JPH0722488A - Wafer carrying system for semiconductor manufacturing plant - Google Patents

Abstract

PURPOSE:To provide a wafer carrying system for a semiconductor manufacturing plant so as to shorten wafer carrying path and the carrying time, reduce the occupying area in the semiconductor manufacturing plant and eventually reduce the initial cost and improve the carriage efficiency, manufacturing efficiency and yield. CONSTITUTION:For the wafer carrying system of a semiconductor device manufacturing plant provided with facilities 11, 12, 13, 14, 15 and 16 for at least two processes selected from CVD process, ion implanting process, etching process, photolithography process, washing process and diffusion process, a lift 17 is arranged at the center of a building 19. The facilities 11, 12, 13, 14, 15 and 16 for the processes are independently arranged on each floor of the building 19 and the lift 17 ascends and descends between the floors. A rotating carrier which carries wafers to the lift 17 is arranged on each floor for the single wafer transfer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer system in a semiconductor device manufacturing factory, and more particularly to a semiconductor device manufacturing factory in which equipment for each process for manufacturing a semiconductor device is provided and a wafer is transferred by automatic control. Wafer transfer system.

[0002]

2. Description of the Related Art Conventional semiconductor device manufacturing plants generally use C
Equipment for performing a VD process, an ion implantation process, an etching process, a photolithography process, a cleaning process, a diffusion process, and the like are arranged in a plane such as a zone layout and a bay layout.

Robots and monorails are used in the wafer transfer system in such a semiconductor device manufacturing factory.

FIG. 6 is a schematic plan view of a conventional semiconductor device manufacturing factory, and FIG. 7 is a schematic plan view of a photolithography process area. Reference numeral 47 in the figure denotes a building, and in the one-story building 47, a CVD process area 46, an ion implantation process area 45, an etching process area 44, a photolithography process area 43, a cleaning process area 42, and a diffusion process area 41. Are provided at each position. Further, for example, in the photolithography process area 43, a coating / developing device 43c and an exposure device 43d are installed as devices used in each process of photolithography, and an inspection device 43e is also installed in the photolithography process area 43. There is. Also,
A robot passage 43b is formed around the coating / developing device 43c and the exposure device 43d.
A transfer robot 43a for transferring the wafer is arranged in the wafer carrier, and the wafer is transferred by the transfer robot 43a to each device in each process area 41, 42, 43, 44, 45, 46 in lot units. ing. Further, the hatched portion shows the space for the transport robot 43a to move and operate. In addition, the inside of the building 47 is a clean room with a high degree of cleanliness in order to prevent contamination of the wafer by particles and the like. Further, a host computer (not shown) is used for the lot management of the wafer, the progress status of the process and the wafer history are registered in the host computer, and the production control of each semiconductor device and the process in each process are performed. A system is in place to manage the situation.

[0005]

In the wafer transfer system of the conventional semiconductor device manufacturing plant described above, the transfer robot 43a moves between the respective devices arranged on the left and right, and therefore operates. The space is wide. In addition, each process area 41, 42,
43, 44, 45 and 46 are provided in a one-story building 47. Due to these factors, the occupied site area of the semiconductor device manufacturing factory is large, and a large site is required to construct the semiconductor device manufacturing factory, which causes a problem of high initial cost.

Further, since the transfer robot 43a moves between the process areas 41, 42, 43, 44, 45, 46 and within the process areas 41, 42, 43, 44, 45, 46 in a plane, There is also a problem that the transportation route of the transportation system is long, the transportation takes time, and the transportation efficiency and the production efficiency are poor.

Further, since it takes a long time to carry the wafer, there is a problem that a large number of particles are likely to adhere to the wafer being carried, resulting in a poor yield.

The present invention has been made in view of the above problems, and it is possible to shorten the wafer transfer path, shorten the transfer time, and significantly increase the area occupied by a semiconductor device manufacturing factory. An object of the present invention is to provide a wafer transfer system in a semiconductor device manufacturing factory, which can be reduced in size, and therefore can reduce initial cost and improve transfer efficiency, production efficiency, and yield.

