JPH07237940A - Device for soldering electrically conductive terminal to plate glass face - Google Patents

Abstract

PURPOSE:To automatically and rapidly solder an electrically conductive terminal to a plate glass face by positioning the electrically conductive terminal in other place and moving the terminal to a soldering position by a moving apparatus having a specific structure. CONSTITUTION:Plate glass 7 to which an electrically conductive terminal 1 is soldered is put on a placing table 8 and positioned by a pusher 9. An electrically conductive terminal 1 to which lead wire is pressed is separately accurately positioned by a positioning device 2. Then, a cylinder 32 for rotating a moving device 3 is operated and an arm 34 is rotated by contraction of a rod 33 and a holding means 4 is moved at the position of the positioning device 2 and a cylinder 36 for lifting and lowering is operated to lower the holding means 4. Then, a terminal part of the electrically conductive terminal 1 is held by the holding means 4 and raised and rotated and moved right above a soldering position on the plate glass 7 and then, lowered to press the electrically conductive terminal 1 to an electrically conducted material formed on the upper face of the plate glass 7. Then, hot air is fed from a heater 5 and the electrically terminal 1 is soldered to the electrically conductive material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for soldering a conductive terminal to a conductive material such as a bus bar of an anti-fogging heating wire provided on a rear window glass of a vehicle or a feeding point of a glass antenna.

[0002]

2. Description of the Related Art A conductive terminal generally has a pair of pedestals, and has a small and complicated shape. The conductive terminal is bonded to a conductive material such as a bus bar or a feeding point. In this case, the solder deposited on the back surface of the pedestal is melted and adhered, but it is difficult to perform positioning and grasping. For such soldering, JP-A-55-54266, Japanese Patent Application Laid-Open No. 58-32043 and the like have been filed. The former discloses an apparatus for soldering with an infrared heater, and the latter discloses an apparatus for blowing hot air to a soldering location for soldering. However, in both cases, the conductive terminals are temporarily attached manually with clips etc. when soldering, and even if it is called temporary attachment, it is necessary to make the position accurate, and it is also necessary to remove it after completion of soldering. Ri, complicated and time-consuming there has been a drawback that it takes.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an apparatus for soldering a conductive terminal to a plate glass surface which can automatically and quickly perform such a soldering operation. To aim.

[0004]

SUMMARY OF THE INVENTION The present invention is an apparatus for connecting a pair of pedestals to a conductive material formed on a plate glass surface and soldering a conductive terminal having a terminal portion at a tip thereof, wherein the conductive terminal is soldered. A device for positioning at a place different from the mounting place, a device for holding the terminal part of the conductive terminal from both the front and back sides of the terminal part, and a moving device for moving from the positioning device to the soldering place of the plate glass, and a soldering place The positioning device is characterized in that at least a heater for applying heat is provided, and the positioning device has a stopper portion and a terminal portion where the tip of one pedestal of the conductive terminal abuts due to the shape of the conductive terminal. At least composed of a mounting piece having a notch that fits,
Alternatively, it is preferable to provide at least a stopper portion with which the tip of one pedestal of the conductive terminal abuts and a barrier with which the outer shape of both sides of the conductive terminal abuts.

Further, it is preferable to add a pressing means having a vertically movable pin capable of pressing a pair of pedestals of the conductive terminals to the moving device, and means for holding the terminal portions of the conductive terminals from both front and back surfaces. Depending on the shape of the conductive terminal, it may be composed of a member that presses from both the front and back sides of the terminal of the conductive terminal, or the means for sandwiching the terminal part of the conductive terminal from both the front and back sides is a hole through which the pressing pin is inserted. It is preferable that the flat plate and the rotatable finger are provided with notches into which the pressing pins can be fitted, and in the former case, one of the members pressing from both sides has a tongue piece. However, it is more preferable that the other has a groove into which the terminal portion of the conductive terminal can be fitted and a groove into which the tongue piece can be fitted.

It is also preferable that the heater is moved integrally with the moving means.

[0007]

The soldering of the conductive terminal is performed on the plate glass formed in a curved shape, and it is very difficult to position it at this location. Therefore, in the present invention, a horizontal location different from the soldering location is used. This is made possible by locating at, specifically, when the terminal portion at the tip of the conductive terminal is formed so as to be parallel to the horizontal plane, especially when the front and back surfaces of the terminal portion are perpendicular to the horizontal plane. If it is formed so as to have at least a mounting piece having a stopper portion with which the tip of one pedestal of the conductive terminal contacts and a notch portion with which the terminal portion fits, it will be described later. As shown in the first embodiment, the front and rear and left and right directions of the conductive terminal can be accurately fixed and positioned.

