JPH0722896B2 - Super abrasive grain rotating blade - Google Patents

Super abrasive grain rotating blade

Info

Publication number
JPH0722896B2
JPH0722896B2 JP28290A JP28290A JPH0722896B2 JP H0722896 B2 JPH0722896 B2 JP H0722896B2 JP 28290 A JP28290 A JP 28290A JP 28290 A JP28290 A JP 28290A JP H0722896 B2 JPH0722896 B2 JP H0722896B2
Authority
JP
Japan
Prior art keywords
chip
corner
substrate
blade
steps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP28290A
Other languages
Japanese (ja)
Other versions
JPH03208562A (en
Inventor
努 田窪
Original Assignee
大阪ダイヤモンド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大阪ダイヤモンド工業株式会社 filed Critical 大阪ダイヤモンド工業株式会社
Priority to JP28290A priority Critical patent/JPH0722896B2/en
Publication of JPH03208562A publication Critical patent/JPH03208562A/en
Publication of JPH0722896B2 publication Critical patent/JPH0722896B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121Circular saw blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、主として石材やコンクリート等の切断に用い
られるダイヤモンド、CBN(立方晶型窒化硼素)等の超
砥粒回転ブレードに関する。
TECHNICAL FIELD The present invention relates to a superabrasive rotary blade of diamond, CBN (cubic boron nitride) or the like, which is mainly used for cutting stones, concrete and the like.

(従来の技術、及び解決しようとする課題) 第5図はダイヤモンド回転ブレードを加工状態を合わせ
て示すものである。
(Prior Art and Problem to be Solved) FIG. 5 shows a diamond rotary blade in a processed state.

図に示すように円板状基体1は中心穴2を介して回転軸
に取りつけることができ、その外周面にチップ台座3が
所定間隔で多数形成されている。
As shown in the figure, the disk-shaped substrate 1 can be attached to the rotary shaft through the center hole 2, and a large number of chip pedestals 3 are formed on the outer peripheral surface thereof at predetermined intervals.

前記台座3上には、上層部にダイヤモンド層が形成され
たダイヤモンドチップ4が取付けられる。
On the pedestal 3, a diamond chip 4 having a diamond layer formed on the upper layer is attached.

このチップ4の両側面は前記基体端面の回転方向に対し
て平行に配置されており、一般にブレード径が小さい場
合、ろう付け等で台座3に固定され、径寸法が大きくな
ると蟻溝等を利用した機械的はめ合いにより着脱可能に
取付けられるようになったものもある。
Both side surfaces of the chip 4 are arranged parallel to the rotation direction of the end face of the base body, and generally, when the blade diameter is small, it is fixed to the pedestal 3 by brazing or the like, and when the diameter dimension becomes large, a dovetail groove or the like is used. There are also those that can be removably attached by a mechanical fit.

研削は、図に示すようにブレードを回転させて被削材5
に一定量ずつ切り込んで行く方法で行う。
For grinding, rotate the blade as shown
It is done by cutting into a certain amount.

その場合、チップ4の両側面とブレード回転方向前端面
とが砥面となって被削物に喰い込んで行くが、研削時に
は大きな摩擦熱を生じるためブレードと被削物との間に
研削液を連続供給し、加工部を十分冷却する必要があ
る。
In that case, both side surfaces of the tip 4 and the front end surface in the blade rotation direction serve as grinding surfaces and bite into the work piece, but a large amount of frictional heat is generated during grinding, so that the grinding liquid is left between the blade and the work piece. Must be continuously supplied to sufficiently cool the processed part.

このような構造の回転ブレードについては、従来より次
のような種類がある。
Conventionally, there are the following types of rotary blades having such a structure.

その第1は第3図(イ)に示すようにチップ両側面を対
称な3段状に形成したチップ9と同様に2段状に形成さ
れたチップ9′の2種類のチップを例えば3段チップ9
が2に対し2段チップ9′が1の割合で基体外周端面上
に所定間隔で固着したものである。
First, as shown in FIG. 3 (a), two kinds of chips, for example, a chip 9'which is formed in a two-step shape like the chip 9 in which both side surfaces of the chip are formed in a symmetrical three-step shape, have three steps, for example, three steps. Chip 9
2 to 2, the two-stage chip 9'is fixed at a predetermined interval on the outer peripheral end face of the base body at a ratio of 1.

