JPH0723957Y2 - プラズマ処理装置 - Google Patents
プラズマ処理装置Info
- Publication number
- JPH0723957Y2 JPH0723957Y2 JP4279089U JP4279089U JPH0723957Y2 JP H0723957 Y2 JPH0723957 Y2 JP H0723957Y2 JP 4279089 U JP4279089 U JP 4279089U JP 4279089 U JP4279089 U JP 4279089U JP H0723957 Y2 JPH0723957 Y2 JP H0723957Y2
- Authority
- JP
- Japan
- Prior art keywords
- permanent magnet
- plasma
- holder
- diffusion chamber
- annular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009792 diffusion process Methods 0.000 claims description 42
- 239000000758 substrate Substances 0.000 description 7
- 239000000498 cooling water Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
- Electron Sources, Ion Sources (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4279089U JPH0723957Y2 (ja) | 1989-04-11 | 1989-04-11 | プラズマ処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4279089U JPH0723957Y2 (ja) | 1989-04-11 | 1989-04-11 | プラズマ処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02132939U JPH02132939U (enrdf_load_stackoverflow) | 1990-11-05 |
JPH0723957Y2 true JPH0723957Y2 (ja) | 1995-05-31 |
Family
ID=31554639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4279089U Expired - Fee Related JPH0723957Y2 (ja) | 1989-04-11 | 1989-04-11 | プラズマ処理装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0723957Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN119111620B (zh) * | 2024-09-02 | 2025-08-05 | 哈尔滨商业大学 | 一种冷等离子体果蔬保鲜杀菌系统 |
-
1989
- 1989-04-11 JP JP4279089U patent/JPH0723957Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH02132939U (enrdf_load_stackoverflow) | 1990-11-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7294224B2 (en) | Magnet assembly for plasma containment | |
US9111968B2 (en) | Plasma processing chamber with a grounded electrode assembly | |
US4632719A (en) | Semiconductor etching apparatus with magnetic array and vertical shield | |
US7757633B2 (en) | Method, apparatus and magnet assembly for enhancing and localizing a capacitively coupled plasma | |
US20020142615A1 (en) | Etching apparatus and etching method | |
US20060283553A1 (en) | Plasma chamber insert ring | |
KR100390540B1 (ko) | 마그네트론 플라즈마 에칭장치 | |
JP4924835B2 (ja) | マグネトロンスパッタリング用磁気回路装置及びその製造方法 | |
US8171877B2 (en) | Backside mounted electrode carriers and assemblies incorporating the same | |
KR20040014130A (ko) | 챔버 배기장치내의 플라즈마용 자기 배리어 | |
EP1369898B1 (en) | Magnetic field generator for magnetron plasma | |
EP1215717B1 (en) | Magnetron plasma processing apparatus | |
US6998033B2 (en) | Sputtering cathode adapter assembly and method | |
WO2000037206A3 (en) | Permanent magnet ecr plasma source with integrated multipolar magnetic confinement | |
US4611121A (en) | Magnet apparatus | |
US20030192646A1 (en) | Plasma processing chamber having magnetic assembly and method | |
JPH0723957Y2 (ja) | プラズマ処理装置 | |
JPH0855841A (ja) | 即時離脱型プロセスキット | |
JP2000030894A (ja) | プラズマ処理方法および装置 | |
US9236226B2 (en) | Plasma processing apparatus | |
JPS63279599A (ja) | マイクロ波プラズマ発生方法 | |
CN215896307U (zh) | 一种更换上电极的工具 | |
CN116034450A (zh) | 用于改进的磁控管电磁组件的系统和方法 | |
JPH1136068A (ja) | スパッタリング用カソードマグネット取付け構造 | |
JPH11315371A (ja) | 真空成膜装置のプラズマ源 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |