JPH0727818A - Semiconductor testing device - Google Patents

Abstract

PURPOSE:To effectively prevent the occurrence of thermal runaway by installing semiconductors to the front surface of a substrate and providing wind direction changing means which change the direction of a part of wind supplied along the rear surface of the substrate into the direction perpendicular to the rear surface of the substrate. CONSTITUTION:A burn-in board 1 is provided so that its upper and lower plates 1a and 1b can constitute a space 4 together with spacers 7. LSI mounting sockets 3 are provided at prescribed intervals on the upper surface of the plate 1a. A connector section 5 which supplies the signal of a signal power source section to the board 1 is provided at one end of the plate 1a. Air blowing fans 2 are provided in the lower plate 1 so that the wind generated by the fans 2 can be directly supplied to upper surfaces of the sockets 3 mounting the LSIs through the space 4. Therefore, no heat stagnant section is formed in the semiconductor devices.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor testing device, and more particularly to a semiconductor testing device for detecting an initial failure of a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, semiconductor integrated circuit devices (hereinafter referred to as LSI
Is known as a test for screening an initial failure of an LSI by applying a power supply voltage and a temperature stress higher than those in normal operation. The device used for this burn-in is called a burn-in board.
FIG. 11 is a perspective view showing the structure of a conventional burn-in board. Referring to FIG. 11, the conventional burn-in board has the following configuration. That is, the socket 3 for mounting the LSI on the upper surface of the burn-in board 1
Are provided at a predetermined interval. Further, at one end of the burn-in board 1 is provided a connector section 5 for supplying a signal from a signal power source section of a burn-in device (not shown) to the burn-in board 1.

FIG. 12 is a front view showing a structure of a conventional burn-in device in which a plurality of burn-in boards are stored. Referring to FIG. 12, a conventional burn-in device 6 has an inner tank 1 for accommodating a plurality of burn-in boards 1.
2 is provided, and a storage frame 13 for fixing the burn-in board 1 is further provided in the inner tank 12. Further, on the inner surface of the upper portion of the burn-in device 6, a heater 8 for raising the temperature in the burn-in device 6 and a blower 9 for sending the air heated by the heater 8 to the entire burn-in device 6 are provided. It is installed at intervals. Further, a blower opening 10 is provided for sending air into the inner tank 12, and a discharge opening 11 is provided for discharging the air flowing in the inner tank 12 to the outside of the inner tank 12.

When performing the burn-in (acceleration test) using the burn-in device having the above-mentioned structure, first, the burn-in board 1 is inserted into the inner tank 12. Then, a continuous operation by voltage application and a temperature load due to a high temperature state are applied to cause a failure in an initial stage. At this time, in order to keep the temperature in the inner tank 12 constant, the heater 8
The air whose temperature has been raised to a predetermined set temperature is blown into the inner tank 12 from the blower port 10 by the blower 9. And the inner tank 12
The air sent to is discharged from the discharge port 11. In this way, the burn-in (acceleration test) is performed in a state where the temperature condition is kept constant by circulating the air in the burn-in device 6.

[0005]

In the conventional burn-in device 6 shown in FIG. 12, when the air having a constant temperature circulates in the inner tank 12, the air cannot be directly applied to the LSI. . FIG. 13 is a schematic diagram for explaining the flow of wind in the inner tank 12. Referring to FIG.
Latches 24 are provided on both ends of the socket 3. Therefore, the latch 24 prevents the air circulating in the inner tank from hitting the LSI 14 mounted on the socket 3. As a result, heat accumulation occurs around the LSI 14, and the temperature of the LSI 14 becomes abnormally high. As a result, there is a problem that the LSI 14, which originally does not fail at the set temperature (the temperature of the circulating air), fails due to thermal runaway.

The present invention has been made to solve the above problems, and an object thereof is to provide a semiconductor test apparatus capable of effectively preventing thermal runaway of a semiconductor device due to heat accumulation. With the goal.

[0007]

A semiconductor testing device according to claim 1 is a semiconductor testing device for detecting an initial failure of a semiconductor device, wherein the substrate has a front surface and a back surface, and An installation means provided on the front surface for installing the semiconductor device, and at least a part of the wind sent along the back surface of the base provided on the back surface of the base to the back surface of the base. On the other hand, the wind direction changing means is provided for changing the wind in a substantially vertical direction.