ところで前記3段チップ9は研削の際のチップ側面抵抗
を減らし円滑な研削を可能とするが、チップ上層部から
摩耗が進み、第4図(イ)に示すように極端チップ側面
の被削材への当たり面積が小さくなった場合、被削材の
切断面にスジ状の跡を残し、さらに第4図(ロ)のよう
に偏った摩耗を生じた場合には、ブレードが振れ、切断
面が蛇行状態となる。
By the way, the three-stage tip 9 reduces the side resistance of the tip at the time of grinding and enables smooth grinding, but wear progresses from the upper layer of the tip, and as shown in FIG. When the contact area becomes smaller, streaky marks are left on the cut surface of the work material, and when uneven wear occurs as shown in Fig. 4 (b), the blade shakes and the cut surface Becomes a meandering state.

この3段チップの欠点を補うべく2段チップを一定の割
合で3段チップの間に配置することがなされたわけであ
るが、この場合、チップは、3段状のものと2段状の2
種類を用意せねばならずチップ製造上、手間がかかり又
チップ交換において不便を来すということが問題となっ
ていた。
In order to make up for the drawbacks of the three-stage chip, the two-stage chips are arranged at a constant ratio between the three-stage chips. In this case, the chips are three-stage type and two-stage type.
It has been a problem that it is necessary to prepare a type, which is troublesome in manufacturing a chip and inconvenient in chip replacement.

第2は第3図(ロ)に示すようにチップの一側面のみが
階段状で他端面は非階段状のチップを、交互に又は任意
のチップ間隔で反転させて基体外周面上に配置したもの
である(特開昭62年277270号等)。
Second, as shown in FIG. 3B, chips having only one side surface stepwise and the other end surface non-stepwise are arranged alternately or at arbitrary chip intervals on the outer peripheral surface of the substrate. (Japanese Patent Application Laid-Open No. 62-277270, etc.).

この構成の場合、基体端面へのチップ固着は段階的側面
のみで位置決めし、非段階的側面はチップのバラツキに
任されるためツルーイング等の幅決め加工は不要となる
が、研削は一チップおきに配された段階的側面とブレー
ド回転方向前端面により行われるため、段階的側面の摩
耗が早く、チップの耐用寿命が来る前に両側面が非段階
状となり切削抵抗が高くなるということが問題となって
いた。
In this structure, the chips are fixed to the end face of the substrate only by the stepwise side surface, and the non-stepwise side is left to the variation of the chips. Since it is performed by the stepped side surface and the front end surface in the blade rotation direction arranged on the blade, the stepped side surface wears quickly, and both sides become non-stepped before the end of the useful life of the chip, resulting in high cutting resistance. It was.

さらに、チップの摩耗により切断面に前記スジ状の跡が
残り均一な切断面が得られないという問題点も解決され
ていなかった。
Furthermore, the problem that the stripe-shaped marks remain on the cut surface due to wear of the chip and a uniform cut surface cannot be obtained has not been solved.

(問題を解決するための手段) 本発明は上記問題点を解決するためにチップの形状を新
しく変更し、その基体への取付け配置に工夫をした回転
ブレードを提供するものである。
(Means for Solving the Problem) The present invention provides a rotating blade in which the shape of the tip is newly changed to solve the above-mentioned problems and the mounting arrangement on the base is devised.

まずチップの形状についてであるが、第1図及び第2図
(イ),(ハ)に示すようにチップ両側面は段階的に構
成されているが、一側面と他側面は段数が異なるか、又
は第2図(ロ)に示すよう両側面の段数は同数でもチッ
プの高さ方向で段階構成が異なるもので左右非対称型と
なっている。このチップを第1図に示すように交互に又
は任意のチップ間較で反転させて基体外周端面上に取付
けることにある。
First, regarding the shape of the chip, both side surfaces of the chip are configured stepwise as shown in FIGS. 1 and 2 (a) and (c). Is the number of steps different between one side surface and the other side surface? Alternatively, as shown in FIG. 2 (B), even if the number of steps on both sides is the same, the step configuration differs in the height direction of the chip, which is a left-right asymmetric type. This chip is mounted on the outer peripheral end face of the base body alternately as shown in FIG. 1 or inverted between arbitrary chips.

