JPH072497Y2 - Separator for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to, for example, a transistor, a Hall element, and a Hall element.
In the process of aligning semiconductor elements such as ICs on a work jig such as a jig, tray or stick, they are continuously conveyed by a conveying means such as a vibrating linear feeder and stopped at the end of the conveying means to stay. The present invention relates to a separating device that sequentially separates one semiconductor element from the leading element.

[Prior Art] Conventionally, as a separating device for the above-mentioned semiconductor element, two stoppers using a small air cylinder are provided at the end of a conveying means for continuously conveying the semiconductor element laterally in a lying state. Provided as a first stopper that advances and retreats in front of the semiconductor element to lock and release it, and a second stopper that advances and retracts above the second semiconductor element to hold and release it from above. The one in which the first stopper and the second stopper are alternately operated has been previously provided (Japanese Utility Model Publication Nos. 62-26322 and 62-26323).

In the above conventional separation device, the first semiconductor element is locked by the first stopper, the second semiconductor element is pressed from above by the second stopper, and then the locking by the first stopper is released. Send the first semiconductor element separately from the others, return the first stopper to the locking position, and then release the second stopper from the second semiconductor element. It is moved to the leading position where it is locked by, and the same operation as above is repeated thereafter.

[Problems to be Solved by the Invention] However, in the above-described conventional separation device, particularly in the case of a semiconductor element in which leads are left and right protruding with respect to the mold part, the lead of the first semiconductor element is the second semiconductor element. Even if the first semiconductor element is pressed by the lead and the locking by the first stopper is released, the leading semiconductor element is not sent out and cannot be separated. That is, when the semiconductor element with the leads protruding to the left and right with respect to the mold portion is continuously conveyed in the lateral direction in a lying state, inevitably between the adjacent semiconductor elements,
The leads will overlap vertically. This lead overlap is when the lead of the first semiconductor element is on the upper side and the lead of the second semiconductor element is on the lower side, and when the lead of the first semiconductor element is on the lower side and the lead of the second semiconductor element is on the upper side. When and when occurs irregularly. In particular, in the latter case, the second semiconductor element is pressed from above by the second stopper, while the first semiconductor element is released and only the first semiconductor element is separated from the other semiconductor element and sent out. The element lead will press down the lead of the leading semiconductor element from above. Also, whether the lead of the top semiconductor element is up or down,
If the lead of the second semiconductor element crosses and is entangled with the lead of the second semiconductor element, only the first semiconductor element cannot be separated from the others and sent out.

[Means for Solving Problems] Means for solving the above problems will be described with reference to FIGS. 1 and 2 corresponding to an embodiment of the present invention.
A separating device for a semiconductor element 1 having a head 1a whose width is narrower than that of a lead 1b, and a receiving guide groove 2a for sequentially guiding the semiconductor elements 1 which are continuously conveyed laterally in a lying state, The guide groove 2a is continuous with the receiving guide groove 2a and is formed in a direction perpendicular to the plane of the head 1a side of the semiconductor element 1 with a width capable of receiving only one semiconductor element 1. Is provided,
A chute 3 having a fine hole 6 for sucking the head 1a of the semiconductor element 1 and connected to a suction means, and a lead-out portion 1b which moves forward and backward in the longitudinal direction of the delivery guide groove 2b of the chute 3 and moves forward. From the side, the head 1a of the semiconductor element 1 is pressed, and one semiconductor element 1 in the receiving guide groove 2a is sent out into the guide groove.
The means for separating the semiconductor element having the extruding plate 4 extruded to 2b is taken.

[Operation] When the push-out plate 4 is moved forward, one semiconductor element 1 in the receiving guide groove 2a is pushed by the push-out plate 4 and pushed out to the delivery guide groove 2b. At this time, the subsequent semiconductor device 1
However, the lead 1b is the lead of the semiconductor element 1 to be extruded.
Because of overlapping with 1b, a catch is generated, and both of them tend to enter the delivery guide groove 2b. However, in the present invention, the semiconductor element 1 to be pushed out is pushed in the direction of the head 1a thereof without applying any pressing force to the following semiconductor element 1, and only one semiconductor element 1 has the delivery guide groove 2b. Since the width of the semiconductor element 1 is only acceptable,
Therefore, only one semiconductor element 1 is surely pushed out into the delivery guide groove 2b.

