JPH04160804A - Monolithic antenna - Google Patents
Monolithic antennaInfo
- Publication number
- JPH04160804A JPH04160804A JP28671790A JP28671790A JPH04160804A JP H04160804 A JPH04160804 A JP H04160804A JP 28671790 A JP28671790 A JP 28671790A JP 28671790 A JP28671790 A JP 28671790A JP H04160804 A JPH04160804 A JP H04160804A
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- radiation
- conductor
- microwave integrated
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 39
- 230000005855 radiation Effects 0.000 claims abstract description 25
- 239000004065 semiconductor Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 25
- 239000003990 capacitor Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 abstract description 3
- 238000010168 coupling process Methods 0.000 abstract description 3
- 238000005859 coupling reaction Methods 0.000 abstract description 3
- 230000000644 propagated effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
この発明はマイクロ波集積回路とマイクロストリップア
ンテナを半導体から成る基板に一体構成したモノリシッ
クアンテナに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a monolithic antenna in which a microwave integrated circuit and a microstrip antenna are integrated on a substrate made of semiconductor.
[従来の技術]
従来とシテは、例えば阿ICROWAVE JO[JR
NAL MARCH1988pp、 113−125に
掲載された°’MONOLITHICPHASED A
RRAYS FOREHF COMMtJNICATI
ONS TERMINALS″に示された半導体基板に
構成したモノリシックアンテナがある。第3図はこの従
来のモノリシックアンテナの構成例を示すものである。[Conventional technology] Conventional technology and shite are, for example, ACROWAVE JO [JR
°'MONOLITHICPHASED A published in NAL MARCH1988pp, 113-125
RRAYS FOREHF COMMtJNICATI
There is a monolithic antenna constructed on a semiconductor substrate as shown in "ONS TERMINALS". FIG. 3 shows an example of the construction of this conventional monolithic antenna.
ここで1本発明はアンテナとモノリシックマイクロ波集
積回路を一体化したものであるが、マイクロ波集積回路
の個々の構成回路に関するものでなく、アンテナとマイ
クロ波集積回路を一体化する構成法に関するものである
。従って、図についての説明もマイクロ波集積回路の個
々の構成回路の詳細説明は省く。第3図の従来例は4素
子のモノリシックアンテナの例である。図において1は
半導体基板で例えばガリウム砒素やシリコンが半導体と
して用いられている。2は半導体基板1の一方の面に設
けられた地導体で、半導体基板1の他方の面の四隅には
放射導体3が構成され、地導体2と共にマイクロストリ
ップアンテナ4を構成する。Here, 1. Although the present invention integrates an antenna and a monolithic microwave integrated circuit, it does not relate to the individual constituent circuits of the microwave integrated circuit, but relates to a configuration method for integrating the antenna and the microwave integrated circuit. It is. Therefore, detailed explanations of the individual constituent circuits of the microwave integrated circuit will be omitted from the explanations regarding the figures. The conventional example shown in FIG. 3 is an example of a four-element monolithic antenna. In the figure, reference numeral 1 denotes a semiconductor substrate in which, for example, gallium arsenide or silicon is used as a semiconductor. Reference numeral 2 denotes a ground conductor provided on one surface of the semiconductor substrate 1. Radiation conductors 3 are formed at the four corners of the other surface of the semiconductor substrate 1, and together with the ground conductor 2, a microstrip antenna 4 is formed.
さらにマイクロストリップ線路5が回路構成用線路とな
った増幅器6や移相器7等の回路が構成される。これら
の回路は半導体素子として電界効果トランジスタやここ
では図示していないがキャパシタ、インダクタ、抵抗器
等の回路素子を用いて構成したモノリシックマイクロ波
集積回路となっている。すなわち一つの半導体基板1に
上記マイクロストリップアンテナ4を構成する放射導体
3およびマイクロ波集積回路が一体構成されておりモノ
リシックアンテナと呼ばれている。Further, circuits such as an amplifier 6 and a phase shifter 7 are configured using the microstrip line 5 as a circuit configuration line. These circuits are monolithic microwave integrated circuits constructed using field effect transistors as semiconductor elements, and circuit elements such as capacitors, inductors, and resistors (not shown here). That is, the radiation conductor 3 and the microwave integrated circuit constituting the microstrip antenna 4 are integrally formed on one semiconductor substrate 1, and is called a monolithic antenna.