[0009]

In order to achieve the above object, a wafer transfer system in a semiconductor device manufacturing factory according to the present invention comprises a CVD process, an ion implantation process, an etching process,
In a wafer transfer system of a semiconductor device manufacturing factory equipped with equipment for performing at least two steps selected from a photolithography step, a cleaning step and a diffusion step, a building in which the equipment for each step is independently arranged on each floor An elevator for raising and lowering each floor is arranged in the central part of the, and a rotary type carrier for carrying out a wafer transfer operation with the elevator is arranged for each floor, and is configured to perform single-wafer processing. It is characterized by being.

[0010]

According to the wafer transfer system of the semiconductor device manufacturing plant having the above-mentioned structure, since the equipment of each process is independently arranged on each floor, the cleanliness of the equipment of each process is optimal for each process. It is possible to set the level separately.

Further, since the elevator for moving up and down between the floors is arranged in the central part of the building and the semiconductor device manufacturing factory has a three-dimensional structure, the area occupied by the semiconductor device manufacturing factory is Significantly reduced, it is possible to significantly reduce the construction site of the semiconductor device manufacturing plant,
Significant reduction of initial cost can be achieved.

Further, the elevator for moving up and down between the floors is arranged in the central portion of the building, and the rotary transfer machine for carrying out a wafer transfer operation with the elevator is arranged on the floors. Therefore, since the transfer of the wafer is performed by the elevator between the equipment of each process and the rotary transfer machine in the equipment of each process, it is not necessary to use a transfer robot, and the transfer robot is not required. Operation space is not required, the transfer path of the wafer is shortened, and the transfer time is also shortened.
Transport efficiency and production efficiency are improved.

Further, by shortening the transfer route of the wafer, the area of equipment for each process is reduced, the area of the site occupied by the semiconductor device manufacturing factory is reduced, and the initial cost is reduced.

Moreover, since the transfer route and time are shortened, the probability that particles adhere to the wafer is reduced, and the yield is improved.

Further, since the single-wafer processing is carried out, it is possible to deal with the case of processing a large number of wafers of various kinds. In addition, there is no time loss as in the case where the wafer is transferred in lot units. That is, even when processing a plurality of wafers,
It is possible to advance the processing of the first wafer to the next without waiting for the completion of the processing of the last wafer. Therefore, the transportation time is significantly shortened, the transportation efficiency is improved, and the production efficiency is improved.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a wafer transfer system in a semiconductor device manufacturing factory according to the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view schematically showing a semiconductor device manufacturing factory according to the embodiment, and FIG. 2 is a plan view schematically showing a photolithography process area according to the embodiment.

Reference numeral 19 in the figure indicates a building, and the diffusion process area 11 is arranged on the first floor of the 6-story building 19.
A cleaning process area 12 is arranged on the second floor, a photolithography process area 13 is arranged on the third floor, an etching process area 14 is arranged on the fourth floor, and an ion implantation process area 15 is arranged on the fifth floor. A CVD process area 16 is arranged on the 6th floor. In addition, an elevator 17 for raising and lowering each floor is arranged in the center of the building 19.
7, each process area 11, 12, 13, 14, 15,
The wafer is transferred between 16 units. Also,
A device elevator 18 for moving up and down between the floors is arranged on the side of the building 19, and the device elevator 18 carries the device into each process area 11, 12, 13, 14, 15, 16. ing.

Further, as shown in FIG. 2, a circular elevator passage 1 is formed at the center of the photolithography process area 13.
7a is formed so that the elevator 17 moves up and down in the elevator passage 17a. Further, in the elevator passage 17a, four wafer loading / unloading doors 13c that can be opened and closed are formed, and a rotary carrier 13a is arranged around the elevator passage 17a. An apparatus 13b for exposing or developing the wafer is installed. The wafer transfer system is configured to perform the single-wafer processing of the wafer by the elevator 17 and the rotary transfer device 13a, and the wafer is transferred from the elevator 17 to the rotary transfer device 13a through the wafer loading / unloading door 13c. It is received and conveyed to each device 13b. Although omitted here, the process areas 11, 12, 14, 15, and 16 on the other floors are also configured similarly to the photolithography process area 13 described above. The photolithography process area 13 and the elevator passage 17a are high-level clean rooms, and the other process areas 11, 12, 14, 15, 1
6 is a clean room of the optimum level for each process.