[0008]

In the semiconductor test apparatus according to the first aspect, at least a part of the wind sent along the back surface of the substrate is blown onto the back surface of the substrate in a direction substantially perpendicular to the back surface of the substrate. Since the wind direction changing means for changing the wind direction is provided, the wind generated by the wind direction changing means is blown directly to the upper surface of the installation means on which the semiconductor device of the semiconductor test apparatus one step lower is mounted. Unlike the related art, the heat accumulation of the semiconductor device does not occur due to the self-heating of the semiconductor device. This eliminates the inconvenience that the semiconductor device fails due to thermal runaway during the test.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a burn-in board according to a first embodiment of the present invention. Referring to FIG. 1, in burn-in board 1 according to the first embodiment, upper plate 1a
And the lower plate 1b are provided so as to form the space 4 via the spacer 7. Sockets 3 for mounting LSIs (not shown) are installed on the upper surface of the upper plate 1a at predetermined intervals. A connector portion 5 for supplying the signal of the signal power source portion to the burn-in board 1 is provided at one end of the upper plate 1a.

Here, in the first embodiment, the blower fan 2 is provided on the lower plate 1b. The air blown by the blower fan 2 is supplied through the space 4.

FIG. 2 is a front view showing the burn-in device in which the burn-in board of the first embodiment shown in FIG. 1 is housed, and FIG. 3 shows the wind around the socket in the burn-in device shown in FIG. It is a partially enlarged view for explaining a flow.
2 and 3, the structure of burn-in device 6 except burn-in board 1 is the same as the conventional structure shown in FIG. In this embodiment, the air having a constant temperature is blown from the blower port 10 on the side surface of the burn-in device 6. Then, the wind passes through the space 4 of the burn-in board 1 and is blown vertically downward by the blower fan 2 provided on the lower plate of the burn-in board 1. As a result, the upper surface of the socket 3 one step below is directly exposed to the wind set to a constant temperature, and the heat accumulation around the LSI 14 caused by the self-heating of the LSI 14 can be eliminated. As a result, it is possible to effectively prevent the inconvenience that the LSI 14, which originally does not fail at the set temperature (the temperature of the circulating air), fails due to thermal runaway. The inner tank 12
The air flowing inside is discharged from the discharge port 11 and circulates in the burn-in device 6 to keep the temperature constant.

FIG. 4 is a perspective view showing a burn-in board according to a second embodiment of the present invention. Referring to FIG. 4, in the second embodiment, an air blowing pipe 15 is provided as a vertically downward air blowing mechanism. That is, the blower pipe 15 having the in-pipe inlet 16 and the plurality of outlets 17 is attached to the lower plate 1b. The wind that has entered from the in-pipe inlet 16 passes through the blower pipe 15 and is blown to the upper surface of the lower LSI (not shown) by the blow-out port 17.

FIG. 5 is a schematic view of a burn-in system equipped with the burn-in board of the second embodiment shown in FIG. 4 when viewed from the side. Referring to FIG. 5, inside the burn-in device 26, a device internal pipe 18 is provided to enable use of the burn-in board 21 of the second embodiment shown in FIG. A plurality of air supply ports 1 are provided in the device internal piping 18.
9 is provided, and a supply fan 20 is attached to one end of the apparatus internal pipe 18. When mounting the burn-in board 21, the connector part 5 is attached to the burn-in board 21, and at the same time, the intake port 16 of the blow-in pipe 15 of the burn-in board is connected to the internal pipe 1 of the apparatus.
8 to the air supply port 19.

FIG. 6 is a schematic diagram for explaining the flow of wind when the burn-in device shown in FIG. 5 is viewed from the front. FIG. 7 is an enlarged sectional view for explaining the flow of wind around the socket in the burn-in device shown in FIG.
First, referring to FIGS. 5 and 7, the burn-in device 26
The air that circulates inside is taken into the device internal piping 18 by the blower fan 20. Then, the air is supplied from the apparatus internal pipe to the blower pipe 15 through the pipe intake 16. The air supplied to the air blowing pipe 15 is blown vertically downward from the air outlet 17 and is blown directly to the upper surface of the socket 3 in which the LSI 14 is mounted. This gives L
A heat pool around the LSI 14 caused by the self-heating of the SI 14 can be eliminated, and the problem that the LSI 14 which does not originally fail at the set temperature (temperature of the circulating wind) fails due to thermal runaway can be prevented. it can. Further, the wind flow seen from the front of the burn-in device 26 is in a state as shown in FIG.

