JPH07273443A - Batch system vapor phase soldering equipment - Google Patents
Batch system vapor phase soldering equipmentInfo
- Publication number
- JPH07273443A JPH07273443A JP9682594A JP9682594A JPH07273443A JP H07273443 A JPH07273443 A JP H07273443A JP 9682594 A JP9682594 A JP 9682594A JP 9682594 A JP9682594 A JP 9682594A JP H07273443 A JPH07273443 A JP H07273443A
- Authority
- JP
- Japan
- Prior art keywords
- vapor phase
- heated
- steam
- vapor
- primary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は基板等の上に部品をはん
だ付する装置の1つで、あらかじめ基板等の電極部にソ
ルダーペースト等のはんだ材料を盛り、更にその上に電
子部品等を搭載した基板すなわち被加熱物体を例えば沸
点215℃前後の不活性蒸気中へ浸漬することによりは
んだ付するバッチ式気相はんだ付装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is one of devices for soldering components on a board or the like, in which a solder material such as a solder paste is pre-deposited on an electrode portion of the board or the like, and an electronic component or the like is further deposited thereon. The present invention relates to a batch type vapor phase soldering apparatus for soldering by mounting a mounted substrate, that is, an object to be heated in an inert vapor having a boiling point of about 215 ° C.
【0002】[0002]
【従来の技術】従来の技術としては、特願平4−351
179「バッチ式気相はんだ付装置」(出願人は、本特
許出願人と同じ)においては図1の通り、基板を固定
し、蒸気槽自体を昇降させるバッチ式気相はんだ付装置
が出願されていたが、この場合の蒸気相7は1種類のみ
であった。又他の従来技術として、図2の通り、沸点の
異なる2種類の不活性液体を用い、下から順次高沸点の
1次蒸気相7、低沸点の2次蒸気相13を各々所定の蒸
気相厚さを維持するため、空冷式2次蒸気凝縮器21
と、2次蒸気凝縮液24を冷却熱媒体に使用した1次蒸
気凝縮器を備えた単一槽による2重蒸気相はんだ付装置
が開発されていた。なお、2次蒸気相を設ける目的は、
高価な1次蒸気の放散防止と基板等被加熱物体の予備加
熱を不活性雰囲気である第2蒸気中で行なうことにあ
る。従来の使用法としては、基板等被加熱物体を昇降装
置により順次下降し、1次蒸気相ではんだ付等の加熱処
理を行なったあと上昇させていた。2. Description of the Related Art Japanese Patent Application No. 4-351 is a conventional technique.
179 “Batch type vapor phase soldering apparatus” (the applicant is the same as the applicant of the present patent application), as shown in FIG. 1, a batch type vapor phase soldering apparatus for fixing the substrate and elevating the steam tank itself has been filed. However, there was only one type of vapor phase 7 in this case. As another conventional technique, as shown in FIG. 2, two kinds of inert liquids having different boiling points are used, and a primary vapor phase 7 having a high boiling point and a secondary vapor phase 13 having a low boiling point are sequentially provided from the bottom in a predetermined vapor phase. To maintain the thickness, the air-cooled secondary steam condenser 21
In addition, a double-vapour-phase soldering device with a single tank equipped with a primary steam condenser using the secondary steam condensate 24 as a cooling heat medium has been developed. The purpose of providing the secondary vapor phase is
The purpose is to prevent the emission of expensive primary steam and preheat the object to be heated such as the substrate in the second steam which is an inert atmosphere. As a conventional usage method, an object to be heated such as a substrate is sequentially lowered by an elevating device, and is heated after being subjected to heat treatment such as soldering in a primary vapor phase.
