JPH07270633A - Method for working optical parts - Google Patents
Method for working optical partsInfo
- Publication number
- JPH07270633A JPH07270633A JP6057178A JP5717894A JPH07270633A JP H07270633 A JPH07270633 A JP H07270633A JP 6057178 A JP6057178 A JP 6057178A JP 5717894 A JP5717894 A JP 5717894A JP H07270633 A JPH07270633 A JP H07270633A
- Authority
- JP
- Japan
- Prior art keywords
- blade
- groove
- cutting
- optical waveguide
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は基板上に形成された光
導波路と交差した反射用溝をその基板に形成する光部品
加工方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of processing an optical component in which a reflecting groove intersecting an optical waveguide formed on a substrate is formed on the substrate.
【0002】[0002]
【従来の技術】例えば図1に示すように、二重イオン交
換ガラス基板11上にその表面下約10μmの位置に光
導波路12が形成されている。この光導波路12と交差
して反射用溝13が形成され、例えば基板11の表面と
45°傾斜し、光導波路12の延長方向と、基板表面と
平行な面内で直角に交差した反射用溝13が形成され
る。光導波路12を例えば図において左から進行して来
た光が反射用溝13に達し、その光導波路12の切断面
で反射されて光14として外部へ出射される。2. Description of the Related Art For example, as shown in FIG. 1, an optical waveguide 12 is formed on a double ion exchange glass substrate 11 at a position of about 10 μm below the surface thereof. A reflection groove 13 is formed so as to intersect with the optical waveguide 12, for example, is inclined at 45 ° with respect to the surface of the substrate 11 and intersects the extension direction of the optical waveguide 12 at a right angle in a plane parallel to the substrate surface. 13 is formed. For example, the light traveling from the left in the optical waveguide 12 in the figure reaches the reflection groove 13, is reflected by the cut surface of the optical waveguide 12, and is emitted to the outside as light 14.
【0003】このように光導波路と交差した反射用溝1
3を形成することにより、光部品から光を外部へ出射さ
せたり、逆に外部から光を光部品内に入射させることが
できる。このような反射用溝13の形成を従来において
は直径30mm、厚さ30μmのセラミック(SiC)
よりなる円板状ブレードを50.000rpmの速度で回転さ
せ、研磨砥粒を含んだ冷却液を注ぎながら基板11を切
削させ、加工速度0.1 〜0.2 mm/minで行ってい
た。The reflection groove 1 intersecting the optical waveguide in this way
By forming 3, the light can be emitted from the optical component to the outside, or conversely, the light can be made incident from the outside into the optical component. Conventionally, such a reflection groove 13 is formed by a ceramic (SiC) having a diameter of 30 mm and a thickness of 30 μm.
The disk-shaped blade was made to rotate at a speed of 50.000 rpm, the substrate 11 was cut while pouring a cooling liquid containing abrasive grains, and the processing speed was 0.1 to 0.2 mm / min.
【0004】[0004]
【発明が解決しようとする課題】従来の加工法により形
成された反射用溝では、前記図1に示した光導波路12
は、ビーム直径が約10μmで単一モード光ファイバの
モード径に一致し、伝搬損失は約0.2 dB/cmである
が、反射用溝13による全反射の損失は1.5μm波長に
対し1.02dBと比較的大きいという問題があった。In the reflection groove formed by the conventional processing method, the optical waveguide 12 shown in FIG. 1 is used.
Has a beam diameter of about 10 μm, which corresponds to the mode diameter of a single-mode optical fiber and has a propagation loss of about 0.2 dB / cm, but the total reflection loss due to the reflection groove 13 is 1.5 μm for a wavelength of 1.5 μm. There was a problem that it was relatively large as 02 dB.
【0005】従来の加工法で形成された反射用溝13の
側面、つまり全反射面は、顕微鏡でみると、小さい筋乃
至ひゞが入っている。The side surface of the reflection groove 13 formed by the conventional processing method, that is, the total reflection surface has small streaks or crevices when viewed under a microscope.
【0006】[0006]
【課題を解決するための手段】この発明によれば、ダイ
ヤモンド粒入りレジンからなる円板状ブレードを回転さ
せて基板を切削して反射用溝を形成する。According to the present invention, a disc-shaped blade made of a resin containing diamond grains is rotated to cut a substrate to form a reflection groove.
【0007】[0007]
【実施例】以下この発明の実施例を説明する。ブレード
として、粒度が#6.000(粒径2μm〜2.5 μm) の
ダイヤモンド粒子をフェノール樹脂、ポリイミド樹脂、
変性フェノール樹脂などの樹脂材に混入したダイヤモン
ド粒入りレジンよりなる直径32mm、厚さ300μm
の円板状のものを用いた。このブレードを20.000rpm
で回転させ、粒径が0.24μmのSiO2 よりなる研磨
砥粒を、水に5重量%含ませた冷却液を注ぎながら、前
記した表面下約10μmの位置に光導波路が形成されて
いる二重イオン交換ガラスの光導波路基板に対し、その
表面に45°の傾斜をさせて切削し、その加工速度を0.
1〜0.2mm/minとして反射用溝13を形成した。Embodiments of the present invention will be described below. As a blade, diamond particles with a particle size of # 6.000 (particle size 2 μm to 2.5 μm) are phenol resin, polyimide resin,
Diameter 32mm, thickness 300μm made of resin with diamond grains mixed in resin material such as modified phenolic resin
The disk-shaped one was used. 20.000 rpm with this blade
The optical waveguide is formed at a position of about 10 μm below the surface while pouring a cooling liquid containing 5% by weight of polishing abrasive grains made of SiO 2 having a particle size of 0.24 μm in water. The optical waveguide substrate of double ion exchange glass is cut with a 45 ° inclination on the surface and the processing speed is set to 0.
