JPH07273442A - Batch system vapor phase soldering equipment - Google Patents
Batch system vapor phase soldering equipmentInfo
- Publication number
- JPH07273442A JPH07273442A JP9682494A JP9682494A JPH07273442A JP H07273442 A JPH07273442 A JP H07273442A JP 9682494 A JP9682494 A JP 9682494A JP 9682494 A JP9682494 A JP 9682494A JP H07273442 A JPH07273442 A JP H07273442A
- Authority
- JP
- Japan
- Prior art keywords
- boiling point
- vapor
- heated
- vapor phase
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は基板等の上に部品をはん
だ付する装置の１つで、あらかじめ基板等の電極部にソ
ルダーペースト等のはんだ材料を盛り、更にその上に電
子部品等を搭載した基板すなわち被加熱物体を例えば沸
点２１５℃前後の不活性蒸気中へ浸漬することによりは
んだ付するバッチ式気相はんだ付装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is one of devices for soldering components on a board or the like, in which a solder material such as a solder paste is pre-deposited on an electrode portion of the board or the like, and an electronic component or the like is further deposited thereon. The present invention relates to a batch type vapor phase soldering apparatus for soldering by mounting a mounted substrate, that is, an object to be heated in an inert vapor having a boiling point of about 215 ° C.
【０００２】[0002]
【従来の技術】従来の技術としては、特願平４−３５１
１７９「バッチ式気相はんだ付装置」（出願人は、本特
許出願人と同じ）においては図１の通り、基板を固定
し、蒸気槽自体を昇降させるバッチ式気相はんだ付装置
が出願されていたが、この場合の蒸気相７は１種類のみ
であり、又、不活性蒸気槽も１槽のみであった。そして
被加熱物体の予備加熱は赤外線加熱装置により行なわれ
ていた。2. Description of the Related Art Japanese Patent Application No. 4-351 is a conventional technique.
179 “Batch type vapor phase soldering apparatus” (the applicant is the same as the applicant of the present patent application), as shown in FIG. 1, a batch type vapor phase soldering apparatus for fixing the substrate and elevating the steam tank itself has been filed. However, there was only one type of vapor phase 7 in this case, and there was only one inert vapor tank. The object to be heated is preheated by an infrared heating device.
【０００３】[0003]
【発明が解決しょうとする課題】特願平４−３５１１７
９「バッチ式気相はんだ付装置」においては被加熱物体
は固定され、蒸気槽自体が昇降することから、目視観察
は可能であるが、予備加熱を赤外線加熱方式で行なう
と、大気雰囲気の場合、酸化されるという欠点があっ
た。又、酸化防止を図るには雰囲気をＮ２とする方式も
あるが、コスト的にＮ２費がよけいにかかるという問題
があった。[Problems to be Solved by the Invention] Japanese Patent Application No. 4-35117
9 In the "batch type vapor phase soldering device", the object to be heated is fixed, and the steam tank itself moves up and down, so visual observation is possible, but if preheating is performed by the infrared heating method, in the case of atmospheric atmosphere However, there was a drawback that it was oxidized. Further, there is a method in which the atmosphere is N 2 in order to prevent oxidation, but there is a problem in that the cost of N 2 is large.
【０００４】[0004]
【課題を解決するための手段】上記の問題点を解決すべ
く提案されたもので、沸点の異なる２種類の不活性液体
の注入された２槽式蒸気槽を備える。このうち一槽は低
沸点蒸気槽であり、予備加熱用に用いられる。他の一槽
は高沸点蒸気槽ではんだ付に用いられる。基板は予備加
熱、はんだ付け加熱の間、常に固定されている。なお、
いずれも蒸気相中は酸素濃度が極めて低いことが確認さ
れている。[Problems to be Solved by the Invention] It has been proposed to solve the above problems, and is provided with a two-tank type steam tank in which two kinds of inert liquids having different boiling points are injected. One of these tanks is a low boiling point steam tank and is used for preheating. Another tank is a high boiling steam tank used for soldering. The board is always fixed during preheating and soldering heating. In addition,
It has been confirmed that the oxygen concentration is extremely low in the vapor phase.
【０００５】[0005]
【作用】本発明において、被加熱物体は常に固定されて
いる。最初に低沸点蒸気槽が基板の真下に移動し、その
後、上昇することにより、基板が低沸点蒸気相中へ浸漬
される。その後、低沸点蒸気槽は下降し、次に高沸点蒸
気槽が基板の真下へ移動し、上昇することにより基板が
高沸点蒸気相中へ浸漬される。その後、高沸点蒸気槽が
下降する。In the present invention, the object to be heated is always fixed. First, the low boiling vapor bath is moved directly under the substrate, and then it is raised to immerse the substrate in the low boiling vapor phase. After that, the low boiling point steam tank descends, then the high boiling point steam tank moves directly below the substrate, and ascends, so that the substrate is immersed in the high boiling point vapor phase. Then, the high boiling point steam tank descends.
