JPH07266331A - Method for cutting single crystal - Google Patents

Abstract

PURPOSE:To largely reduce the cracking of a silicate compound single crystal by converting liquid to be used for cooling to non-aqueous liquid. CONSTITUTION:When a bond of Si-O exists in a crystal lattice, the bond of the Si-O on a surface of a crystal is hydrogen-bonded to water when it is cut by using the water, thereby becoming easy to cut. Thus, in the process using the water, the crystal is easily cracked. Accordingly, if the water is not used to cut the crystal, the cracking is prevented. As this non-aqueous liquid, liquid containing no water such as oil, organic compound used widely as organic solvent, etc., is used. Occurrence of the cracking can be completely prevented under the conditions using the oil as refrigerant, thereby largely reducing occurrence rate of the cracking.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a single crystal used in electronic equipment and the like.

[0002]

2. Description of the Related Art Processing for cutting a single crystal such as a cerium-activated gadolinium silicate single crystal has been conventionally cooled with a liquid mainly composed of water so that the temperature does not rise due to friction between the crystal and a rotary blade. .

[0003]

However, this method has a problem that the crystal is easily broken. The present invention provides a method for preventing cracking by cutting a single crystal by using oil as a refrigerant.

[0004]

SUMMARY OF THE INVENTION In order to achieve the above object, the present inventors have made the present invention by finding that the above object can be achieved by processing a crystal without using water. It is a thing. Oil is preferably used as the liquid for cooling the rotary blade. Further, the present invention is preferably applied to a cutting method using an inner peripheral blade for processing a single crystal.

[0005]

When the crystal lattice has a Si-O bond, it is considered that in the cutting method using water, the Si-O bond on the crystal surface is hydrogen-bonded to water, so that the bond is easily broken. Therefore, it is considered that cracks are likely to occur in the crystal in the processing using water. Therefore, it is possible to prevent cracking unless water is used for cutting the crystal. The non-aqueous liquid is a liquid containing no water, and for example, oil, organic compounds widely used as organic solvents, and the like can be used.

[0006]

【Example】

Comparative Example Cerium Activated Gadolinium Silicate Single Crystal (Ce: Gd ₂ S
An example in the case of iO ₅ ) will be described. First, φ50 × 180m
The crystal of m was grown by the Czochralski method. This crystal was cut using an inner cutter. The rotary blade was cooled with water during the crystal cutting. Two single crystals were cut by this method.

Example A GSO single crystal was cut with an inner blade cutter in the same manner as in the comparative example. Crystals of φ50 × 180 mm were cut using an inner blade cutter. The rotary blade was cooled with oil during the crystal cutting. Two crystals were cut by this method. The cracks and the incidence of cracks caused by cutting in the examples of the present invention were compared with the cutting results of the comparative examples. The results are shown in Table 1.

[0008]

[Table 1] GSO cracking rate and cracking rate ───────────────────────────────── Comparative Example Example ─ ──────────────────────────────── Crack occurrence rate (book / book) 2/2 0/2 ─── ──────────────────────────────

As can be seen from this table, 100% cracking occurred under the condition that water was used as the refrigerant in the comparative example. It can be seen that under the condition that oil is used as the refrigerant in the example, the occurrence of cracking can be completely prevented, and the rate of occurrence of cracking can be greatly reduced. Although the embodiments of the present invention have described the cutting method, similar effects can be obtained when water is used for other processing. Further, although the case where oil is used as the cooling liquid has been described in the examples, similar results can be expected even if the liquid other than water-containing liquid is not oil.

[0010]

According to the cutting method of the present invention, crystal cracking can be significantly reduced.

Claims (1)

[Claims] 1. A method for processing a single crystal in which a liquid used for cooling is a non-aqueous liquid when processing a silicate compound single crystal while cooling with a liquid.