When the area occupied by the semiconductor device manufacturing factory according to this embodiment was calculated, it was confirmed that the area was reduced to about 1/6 of the area occupied by the conventional semiconductor device manufacturing factory. .

Further, when the length of the wafer transfer path in the semiconductor device manufacturing factory according to the present embodiment is calculated, it is reduced to about 1/3 to 1/4 of the length of the wafer transfer path in the conventional semiconductor device manufacturing factory. I was able to confirm that it will be done.

As described above, in the wafer transfer system of the semiconductor device manufacturing factory according to this embodiment, since the process areas 11, 12, 13, 14, 15, 16 are arranged independently on each floor, Each process area 11, 12, 13,
The cleanliness of 14, 15 and 16 can be individually set to the optimum level for each process.

Further, since the elevator 17 for moving up and down between the floors is arranged in the center of the building 19 and the semiconductor device manufacturing factory has a three-dimensional structure, the area occupied by the semiconductor device manufacturing factory is reduced. It is possible to greatly reduce the size of the construction site of the semiconductor device manufacturing plant, and it is possible to significantly reduce the initial cost.

Further, an elevator 17 for moving up and down between the floors is arranged in the central portion of the building 19, and a rotary transfer machine 13a for transferring the wafer with the elevator 17 is installed on each floor. Therefore, the wafer is transferred by the elevator 17 between the process areas 11, 12, 13, 14, 15, 16 and by the rotary transfer machine 13a in the photolithography process area 13, for example. It is not necessary to use a transfer robot, an operating space for the transfer robot is not required, the transfer path of the wafer can be shortened, the transfer time can be shortened, and transfer efficiency and production efficiency can be improved. it can.

Further, by shortening the transfer route of the wafer, each process area 11, 12, 13, 14, 15, 16 is formed.
The area of the semiconductor device manufacturing plant can be reduced, and the initial cost can be reduced.

Moreover, since the transfer route and time are shortened, the probability that particles adhere to the wafer can be reduced, and the product yield can be improved.

Further, since the single-wafer processing is carried out, it is possible to deal with the case where a large number of wafers of a wide variety are processed. Further, it is possible to eliminate the time loss that occurs when the wafers are transferred in lot units. That is, even when processing a plurality of wafers, the processing of the first wafer can proceed to the next without waiting for the end of the processing of the last wafer. For this reason, the transfer time can be significantly shortened, the transfer efficiency can be improved, and the production efficiency can also be improved.

FIG. 3 is a schematic plan view showing a photolithography process area in a semiconductor device manufacturing factory according to another embodiment. Since the entire semiconductor device manufacturing factory has the same structure as the semiconductor device manufacturing factory according to the above-described embodiment, the description thereof is omitted here. In the figure, 20 indicates a space or a utility, and a rotary carrier 23a is provided around the utility 20.
Are arranged. A rectangular elevator passage 27a is formed in the center of the photolithography process area 23, and the elevator 27 is moved up and down in the elevator passage 27a. In addition, a setting device 23c is arranged in the elevator passage 27a via four wafer loading / unloading doors 23b that can be opened and closed. Further, in the photolithography process area 23, a coating device 23e, an exposure device 23f, a developing device 23g, and an inspection device 23h are installed as devices used in each process of photolithography. A standby area 23d is formed between these devices and the rotary carrier 23a. And
Elevator 27 associated by setting device 23c
And the rotary transfer machine 23a constitute a wafer transfer system. Although omitted here, each process area on the other floors has the same structure as the photolithography process area 23 described above. The photolithography process area 23 and the elevator passage 27a are high-level clean rooms, and the other process areas are clean rooms of optimum levels for each process. Also, the utility 20 need not be a clean room.

In the wafer transfer system of the semiconductor device manufacturing plant having such a structure, the wafer is set on the single wafer type wafer jig 37 as shown in FIGS. 4 and 5. The wafer jig 37 is composed of a horizontal fixing jig 35 having a groove 35a and an orientation flat fixing jig 36 having an orientation flat groove 36a. A wafer S vertically installed on such a wafer jig 37.
Is installed on the rotary carrier 23a by the setting device 23c from the elevator 27 through the loading / unloading door 23b,
After that, a predetermined waiting area 23 is set by the rotary carrier 23a.
It is transported to d and waits for processing in each device.

