JPH07238365A - Thin film forming device - Google Patents

Abstract

PURPOSE:To prevent a substrate from being charged and excellently form a thin film on the substrate by depositing the particle vaporized by the irradiation with a beam on the substrate and arranging a conductive protruding member close to the substrate. CONSTITUTION:A substrate 3 consisting of a long-sized nonconductive film laid over between a feed roll 2a and a winding roll 2b is traveled along a cooling-can roll 1 in a vacuum vessel 9. Meanwhile, a vapor-deposition material 7 such as a magnetic alloy in a crucible 6 is irradiated with an electron beam from an electron gun 8 to vaporize off the particles. The particle is allowed to react with oxygen supplied from an inlet pipe 5, and the formed metal oxide is deposited on the substrate 3 to form a thin film. In this case, a conductive protrusion 10 of Cu, etc., is integrally formed on the shielding sheets 4a, 4b and 4d arranged close to the substrate 3 and grounded. Consequently, the scattered electron is trapped with the protrusion 10 and not accumulated on the substrate 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus used for manufacturing a magnetic recording medium having a metal film (magnetic film and / or back coat film) provided on a non-magnetic support.

[0002]

BACKGROUND OF THE INVENTION In a magnetic recording medium such as a magnetic tape, due to a demand for high density recording, a binder resin is not used as a magnetic layer provided on a non-magnetic support, instead of a coating type using a binder resin. It is well known that a metal thin film type that is not used has been proposed.

That is, there has been proposed a magnetic recording medium having a magnetic layer formed by a wet plating means such as electroless plating, or a dry plating means such as vacuum deposition, sputtering or ion plating. Since the magnetic recording medium of this type has a high packing density of magnetic material, it is suitable for high-density recording. In particular, a means for forming a magnetic film by means of irradiating with an electron beam to evaporate and adhere is said to be preferable because the film forming rate is faster than that by sputtering.

An apparatus for manufacturing a magnetic recording medium by such a vapor deposition means is generally constructed as shown in FIG. In FIG. 2, 31 is a cooling can roll, 32 is
a is polyethylene terephthalate (PET) film 3
3 is a supply side roll, 32b is a PET film 33 winding side roll, 34 is a shielding plate, 35 is a crucible, 36 is a magnetic alloy, and 37 is a vacuum container.

Then, after evacuating the inside of the vacuum container 37 to a predetermined degree of vacuum, the electron gun 38 is operated to heat and evaporate the magnetic alloy 36 in the crucible 35, and the magnetic alloy is applied to the PET film 33. A magnetic recording medium is manufactured by depositing 36. By the way, the beam emitted from the electron gun 38 is scattered as it goes away from the electron gun, and the scattered electrons are attached to the PET film 33, and the traveling property of the PET film 33 is deteriorated (disturbed) by the electrification of the electrons, and in a severe case. In some cases, the PET film 33 sticks to the cooling can roll 31 and cannot run.

[0006]

DISCLOSURE OF THE INVENTION While the inventors of the present invention intensively studied the above-mentioned problems, they found that electrons tend to concentrate on conductive protrusions, and a sharp protrusion was formed inside the vacuum container. If this is done, scattered electrons will preferentially collect on this, leading to the revelation that it will become difficult to charge the PET film.

That is, if a conductive pointed projection is formed at the position on the PET film side from the beam emitted from the electron gun toward the target position, the scattered electrons are PE.
Before hitting the T film, the projections are preferentially drawn (focused) to the projections, the charge of the PET film is improved, the running property of the PET film does not deteriorate due to charging, and the thin film is formed on the running support. I got the revelation that would be beautifully formed.

The present invention has been achieved based on the above findings, and an object of the present invention is to provide a technique by which a thin film (for example, a metal magnetic film) is favorably formed. An object of the present invention is to provide a thin film forming apparatus comprising: a beam irradiation unit, a support on which a beam is irradiated from the beam irradiation unit and vaporized particles are deposited, and a conductive protrusion member. To be achieved.

The electron beam irradiating means comprises an electron beam irradiating means, a support on which electron beams are radiated from the electron beam irradiating means and vaporized particles are deposited, and a conductive projection member. From the above, it is achieved by a thin film forming apparatus characterized in that scattered electrons by an electron beam irradiated toward a target position are captured by the projecting member.

It is preferable that the above-mentioned projection member is grounded. That is, with this structure, electrons can be immediately released, and what is called charging can be effectively prevented. By the way, the thin film forming apparatus is usually provided with a shielding member in order to prevent the evaporated particles from adhering to and contaminating a portion other than the support to be deposited. The shielding member is usually arranged at a position near the support on which the evaporated particles are accumulated. Of course, it may be provided in a portion other than these. However, since at least one shielding member is provided at a position between the evaporation source and the support to be deposited, if a sharp protrusion is formed on the surface of such a shielding member, it is unnecessary It is convenient because it does not require any special member. In particular, if the projections (particularly the projections provided in the direction in which scattered electrons are scattered toward the support) are formed on the surface of the shielding member arranged in the vicinity of the support, The number of scattered electrons attached to the support is further reduced, the mobility of the support does not deteriorate due to the charging of electrons, and a thin film is formed neatly on the running support.

The shielding member and the protruding member may be integrally formed of a conductive material such as Ag, Cu, Au, Pt, Al, and Rh. You may make it plant in the shielding member. Then, in the thin film forming apparatus of the present invention, a support is provided between the supplying means and the winding means, and the particles evaporated by the beam irradiating means are applied to the support running while being in contact with the cooling roll. It is generally configured to be deposited, and the features are greatly exhibited in the case of such a type. In particular, when the support is a long non-conductive film, the features are greatly exhibited.

According to the thin film forming apparatus configured as described above, it is possible to preferentially capture the scattered electrons by the electron beam irradiated toward the target position on the protruding member during the thin film forming operation, and to obtain a vacuum. Electrons are scattered inside the container, that is, the inside of the thin film forming apparatus, and the phenomenon that the electrons adhere to and are charged on the insulating support is largely eliminated. Therefore, the runnability of the support does not decrease due to the electrification (electrostatic charge) of electrons, and the thin film can be formed neatly on the running support.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic view showing an embodiment of the thin film forming apparatus of the present invention. In the figure, 1 is a cooling can roll, 2
a is a non-magnetic and insulating support (for example, polyester such as PET, polyamide, polyimide, polysulfone,
Polymer side material such as olefin resin such as polycarbonate and polypropylene, cellulose resin, vinyl chloride resin) 3 supply side roll, 2b winding side roll of the support 3, 4a, 4b, 4c, 4d Shielding plate, 5 is an oxygen gas introduction tube, 6 is a crucible, 7 is a magnetic alloy contained in the crucible 6 (for example, in addition to metals such as Fe, Co, and Ni, Co--Ni alloy, Co--Pt alloy, Co-Ni-P
t alloy, Fe-Co alloy, Fe-Ni alloy, Fe-Co
-Ni alloy, Fe-Co-B alloy, Co-Ni-Fe-
B alloy, Co-Cr alloy, or those containing a metal such as Al), 8 is an electron gun, and 9 is a vacuum container.

The shielding plate 4a is provided at a position between the crucible 6 and the oxygen gas introducing pipe 5, and the shielding plate 4a.
b and 4c are vacuum containers 9 based on the cooling can roll 1.
It is provided in a position that divides the inside of the
The shielding plate 4d is provided on the left and right of the cooling can roll 1 (in the drawing, the axis of the cooling can roll 1 is a direction perpendicular to the paper surface,
The left and right sides of the cooling can roll 1 are provided laterally on the front side and the other side of the drawing.

Since the structure of these portions is well known in the art, detailed description thereof will be omitted. 1
Reference numeral 0 denotes a protrusion having a sharp portion provided on the lower surface or the end portion of the shielding plates 4a, 4b, 4d. In addition, these protrusions 1
0 is the shielding plates 4a, 4 made of a conductive material such as Cu
It is constructed integrally with b and 4d.

As can be seen from FIG. 1, the shielding plate 4
Since a, 4b and 4d are grounded, the protrusion 10 is grounded. Manufacturing of a metal thin film type magnetic recording medium using the thin film forming apparatus (magnetic recording medium manufacturing apparatus) configured as described above will be described. First, the inside of the vacuum container 9 is evacuated to have a predetermined vacuum degree. Then, it is fed out from the supply side roll 2a, is attached to the cooling can roll 1, and the support 3 is attached to the winding side roll 2b.
Is rolled up. In this state, an electron beam is emitted from the electron gun 8 as shown by an arrow, and the Co—Ni magnetic alloy 7 in the crucible 6 is irradiated with the electron beam.
The particles of the Ni magnetic alloy 7 evaporate, adhere to the support 3 attached to the cooling can roll 1, and accumulate. still,
Such a process is the same in the conventional thin film forming apparatuses.

By the way, in the conventional thin film forming apparatus in which the projection 10 is not provided, a part of the electron beam emitted from the electron gun spreads and is scattered, and a part of the electrons is scattered to the support. This then adheres to the support, resulting in electrostatic charge on the support. For this reason, the traveling of the support body is disturbed by this, and in a severe case, the support body may stick to the cooling can roll and become unable to travel.

However, with the above structure, even if scattered electrons from the electron beam emitted from the electron gun 8 or scattered electrons from the molten metal are scattered toward the support 3, The protrusions 10 are preferentially attracted to the protrusions 10, and the number of particles scattered to the support 3 is significantly reduced. As a result, the support 3 sticks to the cooling can roll 1 due to electrostatic charge and cannot run. The phenomenon described above can be effectively prevented.

The scattered electrons captured by the projection 10 are immediately released because the projection 10 is grounded. By the way, in the above apparatus, the inside of the vacuum container 9 was evacuated to a vacuum degree of 3 × 10 ⁻⁵ Torr, and
An m-thick PET film was made to travel from the supply side roll 2a to the winding side roll 2b at a speed of 10 m / min, and an electron beam Co- was produced with an output of 30 kW using a pierce type electron gun manufactured by JEOL Ltd. Irradiating the Ni (80-20) magnetic alloy to evaporate the particles of the Co-Ni magnetic alloy and attach them to the PET film attached to the cooling can roll 1.
It was deposited to a thickness of 1600Å. When forming this metal magnetic film, oxygen gas was introduced from the oxygen gas introducing pipe 5 at a rate of 25 minutes per minute.
Flowing at 0 sccm to oxidize the surface. And 100
A metal magnetic film was formed over a length of 0 m, and the variation in thickness was measured by a step gauge (Taristep manufactured by Langter Labosson). The results are shown in Table 1.

Table-1 100m 200m 300m 400m 500m 600m 700m 800m 900m Example -60 -40 -20 -20 +10 0 +10 +30 +10 Comparative example +50 -100 +180 +70 +150 -60 +10 -20 +140 * The numbers in the table show the difference from 1600Å (unit is Å).

* The comparative example is for a device not provided with the protrusion 10. According to this, when the thin film forming apparatus of the present invention provided with the protrusions 10 is used, the running characteristics of the support during thin film formation are good, and the metal magnetic film is formed with a uniform thickness. You can see that On the other hand, when the protrusion 10 is not provided, the scattered electrons from the electron beam emitted from the electron gun scatter to the support, and the support is charged with static electricity, and the support travels. It can be seen that there is a large amount of variation in the deposited metal magnetic film.

Therefore, according to the thin film forming apparatus of the present invention,
It can be seen that the formed thin film is uniform, a metal magnetic film with a small variation in thickness is formed, and a high-performance magnetic recording medium can be obtained with good yield. In addition, in the above-mentioned embodiment, the case where the metal magnetic film is provided on the support has been described, but the same characteristics can be obtained even when the back coat film is formed in the metal thin film type magnetic recording medium. .

[0023]

[Effects] According to the present invention, a thin film having a uniform thickness and a small variation is favorably formed.

[Brief description of drawings]

FIG. 1 is a schematic view of a thin film forming apparatus of the present invention.

FIG. 2 is a schematic view of a conventional thin film forming apparatus.

[Explanation of symbols]

 1 Cooling Can Roll 2a Supply Side Roll 2b Winding Side Roll 3 Supports 4a, 4b, 4d Shielding Plate 7 Magnetic Alloy 8 Electron Gun 9 Vacuum Container 10 Protrusion

Front page continuation (72) Inventor Shigemi Wakabayashi 2606 Akabane, Kai Co., Ltd., Kaigamachi, Haga-gun, Tochigi Prefecture Inside Kao Co., Ltd. Information Science Laboratory In the laboratory

Claims (7)

[Claims] 1. A thin film forming apparatus comprising: a beam irradiating unit, a support on which a beam is radiated from the beam irradiating unit and vaporized particles are deposited, and a conductive protrusion member. 2. An electron beam irradiating means, a support on which an electron beam is radiated from the electron beam irradiating means, and vaporized particles are deposited, and a conductive protrusion member.
A thin film forming apparatus, characterized in that scattered electrons by an electron beam emitted from the electron beam irradiating means toward a target position are captured by the projecting member. 3. The thin film forming apparatus according to claim 1, wherein the protrusion member is grounded. 4. The thin film forming apparatus according to claim 1, wherein the projection member is provided on the surface of a conductive shielding member. 5. The projection member is provided on the surface of a conductive shielding member, and the shielding member is arranged at a position in the vicinity of a support on which vaporized particles are deposited. The thin film forming apparatus according to claim 1, claim 2 or claim 3. 6. A support is provided between the supply means and the winding means, and is configured so that particles evaporated by the beam irradiation means are deposited on the support that runs while being in contact with the cooling roll. The thin film forming apparatus according to claim 1 or 2. 7. The support according to claim 1, wherein the support is a long non-conductive film.
Thin film forming equipment.