Further, as shown in the second embodiment, at least a stopper portion with which the tip of one pedestal of the conductive terminal abuts and a barrier with which the outer shape of both sides of the conductive terminal abuts are provided.
Also in this case, the front and rear and the left and right can be accurately fixed and positioned.

The positioned conductive terminal is provided with a means for holding the terminal portion of the conductive terminal from both front and back surfaces,
By the moving device for moving from the positioning device to the soldering position of the plate glass, it is surely supported and accurately moved to the soldering position, and heat is applied by the heater so that the soldering can be performed automatically.

A member for pressing the means for sandwiching the terminal part of the conductive terminal from both the front and back surfaces, particularly one of the pressing members has a tongue piece, and the other has a groove into which the terminal part of the conductive terminal can be fitted. By forming the groove into which the tongue piece can be fitted, the conductive terminal can be reliably gripped and reliably moved to the soldering position without dropping or shifting during the movement. In this case, if the groove into which the terminal part fits is made larger than the width of the terminal part, when the solder bonding surface is inclined with respect to the horizontal plane, the pedestal is pressed by the pressing pin to bond from the sandwiched state. It can absorb even when it comes into contact with the surface and tilts.

Alternatively, the means for holding the terminal portion of the conductive terminal from both the front and back sides is a flat plate having a hole through which a pressing pin is inserted and a rotatable finger having a notch into which the pressing pin can be inserted. With this configuration, the pressing pin can be sandwiched between the flat plate and the fingers from both sides of the front and back surfaces of the terminal portion with the pressing pin inserted into the hole of the flat plate and the hole of the terminal portion of the conductive terminal without pressing. Also, it is possible to reliably move to the soldering point without dropping or shifting during movement.

In addition, since the conductive terminal accurately moved to the soldering point is pressed by the pressing means having the vertically movable pin at the tip, the pair of pedestals of the conductive terminal are pressed by the pins, so that the predetermined position is set at the time of soldering. Can be soldered accurately.

If the heater is provided independently of the moving means, it is necessary to change the position of the heater each time the soldering location changes. However, the heater is moved integrally with the moving means. As a result, when the moving means is moved following the change of the soldering location, the relative positions of the pressing pin and the sandwiching means do not change, so that no adjustment is necessary.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the drawings. 1 to 4 are respectively a front view showing an entire soldering device according to a first embodiment of the present invention, a perspective view showing a positioning device, a partial perspective view showing a holding means, and a perspective view of a main part showing a holding means and a pressing means. 5 and 5 are perspective views of a main part of the soldering device according to the second embodiment.

Embodiment 1 With reference to FIGS. 1 to 4, a pair of pedestals 11, 11 to which a lead wire having a connector at the tip is preliminarily crimped, are connected to each other and extend parallel to the horizontal plane at the tip, and the front and back surfaces thereof A case will be exemplified in which the conductive terminal 1 having the terminal portion 12 such that is perpendicular to the horizontal plane is soldered.

The soldering device of the present invention comprises a positioning device 2,
A moving device 3 that can move horizontally and vertically, a means 4 for sandwiching a conductive terminal provided on the moving device, a heater 5 such as a heater or an infrared heater for blowing hot air to heat a soldering portion, and a pressing means. It is composed of 6 and so on.

The structure of each part will be described in detail. As shown in FIG. 2, the positioning device 2 includes one pedestal 1 of the conductive terminal 1.
A mounting piece 23 having a stopper portion 21 with which the tip of 1 abuts and a notch portion 22 with which the terminal portion 12 is fitted.
Further, the mounting piece 25 has a cutout portion 24 into which the lead wire fits, but the positioning can be performed without necessarily including the cutout portion 24 into which the lead wire fits.

The moving device 3 includes a turning cylinder 32 attached to a fixed support frame 31, an arm 34 that is horizontally rotated by a mechanism (not shown) due to expansion and contraction of a rod 33 of the cylinder, and a support fixed to the tip of the arm 34. Frame 35
The lifting cylinder 36 (including the rod 37) and the like attached to the means 4, and the means 4 for holding the conductive terminal, the chuck cylinder is built in, the casing 41 fixed to the rod 37 of the lifting cylinder 36, and the built-in not shown. The cylinder is actuated to narrow or widen the space, and one end has a tongue piece 43, and the other end has a groove 44 into which the terminal portion 12 of the conductive terminal 1 can be fitted and the tongue piece 43. Is composed of two chuck rods 42, 42, etc. each having a groove 45 into which can be fitted. A heater for applying heat to a soldering portion is connected to a rod 37 of a lifting cylinder 36 by a connecting rod 51, a sliding member 52, and a support. A frame 53, a hot air generating means connected via a spring 54 or the like, a heater 5 such as an infrared heater, and the like, and the pressing means 6 is a supporting frame 53. Mounting the pressing cylinder 6
1, 61, cylinders 61, 61, and rods 62, 62, and pressure pins 63, 63 attached to the tips of the rods.

