JPH07263918A - Microwave integrated circuit device - Google Patents

Abstract

PURPOSE:To miniaturize the entire structure by sharing a magnet at the time of constituting the integrated circuit where the magnet is used in metallic substrates facing each other. CONSTITUTION:A base plate 12a and a dielectric substrate 13a are arranged on one substrate 11a of two metallic substrates 11a and 11b facing each other. A ferrite substrate 14a is provided on the base plate 12a, and a metallic film pattern 15a is formed on surfaces of substrates 14a and 13a, and a spacer 17a made of a Teflon material is provided between the metallic film pattern 15a and a magnet 16 arranged under this pattern 15a. This spacer 17a is provided for the purpose of preventing direct contact between the metallic film pattern 15a and the magnet 16. As a result, the circulator is constituted so that a magnetic field (dot-line arrows) is given to the part of the metallic pattern part 15a by the magnet 16. Another circulator having the same constitution is constituted on the other substrate 11b. Consequently, the entire structure is made thinner in comparison with the use of two magnets because circulators formed on two metallic substrates 11a and 11b use the common magnet 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave integrated circuit device using a magnet such as a circulator or an isolator used in a microwave band or a millimeter wave band.

[0002]

2. Description of the Related Art A conventional microwave integrated circuit device will be described with reference to FIG. 4, taking as an example a case where circulators are respectively formed on two metal substrates. FIG. 4 is a cross-sectional view of the main part, and 41a and 41b are two metal substrates facing each other. A base plate 42a and a dielectric substrate 43a are arranged on one metal substrate, for example, 41a. A ferrite substrate 44a is provided on the base plate 42a. The metal film pattern 45 is formed on the surface of the ferrite substrate 44a or the dielectric substrate 43a.
a is formed. The metal film pattern 45a is connected to a microstrip line (not shown) formed on the surface of the dielectric substrate 43 and radially branched in, for example, three directions. The magnet 4 is provided below the metal film pattern 45a.
6a is arranged, and the magnet 46a and the metal film pattern 45 are arranged.
A spacer 47a made of a material such as Teflon is provided between a. The spacer 47a is a metal film pattern 45.
It is designed so that a and the magnet 46a do not directly contact with each other. Further, the magnet 46a applies a magnetic field as indicated by a dotted arrow to the metal film pattern 45a to form a circulator.
If the circulator consists of three branches,
A resistor may be connected to the one branch to function as an isolator.

A circulator having a similar structure is also formed on the other metal substrate 41b. That is, the base plate 42b and the dielectric substrate 43b are arranged on the metal substrate 41b. Further, the ferrite substrate 44b is arranged on the base plate 42b. And the ferrite substrate 4
4b or a dielectric substrate 43b is formed with a metal film pattern 45b. The metal film pattern 45b is, for example, a microstrip line (not shown) radially branched in three directions.
Connected to. Further, the magnet 46b is arranged above the metal film pattern 45b. Magnet 46b and metal film pattern 4
A spacer 47b made of a material such as Teflon is provided between the 5b to prevent the metal film pattern 45b and the magnet 46b from directly contacting each other. The magnet 46b applies a magnetic field as indicated by a dotted arrow to the metal film pattern 45b to form a circulator. In this case also, a resistor can be connected to one branch forming the circulator to function as an isolator. The arrows shown on the metal substrates 41a and 41b in FIG. 4 indicate the traveling directions of electromagnetic waves.

As described above, in the conventional microwave integrated circuit device, the two metal substrates 41a, 41 facing each other are provided.
When an integrated circuit using magnets for b, for example, a circulator is configured, an independent magnet is used for each circulator.

[0005]

In the conventional microwave integrated circuit device, when the circulator is formed on the facing metal substrate surfaces, a separate magnet is used for each circulator. Therefore, as shown in A of FIG.
A mutual interference region occurs between the two magnets. When mutual interference occurs between magnets, the magnetic field is distorted and becomes complicated. For this reason, it becomes difficult to analyze the magnetic field and it becomes difficult to apply an appropriate magnetic field, and characteristics such as VSWR, insertion loss, and isolation cannot be realized as designed.

In order to eliminate the mutual interference between the magnets as described above, for example, a metal wall for blocking the magnetic field is provided between the magnets or the magnets are separated from each other. Therefore, the whole structure becomes thick and large,
The price will also be high.

The present invention solves the above-mentioned drawbacks and provides a microwave integrated circuit device in which the magnets are shared when the two integrated circuits using the magnets are formed and the overall structure is miniaturized. The purpose is to do.

[0008]

In the microwave integrated circuit device of the present invention, a metal film pattern connected to a microstrip line branched in a plurality of directions is formed on one surface,
A first ferrite substrate having the other surface in contact with the metal film, and one magnet for applying a magnetic field to the metal film pattern portion,
A metal film pattern connected to a microstrip line branched in a plurality of directions is formed on one surface, the other surface is in contact with the metal film, and a magnetic field is applied to the metal film pattern portion from the magnet. It is composed of a second ferrite substrate.

Further, a spacer is provided between at least one of the metal film patterns formed on each of the first ferrite substrate surface and the second ferrite substrate surface and the magnet.