FIG. 8 is a perspective view showing a burn-in board according to a third embodiment of the present invention. Referring to FIG. 8, in the burn-in board according to the third embodiment, a wind direction deflector 22 for changing the horizontal wind sent from the side surface of the burn-in device (not shown) to the lower plate 1b in a substantially vertical direction is provided. It is provided. The wind direction deflector 22 includes the wind direction deflector 22.
An air passage hole 23 is provided for sending a part of the wind hit by the wind to the next wind direction deflector 22.

FIG. 9 is a front view of a burn-in system equipped with the burn-in board of the third embodiment shown in FIG. FIG. 10 is an enlarged cross-sectional view showing the wind flow around the socket in the burn-in system shown in FIG. With reference to FIGS. 9 and 10, the horizontal wind introduced into the inner tub 12 from the blower port 10 is deflected in the vertical direction by hitting the wind direction deflector 22. Then, the wind deflected in the vertical direction is directly sent to the upper surface of the socket 3 located one step below. At this time, part of the wind passes through the ventilation holes 23 and is blown to the next wind direction deflector 22. The wind flowing in the inner tank 12 is discharged from the discharge port 11 and circulates in the burn-in device 6 to keep the temperature condition constant.

By using the wind direction deflector 22 as described above, the wind can be directly applied to the upper surface of the socket 3, and the heat accumulation around the LSI 14 due to the self-heating of the LSI 14 can be eliminated. As a result, the LS that does not originally fail at the set temperature (the temperature of the circulating air)
It is possible to effectively prevent the inconvenience that I14 fails due to thermal runaway.

[0019]

According to the first aspect of the present invention, at least a part of the wind sent along the back surface of the substrate to the back surface of the substrate is directed in a direction substantially perpendicular to the back surface of the substrate. By providing the wind direction changing means for changing to the wind, the wind in the vertical direction generated by the wind direction changing means is blown directly to the surface of the installation means on which the semiconductor device one step below is mounted. As described above, the heat accumulation around the semiconductor device due to the heat generation of the semiconductor device itself is effectively reduced. As a result, the semiconductor device does not have an abnormally high temperature during the test, and there is no inconvenience that the semiconductor device causes thermal runaway and fails due to such an abnormally high temperature.

[Brief description of drawings]

FIG. 1 is a perspective view showing a burn-in board according to an embodiment of the present invention.

2 is a front view showing a burn-in device provided with the burn-in board shown in FIG. 1. FIG.

FIG. 3 is an enlarged cross-sectional view for explaining a wind flow around a socket in the burn-in device shown in FIG.

FIG. 4 is a perspective view showing a burn-in board according to a second embodiment of the present invention.

FIG. 5 is a schematic view of the burn-in device for installing the burn-in board of the second embodiment shown in FIG. 4 when viewed from the side.

FIG. 6 is a schematic diagram for explaining the flow of wind when the burn-in device shown in FIG. 5 is viewed from the front direction.

FIG. 7 is an enlarged cross-sectional view for explaining the flow of wind around the socket in the burn-in device shown in FIG.

FIG. 8 is a perspective view showing a burn-in board according to a third embodiment of the present invention.

9 is a front view of a burn-in device provided with the burn-in board of the third embodiment shown in FIG.

10 is an enlarged cross-sectional view for explaining a wind flow around the socket in the burn-in device shown in FIG.

FIG. 11 is a perspective view showing a conventional burn-in board.

12 is a front view of a burn-in device in which the conventional burn-in board shown in FIG. 11 is installed.

13 is an enlarged cross-sectional view for explaining a wind flow around the socket of the burn-in device shown in FIG.

[Explanation of symbols]

 1: Burn-in board 2: Blower fan 3: Socket 4: Space 5: Connector part 7: Spacer 15: Blower pipe 22: Wind direction deflector In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Claims] 1. A semiconductor test device for detecting an initial failure of a semiconductor device, comprising a base having a front surface and a back surface, and the semiconductor device provided on the front surface of the base. An installation means for installing, and at least a part of the wind which is provided on the back surface of the base body and is sent along the back surface of the base body in a direction substantially perpendicular to the back surface of the base body. And a wind direction changing means for changing to a semiconductor test apparatus.