In the wafer transfer system of the semiconductor device manufacturing factory according to this embodiment, the same effects as those of the wafer transfer system of the semiconductor device manufacturing factory according to the above-described embodiments can be obtained, and the setting device 23c is provided. Since the wafer S has been placed, the wafer S transferred by the elevator 27
Can be selected.

Further, since the standby area 23d is formed, it is possible to eliminate the influence on the throughput of the rotary carrier 23a.

Further, since the wafer S can be moved in the vertical state by the wafer jig 37, it is possible to prevent particles from adhering more than in the case where the wafer S is moved in the horizontal state, and the product yield is further improved. Can be made.

Even when the wafer S has a large diameter, by adjusting the groove portion 35a of the wafer jig 37,
It can be handled at low cost.

[0034]

As described above in detail, in the wafer transfer system of the semiconductor device manufacturing plant according to the present invention, since the equipment of each process is independently arranged on each floor, the cleanliness of the equipment of each process is Can be individually set to an optimum level for each process.

Further, since the elevator for moving up and down between the floors is arranged in the central part of the building and the semiconductor device manufacturing factory has a three-dimensional structure, the area occupied by the semiconductor device manufacturing factory is reduced. It is possible to greatly reduce the size of the construction site of the semiconductor device manufacturing plant, and it is possible to significantly reduce the initial cost.

Further, the elevator for moving up and down between the floors is arranged in the central portion of the building, and the rotary transfer machine for carrying out a wafer transfer operation with the elevator is arranged on each floor. Therefore, since the transfer of the wafer is performed by the elevator between the facilities of each process and by the rotary transfer machine in the facility of each process, it is not necessary to use a transfer robot. The operation space of the robot becomes unnecessary, the transfer path of the wafer can be shortened, the transfer time can be shortened, and the transfer efficiency and the production efficiency can be improved.

Further, by shortening the wafer transfer path, the area of equipment for each step can be reduced, the area of the site occupied by the semiconductor device manufacturing factory can be reduced, and the initial cost can be reduced. be able to.

Moreover, since the transfer route and the time are shortened, the probability that particles adhere to the wafer can be reduced, and the yield of products can be improved.

Further, since the single-wafer processing is carried out, it is possible to deal with the case of processing a large number of kinds of a small number of wafers. Further, it is possible to eliminate the time loss that occurs when the wafers are transferred in lot units. That is, even when processing a plurality of wafers, the processing of the first wafer can proceed to the next without waiting for the end of the processing of the last wafer. For this reason, the transfer time can be significantly shortened, the transfer efficiency can be improved, and the production efficiency can also be improved.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of a semiconductor device manufacturing factory according to the present invention.

FIG. 2 is a plan view schematically showing a photolithography process area according to an embodiment.

FIG. 3 is a plan view schematically showing a photolithography process area according to another embodiment.

FIG. 4 is a schematic top view showing a wafer jig used in a semiconductor device manufacturing factory according to another embodiment.

FIG. 5 is a schematic cross-sectional view of a wafer jig according to another embodiment.

FIG. 6 is a plan view schematically showing a conventional semiconductor device manufacturing factory.

FIG. 7 is a schematic plan view showing a photolithography process area in a conventional semiconductor device manufacturing factory.

[Explanation of symbols]

11, 12, 13, 14, 15, 16, 23 Process area (process equipment) 13a, 23a Rotary carrier 17, 27 Elevator 19 Building

Claims (1)

[Claims] 1. A wafer transfer system in a semiconductor device manufacturing factory, comprising a facility for performing at least two steps selected from a CVD step, an ion implantation step, an etching step, a photolithography step, a cleaning step and a diffusion step, An elevator for moving up and down between the floors is arranged in the central portion of a building where the equipment for each process is independently arranged on each floor, and a rotary transfer for performing wafer transfer operation with the elevator on each floor. A wafer transfer system for a semiconductor device manufacturing plant, wherein the machines are arranged and configured to perform single-wafer processing.