JPH07240580A - Laminated substrate and its manufacture - Google Patents

Abstract

PURPOSE:To effectively prevent delamination from occurring by improving the adhesion property between green sheets in a laminated substrate of a green sheet multilayer and its manufacturing method. CONSTITUTION:In a laminated substrate consisting of a plurality of ceramic layers 1a-1e and conductor layers 2, 3, 4, and 5 in a specific pattern included among the ceramic layers 1a-1e, an insulation layer 10... for adhesion is included on one main surface of the conductor layers 2, 3, 4, and 5 and the adjacent ceramic layers 1a-1e. The insulation layer 10... for adhesion is formed by printing and drying a slurry which is formed by mixing an inorganic filler which is of virtually same material as a ceramic green sheet and a binder.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated substrate in which a plurality of ceramic layers such as a laminated capacitor, a multilayer ceramic circuit board, a laminated resonator and a laminated filter are laminated, and a conductor layer having a predetermined pattern is arranged between the laminated layers. The present invention relates to a manufacturing method.

[0002]

2. Description of the Related Art For example, in a multilayer capacitor, a ceramic layer made of a dielectric material and a conductor layer having a predetermined pattern to be an opposing electrode formed between layers of each ceramic layer are alternately laminated and fired. Terminal electrodes connected to each conductor layer were formed on both ends of the laminate.

Further, the multilayer ceramic circuit board has a structure in which a ceramic layer made of an insulating material and a conductor layer having a predetermined pattern, which is an internal wiring formed between layers of the ceramic layers, are sequentially laminated, and is formed by a firing treatment. Various electronic components and input / output lead terminals were formed on the main surface.

The laminated resonator and the laminated filter are
A ceramic layer made of a dielectric material or a magnetic material and a conductor layer of a predetermined pattern to be a microstrip conductor (inductance conductor) or an earth conductor formed between layers of the respective ceramic layers are sequentially laminated and fired. I / O terminal electrodes and ground terminal electrodes were formed on the end faces of the laminate.

Although these laminated substrates have different functions and therefore their structures are slightly different, basically, in a laminated body composed of a plurality of ceramic layers, conductor layers having a predetermined pattern are arranged between the layers of the ceramic layers. .

The method for manufacturing such a laminated substrate is roughly classified into a printing multilayer manufacturing method and a green sheet multilayer manufacturing method. In the manufacturing method using a printed multilayer, a ceramic film to be a first ceramic layer is formed on a substrate such as a film by printing and drying a ceramic paste, and a conductor film having a predetermined pattern is formed on the film. Is formed by printing and drying a conductive paste, and further, a ceramic film to be the second ceramic layer is formed thereon by printing and drying the ceramic paste, and then a conductor film is formed thereon. , ... By printing and drying ceramic paste and conductive paste,
By sequentially forming, a laminated body of a plurality of ceramic films and a plurality of conductor films is formed, the base is peeled off, and the laminated body is integrally fired.

In the green sheet multi-layer manufacturing method, a ceramic raw material is homogeneously mixed with a binder or the like to form a slip material, and the slip material is formed into a green sheet having a predetermined thickness by a doctor blading method or the like. A conductive film to be a conductor layer having a predetermined pattern is printed and dried using a conductive paste on a region of one element of the green sheet, and a plurality of green sheets on which the conductor film is formed are stacked in consideration of the stacking order. The laminated body is laminated and thermocompression-bonded to integrally fire a laminated body composed of a green sheet and a conductor film to be a ceramic layer.

[0008]

The conventional manufacturing method using a multilayer green sheet has an advantage that a conductor film having a complicated pattern can be easily formed and an increase in the number of laminated layers can be easily coped with. The adhesion reliability between the green sheets sometimes became a problem. The decrease in adhesion reliability is caused by peeling (chip peeling) at the joining interface when stacking gut sheets and cutting into a chip shape of a predetermined size, and after firing, the joining interface. Delamination (peeling) may occur.