The pores 6 position the semiconductor element 1 extruded into the delivery guide groove 2b and separated by sucking the head portion 1a thereof, and when the push-out plate 4 retreats, the semiconductor element 1 is slightly separated from the lead 1b of the semiconductor element 1. Even if they are rubbed together, the separated semiconductor element 1 is held so as not to be displaced.

The pressing plate 4 presses the head 1a from the side of the lead 1b of the semiconductor element 1, which means that the leads 1b of the adjacent semiconductor elements 1 are tentatively crossed vertically. However, by rubbing out the lead 1b, it is possible to surely separate the both. Also, in order to obtain this reasonable separation, lead 1b
Since the head portion 1a of the semiconductor element 1 is pressed by the pressing plate 4 from the part side, the pores 6 are provided in order to prevent the positional displacement due to the friction with the lead 1b when the pressing plate 4 is retracted. It is a thing.

[Embodiment] As shown in FIG. 1, the chute 3 is located at the tip of the conveying means 5.

The conveying means 5 receives the head portion 1a of the semiconductor element 1 in the conveying guide groove 5a and continuously conveys the semiconductor element 1 in a lateral direction in a lying state. For example, a vibrating rectilinear feeder or the like is used. . Further, the chute 3 is provided independently of the conveying means with a slight gap between the chute 3 and the tip of the conveying means 5 in order to prevent the vibration of the conveying means 5 from being transmitted.

As shown in FIG. 2, the chute 3 is provided with a receiving guide groove 2a for receiving and sequentially guiding the head 1a of the semiconductor element 1 in the same direction as the carrying direction of the carrying means 5.
It is preferable that the width of the receiving guide groove 2a is slightly larger than the height of the head 1a of the semiconductor element 1 and the length of the receiving guide groove 2a is a length in which 2 to 5 semiconductor elements are arranged.

The head of the semiconductor device 1 continues from the end of the receiving guide groove 2a.
A delivery guide groove 2b is provided in the direction perpendicular to the 1a side. The width of the delivery guide groove 2b is such that only one semiconductor element 1 can be received, and is slightly larger than the width of the lead 1b. The length of the delivery guide groove 2b is about 1.5 of the total length of the semiconductor element 1. The length is preferably about 2.0 times.

The end wall of the delivery guide groove 2b is provided with a pore 6 having a diameter equal to or smaller than the thickness of the head portion 1a of the semiconductor element 1 and connected to suction means (not shown). The pores 6 are for sucking the head portion 1a of the semiconductor element 1 that has been pushed into the delivery guide groove 2b and for accurately positioning the head portion 1a.
In addition, as shown in FIG.
In the semiconductor device 1 having a narrow width, as shown in FIGS. 1 (a) and 2, only the distal end of the delivery guide groove 2b is made narrower in accordance with the head 1a, and the positioning in the delivery guide groove 2b is made accurate. It is preferable.

The push-out plate 4 is provided above the upper surface of the lead 1b of the semiconductor element 1 at the end of the receiving guide groove 2a by about 0.3 to 0.5 mm. The push-out plate 4 is advanced and retracted by the air cylinder 7 in the lengthwise direction of the delivery guide groove 2b, and at the time of forward movement, the lower surface of the head 1a of the semiconductor element 1 located at the end of the reception guide groove 2a is
The semiconductor element 1 is pushed toward the receiving guide groove 2b and pushed out into the receiving guide groove 2b. The width of the push plate 4 is such that only one semiconductor element 1 at the end of the receiving guide groove 2a is pushed. Further, the push-out plate 4 locks the head portion 1a of the succeeding semiconductor element at its side surface so that the succeeding semiconductor element 1 does not enter the distal end portion (leading portion) of the receiving guide groove 2a while it is moving forward. It is supposed to do.

The above separating device is used, for example, in a device for aligning semiconductor elements as shown in FIG. 4, and its operating state will be described by taking as an example the case of being incorporated in this aligning device.

The semiconductor elements are supplied to the conveying means 5 by aligning the front and back sides and the top and bottom by a supplying means 8 such as a vibration feeder, and are sequentially conveyed by the conveying means 5 to transfer to the receiving guide groove 2a of the sheet 3. When the leading semiconductor element 1 is prevented from being conveyed by the end wall of the receiving guide groove 2a, the succeeding semiconductor elements 1 are connected one after another, and the conveying means 5 moves from the receiving guide groove 2a.
The semiconductor elements 1 are further pressed on the upper side and are aligned in a line.

