JPH07218536A - Contact probe mounting holder - Google Patents

Abstract

PURPOSE:To satisfactorily prevent intrusion of noise into the signals transmitted to contact probe by arranging a plurality of contact probes of different sorts at minute pitches. CONSTITUTION:A contact probe mounting holder consists of sockets 20, each of which is made of a conductive material and in which the body of each contact probe 30 is fitted removably, and a holder body consisting of a conductive material and equipped with a plurality of socket fitting holes. An insulating material is set between the sockets and holes to insulate them from one another.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a holder on which a plurality of so-called contact probes can be mounted at an extremely small pitch, and more specifically to an IC, LSI, LC.
When the pins of the contact probe are brought into contact with the lead parts of the electronic parts such as the D panel to electrically connect the circuits of the electronic parts and to conduct the inspection, the contact probe has a structure in which a plurality of contact probes can be attached at an extremely small pitch. However, the present invention relates to a contact probe mounting holder having an insulating structure capable of sufficiently preventing noise from entering a signal transmitted to each contact probe.

[0002]

2. Description of the Related Art When electrically connecting circuits of an electronic component P such as an IC, LSI, LCD panel and inspecting the circuits, as disclosed in, for example, Japanese Utility Model Laid-Open No. 63-60966. A contact probe 100 including a pin 101 that comes into contact with the lead portion P ′ of the electronic component P has been conventionally used (FIG. 5).

However, as the electronic components P such as ICs and LSIs have been highly integrated and miniaturized in recent years, the pitch between the plurality of lead portions P '... P'provided in the electronic components P has been minimized. ing. Therefore, a plurality of lead parts P '... of such electronic components P arranged at a very small pitch
In order to be able to collect a signal from P ′, this type of contact probe 100 is arranged at a pitch corresponding to the minimum pitch of the lead portions P ′ ... P ′ arranged as described above. It has been strongly desired to arrange a plurality of them.

On the other hand, in this type of contact probe 100, in order to perform an accurate inspection between the circuits of the electronic component P, signals other than signals provided from a specific lead portion P ′ with which the specific contact probe 100 is in contact are provided. Signal, for example, an electromagnetic wave coming from a peripheral device other than the electronic component P to be inspected, or another adjacent lead portion P ′ in the energized state or another contact probe in contact with the other lead portion P ′. A shield property from an unnecessary signal due to a current generated by a magnetic field formed in 100 is required.

For this reason, as shown in FIG. 5, a socket 200 for accommodating the contact probe 100, which comprises a pin 101 in contact with the lead portion P'and a sheath-shaped probe main body 102 for accommodating the pin 101 in a retractable manner, is provided. ,
It is composed of an inner cylinder 201 and an outer cylinder 202, and an insulating layer 300 made of an insulating material such as plastic is formed between the both cylinders to shield the current generated by the electromagnetic waves and the like with the insulating layer 300, and the outer cylinder 202 Is grounded so that the electric potential of the outer cylinder 202 does not become high due to the electromagnetic waves or the like.

[0006]

However, another contact probe 100 adjacent to the other contact probe 100 due to the demand for the minimum pitch.
So that the pitch between the two cylinders 201,
It is difficult to form the insulating layer 300 made of an insulating material such as plastic between the two cylinders 201 and 202 because the distance between the cylinders 202 must be set extremely small.

Further, even if plastic or the like can be injected between the two cylinders 201 and 202, there are many cases where the injected plastic does not properly cover the inner cylinder 201.
In this case, there is a disadvantage that the shield effect is lost.

After the insulating layer 300 is formed inside the outer cylinder 202, the inner cylinder 201 is attached to the outer cylinder 2 in advance.
When the socket 200 is formed by press-fitting into the inner cylinder 02, it is still difficult to uniformly form the insulating layer 300 on the inner surface of the outer cylinder 202. Or, it often caused a situation where it could not be pressed.

However, if the inner cylinder 201 is not provided, the contact probe 100 cannot be accommodated smoothly, so that the inner cylinder 201 cannot be omitted to configure the socket 200.

Further, in order to prevent such inconvenience,
It is not impossible to construct the socket 200 with manufacturing labor and cost, but it is essential to reduce the wall thickness of the socket 200 that requires both the inner cylinder 201 and the outer cylinder 202 in terms of the structure. Since the socket 200 has a limit, it is difficult for the socket 200 to meet the demand for the extremely small pitch, which is expected to become stronger in the future.

Further, in the socket 200, there is a disadvantage that each socket 200 must be grounded so as not to raise the potential of the outer cylinder 202.

Therefore, the first object of the present invention is to arrange and attach a plurality of contact probes of various types with the smallest possible pitch. And second,
An object of the present invention is to sufficiently prevent noise from entering a signal transmitted to the contact probes while arranging the contact probes at the minimum pitch as described above.

[0013]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention according to claim 1 provides a mounting holder for a contact probe, wherein
The probe main body 31 is detachably inserted into a socket 20 made of a conductive material, and the holder body 10 made of a conductive material having a plurality of socket mounting holes 11 ... 11 for accommodating and mounting the socket 20. The structure is such that the socket 20 assembled in the socket mounting hole 11 and the socket mounting hole 11 are insulated from each other by an insulating material 21.

According to the second aspect of the present invention, the contact probe mounting holder is the contact probe 30.
The probe main body 31 is detachably inserted into a socket 20 made of a conductive material, and the holder body 10 made of a conductive material having a plurality of socket mounting holes 11 ... 11 for accommodating and mounting the socket 20. The structure is such that the outer peripheral surface of the socket 20 assembled in the socket mounting hole 11 is provided with the insulating coating layer 21a.

Further, in the invention according to claim 3, the mounting holder for the contact probe is mounted with the socket 20 made of a conductive material into which the probe main body 31 of the contact probe is detachably inserted, and the socket 20. 31 and a holder main body 10 made of a conductive material and provided with a plurality of socket mounting holes 31 ...
The socket 2 assembled in the socket mounting hole 11
The insulating cap 21b is attached to the outer peripheral surface of No. 0 in a fitted manner.

[0016]

In the holder for mounting the contact probe according to the present invention, the probe main body 31 of the contact probe 30 is used.
20 made of a conductive material into which the plug is detachably attached
And the holder body 10 made of a conductive material having a plurality of socket mounting holes 11 ... 11 for accommodating and mounting the socket 20 are insulated from each other by the insulating material 21. The contact probe 30 can be insulated from the generated current.

Further, since the holder body 10 is made of a conductive material, it is possible to prevent the electric potential of the mounting holder from becoming high due to electromagnetic waves from the outside by grounding only the holder body 10.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A typical embodiment of a mounting holder for a contact probe according to the present invention will be described below with reference to FIGS. 1 and 3 are views showing an assembled state of the socket 20 and the contact probe 30 with respect to the holder main body 10 which constitutes the attachment holder of the contact probe according to this embodiment. 2 is a view showing the socket 20 and an insulating cap 21b to be mounted on the socket 20. As shown in FIG. Also, FIG.
Shows the usage state of the contact probe 30 in a state of being assembled to the holder body 10.

As shown in FIG. 1, the mounting holder of the contact probe according to this embodiment is composed of a holder body 1
0 and a plurality of sockets 20 ... 20 for inserting the probe main body 31 of the contact probe 30 which is housed and mounted in the plurality of mounting holes 11 ... 11 provided in the holder main body 10. Has been done.

First, the holder body 10 is made of a conductive metal material in the form of a board in this embodiment, and has a plurality of mounting holes 11 ... 1 in the thickness direction.
1 is transparently installed. Each of the mounting holes 11 ... 11 is configured such that a hole edge on one surface side of the holder body 10 has a large diameter, and a step surface 11a is formed on the hole edge side. Also, each mounting hole 11 ...
Pins 32 of the contact probes 30 ... 30 inserted into the sockets 1 ... 11 via the sockets 20 ... 20
... Lead part P'of electronic component P with which 32 is brought into contact
... P 'is provided so as to match the number and arrangement of P'.

Next, the sockets 20 ... 20 housed and mounted in the mounting holes 11 ... 11 of the holder body 10 are made of a conductive metal material in this embodiment. It is formed in a tubular shape having a dimension slightly longer than the axial length dimension of 11. One end of the cylindrical socket 20 is configured to have an enlarged diameter, and an end portion where the enlarged diameter cylindrical portion 20a is provided between the enlarged diameter cylindrical portion 20a and another cylindrical portion 20b. The step surface 20c facing the opposite end is provided. Further, the end edge 20d on the side where the expanded diameter tubular portion 20a is not provided is formed so that the end edge is located obliquely with respect to the tubular axis of the tubular portion 20b, and has a substantially elliptical shape. , The protrusion 20 on the edge 20d
forming d '.

Further, as shown in FIG. 1, in this embodiment, an insulating coating layer 21a is formed on the outer peripheral surface of the socket 20 by an insulating material 21 such as plastic such as Teflon resin or epoxy resin or rubber. ing. The insulating coating layer 21a may be formed by coating on the outer peripheral surface of the socket 20, or by forming the insulating coating layer 21a on the outer peripheral surface of the socket 20 by using the socket 20 as an insert. Is also good. Further, as shown in FIG. 4, a cylindrical insulating cap 21b having an inner diameter substantially equal to the outer shape of the socket 20 is formed of the insulating material 21 such as the plastic material, and the cap 21b is formed on the socket 21b. The outer peripheral surface of 20 may be fitted.

In this embodiment, the socket 20 constructed in this manner has the same outer diameter as the inner diameters of the plurality of mounting holes 11 ... 11 provided in the holder body 10. The protruding portion 20 is formed from the opening of the mounting hole 11 on the side where the step surface 11a is formed.
It is inserted from the end portion on the side where d'is formed, fitted into the attachment hole 11 or attached by adhesion or the like. As described above, since the step surface 20c is formed on the base side of the expanded diameter tubular portion 20a on the side opposite to the insertion side of the holder body 10 into the mounting hole 11,
The holder body 10 has the step surface 20c at the mounting hole 1
It is not inserted and attached before the position where the stepped surface 11a provided on the first contacting portion 11a is contacted. In addition, FIG.
As shown in FIG. 4 and FIG. 4, the hole edge portion of the mounting hole 11 on the side where the step surface 11a is provided has a large diameter, and the large diameter portion 11b expands the socket 20. The diameter cylindrical portion 20a is housed, and in this state, the end of the socket 20 on the side of the diameter enlarged cylindrical portion 20a and the surface of the holder body 10 are substantially flush with each other. In addition, the end of the socket 20 on the side where the protrusion 20d 'is formed is, in this embodiment, the holder main body when the socket 20 is inserted and mounted in the mounting hole 11 as described above. 10 is formed so as to project outward from the other surface, and the projecting portion 20d ′ formed at the end of the socket 20 projecting in this way is used to The wiring W connected to an appropriate measuring device can be easily connected by soldering or the like.

Next, a usage state and a usage method of the contact probe mounting holder configured as described above will be described.

As shown in FIG. 1, the mounting holder according to this embodiment has the socket 20 mounted in the mounting holes 11 ... 11 of the holder body 10 as described above. A plurality of contact probes 30 ... 30 to be attached are detachably inserted so that the pins 32 of the contact probes 30 are projected outward from the opening of the socket 20 on the side of the enlarged diameter cylindrical portion 20a. Used. As shown in FIG. 3, in order to easily secure the insertion state of the contact probe 30,
The protrusion 20e is formed inside the socket 20, and the protrusion 20e is pressed against the probe body 31 of the contact probe 30 into which the socket 20 is attached.
The contact probe 30 may be attached to 0.

In this embodiment, the contact probe 30 inserted into the socket 20 is made of a conductive metal material and has a sheath having an outer diameter approximately the same as the inner diameter of the socket 20. Shaped probe body 31,
The probe main body 31 is mainly composed of a pin 32 made of a conductive metal material. As shown in FIGS. 1 to 4, a compression coil spring 33 is provided inside the probe main body 31 between the probe main body 31 and the pin 32.
Is always urged in the direction of protruding from the inside of the probe main body 31. In addition, the intermediate portion of the pin 32 is formed to have a smaller diameter than both end portions, while the small diameter portion 32
Since the inwardly projecting portion 31a is formed in a part of the probe main body 31 so as to be in contact with a, the pin 32 urged as described above includes the small diameter portion 32a and the pin 32. The step 32b between the lower end of the
It is not projected before the position where it contacts a,
Further, the step portion 32c between the small diameter portion 32a and the upper end 32d portion of the pin 32 can be pushed to a position where the step portion 32c is brought into contact with the protruding portion 31a.

After inserting the contact probe 30 in this manner, the upper end 32d of the pin 32 of the contact probe 30 is brought into contact with the lead portion P'of the electronic component P so that a circuit in the electronic component P is formed. Electrical inspection is performed by electrically connecting the spaces.

Here, since the pin 32, the probe main body 31 and the socket 20 are all made of a conductive metal material, the signal transmitted from the lead portion P ′ is generated by the pin 32. The wire W is transmitted to the probe main body 31 in contact with the pin 32 via the socket 20 in which the probe main body 31 is inserted, and is connected to the protruding portion 20d ′ of the socket 20. It is sent to an appropriate measuring device via the.

