JPH07273443A - Batch system vapor phase soldering equipment - Google Patents

Abstract

PURPOSE:To perform preliminary heating and soldering heating in vapor phase different in boiling point, as an inert atmosphere, without moving an object to be heated. CONSTITUTION:An object 4 to be heated is fixed. An equipment 34 for elevating a single vapor bath 29 in which two kinds of inert liquid different in boiling point is injected is installed. Thereby the object 4 to be heated can be subjected to preliminary heating and soldering heating, in a vapor phase, as an inert atmosphere, without using N2 atmosphere.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is one of devices for soldering components on a board or the like, in which a solder material such as a solder paste is pre-deposited on an electrode portion of the board or the like, and an electronic component or the like is further deposited thereon. The present invention relates to a batch type vapor phase soldering apparatus for soldering by mounting a mounted substrate, that is, an object to be heated in an inert vapor having a boiling point of about 215 ° C.

[0002]

2. Description of the Related Art Japanese Patent Application No. 4-351 is a conventional technique.
179 “Batch type vapor phase soldering apparatus” (the applicant is the same as the applicant of the present patent application), as shown in FIG. 1, a batch type vapor phase soldering apparatus for fixing the substrate and elevating the steam tank itself has been filed. However, there was only one type of vapor phase 7 in this case. As another conventional technique, as shown in FIG. 2, two kinds of inert liquids having different boiling points are used, and a primary vapor phase 7 having a high boiling point and a secondary vapor phase 13 having a low boiling point are sequentially provided from the bottom in a predetermined vapor phase. To maintain the thickness, the air-cooled secondary steam condenser 21
In addition, a double-vapour-phase soldering device with a single tank equipped with a primary steam condenser using the secondary steam condensate 24 as a cooling heat medium has been developed. The purpose of providing the secondary vapor phase is
The purpose is to prevent the emission of expensive primary steam and preheat the object to be heated such as the substrate in the second steam which is an inert atmosphere. As a conventional usage method, an object to be heated such as a substrate is sequentially lowered by an elevating device, and is heated after being subjected to heat treatment such as soldering in a primary vapor phase.

[0003]

[Problems to be Solved by the Invention] Japanese Patent Application No. 4-35117
9 In the “batch type vapor phase soldering device”, the object to be heated is fixed and the vapor tank itself moves up and down, so visual observation is possible, but since there is one vapor phase, it is expensive due to the secondary vapor phase. However, it was impossible to prevent the primary vapor from being dissipated, and the object to be heated could not be preheated in the second vapor phase which is an inert atmosphere. Further, in the vapor-phase soldering apparatus using a single bath using two kinds of inert liquids having different boiling points, the heated object such as the substrate is dropped from the atmosphere to the second vapor phase and further to the first vapor phase. Had to let. Therefore, since the object to be heated moves, it is not possible to visually observe the delicate behavior during soldering, or to take an image with a high-speed high-speed camera or the like.

[0004]

SUMMARY OF THE INVENTION The present invention has been proposed to solve the above-mentioned problems, and it is a single unit that fixes an object to be heated such as a substrate and uses two kinds of inert liquids having different boiling points. It is equipped with a device for moving the steam tank up and down.

[0005]

According to the present invention, the object to be heated is fixed, and the single vapor tank using two kinds of inert liquids having different boiling points is moved up and down so that the object to be heated has a low boiling secondary It is preheated in steam and can be soldered in the high boiling primary steam which is an inert atmosphere.