(作用) 上述のようにチップ両側面はその上端面より段階的に陥
没してコーナーが形成された側面をなし、しかも左右非
対称型であるため、各チップを反転させて取付けること
によりブレード回転時、チップの各コーナーの間、及び
又はコーナーの上下に反転して取付けたチップの各コー
ナーが位置することになる。
(Function) As described above, both side surfaces of the tip are stepped from the upper end surface in a stepped manner to form a side surface with a corner formed. Moreover, since it is a left-right asymmetric type, each tip is inverted and mounted to rotate the blade. , Between the corners of the chip and / or each corner of the chip mounted upside down.

この状態で研削を行った場合、加工溝の一側面は基体端
面の一側に最も突出したチップ上側面により加工され以
下チップの摩耗に従い順次突出したチップの段階状側面
が加工に関与することとなる。
When grinding is performed in this state, one side surface of the processing groove is processed by the chip upper surface most protruding to one side of the base end surface, and the stepped side surface of the chip sequentially protruding according to the wear of the chip is involved in the processing. Become.

(実施例) 第2図(イ)は本発明の実施例としてチップの一側面を
2段、他側面を3段とした場合、ブレード回転時の一チ
ップとこれを反転して取付けたチップの重複状態を示す
ものである。
(Embodiment) FIG. 2 (a) shows an embodiment of the present invention in which one side surface of the chip has two steps and the other side surface has three steps. It shows an overlapping state.

前記チップは上端面が長さ方向で僅かに湾曲し、両側面
が平行なほぼ短ざく状のメタルボンドダイヤモンドチッ
プであって、下端面幅は基体の厚みより大きく、該下端
面につながるチップの両下側面においても研削が可能と
なっている。しかしチップ最下層部ではダイヤモンド砥
粒10は少なく基体へのろう付けが容易になっている(第
1図参照)。
The tip is a metal-bonded diamond tip whose upper end surface is slightly curved in the lengthwise direction and whose both side surfaces are parallel to each other, and whose lower end surface width is larger than the thickness of the substrate. Grinding is also possible on both lower side surfaces. However, there are few diamond abrasive grains 10 in the lowermost layer of the chip, and brazing to the substrate is easy (see FIG. 1).

ここで、該チップの段階構成について説明すると、図に
示すようにチップ幅方向において、チップ中心線8より
3段側上側面4aまでの寸法をd1,同8より2段側上側面4
bまでの寸法をd2,同8より3段側中側面4a′までの寸法
をd3,同8より同側下側面4a″及び2段側下側面4b′ま
での寸法をd4とした場合、これらがd1>d2>d3>d4の関
係にある。又チップ高さ方向において、上側面4aの高さ
方向への寸法をh1,2段側上側面の4bの同方向への寸法を
h2,チップ上端面より中側面4a′の下端までの寸法をh3
とした場合、これらはh1<h2<h3の関係にある。なお、
図において、6a,6a′,6aはコーナーを示す。
Here, the step structure of the chip will be described. As shown in the drawing, the dimension from the chip center line 8 to the upper surface 4a on the third step side is d 1 in the width direction of the chip, and the upper surface 4 on the second step side from the same 8 is shown.
The dimension up to b is d 2 , the dimension from the same 8 to the middle side surface 4a ′ of the third step is d 3 , and the dimension from the same 8 to the lower side surface 4a ″ of the same side and the lower step side surface 4b ′ is d 4 . In this case, these are in the relationship of d 1 > d 2 > d 3 > d 4. Also, in the chip height direction, the dimension of the upper side surface 4a in the height direction is the same as h 1 and the upper step side surface 4b has the same dimension. The dimension in the direction
h 2 , the dimension from the top of the chip to the bottom of the medial side 4a ′ is h 3
, They are in the relationship of h 1 <h 2 <h 3 . In addition,
In the figure, 6a, 6a 'and 6a indicate corners.