In order to prevent this delamination,
It is necessary to control various conditions for thermocompression bonding, but the control is different depending on the shape and size of the conductor film forming the predetermined conductor pattern and the type and content of the binder, which is very complicated. For example, when a water-soluble emulsion binder is used as the binder and the area ratio of the conductor film having a predetermined pattern is 70% or more with respect to the total area of the green sheet,
The adhesiveness with the green sheet laminated on the conductor film is greatly reduced, and chip peeling and delamination occur remarkably.

The present invention has been devised in view of the above-mentioned problems, and a green sheet serving as a ceramic layer on which a conductor film serving as a conductor layer of a predetermined pattern in a green sheet multilayer is formed, and a green sheet on the conductor film are provided. (EN) Provided are a laminated substrate which improves adhesion to a laminated green sheet, and as a result can effectively suppress chip peeling and delamination, and a manufacturing method thereof.

[0011]

According to a first aspect of the present invention, in a laminated substrate comprising a plurality of ceramic layers and a conductor layer having a predetermined pattern interposed between the ceramic layers, one main surface of the conductor layer is provided. , A laminated substrate in which an insulating layer for adhesion is interposed between the adjacent ceramic layers.

According to the second invention, a step of forming a green sheet to be a plurality of ceramic layers, a step of forming a conductor film to be a conductor layer of a predetermined pattern on each of the ceramic green sheets, and A ceramic green sheet on which a conductor film having a predetermined pattern is formed is coated with a slurry formed by mixing an inorganic filler and a binder of substantially the same material as the ceramic green sheet to form an adhesion film that serves as an adhesion insulating layer. It is a method of manufacturing a laminated substrate in which a covering step and a plurality of the above-mentioned ceramic green sheets are laminated vertically, thermocompression-bonded, and then integrally fired.

[0013]

According to the first aspect of the invention, since the adhesion insulating layer is interposed between the one main surface of the conductor layer and the ceramic layer adjacent to the one main surface, the ceramic layer and the conductor layer can be connected to each other. It is possible to improve the adhesion between the ceramic layer and the ceramic layer, and it is possible to effectively suppress chipping and delamination.

According to the second aspect of the invention, a conductor film to be a conductor layer having a predetermined pattern is formed by printing and drying on a ceramic green sheet, and then slurry is applied so as to cover at least the conductor film. Then, an adhesion layer to be an adhesion insulation layer is formed, and a plurality of green sheets are laminated and thermocompression bonded. That is, since the adhesive film is deposited by applying the slurry, the green sheet and the conductor film that sandwich the adhesive film,
The adhesiveness between the green sheets that sandwich the adhesive film is greatly improved as compared with the case without the adhesive film. It is considered that this is because the binder in the slurry is easily adapted to the binder of the green sheet or the conductor film and easily dissolved.

Furthermore, because the binder of the adhesive film is easy to adapt and melt, the generation of voids in the film during the firing process can be effectively suppressed.

Therefore, chip peeling and delamination between the ceramic layers, at least between the ceramic layers and the conductor layers, can be effectively suppressed.

Since this adhesion layer is basically formed by mixing an inorganic filler and a binder, which are substantially the same as the ceramic green sheet, various characteristics depending on the relationship between the ceramic layer and the conductor layer, such as pressure resistance characteristics and dielectric characteristics. The delamination can be effectively suppressed even if the body characteristics and the like are not significantly changed and the sintering shrinkage behavior between them can be approximated.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings.
It should be noted that the embodiments will be described using a laminated resonator which is an example of a laminated substrate.

FIG. 1 is an external perspective view of a laminated resonator,
FIG. 2 is an exploded perspective view of the laminated body.

The laminated resonator of the present invention is a laminated body 1 formed by laminating a plurality of ceramic layers, for example, 5 layers 1a to 1e.
A conductor layer having a predetermined pattern disposed in the laminate 1, for example, the center conductor layer 2, the intermediate conductor layer 3, the first ground conductor layer 4, the second ground conductor layer 5, and the laminate 1 Of the terminal electrodes 6 and 7 arranged on the opposite end faces of the.

The laminate 1 is made of Al ₂ O ₃ , SiO ₂ , Ti.
A plurality of dielectric ceramic green sheets containing O ₂ or the like as a main component are laminated, thermocompression-bonded, and integrally fired. Incidentally, the ceramic layer, between the conductor layers,
Further, it means a ceramic layer outside the earth conductor layer and does not correspond to one green sheet.

The laminated body 1 has a five-layer structure of a first ceramic layer 1a to a fifth ceramic layer 1e from the bottom in FIG.

The central conductor layer 2, which is one of the conductor layers having a predetermined pattern, is arranged in a substantially linear band between the third ceramic layer 1c and the fourth ceramic layer 1d, and both ends thereof are the third layers. Ceramic layer 1c and fourth ceramic layer 1d
Extends to the edge. In addition, one end side of the central conductor layer 3,
That is, the end surface of the laminated body 1 on the left side in FIG. 2 is referred to as an open end surface, and the other end side of the central conductor layer 3, that is, the end surface of the laminated body 1 on the right side in FIG.

The intermediate conductor layer 3, which is one of the conductor layers having a predetermined pattern, is arranged between the second ceramic layer 1b and the third ceramic layer 1c in a substantially linear band shape, and one end thereof is an open end surface. The second ceramic layer 1b and the third ceramic layer 1c, and the other end is interrupted between the second ceramic layer 1b and the third ceramic layer 1c.
It does not extend to the short-circuited end face side.

The first ground conductor layer 4, which is one of the conductor layers having a predetermined pattern, is arranged so as to spread in a plane between the first ceramic layer 1a and the second ceramic layer 1b. The second ground conductor layer 5 is arranged so as to spread in a plane between the fourth ceramic layer 1d and the fifth ceramic layer 1e. These ground conductor layers 4,
5 is formed over the substantially entire surface between the ceramic layers 1a and 1b, 1d and 1e so that a margin is provided on the open end face side.

The above-mentioned central conductor layer 2, intermediate conductor layer 3, and first conductor layer
It is important that the ground conductor layer 4 and the second ground conductor layer 5 are low resistance materials, and Ag-based, Cu-based, etc. are used, for example. In addition, since the green sheet is integrally fired in the manufacturing process, P
It is also possible to use an Ag-Pd system such as a d-alloy.

Further, one terminal electrode (input / output side terminal electrode) 6 is a central conductor layer 2 extending to an open end surface of a laminated body 1 in which first to fifth ceramic layers 1a to 1e are laminated.
And the intermediate conductor layer 3 is arranged with a sufficient width to connect one end thereof. As a result, one end of the central conductor layer 2 and one end of the intermediate conductor layer 3 are electrically connected at the open end surface.

The other terminal electrode (ground side terminal electrode)
7 is arranged over substantially the entire short-circuit end surface of the laminated body 1. As a result, the other end of the central conductor layer 2 and the first
And the second ground conductor layers 4 and 5 are electrically connected to each other. In particular, if the ground-side terminal electrode 7 is arranged over substantially the entire short-circuited end face, the ground-side terminal electrode 7 electrically connects the first ground conductor layer 4 and the second ground conductor layer 5 in the entire width direction of the dielectric laminate 1. This is because the grounding effect can be increased.

Input / output side terminal electrode 6, ground side terminal electrode 7
Is composed of a conductor film obtained by baking a conductor paste containing Ag-based, Ag-Pd-based, etc. as a main component, and further, in order to prevent solder erosion and improve solder wettability at the time of solder joining, Ni plating, The plating layer is covered with solder plating or the like.

Further, since the input / output side terminal electrode 6 and the ground side terminal electrode 7 are solder-bonded on a predetermined wiring pattern of the printed wiring board, they may extend from the end face of the laminate 1 to a part of the back face side. It is important to place In order to achieve such a structure of the input / output side terminal electrode 6 and the ground side terminal electrode 7, when forming the input / output side terminal electrode 6 and the ground side terminal electrode 7, for example, a conductive paste serving as a conductor film is formed. Selectively printed on the end surface and the back surface of the fired laminate 1, transferred to the end surface of the laminate 1 with a sufficient amount of conductive paste, or selectively immersed in a bath of conductive paste. After baking or the like, it is performed by baking.

With the above configuration, a capacitance component is generated between the central conductor layer 2 connected to the input / output side terminal electrode 6 and the first and second ground conductor layers 4 and 5, and the input / output side terminal electrode 6 is also formed. A capacitance component is generated between the intermediate conductor layer 3 and the first ground conductor layer 4 connected to the central conductor layer 2 and the intermediate conductor layer 3 between the input / output electrode terminal 6 and the ground side terminal electrode 7. , An inductance component is generated by the conductor lengths of the first and second ground conductor layers 4 and 5, and thus 1 /
A 4λ type resonator will be configured. The intermediate conductor layer 3 is provided to shorten the axial length of the resonator and can be omitted.

In the present invention, the first ground conductor layer 4 and the second ground conductor layer 4
Between the intermediate conductor 3 and the third ceramic layer 1c, between the center conductor layer 2 and the fourth ceramic layer 1d, between the second ground conductor layer 3 and the first earth conductor layer 3
Insulation layer 10 for adhesion between the ceramic layer 1a and
.. is interposed.

The adhesion insulating layers 10 ... Are composed of an inorganic filler which is substantially the same as the inorganic filler constituting the ceramic layer as a main component. Although described in detail in the manufacturing method described later, the insulating layer for adhesion 10 ... Is prepared by mixing the above-mentioned inorganic filler and binder into a slurry for each conductor film (center conductor layer, intermediate conductor layer, First and second
It is obtained by co-firing the adhesion film coated and dried on the ground conductor layer (1) when the laminated body 1 is fired.

Next, a method of manufacturing the above-mentioned laminated resonator will be described with reference to FIG.
It will be described based on.

As a preparatory step, a step of forming a ceramic green sheet, a step of forming a conductive paste for forming a conductor layer having a predetermined pattern, and a step of forming an adhesion slurry for forming an adhesion film are performed. .

First, for the ceramic green sheets to be the respective ceramic layers, raw materials such as inorganic fillers made of Al ₂ O ₃ , SiO ₂ and TiO ₂ are mixed and calcined and crushed to obtain a water-soluble acrylic emulsion. Of the organic binder, the inorganic filler, the water-soluble binder, pure water and the dispersant are homogeneously mixed and mixed to prepare a slip material. Then, the slip material is formed into a tape having a predetermined thickness by the doctor blade method. Then, it is cut into a predetermined size to produce a green sheet having a predetermined size.

For example, the slip material to be a green sheet is an inorganic filler composed of Al ₂ O ₃ , SiO ₂ , and TiO ₂ , and 35 parts by weight of pure water, 1% by weight of a dispersant, acrylic emulsion, etc. per 100 parts by weight. It is formed by mixing 7.7 wt% of a water-soluble binder. The green sheet having a predetermined size is composed of a plurality of regions where a plurality of laminated resonators are extracted. The following steps are processed simultaneously for each region.

Next, the conductive paste for forming the conductor layer is prepared by homogeneously mixing and mixing the conductive powder such as Ag, the binder and the solvent.

Next, the adhesion slurry for forming the adhesion layer to be the adhesion insulating layer 10 ... Is an inorganic filler made of substantially the same material as the ceramic green sheet, that is, Al ₂ O ₃ , SiO _{2. 2} , an inorganic filler composed of TiO ₂ , a water-soluble binder, and a solvent are homogeneously mixed and formed.

For example, 100 parts by weight of an inorganic filler composed of Al ₂ O ₃ , SiO ₂ , and TiO ₂ are homogeneously mixed with 35 wt% of ethylene glycol as a solvent and 7.7 wt% of a binder such as a water-soluble butyral resin. To be done.

Next, the first to fifth ceramic layers 1a to 1
Depending on e, for example, a conductor film to be the first ground conductor layer 4 is provided on the green sheet to be the first ceramic layer 1a, and an intermediate conductor is provided to the green sheet to be the second ceramic layer 1b. The conductor film to be the layer 3 is provided on the green sheet to be the third ceramic layer 1c, the conductor film to be the central conductor layer 2 is provided on the green sheet to be the fourth ceramic layer 1d, and the second earth is provided on the green sheet to be the fourth ceramic layer 1d. Conductor films to be the conductor layers 5 are formed respectively. Specifically, the above-mentioned conductive paste is screen-printed in a predetermined shape and dried at 70 ° C. for about 10 minutes to be formed.

Next, an adhesion layer to be the adhesion insulating layer 10 ... Is formed on each conductor film having a predetermined conductor pattern. Specifically, it is formed by applying and drying the above-mentioned adhesion slurry.

In the case of the above-mentioned laminated resonator, since the conductor film arranged between different ceramic layers is not electrically connected through the thickness direction of the ceramic layer, the adhesion slurry is applied to the entire surface of the conductor film. For example, it may be applied to substantially the entire surface of the green sheet.

Next, the above-mentioned first film having the respective conductor films formed thereon is formed.
The green sheet to be the ceramic layer 1a to the fourth ceramic layer 1d and the green sheet to be the fifth ceramic layer 1a are sequentially laminated at a predetermined temperature, for example, 50 to 100.
Thermocompression bonding is performed at a predetermined temperature of, for example, 150 to 250 kg / cm ² for a predetermined time of, for example, 5 to 10 minutes.

Next, the green sheets laminated by a cutter are cut into the size of each element according to each area.

Next, the cut elements are housed in a firing setter and fired. This firing process is performed by the green sheet to be the ceramic layers 1a to 1e, the insulating layer 1 for adhesion.
It includes a contact film that becomes 0 ..., a debye process of removing the vaniders contained in each conductor film, and a sintering process of sintering reaction of the ceramic and the conductor material.

For example, the debye step is generally processed at around 500 ° C., and the sintering step is adjusted so that the conductor components of the conductor film and the sintering behavior of the green sheet are approximated. When using Ag-based or Cu-based,
It is fired at around 1000 ° C., and when using a Ag—Pd system for the conductor film, it is fired at around 1200 ° C.

Next, the laminated body 1 that has been fired is placed on an alignment jig for end face printing, and the laminated body 1 is provided with an end face on both sides.
The conductor films to be the terminal electrodes 6 and 7 are formed by, for example, dipping in an Ag-based conductor paste bath and baking (about 600 ° C.),
Further, the surface is plated.

The present inventor cuts the present invention formed as described above, that is, having the adhesion insulating layer 10 ... And the conventional product having no adhesion insulating layer 10. A comparative study was conducted on chip peeling at the time and delamination after firing treatment.

As a result, in the product of the present invention, neither chip peeling during cutting (total number of 392) nor delamination after firing (total number of 270) occurred. On the other hand, in the conventional product, chip peeling at the time of cutting is about 80 for all 392 elements.
%, And about 90% of the delamination after firing was generated for all 270 elements.

As described above, when the adhesion film which becomes the adhesion insulating layer 10 ... Is formed, the adhesion layer which becomes the adhesion insulating layer 10 ... It can be understood that the ceramic green sheet to be arranged or the ceramic green sheet can be firmly adhered to the ceramic green sheet and can effectively act even against excessive impact such as cutting.

Further, it can be understood that even if the firing treatment is performed, the occurrence of voids and the occurrence of delamination are effectively suppressed at the respective ceramic layers and at the interface between the conductor layer and the ceramic layer.

This is because the green sheet, which is a ceramic layer interposed so as to sandwich the adhesive layer, and the binder contained in each conductor film are familiar to each other by a bander such as a water-soluble butyral resin present in the adhesive layer. Further, it is considered that the chips are prevented from peeling because they melt each other and completely bond the adhesion layer and the green sheet and the adhesion layer and the conductor layer.

Further, since the adhesive layer is mixed with an inorganic filler of substantially the same quality as that of the green sheet, it exhibits a behavior similar to the sintering behavior of the green sheet during the firing treatment, and as described above, the familiarity of the binder. It is considered that voids and delamination after sintering are effectively prevented due to the ease of melting.