【0003】[0003]
【発明が解決しょうとする課題】特願平4−35117
9「バッチ式気相はんだ付装置」においては被加熱物体
は固定され、蒸気槽自体が昇降することから、目視観察
は可能であるが、蒸気相が1種類のため、2次蒸気相に
よる高価な1次蒸気の放散防止が不能であり、更に被加
熱物体の予備加熱を不活性雰囲気である第2蒸気相中で
行なうことができなかった。又、上記した沸点の異なる
2種類の不活性液体を用いた単一槽による気相式はんだ
付装置では、基板等被加熱物体を大気中から第2蒸気
相、更に第1蒸気相へと降下させる必要があった。従っ
て、被加熱物体が動くことからはんだ付時の細やかな挙
動を目視観察したり、高倍率の高速度カメラ等で撮影す
ることができなかった。[Problems to be Solved by the Invention] Japanese Patent Application No. 4-35117
9 In the “batch type vapor phase soldering device”, the object to be heated is fixed and the vapor tank itself moves up and down, so visual observation is possible, but since there is one vapor phase, it is expensive due to the secondary vapor phase. However, it was impossible to prevent the primary vapor from being dissipated, and the object to be heated could not be preheated in the second vapor phase which is an inert atmosphere. Further, in the vapor-phase soldering apparatus using a single bath using two kinds of inert liquids having different boiling points, the heated object such as the substrate is dropped from the atmosphere to the second vapor phase and further to the first vapor phase. Had to let. Therefore, since the object to be heated moves, it is not possible to visually observe the delicate behavior during soldering, or to take an image with a high-speed high-speed camera or the like.
【0004】[0004]
【課題を解決するための手段】本発明は上記の問題点を
解決すべく提案されたもので、基板等被加熱物体を固定
し、かつ沸点の異なる2種類の不活性液体を用いた単一
蒸気槽を上下させる装置を備える。SUMMARY OF THE INVENTION The present invention has been proposed to solve the above-mentioned problems, and it is a single unit that fixes an object to be heated such as a substrate and uses two kinds of inert liquids having different boiling points. It is equipped with a device for moving the steam tank up and down.
【0005】[0005]
【作用】本発明は被加熱物体を固定し、かつ沸点の異な
る2種類の不活性液体を用いた単一蒸気槽を上下させる
ことにより、被加熱物体を不活性雰囲気である低沸点の
2次蒸気中で予備加熱し更に不活性雰囲気である高沸点
の1次蒸気中ではんだ付可能とする。According to the present invention, the object to be heated is fixed, and the single vapor tank using two kinds of inert liquids having different boiling points is moved up and down so that the object to be heated has a low boiling secondary It is preheated in steam and can be soldered in the high boiling primary steam which is an inert atmosphere.
【0006】[0006]
【実施例】第3図は本発明の実施例であり、第3図につ
いて説明する。外枠2の上部には窓が設けられている。
外枠2と蒸気槽29とは昇降装置34を介して一体構造
となっている。外枠2には支持部3が一体構造となって
おり、支持部3は被加熱物体4を固定できる構造となっ
ている。蒸気槽29内に予め高沸点(215℃)の一次
不活性液体9を下部に注入し、二次不活性液滞留槽30
には低沸点(150℃)の二次不活性液体24を注入し
ておく。これを稼動させるには、まず水冷式2次蒸気凝
縮器31に冷却水を通水し、次にヒーター8に通電す
る。加熱された高沸点の一次不活性液体9から、一次蒸
気7が発生するが、下部せき32よりも上に上昇する
と、一次蒸気7が二次不活性液滞留槽30に接触し、冷
却され凝縮する。一次蒸気凝縮液26は連通管34を通
り、蒸気槽内29へ還流する。一方二次不活性液滞留槽
30内の二次不活性液体24が一次蒸気7の凝縮潜熱に
より加熱され、二次蒸気25を発生する。二次蒸気13
の上端の二次蒸気レベル12が上部せき33よりも上に
上昇すると、二次蒸気13が冷水式二次蒸気凝縮器31
に接触し、冷却され凝縮するこの二次蒸気凝縮液22に
は空気中の水分も凝縮し混入する可能性があることか
ら、水分除去器23で水分を除去されたあと、二次不活
性液滞留槽30へ流入する。なお、二次不活性液滞留槽
30内の二次不活性液24は放散し、減少することもあ
るので、随時放散量に見合う量、二次不活性液24が注
入される。以上の働きにより、結果的に蒸気槽内には常
に一次蒸気7と二次蒸気13とが存在し、一次蒸気7と
二次蒸気13との境界14はほぼ下部せき32のやや上
方に固定され、又、二次蒸気レベル12はほぼ上部せき
33のやや上方に固定される。この状態で、昇降装置3
4により蒸気槽29自体を上昇させることにより、相対
的に被加熱物体4がまず二次蒸気13に浸漬され、次に
一次蒸気7に浸漬され、その後、昇降装置34により蒸
気槽29を下降させることにより再び二次蒸気13に浸
漬され、次に二次蒸気レベルよりも上に出る。この際、
被加熱物体4の各々二次蒸気13、一次蒸気7に浸漬さ
れる時間は昇降装置をタイマー仕掛けで動かすことによ
り容易に可変できる。EXAMPLE FIG. 3 shows an example of the present invention, and FIG. 3 will be described. A window is provided on the upper portion of the outer frame 2.