従来のモノリシックアンテナは上記のように半導体基板
1の一方の面に放射導体3.増幅器6等が構成されてい
るので、入力端8からマイクロストリップ線ls5を伝
搬してきた電波は、電波が位相器7,7方向に分配され
ると共に各移相器7を通って位相が所定の値に設定され
各増幅器6を通って電波が増幅され、最後にマイクロス
トリップアンテナ4としての放射導体3より空間へ放射
される。The conventional monolithic antenna has a radiation conductor 3 on one side of the semiconductor substrate 1 as described above. Since the amplifier 6 and the like are configured, the radio waves propagating through the microstrip line ls5 from the input end 8 are distributed in the directions of the phase shifters 7 and 7, and the radio waves pass through each phase shifter 7 so that the phase reaches a predetermined level. The radio wave is set to a value, passes through each amplifier 6, is amplified, and is finally radiated into space from the radiation conductor 3 as the microstrip antenna 4.
なお、ここでは説明を簡略化するため増幅器6、移相W
r7の回路に必要なバイアスを印加するためのバイアス
回路は図示を省略している。Note that here, in order to simplify the explanation, the amplifier 6 and the phase shift W
A bias circuit for applying a necessary bias to the circuit r7 is not shown.
[発明が解決しようとする課題]
上記のような従来のモノリシックアンテナは、半導体基
板1の一方の面にマイクロストリップアンテナ4および
マイクロ波集積回路が一体構成されている。マイクロス
トリップアンテナ4は概略172波長の長さの方形導体
や同直径の円盤状の放射導体3が必要なため半導体基板
1の上で大きな面積を占めることになる。さらにマイク
ロストリップアンテナ4を多数配置するアレーアンテナ
ではグレーティングローブが生じないという条件から各
素子アンテナの間隔が1/2波長から1波長近くまでと
決まる。素子アンテナの占める大きさはこの素子アンテ
ナの間隔と同じレベルであり、アンテナ以外の基板が利
用できるスペースは狭く。[Problems to be Solved by the Invention] In the conventional monolithic antenna as described above, a microstrip antenna 4 and a microwave integrated circuit are integrally formed on one surface of a semiconductor substrate 1. The microstrip antenna 4 requires a rectangular conductor with a length of about 172 wavelengths and a disc-shaped radiation conductor 3 with the same diameter, so it occupies a large area on the semiconductor substrate 1. Further, in an array antenna in which a large number of microstrip antennas 4 are arranged, the interval between each element antenna is determined to be from 1/2 wavelength to nearly 1 wavelength on the condition that grating lobes do not occur. The size occupied by the element antenna is on the same level as the spacing between the element antennas, and the space available for the board other than the antenna is small.
そのため移相器7や増幅器6およびマイクロストリップ
線路5の占有できる面積が狭くなり、配置および回路構
成に制約が生じたり、回路が構成できないという問題が
あった。さらにマイクロストリップアンテナ4およびマ
イクロ波集積回路が同一の面に構成されているためマイ
クロ波集積回路の線路等の不連続部から発生する放射が
アンテナの放射特性に影響を与えるという問題があった
。Therefore, the area that can be occupied by the phase shifter 7, the amplifier 6, and the microstrip line 5 is narrowed, and there are problems in that the arrangement and circuit configuration are restricted, or the circuit cannot be configured. Furthermore, since the microstrip antenna 4 and the microwave integrated circuit are arranged on the same plane, there is a problem in that radiation generated from discontinuous parts such as lines of the microwave integrated circuit affects the radiation characteristics of the antenna.
この発明は上記のような問題点を解消するためになされ
たもので、マイクロストリップ線路5の占有できる面積
を広く設定可能とし、さらにアンテナの放射特性を良好
とするものである。This invention was made to solve the above-mentioned problems, and it is possible to set a wide area that can be occupied by the microstrip line 5, and further improve the radiation characteristics of the antenna.