Next, the soldering work by the apparatus of the present invention will be described. (1) The plate glass 7 to which the conductive terminals are soldered is placed on the mounting table 8 in advance and positioned by a known method such as pressing the glass edge with the pusher 9 or the like. (2) The conductive terminal 1 to which the lead wire is crimped is inserted into the cutout portion 22 of the positioning device 2, the terminal portion 12 is fitted, and the tip of one pedestal 11 is brought into contact with the stopper 21.
The positions of the terminal 1 in the front-rear direction, the left-right direction, and the up-down direction are determined, and the terminal 1 can be accurately positioned. (3) The moving device 3 first sets the turning cylinder 32 and the lifting cylinder 36 in an initial state, that is, in a state in which the horizontal direction is separated from the positioning device and a vertical direction is raised upward. After the positioning of the conductive terminal is completed, the swiveling cylinder 32 is actuated to swivel the arm 34 by the expansion and contraction of the rod 33 to move the sandwiching means 4 and the like to the position of the positioning device 2 and further elevate and lower. The cylinder 36 is operated to lower the means 4 for holding the conductive terminal by the extension of the rod 37 (the heater 5 and the pressing means 6 also move together) to the position shown in FIG. (4) When the built-in cylinder of the means 4 for holding the conductive terminal is operated and the two chuck rods 42, 42 are moved in the direction of the arrow in FIG. 3, the tongue piece 43 at one end of the chuck rod causes the conductive terminal 1 to move. The terminal portion 12 of the conductive terminal 1 is fitted in the groove 44, the tongue piece 43 is fitted in the groove 45 via the terminal portion 12, and the gap between the chuck rod and the other chuck rod is narrowed. The chuck rods 42, 42 clamp the terminal portion 12 while pressing it. (5) The lifting cylinder 36 is operated to raise the means 4 for holding the conductive terminal and the like, and then the turning cylinder 3
2 is operated and moved to a position right above the pre-positioned glass plate where the solder is applied. After that, the lifting cylinder 36 is operated and the means 4 for holding the conductive terminal is shown in FIG.
As shown in FIG. 5, the pressure linders 61, 61 are moved down to the soldering position, the rods 62, 62 are extended, and the pressing pins 63, 63 contact and press the pedestal parts 11, 11 of the conductive terminal 1. Let

At this time, the conductive terminal 1 is brought into contact with a conductor (not shown) such as a bus bar. This contact surface is inclined with respect to the horizontal plane because glass is generally formed in a curved shape. Since the groove 44 is formed to be larger than the width of the terminal portion 12 of the conductive terminal 1, it is possible to absorb the shift in the relative position between the chuck rod 42 and the terminal portion 12.

Since the holding means 4 and the like are lowered against the pulling force of the spring 54, the conductive terminal can be softly contacted without giving a shock to the conductive material.

Moreover, since the conductive terminal 1 is pressed against a conductor (not shown) only by the pressing pins 63, 63, the entire pedestal can be brought into close contact with the conductor. (6) In this state, the hot air is soldered from the heater 5
Particularly when applied to the pedestal portions 11 and 11, the solder placed on the back surface of the pedestal is melted and the conductive terminal 1 is soldered to the conductive material. After that, cold air is blown onto the solder portion by a cooling means (not shown) or the like to cool and fix the solder, and the soldering work is completed. (7) The pressing cylinder 61 and the lifting cylinder 36 are operated to raise the pressing pin 63, the chuck rod 42, the heater 5 and the like to restore the initial state.

After that, if the steps (1) to (7) are repeated, the soldering work can be performed automatically and quickly. Example 2 With reference to FIG. 5, a pair of pedestals 11 and 11 are connected to each other, and a tip end thereof has a terminal portion 12 extending parallel to a horizontal plane and having its front and back surfaces parallel to each other. Is
An example of soldering the conductive terminal 1 in which a hole for fitting with a protrusion of a female connector is formed will be described.

The soldering device of the present invention comprises a positioning device 2,
A moving device 3 that can move horizontally and vertically, a means 4 for sandwiching a conductive terminal provided on the moving device, a heater 5 such as a heater or an infrared heater for blowing hot air to heat a soldering portion, and a pressing means. Although the mobile device has the same configuration as that of the first embodiment,
Omit it.