As one of the effects of the present invention, since the slurry forming the adhesion layer is mixed with the inorganic filler of substantially the same quality as that of the green sheet, various characteristics of the device, for example, in the case of a laminated resonator. The stable resonator characteristics can be maintained without a large change in the dielectric constant, and the breakdown voltage characteristics between the conductor films can be maintained in an effective state.

Here, the first to fifth ceramic layers 1a to 1e of the dielectric, the central conductor layer 2, the intermediate conductor layer 3, and the first
-Second earth conductor layers 4, 5, adhesion insulating layer 10 ...
The thickness will be described in detail.

The central conductor layer 2 (2a, 2b) is arranged at a substantially central portion between the first ground conductor layer 4 and the second ground conductor layer 5. This is to eliminate the difference in capacitance generated between the center conductor layer 2 (2a, 2b) and the first ground conductor layer 4, and between the center conductor layer 2 (2a, 2b) and the second ground conductor layer 5. Is.

Thickness of the ceramic layers (1b, 1c) between the central conductor layer 2 (2a, 2b) and the first ground conductor layer 4, the center conductor layer 2 (2a, 2b) and the second ground conductor layer The thickness of the ceramic layer (1d) between 5 and 5 needs a certain thickness to obtain a high Q value. The thickness thereof after firing is about 0.2 to 2 mm, usually about 1 mm. If it is less than 0.2, the Q value is lowered and the characteristics are deteriorated. If it exceeds 2 mm, the ceramic layers (1b, 1c) and (1d) sandwiching the central conductor layer 2 will exceed 4 mm, and the outer ceramic layers (1a, 1c).
Considering even e), the height of the laminated resonator becomes high.

The intermediate conductor layer 3 (3a, 3b) and the first
Resonance due to the generation of capacitance between the ground conductor layer 4 and the actual conductor length (the sum of the length of the central conductor layer 2 (2a, 2b) and the length of the intermediate conductor layer 3 (3a, 3b)). It becomes lower than the frequency. In order to raise this to the desired resonance frequency, the actual conductor length needs to be further shortened, so that further miniaturization of the resonator can be achieved. In order to increase the capacitance between the intermediate conductor layer 3 (3a, 3b) and the first ground conductor layer 4, it is preferable to make the thickness of the ceramic layer 1b between them relatively thin.
˜200 μm, usually about 100 μm.

Therefore, the second to fourth ceramic layers 1b to
As the combination of 1d, the thickness of the second dielectric 1b is 100 μm, the thickness of the third ceramic layer 1c is 1000 μm, and the thickness of the fourth ceramic layer 1d is 1 μm.
It is 100 μm. That is, the ratio of the thickness of the second ceramic layer 1b to the thickness of the ceramic layers (1b and 1c) between the central conductor layer 2 (2a, 2b) and the first ground conductor layer 4 is about 1: 9. I am taking it.

In addition, the central conductor layer 2, the intermediate conductor layer 3, the first conductor layer
~ The thickness of the second ground conductor layers 4 and 5 is 10 to 30 µm.
A degree is preferable.

This is because when the thickness exceeds 30 μm and becomes thick, delamination occurs remarkably, and when it is less than 10 μm, the conductor resistance increases and the characteristics such as Q value deteriorate.

The thickness of the adhesion insulating film 10 ...
10 to 20 μm is preferable. For example, when it is 20 μm or more, the binder component cannot be completely removed in the debye process,
Buku (partly unsintered state) occurs. On the other hand, if the thickness is less than 10 μm, printing unevenness of the adhesive film occurs, and conversely delamination occurs.

The ceramic layers 1c and 1d are much thicker than the ceramic layer 1b. In the manufacturing process, the ceramic layers 1c and 1d may be formed of one dielectric green sheet, but for example, a plurality of thin dielectric green sheets may be laminated to form one ceramic layer 1c and 1d. It may be configured.

Although the above embodiments have been described by using the laminated resonator, the present invention is also applicable to a laminated filter in which a plurality of resonance means such as a laminated resonator are integrated.