[課題を解決するための手段]
この発明に係わるモノリシックアンテナは、半導体から
成る基板1の第一の面には地導体2を、第二の面にはス
トリップ導体から成る線路5及び半導体素子、キャパシ
タ、インダクタ等の回路素子を形成してマイクロ波集積
回路を構成し、上記基板lの第一の面に設けた地導体2
の一部を除去して地導体2に細隙9を設け、該細隙9を
含め上記地導体2を覆うように誘電体層10を被着し、
上記半導体基板1と一体構成された誘電体層10の、半
導体基板1と接触しない方の面にマイクロストリップア
ンテナ4の放射導体3を形成したものである。[Means for Solving the Problems] A monolithic antenna according to the present invention has a ground conductor 2 on a first surface of a substrate 1 made of a semiconductor, a line 5 made of a strip conductor and a semiconductor element on a second surface, A ground conductor 2 which constitutes a microwave integrated circuit by forming circuit elements such as capacitors and inductors, and which is provided on the first surface of the substrate l.
A part of the ground conductor 2 is removed to form a slit 9 in the ground conductor 2, and a dielectric layer 10 is applied so as to cover the ground conductor 2 including the slit 9.
The radiation conductor 3 of the microstrip antenna 4 is formed on the surface of the dielectric layer 10 that is integrally formed with the semiconductor substrate 1 and does not come into contact with the semiconductor substrate 1.
[作用]
この発明におけるモノリシックアンテナにおいて、増幅
器6で増幅された電波は、細隙9を介して放射導体3よ
り放射される。[Function] In the monolithic antenna of the present invention, the radio waves amplified by the amplifier 6 are radiated from the radiation conductor 3 via the slit 9.
[実施例]
以下、この発明の一実施例を図について説明する。この
発明においては線路を構成する基板として、モノリシッ
ク・マイクロウェーブ・インテグレーテッド・サーキッ
ト(MMIC)に用いられるガリウム砒素(GaAs)
、シリコン(Si)等の半導体基板が対象となる。第
1図はこの発明の一実施例を示したもので第1図(a)
はマイクロストリップアンテナ側から見た図、第1図(
b)は第1図(a)の逆側すなわちマイクロ波集積回路
側から見た図である。図において1は半導体基板、2は
半導体基板1の第一の面に形成された地導体であり、こ
の地導体2の一部に、共振器に対する結合孔の役目を果
たす程度の大きさの細隙9が設けられ、この細隙9およ
び地導体2を覆うように蒸着、プラズマCVD等の化学
的半導体プロセス技術あるいはスクリーン印刷と焼成に
より誘電体層10を設けてマイクロストリップアンテナ
4を構成し、マイクロ波集積回路と合わせ全体としてモ
ノリシックアンテナを構成している。なお、半導体基板
1の第二の面にはストリップ導体から成る線路5及び半
導体素子、キャパシタ、インダクタ等の回路素子を形成
し、誘電体層10の半導体基板1とは反対側の面の四隅
に放射導体3が設けられる。この場合各放射導体3に対
応する部位に各細隙9が形成され、反射側に位置する増
幅器6側に放射導体3を結合している。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings. In this invention, gallium arsenide (GaAs) used in monolithic microwave integrated circuits (MMIC) is used as a substrate constituting the line.
, and semiconductor substrates such as silicon (Si). FIG. 1 shows an embodiment of the present invention, and FIG. 1(a)
is a view from the microstrip antenna side, Figure 1 (
b) is a view seen from the opposite side of FIG. 1(a), that is, from the microwave integrated circuit side. In the figure, 1 is a semiconductor substrate, 2 is a ground conductor formed on the first surface of the semiconductor substrate 1, and a part of this ground conductor 2 has a thin hole large enough to serve as a coupling hole for the resonator. A gap 9 is provided, and a dielectric layer 10 is provided so as to cover the gap 9 and the ground conductor 2 by vapor deposition, chemical semiconductor process technology such as plasma CVD, or screen printing and baking, thereby configuring the microstrip antenna 4. Together with the microwave integrated circuit, the whole constitutes a monolithic antenna. Note that lines 5 made of strip conductors and circuit elements such as semiconductor elements, capacitors, and inductors are formed on the second surface of the semiconductor substrate 1, and at the four corners of the surface of the dielectric layer 10 opposite to the semiconductor substrate 1. A radiation conductor 3 is provided. In this case, each slit 9 is formed at a portion corresponding to each radiation conductor 3, and the radiation conductor 3 is coupled to the amplifier 6 side located on the reflection side.