【０００６】[0006]
【実施例】第２図は本発明の実施例であり、第２図につ
いて説明する。外枠２の上部には窓が設けられている。
外枠２と低沸点蒸気槽２０および高沸点蒸気槽２０′更
に水平移動装置１０は、昇降装置１１を介して一体構造
となっている。外枠２には支持部３が一体構造となって
おり、支持部３は被加熱物体４を固定できる構造となっ
ている。予め、低沸点蒸気槽２０には低沸点不活性液体
８が入れられており、高沸点蒸気槽２０′には高沸点不
活性液体８′が入れられている。これを稼動させるに
は、まず水冷式の低沸点蒸気凝縮器６及び高沸点蒸気凝
縮器６′に冷却水を通水し、次に低沸点不活性液体加熱
ヒーター９と高沸点不活性液体加熱ヒーター９′に通電
する。加熱された不活性液体から各々低沸点蒸気７、高
沸点蒸気７′が発生するが、蒸気凝縮器６及び６′に接
触することにより凝縮液となる。この状態で、水平移動
装置１０が働き、低沸点蒸気槽２０が被加熱物体４の真
下に移動する。次に昇降装置１１が働き、低沸点蒸気槽
２０および高沸点蒸気槽２０′が上昇することにより、
被加熱物体４は低沸点蒸気７中へ浸漬され、予備加熱さ
れる。次に昇降装置１１が働き、低沸点蒸気槽２０およ
び高沸点蒸気槽２０′が下降し、続いて水平移動装置１
０が働き、高沸点蒸気槽２０′が被加熱物体４の真下に
移動する。次に昇降装置１１が働き、低沸点蒸気槽２０
および高沸点蒸気槽２０′が上昇することにより、被加
熱物体４は高沸点蒸気７′中へ浸漬され、はんだ付け温
度まで加熱される。この後、昇降装置１１が働き、低沸
点蒸気槽２０および高沸点蒸気槽２０′が下降する。な
お、水平移動装置１０、昇降装置１１の停止位置はリミ
ットスイッチ等で制御することができ、予備加熱時間及
びはんだ付け加熱時間はタイマー等で制御することがで
きる。EXAMPLE FIG. 2 shows an example of the present invention, and FIG. 2 will be described. A window is provided on the upper portion of the outer frame 2.
The outer frame 2, the low-boiling steam tank 20, the high-boiling steam tank 20 ′, and the horizontal moving device 10 have an integral structure via an elevating device 11. The outer frame 2 is integrally formed with a supporting portion 3, and the supporting portion 3 has a structure capable of fixing the object 4 to be heated. The low boiling point vapor tank 20 contains the low boiling point inert liquid 8 in advance, and the high boiling point vapor tank 20 'contains the high boiling point inert liquid 8'. In order to operate this, first, the cooling water is passed through the water-cooled low boiling point vapor condenser 6 and the high boiling point vapor condenser 6 ', and then the low boiling point inert liquid heating heater 9 and the high boiling point inert liquid heating are performed. Energize the heater 9 '. A low boiling point vapor 7 and a high boiling point vapor 7'are generated from the heated inert liquid, and become a condensate by contacting the vapor condensers 6 and 6 '. In this state, the horizontal moving device 10 operates, and the low boiling point steam tank 20 moves directly below the object to be heated 4. Next, the elevating device 11 works to raise the low boiling point steam tank 20 and the high boiling point steam tank 20 ',
The object 4 to be heated is immersed in the low boiling point steam 7 and preheated. Next, the lifting device 11 works, the low-boiling steam tank 20 and the high-boiling steam tank 20 'descend, and then the horizontal moving device 1
0 works, and the high-boiling-point steam tank 20 ′ moves directly below the object to be heated 4. Next, the lifting device 11 works, and the low boiling point steam tank 20
As the high-boiling steam tank 20 'rises, the object 4 to be heated is immersed in the high-boiling steam 7'and heated to the soldering temperature. After that, the elevating device 11 operates, and the low boiling point steam tank 20 and the high boiling point steam tank 20 'descend. The stop positions of the horizontal moving device 10 and the lifting device 11 can be controlled by a limit switch or the like, and the preheating time and the soldering heating time can be controlled by a timer or the like.