次に該チップの基体1への取付けについてであるが、第
1図に示すように円板状基体1の外周には周方向に所定
の間隔でチップ台座3が設けられておりチップはこの台
座3上に基体回転方向に両側面を平行にしてろう付け固
着されることとなる。
Next, as to the attachment of the chip to the base 1, as shown in FIG. 1, chip bases 3 are provided on the outer periphery of the disk-shaped base 1 at predetermined intervals in the circumferential direction. It will be fixed by brazing on both sides of the base plate 3 with both sides parallel to the rotation direction of the substrate.

まず、一チップを前記ろう付け固着し、次のチップは前
記ろう付け固着したチップを反転した状態でろう付へ固
着する。
First, one chip is brazed and fixed, and the next chip is fixed to the brazed state while the brazed and fixed chip is inverted.

以下交互にチップを反転させ基体への取付けを行う。尚
上記取付けに際し、チップの中心を正確に基体両側面間
の中心線に合わせることは困難なためチップ両側を基体
両側面からほぼ同寸法突出させ、チップ一側面を基体1
の一側面と平行な状態に揃わせた後、チップの取付け誤
差あるいはチップ自体の加工誤差のため不規則な凹凸状
態にある砥面にツルーイング等の幅決め加工を行いばら
ついた砥面を均一にする。
Thereafter, the chips are alternately inverted and mounted on the base. At the time of mounting, it is difficult to accurately align the center of the chip with the center line between both side surfaces of the base body, so that both side surfaces of the base body are protruded from both side surfaces of the base body by substantially the same size, and one side surface of the base body 1
After aligning in parallel with one side surface, the width of uneven grinding surface is made uniform by performing width-determining processing such as truing on the grinding surface in irregular irregularity due to tip mounting error or machining error of the chip itself. To do.

第2図(ロ)は両側面共にチップ幅方向、即ち段階陥没
の深さtが等しい3段としているが、チップの高さ方向
に段階構成が異なるものについブレード回時の一チップ
とこれを反転して取付けたチップとの重複状態を示すも
のである。該チップの基体への取付けは前記実施例とほ
ぼ同様であるが一チップのコーナー7a,7a′とこれを反
転しチップのコーナー7b,7b′が各々の間に位置するよ
る一チップの中心線を基体1の両側面間の中心線より一
側に約t/4だけずらしこれを反転したチップは他側に約t
/4ずらすことが必要である。
In FIG. 2B, there are three steps on both sides in the width direction of the chip, that is, the depth t of the step depression is equal, but one step at the time of blade rotation is It shows an overlapping state with a chip that is inverted and attached. The attachment of the chip to the substrate is almost the same as that of the above embodiment, but the corners 7a and 7a 'of one chip are reversed and the corners 7b and 7b' of the chip are located between the center lines of one chip. The chip which is shifted from the center line between both side surfaces of the substrate 1 to one side by about t / 4 and is inverted to the other side is about t
/ 4 It is necessary to shift.

第2図(ハ)はチップの一側面を3段、他側面を2段と
したものであるが、第2図(イ)と異なり2側段階陥没
の深さeと3段側各段階陥没の深さfが等しい場合の実
施例についてブレード回転時の一チップとこれを反転し
たチップとの重複状態を示したものであり、チップの基
体への取付けについては、前記実施例に準ずる。以上の
実施例から理解されるようにブレード回転時、一方の取
付けによるチップとこれを反転して取付けたチップのコ
ーナーは同一の回転位置に重複してあることはない。
FIG. 2 (c) shows one side of the chip with three steps and the other side with two steps, but unlike FIG. 2 (a), the depth e of the two-sided step depression and the three-step side depressed In the embodiment in which the depths f are the same, the overlapping state of one chip when the blade is rotated and the inverted chip is shown, and the mounting of the chip on the base body is in accordance with the above embodiment. As can be understood from the above-described embodiments, when the blade is rotated, the corner of the chip mounted by one mounting and the corner of the chip mounted by reversing the mounting do not overlap at the same rotational position.

尚、上記の実施例では全て交互にチップを反転させて取
付けたが2チップあるいは3チップごと等の任意のチッ
プ間隔で反転させて取付けを行ってもよい。
In the above-mentioned embodiment, all the chips are alternately inverted and attached, but the chips may be inverted and attached at intervals of any two chips or every three chips.