The reflection groove 13 was formed at a rate of 1 to 0.2 mm / min.
【0008】この場合の反射用溝13での全反射の損失
は1.5μm波長に対し、0.3dBとなり、従来よりも著
しく改善された。また顕微鏡で観察した所、全反射面に
は筋乃至ひびは見つからなかった。このようにこの発明
の方法により、優れた反射面が得られるのは、ダイヤモ
ンド粒入りブレードを用いているため硬く、切削加工に
ブレードのぶれが生じないこと、また切削性がよいこ
と、更にブレードの側面に接している粒径の小さいダイ
ヤモンドにより、切削により生じる溝の側面が研磨さ
れ、溝の側面が滑らかになるためと思われる。In this case, the total reflection loss in the reflection groove 13 is 0.3 dB with respect to the wavelength of 1.5 μm, which is a significant improvement over the conventional case. When observed under a microscope, no streak or crack was found on the total reflection surface. As described above, according to the method of the present invention, an excellent reflecting surface can be obtained because it is hard because a diamond grain-containing blade is used, no deviation of the blade occurs in the cutting process, and the cutting property is good. It is considered that the side surface of the groove formed by cutting is polished by the diamond having a small grain size, which is in contact with the side surface of, and the side surface of the groove becomes smooth.
【0009】特に前記例ではブレードの厚さが300μ
mと従来の10倍もあり、ぶれが一層生じ難く、また研
磨砥粒を含む冷却液を注ぎながら切削しているため、そ
の砥粒とダイヤモンド粒入りレジンのブレードの側面と
により、溝の側面が研磨されるためと思われる。これに
対し、従来のセラミックブレードは、薄いため、高速回
転させて遠心力によりぶれが生じ難いようにしている
が、切削中にブレードにぶれが生じ、溝側面と接触して
溝側面に筋がつくためと思われる。またセラミックブレ
ードは切削性が悪く、切削量が少ないのを多少無理して
削り取るため、ひびが入るためとも思われる。Particularly in the above example, the thickness of the blade is 300 μm.
m, which is 10 times that of the conventional one, and blurring is less likely to occur, and because the cutting is performed while pouring a cooling liquid containing abrasive grains, the side faces of the groove due to the abrasive grains and the side face of the diamond grain resin blade. Seems to be polished. On the other hand, since the conventional ceramic blade is thin, it is rotated at a high speed to make it difficult for the shake to occur due to centrifugal force. It seems that it is to get on. It is also considered that the ceramic blade has poor machinability, and because the amount of cutting is small, it is forcibly abraded and cracked.
【0010】上述において光導波路形成基板としてはガ
ラス基板に限らず、他の基板で構成されていてもよい。
また上記反射用溝の形成の具体的数値は実施例であり、
これらの数値には可成りの幅が許容されるものである。
また反射用溝は全反射用のみならず、光導波路とのなす
角度の選定などにより、一部反射、一部透過の面とする
こともできる。In the above description, the optical waveguide forming substrate is not limited to the glass substrate and may be composed of other substrates.
Further, the specific numerical value of the formation of the reflection groove is an example,
A considerable range is allowed for these numbers.
The reflection groove is not limited to total reflection, and may be a partially reflective or partially transmissive surface depending on the selection of the angle with the optical waveguide.
【0011】[0011]
【発明の効果】以上述べたようにこの発明の加工方法に
よれば、従来の加工方法よりも、損失が著しく少ない反
射用溝を形成することができる。As described above, according to the processing method of the present invention, it is possible to form the reflection groove with much less loss than the conventional processing method.
【図1】Aは光部品としての光導波路基板を示す断面
図、Bはその平面図である。FIG. 1A is a cross-sectional view showing an optical waveguide substrate as an optical component, and B is a plan view thereof.
Claims (1)
た反射用溝を上記基板に形成する光部品加工方法におい
て、 ダイヤモンド粒入りレジンからなる円板状ブレードを回
転させて上記基板を切削して上記反射用溝を形成するこ
とを特徴とする光部品加工方法。1. A method for processing an optical component, wherein a reflection groove intersecting an optical waveguide formed on a substrate is formed on the substrate, the disc-shaped blade made of a resin containing diamond grains is rotated to cut the substrate. And a groove for reflection is formed to process the optical component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP05717894A JP3312187B2 (en) | 1994-03-28 | 1994-03-28 | Optical component processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP05717894A JP3312187B2 (en) | 1994-03-28 | 1994-03-28 | Optical component processing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07270633A true JPH07270633A (en) | 1995-10-20 |
JP3312187B2 JP3312187B2 (en) | 2002-08-05 |
Family
ID=13048278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP05717894A Expired - Fee Related JP3312187B2 (en) | 1994-03-28 | 1994-03-28 | Optical component processing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3312187B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5999670A (en) * | 1996-07-31 | 1999-12-07 | Nippon Telegraph And Telephone Corporation | Optical deflector, process for producing the same, and blade for use in production of optical deflector |
-
1994
- 1994-03-28 JP JP05717894A patent/JP3312187B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5999670A (en) * | 1996-07-31 | 1999-12-07 | Nippon Telegraph And Telephone Corporation | Optical deflector, process for producing the same, and blade for use in production of optical deflector |
Also Published As
Publication number | Publication date |
---|---|
JP3312187B2 (en) | 2002-08-05 |
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