[0006]

EXAMPLE FIG. 3 shows an example of the present invention, and FIG. 3 will be described. A window is provided on the upper portion of the outer frame 2.
The outer frame 2 and the steam tank 29 have an integrated structure via a lifting device 34. The outer frame 2 is integrally formed with a supporting portion 3, and the supporting portion 3 has a structure capable of fixing the object 4 to be heated. The primary inert liquid 9 having a high boiling point (215 ° C.) is previously injected in the lower part in the steam tank 29, and the secondary inert liquid retention tank 30
A secondary inert liquid 24 having a low boiling point (150 ° C.) is injected in the chamber. In order to operate this, first, cooling water is passed through the water-cooled secondary steam condenser 31, and then the heater 8 is energized. The primary vapor 7 is generated from the heated high-boiling-point primary inert liquid 9, but when it rises above the lower weir 32, the primary vapor 7 comes into contact with the secondary inert liquid retention tank 30 and is cooled and condensed. To do. The primary vapor condensate liquid 26 passes through the communication pipe 34 and returns to the inside of the vapor tank 29. On the other hand, the secondary inert liquid 24 in the secondary inert liquid retention tank 30 is heated by the latent heat of condensation of the primary vapor 7 to generate the secondary vapor 25. Secondary steam 13
When the secondary steam level 12 at the upper end of the above rises above the upper weir 33, the secondary steam 13 is cooled by the cold water secondary steam condenser 31.
Since water in the air may also condense and mix into the secondary vapor condensate 22 that contacts with, cools and condenses, after the water is removed by the water remover 23, the secondary inert liquid is removed. It flows into the retention tank 30. In addition, since the secondary inert liquid 24 in the secondary inert liquid retention tank 30 may be diffused and decreased, the secondary inert liquid 24 is injected at any time in an amount commensurate with the amount of emission. As a result of the above operation, as a result, the primary steam 7 and the secondary steam 13 always exist in the steam tank, and the boundary 14 between the primary steam 7 and the secondary steam 13 is fixed almost above the lower weir 32. The secondary steam level 12 is fixed to a position slightly above the upper weir 33. In this state, the lifting device 3
4, the object to be heated 4 is relatively immersed in the secondary steam 13 first, and then in the primary steam 7, and then the elevating device 34 descends the steam tank 29. It is again immersed in the secondary steam 13 and then above the secondary steam level. On this occasion,
The time in which the heated object 4 is immersed in the secondary steam 13 and the primary steam 7 can be easily changed by moving the lifting device with a timer.

[0007]

The effect of the present invention is that the object 4 to be heated does not move and the object to be heated 4 is in an inert atmosphere with a very low oxygen concentration.
Can be preheated and the soldering can be performed in the primary steam 7 which is an inert atmosphere like the secondary steam. During this time, each step of preheating and soldering of the object 4 to be heated can be visually inspected from the upper window. It becomes easy to observe and photograph with a high speed high speed camera or the like. Furthermore, since the heated object 4 does not move,
Stable soldering can be performed.

[Brief description of drawings]

FIG. 1 Japanese Patent Application No. 4-351179, which is one of conventional examples.
It is a longitudinal cross-sectional view of a "batch type vapor phase soldering apparatus".

FIG. 2 is a vertical cross-sectional view of a vapor phase soldering device (not filed in Japan) of Copaine, Inc., which is one of the conventional examples.

FIG. 3 is a vertical sectional view showing an embodiment of claim 1 of the present invention.

[Explanation of symbols]

 1 Window 2 Outer Frame 3 Support Part 4 Heated Object 5 Inert Vapor Level 6 Vapor Condenser 7 Inert Vapor 8 Heater 9 Inert Liquid 11 Elevating Support Part 12 Secondary Vapor Level 13 Secondary Vapor 14 Primary Vapor and Secondary Boundary with Secondary Steam 21 Air-cooled Secondary Steam Condenser 22 Secondary Steam Condensate 23 Moisture Remover 24 Secondary Inert Liquid 25 Secondary Steam 26 Primary Steam Condensate 27 Reflux Liquid of Primary Steam Condensate 28 Insulation 30 Secondary inert liquid retention tank 31 Cold water secondary steam condenser 32 Lower weir 33 Upper weir 34 Lifting device

Claims (1)

[Claims] 1. A single vapor tank, into which two kinds of inert liquids having different boiling points are injected, is moved up and down without moving the object to be soldered, and the objects to be heated sequentially have different boiling points. A batch type vapor phase soldering device, which is characterized in that it is dipped in two kinds of vapor phases and then pulled up for soldering.