Besides, it can be applied to a multilayer capacitor. At this time, a dielectric material having a high dielectric constant such as BaTiO ₃ is used for the ceramic layer.
The conductor layer having a predetermined pattern serves as a counter electrode. Further, in the temperature-compensated multilayer capacitor, the dielectric material of the ceramic layer is appropriately selected according to its characteristics.

Further, it can be applied to a multilayer ceramic substrate. At this time, the ceramic layer is, for example, an alumina ceramic, or an insulator such as glass-ceramic obtained by mixing glass with an inorganic filler such as alumina or silica,
The predetermined pattern between the ceramic layers becomes internal wiring. In addition, the internal wiring of a predetermined pattern between different ceramic layers is connected via a via-hole conductor that penetrates the thickness of the ceramic layer. In this case, the green sheet
Prior to printing a conductor film to be an internal wiring of a predetermined pattern, it is necessary to form through holes to be via-hole conductors by press molding. The through hole is filled with a conductive paste, but the adhesion film which becomes the adhesion insulating layer formed after printing and drying the conductor film having a predetermined pattern is formed so that the connection by the via hole conductor is not impossible. It is important to apply the coating so as to expose at least the connection portion of the via-hole conductor and its periphery.

Further, in the above-mentioned embodiment, the step of cutting into the size of the element is performed before firing, but before firing, a V-shaped dividing groove for partitioning each region to be cut is formed. After firing, division may be performed along the division grooves. At this time, the problem of chip peeling is solved.

[0069]

As described above, according to the present invention, there is provided a laminated substrate formed by the green sheet multi-layer method and a method for producing the same, since the adhesion film serving as an adhesion insulating film is interposed on the surface of the laminated green sheet. It is possible to effectively prevent chip peeling during the process and delamination of a ceramic layer after firing, and to provide a laminated substrate having high lamination reliability and a manufacturing method thereof.

Further, the adhesion insulating film is coated with a slurry in which an inorganic filler of substantially the same quality as the inorganic filler constituting the green sheet and a binder are applied and dried,
It is formed by stacking a plurality of green sheets, thermocompressing them, and then firing. At this time, the binder of the adhesive film becomes familiar with and melts with the green sheet serving as the ceramic layer and the binder of the conductor film serving as each conductor layer, so that the adhesiveness is enhanced. Further, since the sintering shrinkage behavior can be approximated without significantly changing the characteristics of the ceramic layer by the inorganic filler, delamination after firing can be effectively prevented.

Further, since the binder of the adhesive film can be effectively removed during the debye step in the firing process, the generation of voids can be effectively prevented, and thus delamination can be effectively prevented. it can.

[Brief description of drawings]

FIG. 1 is an external perspective view of a laminated resonator that is an embodiment of the present invention.

FIG. 2 is an exploded perspective view of a laminated body of the laminated resonator of the present invention.

FIG. 3 is a process drawing for explaining the manufacturing method of the present invention.

[Explanation of symbols]

 1 ... Laminated body 1a ... 1st ceramic layer 1b ... 2nd ceramic layer 1c ... 3rd ceramic layer 1d ... 4th ceramic layer 1e ... 5th ceramic layer 2 ... Central conductor layer 3 ... Intermediate conductor layer 4 ... First earth conductor layer 5 ... Second earth conductor layer 6 ... Input / output side terminal electrode 7 ... Ground side terminal electrode

Claims (2)

[Claims] 1. A laminated substrate comprising a plurality of ceramic layers and a conductor layer of a predetermined pattern interposed between the ceramic layers, wherein one main surface of the conductor layer and a ceramic layer adjacent thereto are in close contact with each other. A laminated substrate having an insulating layer interposed therebetween. 2. A step of forming a green sheet to be a plurality of ceramic layers; a step of forming a conductor film to be a conductor layer of a predetermined pattern on each of the ceramic green sheets; A step of applying a slurry formed by mixing an inorganic filler and a binder of substantially the same material as the ceramic green sheet to the formed ceramic green sheet to coat an adhesion film to be an adhesion insulating layer; 2. A method for manufacturing a laminated substrate, comprising stacking a plurality of the ceramic green sheets above and below, thermocompressing them, and then integrally firing them.