Explaining the structure of each part in detail, the positioning device 2 comprises a stopper part 21 with which the tip of one pedestal 11 of the conductive terminal 1 abuts, and barriers 26, 26 with which the outer shapes of both sides of the conductive terminal abut. By arranging the barriers 26, 26 with a slight inclination for a long time and applying vibration or the like, a plurality of conductive terminals can be positioned one after another.

Although the moving device is not shown, an elevating cylinder 36, which is a part of the moving device, is fixed to the frame 35. Support frame 4 connected to rod 37 of cylinder 36
6 is attached with a flat plate 47 having a hole 471 through which a pressing pin described later is inserted.
Attach 8. The finger rotating means 48 is the support frame 46.
A rotation cylinder 481 attached to the arm 48, an arm 483 that rotates by expansion and contraction of the rod 482, and an arm 48.
Fingers 484, 48 attached to the tip of No. 3 and formed with notches 485, 485 into which the pressing pins can be fitted
The support frame 46 is also a part of the finger rotating means 48.

The heater 5 for applying heat to the soldering portion is composed of a heater or the like fixed to a support frame 46 that moves up and down by the expansion and contraction of the rod 37 of the lifting cylinder 36, and the pressing means 6 is the support frame 46. The pressing cylinders 61, 61, and the pressing pins 63, 63 attached to the tips of rods (not shown) of the cylinders 61, 61.

Next, the soldering work by the apparatus of the present invention will be described. (1) The plate glass to which the conductive terminals are soldered is previously positioned by a known method. (2) As shown in FIG. 5, the conductive terminal 1 is attached to the positioning device 2
Between the barriers 26, 26 and abutting against the stopper portion 21, or by inserting the conductive terminal 1 between the barriers 26, 26 which are gently inclined and long and are provided with vibration by a vibrator (not shown) or the like. Then, the conductive terminal 1 gradually moves to the stopper 21 side, the terminal portion 12 of the conductive terminal 1 contacts the stopper portion 21, and the positions of the conductive terminal 1 in the front-rear direction, the left-right direction, and the vertical direction are determined, so that the conductive terminal 1 can be accurately positioned. (3) The moving device (not shown) is set in the initial state, that is, in the horizontal direction in a state separated from the positioning device and in the vertical direction in a raised state, and after the positioning of the conductive terminal in (2) is completed, By moving the holding means 4 and the like to the position of the positioning device 2 and further operating the lifting cylinder 36, the means 4 and the like for holding the conductive terminal by the extension of the rod 37 (the heater 5 and the pressing means 6 are also interlocked). Move) to the position shown in FIG.
Is inserted into the hole (not shown) of the terminal portion 12 of the conductive terminal 1, and the rotating cylinder 481 is operated.
An arm 483 which is rotated by the extension of the rod 482,
Fingers 484, 4 attached to the tip of arm 483
When 84 is rotated until the notches 484 and 484 are fitted into the pressing pins 63 and 63 protruding from the flat plate 47, the pressing pin 63 is inserted into the hole 471 of the flat plate 47 and the hole of the terminal portion 12. In this state, the flat plate 47 and the fingers 484 can hold the terminal portion 12 from both sides of the front and back surfaces. (4) After the conductive terminals of (3) are clamped, the elevating cylinder 36 is actuated to raise the means 4 for clamping the conductive terminals, and the like, and then a moving device (not shown) is placed on the glass plate that has been positioned in advance. Move to just above the soldering point. After that, the elevating cylinder 36 is operated to lower the means 4 for sandwiching the conductive terminal to the soldering point and bring the conductive terminal 1 into contact with a conductor (not shown) such as a bus bar. The rotation cylinder 481 is activated and the fingers are moved to the position shown in FIG.
To avoid the positions as shown in FIG. 1 and to further operate the press linders 61 and 61 to extend the rods thereof and press the pins 63 and 63 to cause the pedestal portions 11 and 11 of the conductive terminal 1 to move.
To press. At this time, there is still room for the stroke of the rod, and when the rod is further extended, the downward force is resisted by the pedestal and stops at a certain point, but it stops at a certain point, but the support frame 46 and the like are lifted as much as the stroke is extended. To operate. As a result, the flat plate 47 also floats up, and the entire pedestal part can be made to conform to the conductive material even if the adhesive surface is inclined with respect to the horizontal plane. (5) In this state, when hot air is applied from the heater 5 to the soldering points, particularly the pedestal portions 11, 11, the solder deposited on the back surface of the pedestal is melted and the conductive terminals 1 are soldered to the conductive material. After that, cold air is blown onto the solder portion by a cooling means (not shown) or the like to cool and fix the solder, and the soldering work is completed. (6) The pressing cylinder 61 and the elevating cylinder 36 are operated to raise the pressing pin 63, the heater 55, etc. to restore the initial state.