この構成によるモノリシックアンテナでは、送信状態を
考えると給電側のマイクロ波集積回路の入力端8からマ
イクロストリップ線路5を伝搬してきた電波は、移相器
7を通って位相が所定の値に設定され増幅器6を通って
電波が増幅され、共振器に対する結合孔の役目を果たす
細隙9を介して共振器の一種であるマイクロストリップ
アンテナ4を構成する反対側の放射導体3へ電波が伝搬
して行き空間へ放射される。In the monolithic antenna with this configuration, considering the transmission state, the radio waves propagating through the microstrip line 5 from the input end 8 of the microwave integrated circuit on the feeding side pass through the phase shifter 7, and the phase is set to a predetermined value. The radio wave is amplified through the amplifier 6, and propagated to the radiation conductor 3 on the opposite side, which constitutes the microstrip antenna 4, which is a type of resonator, through the slit 9, which serves as a coupling hole for the resonator. and is radiated into space.
以上は放射導体3より成るマイクロストリップアンテナ
4が4素予め場合について説明したが第2図に示すよう
に多素子のアレーアンテナとしても良く、この場合には
アンテナ素子の面積にマイクロ波集積回路の配置が制約
を受けること無く本発明の効果が一層発揮できる。The above description is based on the case where the microstrip antenna 4 made of the radiation conductor 3 has four elements, but it may also be a multi-element array antenna as shown in FIG. The effects of the present invention can be further exhibited without restrictions on the arrangement.
[発明の効果]
以上のように、この発明によるモノリシックアンテナは
、半導体基板の第一の面に設けた地導体の一部に細隙が
設けられ、該細隙を含め上記地導体を覆うように層状の
誘電体層を被着させ、上記誘電体層の、半導体基板と接
触しない方の面に放射導体を形成したので、移相器や増
幅器およびマイクロストリップ線路の占有できる面積が
広くなり、配置および回路構成に制約が生じず、回路の
構成が容易になる。さらにマイクロストリップアンテナ
およびマイクロ波集積回路が互いに異なる面に構成され
ているのでマイクロ波集積回路の線路等の不連続部から
発生するアンテナの放射特性に影響を与えない、良好な
アンテナ放射特性を得ることができる。[Effects of the Invention] As described above, in the monolithic antenna according to the present invention, a slit is provided in a part of the ground conductor provided on the first surface of the semiconductor substrate, and a slit is provided so as to cover the ground conductor including the slit. A layered dielectric layer is applied to the semiconductor substrate, and a radiation conductor is formed on the side of the dielectric layer that does not come into contact with the semiconductor substrate, so the area that can be occupied by the phase shifter, amplifier, and microstrip line becomes larger. There are no restrictions on the layout and circuit configuration, and the circuit configuration becomes easy. Furthermore, since the microstrip antenna and the microwave integrated circuit are configured on different surfaces, good antenna radiation characteristics can be obtained that do not affect the antenna radiation characteristics generated from discontinuities such as lines of the microwave integrated circuit. be able to.