【０００７】[0007]
【発明の効果】この様な構造となっているから、被加熱
物体４の予備加熱及びはんだ付け加熱共、コスト的に高
いＮ２ガスを使うことなく、無酸素雰囲気である低沸点
蒸気７中及び高沸点蒸気７′中で行なうことができる。
なお、被加熱物体４が相対的に低沸点蒸気７中から出て
高沸点蒸気７′中へ入るまでの時間、大気雰囲気に暴露
されるが、被加熱物体４の表面が低沸点不活性ガスの凝
縮液で覆われているため、短時間であれば直ちに酸化さ
れることはない。EFFECTS OF THE INVENTION Due to such a structure, both preheating and soldering heating of the object 4 to be heated can be performed in the low boiling point steam 7 which is an oxygen-free atmosphere without using expensive N 2 gas. And in high boiling steam 7 '.
The object 4 to be heated is exposed to the atmosphere for a period of time from the relatively low boiling point vapor 7 to the high boiling point vapor 7 ', but the surface of the object 4 to be heated is a low boiling point inert gas. Since it is covered with the condensate, it is not immediately oxidized for a short time.
【図１】従来例の１つである特願平４−３５１１７９
「バッチ式気相はんだ付装置」の縦断面図である。FIG. 1 Japanese Patent Application No. 4-351179, which is one of conventional examples.
It is a longitudinal cross-sectional view of a "batch type vapor phase soldering apparatus".
【図２】本発明の請求項１の実施例を示す縦断面図であ
る。FIG. 2 is a vertical sectional view showing an embodiment of claim 1 of the present invention.
１ 窓 ２ 外枠 ３ 支持部 ４ 被加熱物体 ５ 低沸点蒸気レベル ５′高沸点蒸気レベル ６ 低沸点蒸気凝縮器 ６′高沸点蒸気凝縮器 ７ 低沸点蒸気 ７′高沸点蒸気 ８ 低沸点不活性液体 ８′高沸点不活性液体 ９ 低沸点不活性液体加熱ヒーター ９′高沸点不活性液体加熱ヒーター １０ 水平移動装置 １１ 昇降装置 １３ 赤外線加熱装置 1 window 2 outer frame 3 support part 4 heated object 5 low boiling point vapor level 5'high boiling point vapor level 6 low boiling point vapor condenser 6'high boiling point vapor condenser 7 low boiling point vapor 7'high boiling point vapor 8 low boiling point inert Liquid 8'High-boiling inert liquid 9 Low-boiling inert liquid heating heater 9'High-boiling inert liquid heating heater 10 Horizontal moving device 11 Lifting device 13 Infrared heating device
Claims (1)
く、沸点の異なる不活性液体が各々注入された２槽式蒸
気槽自体を水平移動及び昇降させることにより、相対的
に被加熱物体を順次沸点の異なる２種類の不活性蒸気相
へ浸漬し引き上げることにより予熱、更にはんだ付する
ことを特徴とするバッチ式気相はんだ付装置。1. The object to be heated is relatively sequentially moved by horizontally moving and vertically moving a two-tank steam tank itself into which inert liquids having different boiling points are injected without moving the object to be soldered. A batch-type vapor phase soldering device characterized by preheating and then soldering by immersing in two types of inert vapor phases with different boiling points and pulling up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9682494A JPH07273442A (en) | 1994-03-31 | 1994-03-31 | Batch system vapor phase soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9682494A JPH07273442A (en) | 1994-03-31 | 1994-03-31 | Batch system vapor phase soldering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07273442A true JPH07273442A (en) | 1995-10-20 |
Family
ID=14175319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9682494A Pending JPH07273442A (en) | 1994-03-31 | 1994-03-31 | Batch system vapor phase soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07273442A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6971571B2 (en) | 2000-12-21 | 2005-12-06 | Fujitsu Limited | Reflow soldering apparatus and reflow soldering method |
| EP3851235A1 (en) * | 2020-01-15 | 2021-07-21 | Helmut Walter Leicht | Device and method for controlled heat transfer, in particular by a condensing liquid on workpieces of larger dimensions and masses |
-
1994
- 1994-03-31 JP JP9682494A patent/JPH07273442A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6971571B2 (en) | 2000-12-21 | 2005-12-06 | Fujitsu Limited | Reflow soldering apparatus and reflow soldering method |
| EP3851235A1 (en) * | 2020-01-15 | 2021-07-21 | Helmut Walter Leicht | Device and method for controlled heat transfer, in particular by a condensing liquid on workpieces of larger dimensions and masses |
| WO2021144332A1 (en) * | 2020-01-15 | 2021-07-22 | Helmut Walter Leicht | Device and method for controlled heat transfer, in particular to workpieces of large dimensions and masses by means of a condensing liquid |
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