The outer frame 2 and the steam tank 29 have an integrated structure via a lifting device 34. The outer frame 2 is integrally formed with a supporting portion 3, and the supporting portion 3 has a structure capable of fixing the object 4 to be heated. The primary inert liquid 9 having a high boiling point (215 ° C.) is previously injected in the lower part in the steam tank 29, and the secondary inert liquid retention tank 30
A secondary inert liquid 24 having a low boiling point (150 ° C.) is injected in the chamber. In order to operate this, first, cooling water is passed through the water-cooled secondary steam condenser 31, and then the heater 8 is energized. The primary vapor 7 is generated from the heated high-boiling-point primary inert liquid 9, but when it rises above the lower weir 32, the primary vapor 7 comes into contact with the secondary inert liquid retention tank 30 and is cooled and condensed. To do. The primary vapor condensate liquid 26 passes through the communication pipe 34 and returns to the inside of the vapor tank 29. On the other hand, the secondary inert liquid 24 in the secondary inert liquid retention tank 30 is heated by the latent heat of condensation of the primary vapor 7 to generate the secondary vapor 25. Secondary steam 13
When the secondary steam level 12 at the upper end of the above rises above the upper weir 33, the secondary steam 13 is cooled by the cold water secondary steam condenser 31.
Since water in the air may also condense and mix into the secondary vapor condensate 22 that contacts with, cools and condenses, after the water is removed by the water remover 23, the secondary inert liquid is removed. It flows into the retention tank 30. In addition, since the secondary inert liquid 24 in the secondary inert liquid retention tank 30 may be diffused and decreased, the secondary inert liquid 24 is injected at any time in an amount commensurate with the amount of emission. As a result of the above operation, as a result, the primary steam 7 and the secondary steam 13 always exist in the steam tank, and the boundary 14 between the primary steam 7 and the secondary steam 13 is fixed almost above the lower weir 32. The secondary steam level 12 is fixed to a position slightly above the upper weir 33. In this state, the lifting device 3
4, the object to be heated 4 is relatively immersed in the secondary steam 13 first, and then in the primary steam 7, and then the elevating device 34 descends the steam tank 29. It is again immersed in the secondary steam 13 and then above the secondary steam level. On this occasion,
The time in which the heated object 4 is immersed in the secondary steam 13 and the primary steam 7 can be easily changed by moving the lifting device with a timer.
【0007】[0007]
【発明の効果】このような構造になっているからその効
果としては、被加熱物体4が動くことなく、被加熱物体
を酸素濃度のごく低い不活性雰囲気である二次蒸気13
の中で予熱でき、更に二次蒸気と同様不活性雰囲気であ
る一次蒸気7の中ではんだ付を行なうことができ、この
間上部の窓から被加熱物体4の予熱及はんだ付の各段階
を目視観察したり高倍率の高速度カメラ等で撮影するこ
とが容易となる。更に、被加熱物体4が動かないので、
はんだ付が安定して行なえる。The effect of the present invention is that the object 4 to be heated does not move and the object to be heated 4 is in an inert atmosphere with a very low oxygen concentration.
Can be preheated and the soldering can be performed in the primary steam 7 which is an inert atmosphere like the secondary steam. During this time, each step of preheating and soldering of the object 4 to be heated can be visually inspected from the upper window. It becomes easy to observe and photograph with a high speed high speed camera or the like. Furthermore, since the heated object 4 does not move,
Stable soldering can be performed.