(発明の効果) 以上の構成のブレードで研削を行った場合、特に第2図
(イ),(ロ)においては、ブレード回転時、一方のチ
ップのコーナーの間、及び、又は上下に、これを反転し
たチップの各コーナーが位置することにより実質的にコ
ーナー数(段数)が多いチップで研削し、従来のチップ
側面の段階陥没の程度が緩和されたこと等に等しく、こ
れによりチップ摩耗に伴う段の変り目で被削材切断面に
スジ状の跡が残ることなく平滑な切断面得られる。
(Effects of the Invention) When grinding is performed with the blade having the above configuration, particularly in FIGS. 2A and 2B, when the blade is rotated, between the corners of one chip, and / or vertically. Since each corner of the inverted chip is located, grinding is performed with a chip that has a substantially large number of corners (steps), which is equivalent to the degree of step depression of the conventional chip side surface being mitigated, etc. A smooth cut surface can be obtained without streaky marks on the cut surface of the work material due to the transition of the step.

第2図(ハ)においも3段側上側面が摩耗し被削材への
当り面積が小さくなっ場合でもこれを反転して取付けた
チップの2段側上側面により研削がなされ、又3段側中
側面と2段側下側面においても同様のことがいえるため
スジ状の跡が残ることはない。
In Fig. 2 (c), even when the upper surface of the third step wears and the contact area with the work material becomes small, grinding is done by the upper surface of the second step of the tip that is mounted by reversing this and the third step. Since the same can be said on the side middle side surface and the second side lower surface, no streak-like marks are left.

又上記(イ)乃至(ハ)のいずれにおいても、時間的に
ずれがあるものの、チップ両側面が研削に作用するため
第3図(ロ)に示すような一側面のみが段階状でかつ該
一側面のみが研削に作用する場合に比べ、極端に偏った
摩耗を生じることがなくブレードの振れが緩和され切断
面の蛇行を防止することができる。
Further, in any of (a) to (c) above, although there is a time lag, both side surfaces of the chip act on the grinding, and therefore only one side surface is stepwise as shown in FIG. Compared with the case where only one side surface acts on the grinding, extremely uneven wear does not occur, and the wobbling of the blade is alleviated, and the meandering of the cut surface can be prevented.

このように一種類のチップを各々反転させて取付けるた
め第3図(イ)に示すような2種類のチップを用意する
必要はなくチップ製造あるいは交換に際し便利であると
ともにチップ両側面が非対称型なため、反転してチップ
を取付ける際にチップの向きを間違うこともない。
In this way, since one type of chip is mounted by reversing each other, it is not necessary to prepare two types of chips as shown in FIG. 3 (a), which is convenient when manufacturing or exchanging chips, and both sides of the chip are asymmetrical. Therefore, the direction of the chip is not mistaken when mounting it by reversing it.