Further, the high frequency shield plate supports the magnet.

[0011]

According to the above structure, the magnets are shared when the integrated circuits are formed using the magnets on the two metal substrates facing each other. Therefore, the entire structure can be downsized.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. 1, taking as an example the case where circulators are formed on two metal substrates facing each other. Note that FIG. 1 is a cross-sectional view of the main part.

Reference numerals 11a and 11b are two metal substrates facing each other. The base plate 12a and the dielectric substrate 13a are arranged on one of the metal substrates, for example, 11a. A ferrite substrate 14a is provided on the base plate 11a. Then, the ferrite substrate 14
A metal film pattern 15a is formed on the surface of a and the dielectric substrate 13a. The metal film pattern 15a is used for the dielectric substrate 1
For example, it is connected to a microstrip line (not shown) formed on the surface 3a and radially branched in three directions. A magnet 16 is arranged below the metal film pattern 15a, and a spacer 17a made of a material such as Teflon is provided between the magnet 16 and the metal film pattern 15a.
The spacer 17a prevents the metal film pattern 15a and the magnet 16 from directly contacting each other. With the above configuration, a magnetic field as indicated by a dotted arrow is applied to the magnet 1 in the metal film pattern 15a.
The circulator is provided by 6. When the circulator is composed of three branches, a resistor can be connected to the one branch to function as an isolator.

A circulator having a similar structure is also formed on the other metal substrate 11b. That is, the base plate 12b and the dielectric substrate 13b are arranged on the metal substrate 11b. Further, the ferrite substrate 14b is provided on the base plate 12b. And the ferrite substrate 1
The metal film pattern 15b is formed on 4b and the dielectric substrate 13b. The metal film pattern 15b is used for the dielectric substrate 1
For example, it is connected to a microstrip line (not shown) formed on 3b and radially branched in three directions.
Then, a magnetic field as indicated by a dotted arrow is applied to the metal film pattern 15b portion by the magnet 16 to form a circulator. A spacer 17b made of a material such as Teflon is provided between the magnet 16 and the metal film pattern 15b to prevent the metal film pattern 15b and the magnet 16 from directly contacting each other. A resistor may be connected to one branch of the circulator to function as an isolator. Further, in FIG. 1, the arrows shown on the metal substrates 11a and 11b represent the traveling directions of electromagnetic waves.

According to the above-described embodiments, the circulators formed on the two metal substrates 11a and 11b use the same magnet. Therefore, the entire structure can be made thinner than the case where two magnets are used. Further, unlike the case where there are two magnets, there is no mutual interference of the lines of magnetic force, so that good isolation and VSWR characteristics can be obtained without providing a metal wall for blocking the magnetic field between the magnets.

FIG. 2 is a cross-sectional view of a main part showing another embodiment of the present invention. The magnet 16 and the metal film pattern 1 in FIG.
The spacer 17a between 5a is eliminated, and the portion is made a void. The same parts as those in FIG. 1 are designated by the same reference numerals, and the duplicated description is omitted.

FIG. 3 is a cross-sectional view of the main part showing another embodiment of the present invention, which is a spacer 17a, 1a between the magnet 16 and the two metal film patterns 15a, 15b in FIG.
7b is eliminated and the portion is made a void. The high-frequency shield plate 31 supports the magnet 16. In addition,
The high-frequency shield plate 31 has a function of supporting the magnet 16 and also prevents the influence of signals that transmit the two microstrip lines close to each other. In the case of FIG. 3 as well, the same parts as those in FIG.

In the above embodiments, the case where the metal pattern is connected to the microstrip line branched in three directions has been described. However, the present invention can also be applied to a case where a metal pattern portion to which a magnetic field is applied is connected to a microstrip line that branches in two directions, as in the case of configuring an isolator.

[0019]

According to the present invention, in the case of forming an integrated circuit using a magnet on two substrates facing each other, by sharing the magnet, the entire structure can be downsized, and a microwave integrated circuit having excellent characteristics can be obtained. The device can be realized.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a sectional view showing another embodiment of the present invention.

FIG. 3 is a sectional view showing another embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 11a, 11b ... Metal substrate 12a, 12b ... Base plate 13a, 13b ... Dielectric substrate 14a, 14b ... Ferrite substrate 15a, 15b ... Metal film pattern 16a ... Magnet 17a, 17b ... Spacer

Claims (3)

[Claims] 1. A first ferrite substrate in which a metal film pattern connected to a microstrip line branching in a plurality of directions is formed on one surface and the other surface is in contact with the metal film, and a magnetic field is applied to the metal film pattern portion. And a metal film pattern connected to the microstrip line branching in a plurality of directions are formed on one surface, the other surface is in contact with the metal film, and with respect to the metal film pattern portion. A microwave integrated circuit device comprising: a second ferrite substrate to which a magnetic field is applied from the magnet. 2. A spacer is provided between the magnet and at least one of the metal film patterns formed on the surface of the first ferrite substrate and the surface of the second ferrite substrate, respectively. 1. The microwave integrated circuit device according to 1. 3. The microwave integrated circuit device according to claim 1, wherein the magnet is supported by a high-frequency shield plate.