After that, if the steps (1) to (6) are repeated, the soldering work can be performed automatically and quickly. The preferred embodiments have been described above, but the present invention is not limited to these, and various applications are possible.

Regarding the conductive terminals to be soldered,
Various shaped terminals are used in addition to the embodiment,
It can be adopted by selecting either of the two types of positioning device of the present invention or the two types of clamping means for most terminals.

Regarding the positioning device, the device of the embodiment is preferable because of its good workability. However, other than that, a device in which a concave portion matching the shape of the pedestal is provided on the mounting table may be used. Regarding the means for sandwiching the terminal portion of the conductive terminal from both the front and back sides, in the case of the means for pressing from the front and back surfaces of the terminal portion of the conductive terminal, the means shown in Example 1 is excellent because the terminals do not slip or drop. However, other than this, it is also possible to press with two flat tongue pieces.

Regarding the moving device, in addition to the device for performing the turning motion and the vertical motion by the operation of the cylinder as in the embodiment, the moving device can be freely moved in the x-axis and y-axis directions in the horizontal plane and the z-axis direction in the vertical direction. Of course, a triaxial drive device, a robot, or the like can also be used.

The pressing means is indispensable when the bonding surface to be soldered is inclined with respect to the horizontal plane, but when the bonding surface is horizontal, the soldering is carried out with the terminal held by the holding means. It is not necessary in this case as it can be attached.

[0034]

According to the soldering apparatus of the present invention, it is possible to automate the soldering work, which has been difficult in the past, and to perform the soldering work quickly.

[Brief description of drawings]

FIG. 1 is a front view showing an entire soldering device according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a positioning device according to the first embodiment of the present invention.

FIG. 3 is a partial perspective view showing a sandwiching unit according to the first embodiment of the present invention.

FIG. 4 is a perspective view of an essential part showing a sandwiching means and a pressing means in Embodiment 1 of the present invention.

FIG. 5 is a perspective view of essential parts showing a soldering device according to a second embodiment of the present invention.

[Explanation of reference numerals] 1 conductive terminal 2 positioning device 3 moving device 4 means for sandwiching the terminal portion of the conductive terminal from both front and back sides 5 heater 6 pressing means

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location B23K 3/00 K 8727-4E 37/04 G // H05B 3/84

Claims (8)

[Claims] 1. A device for soldering a conductive terminal having a terminal portion at its tip by connecting a pair of pedestals to a conductive material formed on a plate glass surface, and positioning the conductive terminal at a place different from a soldering place. And a moving device that is movable from the positioning device to the soldering location of the plate glass and that is movable to the soldering location of the plate glass, and a soldering location. An apparatus for soldering a conductive terminal to a plate glass surface, characterized by comprising at least a heater for applying heat to the plate glass. 2. The positioning device comprises at least a mounting piece having a stopper portion with which a tip of one pedestal of the conductive terminal abuts and a notch portion with which the terminal portion fits. The device for soldering a conductive terminal to a glass plate surface according to claim 1. 3. The platen surface according to claim 1, wherein the positioning device is provided with at least a stopper portion with which the tip of one pedestal abuts and a barrier with which both sides of the conductive terminal abut. Soldering device for conductive terminals. 4. A pressing device having a vertically movable pin capable of pressing a pair of pedestals of the conductive terminals at the tip thereof is added to the moving device. Device for soldering conductive terminals to the plate glass surface described 5. The plate glass according to claim 1, wherein the means for holding the terminal portion of the conductive terminal from both sides of the front and back surfaces is constituted by a member pressing from both sides. Device for soldering conductive terminals to surfaces. 6. The means for sandwiching the terminal portion of the conductive terminal from both the front and back surfaces has a tongue piece on one of the members pressing from both sides,
The other device is configured to form a groove into which a terminal portion of a conductive terminal can be fitted and a groove into which the tongue piece can be fitted, and a device for soldering a conductive terminal to a plate glass surface according to claim 5. 7. A rotatable finger having a flat plate having a hole through which a pressing pin is inserted and a notch portion into which the pressing pin can be fitted, as means for holding the terminal portion of the conductive terminal from both front and back sides. The apparatus for soldering a conductive terminal to a plate glass surface according to claim 1, wherein: 8. The apparatus for soldering a conductive terminal to a plate glass surface according to claim 1, wherein the heater is configured to move integrally with the moving means.