さらに研削加工はチップの階段状側面と、ブレード回転
方向前端面により行われるため、側面抵抗も小さく加工
面への水まわりが良くなって作業性の向上を図ることが
できた。
Further, since the grinding process is performed by the stepped side surface of the tip and the front end surface in the blade rotation direction, the side surface resistance is small and the water flow to the processed surface is improved, so that the workability can be improved.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の実施例を部分的に示し、チップ一側面
を2段他側面を3段としたチップとその取付け状態を示
す斜視図である。 第2図(イ),(ロ),(ハ)はそれぞれ形状の異った
本発明で用いられるチップと同チップを反転し重複した
状態を示す構成図である。 第3図(イ),(ロ)は従来の超砥粒型回転ブレードの
チップ断面図である。 第4図(イ),(ロ)は第3図のチップ使用時における
摩耗状態説明図である。 第5図は回転ブレードと加工状態を示す説明図である。 1……円板状基体、2……中心穴、3……チップ台座、
4……チップ、4a……3段側上側面、4a′……3段側中
側面、4a″……3段側下側面、4b……2段側上側面、4
b′……2段側下側面、5……被削材、6a,6a′,6b,7a,7
a′,7b″……コーナー、8……チップ中心線、9,9′…
…従来の回転ブレードのチップ、10……ダイヤモンド砥
粒。
FIG. 1 is a perspective view partially showing an embodiment of the present invention and showing a chip in which one side surface of the chip is two steps and the other side surface is three steps, and a mounting state thereof. FIGS. 2A, 2B, and 2C are configuration diagrams showing a chip used in the present invention having a different shape and a state in which the chip is inverted and overlapped. FIGS. 3A and 3B are cross-sectional views of a tip of a conventional superabrasive grain type rotary blade. FIGS. 4 (a) and 4 (b) are explanatory views of the wear state when the tip of FIG. 3 is used. FIG. 5 is an explanatory diagram showing a rotary blade and a processing state. 1 ... Disc-shaped substrate, 2 ... Center hole, 3 ... Chip pedestal,
4 …… Chip, 4a …… 3rd side upper side, 4a ′ …… 3rd side middle side, 4a ″ …… 3rd side lower side, 4b …… 2nd side upper side, 4
b ′ …… Lower side of the second step, 5 …… Work material, 6a, 6a ′, 6b, 7a, 7
a ′, 7b ″ …… Corner, 8 …… Chip center line, 9,9 ′…
… Traditional rotating blade tips, 10 …… Diamond abrasive grains.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】両側面が平行なほぼ短ざく状の超砥粒チッ
プを円板状基体の外周端面上に所定の間隔をとって前記
基体の回転方向に前記チップの両側面を平行にして取付
けた超砥粒回転ブレードにおいて、チップの下端面幅は
基体の厚みより大きく、チップの一側面はチップ上端面
とつながる上端面から段階的に陥没してコーナーが形成
された側面をなし、該チップの他側面は前記一側面より
小数段陥没してコーナーが形成された側面をなすチッ
プ、若しくは前記一側面と同数段陥没しているが、チッ
プ高さ方向において、段階的に陥没して形成されたコー
ナーが前記一側面における各コーナーとは異った高さに
ある他側面をなすチップを、基体外周端面上で回転方向
に交互に又は任意のチップ間隔でチップを反転して取付
け、ブレード回転時、前記一方の取付けによるチップの
コーナーが反転して取付けたチップのコーナーと重複し
ない位置にあることを特徴とする超砥粒回転ブレード。
1. A super-abrasive grain tip having a substantially short-sided shape whose both sides are parallel to each other is provided on the outer peripheral end face of a disk-shaped substrate with a predetermined interval so that both sides of the chip are parallel to the rotation direction of the substrate. In the attached superabrasive rotary blade, the width of the lower end surface of the chip is larger than the thickness of the substrate, and one side surface of the chip forms a side surface in which a corner is formed by stepwise recessing from the upper end surface connected to the upper end surface of the chip, The other side surface of the chip has a side surface in which a corner is formed by recessing a smaller number of steps than the one side surface, or the same number of steps as the one side surface is recessed, but is formed by stepwise recessing in the chip height direction. A chip having a corner formed on the other side having a height different from that of each corner on the one side is mounted alternately on the outer peripheral end face of the substrate in the rotation direction or by reversing the chip at an arbitrary chip interval, When rotating Superabrasive rotating blades, characterized in that a position corner of the chip by attaching the one does not overlap with a corner of a chip mounted inverted.
JP28290A 1990-01-04 1990-01-04 Super abrasive grain rotating blade Expired - Fee Related JPH0722896B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28290A JPH0722896B2 (en) 1990-01-04 1990-01-04 Super abrasive grain rotating blade

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28290A JPH0722896B2 (en) 1990-01-04 1990-01-04 Super abrasive grain rotating blade

Publications (2)

Publication Number Publication Date
JPH03208562A JPH03208562A (en) 1991-09-11
JPH0722896B2 true JPH0722896B2 (en) 1995-03-15

Family

ID=11469552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28290A Expired - Fee Related JPH0722896B2 (en) 1990-01-04 1990-01-04 Super abrasive grain rotating blade

Country Status (1)

Country Link
JP (1) JPH0722896B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1008044A5 (en) * 1994-02-17 1996-01-03 Diamant Boart Sa Segment diamond cutting concretion.
JPH07317481A (en) * 1994-05-27 1995-12-05 Showa:Kk Blade for cutting tool and cutting tool
DE69807432T2 (en) * 1998-02-27 2003-05-15 Rousseau Luc cutting segment

Also Published As

Publication number Publication date
JPH03208562A (en) 1991-09-11

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