Next, the push plate 4 reciprocally moved by the air cylinder 7.
However, the semiconductor element 1 at the end of the receiving guide groove 2a is delivered to the delivery guide groove 2b while being separated from the subsequent semiconductor element 1. While the push-out plate 4 is moving forward, the subsequent semiconductor device 1
Is locked by the side surface of the push-out plate 4 and does not enter the end portion (leading portion) of the receiving guide groove 2a.

When the push-out plate 4 reaches the forward end, the pores 6 in the end wall of the delivery guide groove 2b vacuum-suck the head 1a of the semiconductor element 1 to position and fix it. When the push-out plate 4 is retracted, the succeeding semiconductor element 1 is pushed forward by one element to the front of the push-out plate 4, that is, the end of the receiving guide groove 2a by the propulsive force of the conveying means 2, and becomes the initial state.

It is delivered to the end wall of the delivery guide groove 2b by the pushing plate 4, and the head 1a
The semiconductor element 1 held by vacuum suction by the vacuum pressure of the pores 6 is attached to the follower end of the transfer portion 9 such as a pick and place using a cam, and the vacuum suction collet 10 (see FIG. 1 (b)). As a result, the head 1a is vacuum-adsorbed. After that, the vacuum in the pores 6 of the chute 3 is cut off, the semiconductor element 1 is lifted by the vacuum suction collet 10, and then horizontally moved to the work jig transfer rail 11 side, and the work jig transfer rail 11 is moved below the moving end. Work jig 12 intermittently fed up
By lowering the vacuum on the side of the vacuum suction collet 10 after lowering to the predetermined position, the semiconductor elements 1 can be transferred to the work jig 12 and aligned. The work jig 12 has a sending section 13
From each jig, and is intermittently fed on the work jig transport rail 11 by the intermittent feeding portion 14 to be transported, and after the semiconductor element 1 is transferred at the intermediate portion of the work jig transport rail 11, It is stored in the storage section 15.

[Advantages of the Invention] The present invention is as described above, and the lead 1b portion is the head.
Since the semiconductor element 1 protruding from the width of 1a can be separated reasonably and reliably, it is possible to prevent damage to the semiconductor element 1 at the time of separation and decrease in work efficiency, and keep the separated semiconductor element 1 in a fixed position. Therefore, the semiconductor element 1 can be easily moved to the next step.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention. (A) is a plan view, (b) is a partial sectional view of a chute portion, FIG. 2 is a plan view of the chute, and FIG. 3 is a semiconductor device. In the figure showing an example,
(A) is a plan view, (B) is a side view, and FIG. 4 is a plan view of an alignment device using the present separating device. 1: semiconductor element, 1a: head, 1b: lead, 2a: receiving guide groove, 2
b: delivery guide groove, 3: chute, 4: extrusion plate, 5: conveying means, 5
a: conveyance guide groove, 6: fine hole, 7: air cylinder, 8: supply means,
9: Transfer section, 10: Vacuum suction collet, 11: Work jig transfer rail, 12: Work jig, 13: Sending section, 14: Storage section.

Continuation of the front page (56) References JP-A-52-95470 (JP, A) Actual development S56-92620 (JP, U) JP-B 46-39439 (JP, B1) JP-B 56-43967 (JP) , B2) Actual public Sho 56-21688 (JP, Y2) Actual public Sho 52-38840 (JP, Y2)

Claims (1)

[Scope of utility model registration request] 1. A separating device for a semiconductor element having a head width narrower than that of a lead portion, and a receiving guide groove for sequentially guiding semiconductor elements which are continuously conveyed laterally in a lying state. The guide groove is continuous with the receiving guide groove and is formed in a direction perpendicular to the plane of the head side of the semiconductor element with a width capable of receiving only one semiconductor element. A chute that is connected and has pores that suck the head of the semiconductor element, and moves back and forth in the lengthwise direction of the delivery guide groove of the chute, and when moving forward, presses the head of the semiconductor element from the lead side. And a push-out plate for pushing one semiconductor element in the receiving guide groove into the sending guide groove.