JPS6313923U - - Google Patents

Info

Publication number
JPS6313923U
JPS6313923U JP10564286U JP10564286U JPS6313923U JP S6313923 U JPS6313923 U JP S6313923U JP 10564286 U JP10564286 U JP 10564286U JP 10564286 U JP10564286 U JP 10564286U JP S6313923 U JPS6313923 U JP S6313923U
Authority
JP
Japan
Prior art keywords
guide groove
chute
semiconductor device
receiving guide
sending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10564286U
Other languages
Japanese (ja)
Other versions
JPH072497Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986105642U priority Critical patent/JPH072497Y2/en
Publication of JPS6313923U publication Critical patent/JPS6313923U/ja
Application granted granted Critical
Publication of JPH072497Y2 publication Critical patent/JPH072497Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Special Conveying (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す図で、イは平
面図、ロはシユート部分の一部断面図、第2図は
シユートの平面図、第3図は半導体素子の一例を
示す図で、イは平面図、ロは側面図、第4図は本
分離装置を利用した整列装置の平面図である。 1:半導体素子、1a:頭部、1b:リード、
2a:受入案内溝、2b:送出案内溝、3:シユ
ート、4:シユート、5:搬送手段、5a:搬送
案内溝、6:細孔、7:エアシリンダ、8:供給
手段、9:移載部、10:真空吸着コレツト、1
1:作業治具搬送レール、12:作業治具、13
:送り出し部、14:収納部。
Fig. 1 is a diagram showing an embodiment of the present invention, A is a plan view, B is a partial sectional view of a chute portion, Fig. 2 is a plan view of the chute, and Fig. 3 is a diagram showing an example of a semiconductor element. A is a plan view, B is a side view, and FIG. 4 is a plan view of an alignment device using this separation device. 1: semiconductor element, 1a: head, 1b: lead,
2a: Acceptance guide groove, 2b: Delivery guide groove, 3: Chute, 4: Shute, 5: Conveyance means, 5a: Conveyance guide groove, 6: Pore, 7: Air cylinder, 8: Supply means, 9: Transfer Part, 10: Vacuum suction collet, 1
1: Work jig transport rail, 12: Work jig, 13
: Feeding section, 14: Storage section.

補正 昭61.9.11 図面の簡単な説明を次のように補正する。 明細書第11頁下から5行目「4:シユート」
を「4:押出板」に訂正する。
Amendment September 11, 1981 The brief description of the drawing is amended as follows. 5th line from the bottom of page 11 of the specification “4: Shoot”
is corrected to "4: Extrusion plate".

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 寝かされた状態で横方向に連続的に搬送されて
来る半導体素子を順次案内する受入案内溝と、こ
の受入案内溝と連続しかつ半導体素子1の頭部側
平面直角方向に、一の半導体素子のみを受け入れ
可能な幅で形成された送出案内溝とを備えたシユ
ートと、このシユートの送出案内溝の長さ方向に
進退し、前進時に、受入案内溝内の一の半導体素
子を送出案内溝へと押し出す押出板とを有するこ
とを特徴とする半導体素子の分離装置。
A receiving guide groove that sequentially guides the semiconductor devices that are continuously transported laterally in a lying state, and a semiconductor device that is continuous with the receiving guide groove and perpendicular to the head side plane of the semiconductor device 1. A chute is provided with a sending-out guide groove formed with a width that can accept only the device, and the chute moves forward and backward in the length direction of the sending-out guide groove of this chute, and when moving forward, guides one semiconductor device in the receiving guide groove to be sent out. 1. A device for separating semiconductor devices, comprising: an extrusion plate for extruding into a groove.
JP1986105642U 1986-07-11 1986-07-11 Separator for semiconductor devices Expired - Lifetime JPH072497Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986105642U JPH072497Y2 (en) 1986-07-11 1986-07-11 Separator for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986105642U JPH072497Y2 (en) 1986-07-11 1986-07-11 Separator for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS6313923U true JPS6313923U (en) 1988-01-29
JPH072497Y2 JPH072497Y2 (en) 1995-01-25

Family

ID=30980266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986105642U Expired - Lifetime JPH072497Y2 (en) 1986-07-11 1986-07-11 Separator for semiconductor devices

Country Status (1)

Country Link
JP (1) JPH072497Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5621688U (en) * 1979-07-27 1981-02-26
JPS5643967A (en) * 1979-09-19 1981-04-22 Nippon Chemical Ind Powder fireeextinguishing substance

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5621688U (en) * 1979-07-27 1981-02-26
JPS5643967A (en) * 1979-09-19 1981-04-22 Nippon Chemical Ind Powder fireeextinguishing substance

Also Published As

Publication number Publication date
JPH072497Y2 (en) 1995-01-25

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