7. The irradiation area (processing size) of the laser No. 2 was narrowed down to 2 mm × 6 mm, and the XY table 5 was driven so as to scan the irradiation area at a moving speed of 100 mm / sec. As a result of this laser irradiation, as shown in FIG.
No. 4 was removed, and the end edge 25 of the region q was melted by the thermal processing action obtained by the strong laser irradiation having a longer wavelength (than infrared rays) than the laser of the previous irradiation, and the yarn chamfering processing was performed. The same effect can be obtained, and mechanical edge polishing can be omitted.

[0016]

As described above, according to the first invention,
Since the short-circuit electrode is removed by laser machining instead of cutting off the short-circuit electrode by machining, the machining process can be reduced to a minimum and therefore the cleaning process can be omitted. Can be reduced to In addition, since the number of machining processes is reduced, it is possible to suppress dust generation, which is most repelled in the industry, and it is possible to obtain a remarkable effect in maintaining a working environment. Further, as in the second invention, when a powerful laser having a slightly longer wavelength is irradiated, the short-circuit electrode is removed by the decomposition and peeling action, and the end edge is melted by the thermal processing action of the laser, and the thread chamfering process is performed. Since the same effect as that of the above-mentioned is obtained, the machining step can be omitted altogether.

[Brief description of drawings]

FIG. 1 is a plan view of a liquid crystal display.

FIG. 2 is a side view of the liquid crystal display.

FIG. 3 is a diagram showing a flow of conventional electrode processing for a liquid crystal display.

FIG. 4 is a control block diagram of a laser processing machine suitable for carrying out the electrode processing method of the present invention.

FIG. 5 is a diagram showing a flow of processing based on the electrode processing method of the first invention.

FIG. 6 is a diagram showing a flow of processing based on the electrode processing method of the second invention.

[Explanation of symbols]

 1 Centralized Controller 2 Laser Oscillator 3 Mask Module 4 Mirror 5 XY Table 6 Work 7 Image Lens 8 Z-axis Moving Mechanism 9 CCTV 10 Monitor 21 Electrode Terminal 22 Short-circuit Electrode

Claims (4)

[Claims] 1. A method for treating electrode terminals of a liquid crystal display obtained by division from a large-area liquid crystal panel, in which electrode terminals are cut off by cutting off glass ends of short-circuit electrodes where electrode terminals are short-circuited with each other. In place of the method of treating the electrode terminals to be treated, after the edge of the glass edge of the surface where the short-circuit electrodes that short-circuit the electrode terminals are formed, the edge of the glass edge is subjected to thread chamfering with a dry grinder A method for treating an electrode terminal, wherein the treatment of the electrode terminal is completed by irradiating a laser beam on the substrate and removing the short-circuit electrode by the decomposition and peeling action. 2. ArF is used as the discharge gas and has a wavelength of 19
The electrode terminal treatment method according to claim 1, which is performed using an excimer laser of 3 nm. 3. A method for treating electrode terminals of a liquid crystal display obtained by division from a large-area liquid crystal panel, by cutting off the glass ends of the short-circuit electrodes where the electrode terminals are short-circuited. Instead of the method of treating the electrode terminals to be treated, by irradiating the short-circuit electrodes that short-circuit the electrode terminals with a laser, the short-circuit electrodes are removed by the decomposition and peeling action, and the short-circuit electrodes are removed by the thermal energy of the laser. A method for treating an electrode terminal, characterized in that the treatment of the electrode terminal is completed by melting the edge edge of the glass on the surface where the mark is formed and performing the thread chamfering finish. 4. KrF is used as a discharge gas and has a wavelength of 24.
The electrode terminal processing method according to claim 3, which is performed using an 8 nm excimer laser.