第1図はこの発明の一実施例によるモノリシックアンテ
ナの構成を示す表面図及び裏面図、第2図はこの発明の
他の実施例を示す図、第3図は従来のモノリシックアン
テナの構成を示す図である。
図中、1は半導体基板、2は地導体、3は放射導体、4
はマイクロストリップアンテナ、5はマイクロストリッ
プ線路、6は増幅器、7は移相器、8は入力端、9は細
隙、10は誘電体層である。
なお、図中、同一符号は同一、または相当部分を示す。
代理人 弁理士 宮園 純−FIG. 1 is a front and back view showing the configuration of a monolithic antenna according to an embodiment of the present invention, FIG. 2 is a diagram showing another embodiment of the invention, and FIG. 3 is a diagram showing the configuration of a conventional monolithic antenna. It is a diagram. In the figure, 1 is a semiconductor substrate, 2 is a ground conductor, 3 is a radiation conductor, and 4
5 is a microstrip antenna, 5 is a microstrip line, 6 is an amplifier, 7 is a phase shifter, 8 is an input end, 9 is a gap, and 10 is a dielectric layer. In addition, in the figures, the same reference numerals indicate the same or equivalent parts. Agent Patent Attorney Jun Miyazono
Claims (1)
二の面にはストリップ導体より成る線路及び半導体素子
,キャパシタ,インダクタ等の回路素子を形成してマイ
クロ波集積回路を構成し、上記第一の面に設けた地導体
の一部を除去して地導体に細隙を設け、該細隙を含め上
記地導体を覆うように層状の誘電体層を設け、この誘電
体層における上記半導体基板と接触しない方の面に上記
細隙と対応するマイクロストリップアンテナの放射導体
を形成し、この放射導体を上記細隙を介して上記マイク
ロ波集積回路側と結合するようにしたことを特徴とする
モノリシックアンテナ。A ground conductor is formed on a first surface of a substrate made of a semiconductor, and a line made of a strip conductor and circuit elements such as semiconductor elements, capacitors, and inductors are formed on a second surface to constitute a microwave integrated circuit, A part of the ground conductor provided on the first surface is removed to provide a slit in the ground conductor, and a layered dielectric layer is provided so as to cover the ground conductor including the slit. A radiation conductor of a microstrip antenna corresponding to the gap is formed on the surface not in contact with the semiconductor substrate, and this radiation conductor is coupled to the microwave integrated circuit side through the gap. Features a monolithic antenna.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28671790A JPH04160804A (en) | 1990-10-24 | 1990-10-24 | Monolithic antenna |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28671790A JPH04160804A (en) | 1990-10-24 | 1990-10-24 | Monolithic antenna |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04160804A true JPH04160804A (en) | 1992-06-04 |
Family
ID=17708094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28671790A Pending JPH04160804A (en) | 1990-10-24 | 1990-10-24 | Monolithic antenna |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04160804A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG113436A1 (en) * | 2001-10-24 | 2005-08-29 | Maspro Denko Kk | Antenna, phase converter and communication apparatus |
JP2013247493A (en) * | 2012-05-25 | 2013-12-09 | Nippon Telegr & Teleph Corp <Ntt> | Integrated patch antenna |
JP2016506675A (en) * | 2013-01-14 | 2016-03-03 | インテル・コーポレーション | Rear redistribution layer patch antenna |
WO2017073644A1 (en) * | 2015-10-30 | 2017-05-04 | 三菱電機株式会社 | High-frequency antenna module and array antenna device |
-
1990
- 1990-10-24 JP JP28671790A patent/JPH04160804A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG113436A1 (en) * | 2001-10-24 | 2005-08-29 | Maspro Denko Kk | Antenna, phase converter and communication apparatus |
JP2013247493A (en) * | 2012-05-25 | 2013-12-09 | Nippon Telegr & Teleph Corp <Ntt> | Integrated patch antenna |
JP2016506675A (en) * | 2013-01-14 | 2016-03-03 | インテル・コーポレーション | Rear redistribution layer patch antenna |
US10403511B2 (en) | 2013-01-14 | 2019-09-03 | Intel Corporation | Backside redistribution layer patch antenna |
WO2017073644A1 (en) * | 2015-10-30 | 2017-05-04 | 三菱電機株式会社 | High-frequency antenna module and array antenna device |
JP6192875B1 (en) * | 2015-10-30 | 2017-09-06 | 三菱電機株式会社 | High frequency antenna module and array antenna device |
US10263344B2 (en) | 2015-10-30 | 2019-04-16 | Mitsubishi Electric Corporation | High-frequency antenna module and array antenna device |
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