【図1】従来例の1つである特願平4−351179
「バッチ式気相はんだ付装置」の縦断面図である。FIG. 1 Japanese Patent Application No. 4-351179, which is one of conventional examples.
It is a longitudinal cross-sectional view of a "batch type vapor phase soldering apparatus".
【図2】従来例の1つである米国コペイン社の気相はん
だ付装置(日本には出願されておらず)の縦断面図であ
る。FIG. 2 is a vertical cross-sectional view of a vapor phase soldering device (not filed in Japan) of Copaine, Inc., which is one of the conventional examples.
【図3】本発明の請求項1の実施例を示す縦断面図であ
る。FIG. 3 is a vertical sectional view showing an embodiment of claim 1 of the present invention.
1 窓 2 外枠 3 支持部 4 被加熱物体 5 不活性蒸気レベル 6 蒸気凝縮器 7 不活性蒸気 8 ヒーター 9 不活性液体 11 昇降式支持部 12 二次蒸気レベル 13 二次蒸気 14 一次蒸気と二次蒸気との境界 21 空冷式二次蒸気凝縮器 22 二次蒸気凝縮液 23 水分除去器 24 二次不活性液 25 二次蒸気 26 一次蒸気凝縮液 27 一次蒸気凝縮液の還流液 28 断熱材 30 二次不活性液滞留槽 31 冷水式二次蒸気凝縮器 32 下部せき 33 上部せき 34 昇降装置 1 Window 2 Outer Frame 3 Support Part 4 Heated Object 5 Inert Vapor Level 6 Vapor Condenser 7 Inert Vapor 8 Heater 9 Inert Liquid 11 Elevating Support Part 12 Secondary Vapor Level 13 Secondary Vapor 14 Primary Vapor and Secondary Boundary with Secondary Steam 21 Air-cooled Secondary Steam Condenser 22 Secondary Steam Condensate 23 Moisture Remover 24 Secondary Inert Liquid 25 Secondary Steam 26 Primary Steam Condensate 27 Reflux Liquid of Primary Steam Condensate 28 Insulation 30 Secondary inert liquid retention tank 31 Cold water secondary steam condenser 32 Lower weir 33 Upper weir 34 Lifting device
Claims (1)
く、沸点の異なる2種類の不活性液体が注入された単一
の蒸気槽自体を昇降させ相対的に被加熱物体を順次、沸
点の異なる2種類の蒸気相中へ浸漬し、引き上げること
によりはんだ付することを特徴とするバッチ式気相はん
だ付装置。1. A single vapor tank, into which two kinds of inert liquids having different boiling points are injected, is moved up and down without moving the object to be soldered, and the objects to be heated sequentially have different boiling points. A batch type vapor phase soldering device, which is characterized in that it is dipped in two kinds of vapor phases and then pulled up for soldering.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9682594A JPH07273443A (en) | 1994-03-31 | 1994-03-31 | Batch system vapor phase soldering equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9682594A JPH07273443A (en) | 1994-03-31 | 1994-03-31 | Batch system vapor phase soldering equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07273443A true JPH07273443A (en) | 1995-10-20 |
Family
ID=14175344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9682594A Pending JPH07273443A (en) | 1994-03-31 | 1994-03-31 | Batch system vapor phase soldering equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07273443A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3851235A1 (en) * | 2020-01-15 | 2021-07-21 | Helmut Walter Leicht | Device and method for controlled heat transfer, in particular by a condensing liquid on workpieces of larger dimensions and masses |
-
1994
- 1994-03-31 JP JP9682594A patent/JPH07273443A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3851235A1 (en) * | 2020-01-15 | 2021-07-21 | Helmut Walter Leicht | Device and method for controlled heat transfer, in particular by a condensing liquid on workpieces of larger dimensions and masses |
WO2021144332A1 (en) * | 2020-01-15 | 2021-07-22 | Helmut Walter Leicht | Device and method for controlled heat transfer, in particular to workpieces of large dimensions and masses by means of a condensing liquid |
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