On the other hand, the outer peripheral surface of the socket 20 is insulated by an insulating material 21 such as an insulating coating layer 21a and an insulating cap 21b.
Has electrical conductivity, and is generated by electromagnetic waves coming in from other than the lead portion P ′ of the electronic component P, or the pin 32 of another adjacent contact probe 30 receives a signal from the other lead portion P ′. By a magnetic field, etc.
It is possible to prevent a situation in which a current other than a necessary signal flows through the contact probe 30 inserted into the socket 20. It should be noted that, as shown in FIG. 4, the holder main body 10 in which the socket 20 is mounted is grounded A so that the electric potential of the holder main body 10 does not become high.
It is possible to further prevent a situation in which a current other than the signal necessary for the current flows.

Further, in this embodiment, the end portion of the socket 20 on the side of the enlarged diameter tubular portion 20a on the side where the pin 32 of the contact probe 30 protrudes is the holder body 1.
Since it is configured to be mounted in the mounting hole 11 of the holder main body 10 so as not to project from the surface of 0, as shown in FIG. When used, with the pin 32 abutting against the lead portion P ′ of the electronic component P and retracted, with the upper end 32d slightly protruding from the surface of the holder body 10, the expanded diameter cylindrical portion of the socket 20. 20a
And the portion of the pin 32 of the contact probe 30 that is in contact with the lead portion P ′,
It can be sufficiently shielded.

In this embodiment, the holder main body 10 is formed in a plate shape, but if the structure is such that the mounting hole 11 of the socket 20 can be formed, the holder main body 10 will be described.
The entire shape of the above may be appropriately changed as necessary.

Also, if the socket 20 has a structure in which the outer peripheral surface of a cylindrical body made of a conductive metal material is insulated by an insulating material 21, the socket 2
The shape, the length, etc. may be appropriately changed and configured according to the shape, structure, etc. of the contact probe 30 inserted into 0.

Further, if the outer peripheral surface of the socket 20 is insulated by the insulating material 21, the socket 20
A structure in which an insulating layer corresponding to the insulating coating layer 21a or an insulating cap corresponding to the insulating cap 21b is provided on the inner surface of the mounting hole 11 of the holder body 10 for mounting the socket 20 instead of the outer peripheral surface of the insulating cap 21b. May be

[0034]

In the contact probe mounting holder according to the present invention, the socket 20 made of a conductive material into which the probe main body 31 of the contact probe 30 is detachably inserted, and a plurality of sockets for accommodating and mounting the sockets 20 are provided. Since an insulating material 21 for insulating the contact probe 30 from an electric current generated by an external electromagnetic wave or the like is provided between the holder body 10 made of a conductive material and having the mounting hole 11, the inside of the socket 20. As compared with the case where the insulating material 21 is provided in the above, the insulating material 21 can be easily provided, and the mounting holder having such an insulating effect can be easily and reliably manufactured.

Further, since the contact probe 30 can be directly attached to the inside of the socket 20, the contact probe 30 can be inserted into the insulating material 21 as in the case where the insulating material 21 is provided inside the socket 20. It is not necessary to install a separate inner cylinder so that it will not be hindered by
Not only can the structure of the mounting holder be simplified, but it is also extremely suitable for the arrangement of a plurality of contact probes 30 ... 30 at an extremely small pitch.

Further, each socket 20 is inserted into and attached to the holder body 10 made of a conductive material, and only this holder body 10 is grounded so that the potential of the mounting holder does not become high due to electromagnetic waves from the outside. Therefore, it is not necessary to ground each socket 20 and the structure of the mounting holder can be further simplified.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view of a mounting holder for a contact probe.

2 is a side view of the socket 20. FIG.

FIG. 3 is a side sectional view showing a mounting state of the contact probe 30 on a mounting holder of the contact probe.

FIG. 4 is a side sectional view showing a mounting state of the contact probe 30 on a mounting holder of the contact probe.

FIG. 5 is a side sectional view showing a conventional example.

[Explanation of symbols]

 10 Holder Main Body 11 Mounting Hole 20 Socket 21 Insulation Material 30 Contact Probe 31 Probe Main Body 32 Pin 33 Spring W Wiring P Electronic Component

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shigeru Shikahama 4-22-17 Shikahama, Adachi-ku, Tokyo Shikahama Manufacturing Co., Ltd.

Claims (3)

[Claims] 1. A socket made of a conductive material into which a probe main body of a contact probe is removably inserted, and a holder main body made of a conductive material having a plurality of socket mounting holes for accommodating and mounting the sockets. A contact probe mounting holder, characterized in that the socket assembled into the socket mounting hole is insulated from the socket mounting hole by an insulating material. 2. The contact probe mounting holder according to claim 1, wherein the insulating material is an insulating coating layer provided on an outer peripheral surface of the socket. 3. The contact probe mounting holder according to claim 1, wherein the insulating material is an insulating cap attached to the outer peripheral surface of the socket in a fitted manner.