JPH07211733A - Semiconductor manufacturing device and position correcting method of semiconductor chip - Google Patents

Abstract

PURPOSE:To provide a semiconductor manufacturing device capable of avoiding the slide of semiconductor chi[ sucked at a chip control stage as well as the chip and crack at the time of position correction. CONSTITUTION:Sucking trenches 10a sucking a semiconductor chip 4 extending over the wider range than the suction area of a semiconductor chip 2 are formed on the chip control stage 4 holding the semiconductor chip 2 and then an ultrasonic oscillator 9 oscillating the chip control stage 4 is fitted to the stage 4. Through these procedures, the formation of an air heat expansion film instantaneously with the suction of the semiconductor chip 2 at the chip control stage 4 can be avoided thereby enabling the slide suction of the semiconductor chip 2 to be avoided. Furthermore, the strew imposed in stantaneously with the contact of a chip position correction device with the semiconductor chip 2 can be relieved thereby enabling the chip and crack of the semiconductor chip 2 to be previously avoided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and a semiconductor chip position correcting method, and more particularly to a technique effective when applied to a semiconductor manufacturing apparatus used for manufacturing a semiconductor integrated circuit device having a LOC structure.

[0002]

2. Description of the Related Art Inner leads and respective circuit blocks such as a sense amplifier and an input section can be individually wire-bonded to improve electrical characteristics, and the area ratio of the chip to the package is increased to make a large chip. LOC (lead on chip) as a technology to support
A semiconductor integrated circuit device having a structure has been proposed. This LO
The C structure semiconductor integrated circuit device has a structure in which leads are positioned on the upper surface of a semiconductor chip to electrically connect the two, and the manufacturing apparatus uses a chip control stage that also functions as a heater to heat and position the semiconductor chip. Then, it is transferred to the bonding section and pressure-bonded to the lead frame with tape.

That is, a mirror-finished chip control stage is provided with several suction holes communicating with a vacuum chamber,
The diced semiconductor chip is held on the chip control stage by this suction hole. Then, the positional relationship with the bonding portion is adjusted by moving the stage itself with, for example, a pattern recognition device or mechanically correcting the position of the semiconductor chip itself with a chip position correction device, and then the semiconductor chip is bonded with the bonding portion. It is transferred to and crimped at a predetermined position on the lead frame.

[0004]

When the stage is moved by a pattern recognition device to correct the position of the semiconductor chip to an appropriate position, it is necessary to recognize the position of the semiconductor chip.

However, in such a semiconductor manufacturing apparatus, at the moment when a semiconductor chip at room temperature is adsorbed by a mirror-processed chip control stage at a high temperature of about 400 ° C., an air thermal expansion film is generated and the mutual gripping occurs. The resistance decreases sharply, the semiconductor chip slides, and the suction position deviates from the desired range. Therefore, when the semiconductor chip is located outside the operating range of the pattern recognition device due to the slide as described above, the semiconductor chip cannot be recognized and the position of the semiconductor chip cannot be corrected.

Further, when the semiconductor chip is moved by the chip position correcting device, the semiconductor chip is firmly adsorbed to the chip control stage by the several adsorbing holes as described above, and therefore the tip of the chip position correcting device is moved. A great deal of stress was applied to the semiconductor chip at the moment when the portion contacted the semiconductor chip, and the semiconductor chip was cracked or chipped.

By the way, particularly when the semiconductor chip needs to be mounted with high precision at a predetermined position of the lead frame as in the semiconductor integrated circuit device having the LOC structure, precise position control of the semiconductor chip is required. To be done. Here, the pattern recognition device employs a method of processing a semiconductor chip as image data.

However, whether or not the semiconductor chip is attracted to the proper position of the chip control stage should be determined not by the semiconductor chip itself but by the relative positional relationship between the semiconductor chip and the chip control stage. Therefore, it is difficult to control the semiconductor chip to a predetermined position with high accuracy by the above method.

Therefore, an object of the present invention is to provide a technique capable of preventing a semiconductor chip sucked by a chip control stage from sliding during suction.

Another object of the present invention is to provide a technique capable of correcting a suction position without causing a chip or a crack in a semiconductor chip sucked on a chip control stage.

Still another object of the present invention is to provide a technique that enables precise position control of a semiconductor chip attracted to a chip control stage.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0013]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, in the semiconductor manufacturing apparatus of the present invention, the chip control stage for holding the semiconductor chip is formed with the suction groove for sucking the semiconductor chip over a range wider than the suction area of the semiconductor chip.

Further, in the semiconductor manufacturing apparatus of the present invention, an ultrasonic oscillator for vibrating the chip control stage is attached to the chip control stage for holding the semiconductor chip.

Further, in the semiconductor manufacturing apparatus of the present invention, the chip control stage for holding the semiconductor chip is formed with the suction groove for sucking the semiconductor chip over a range wider than the suction area of the semiconductor chip, and the chip control stage is provided. The ultrasonic oscillator that vibrates is attached.

Further, according to the semiconductor chip position correcting method of the present invention, the semiconductor chip is mounted on the chip control stage on which the recognition pattern is formed in a range wider than the mounting area of the semiconductor chip, and relative to the recognition pattern. The position correcting means recognizes the position of the semiconductor chip based on the physical positional relationship and corrects it to an appropriate position.

[0018]

According to the semiconductor manufacturing apparatus in which the suction groove is formed on the chip control stage, the suction groove is not sealed by the semiconductor chip, and the contact area with the chip control stage is reduced. It is possible to prevent the generation of the air thermal expansion film at the moment when the semiconductor chip is adsorbed by the chip control stage and prevent the slide adsorption of the semiconductor chip. Further, due to the vacuum leak effect of the suction groove, the entire semiconductor chip is uniformly and appropriately sucked onto the chip control stage, so that the suction position of the semiconductor chip is corrected by, for example, a chip position correction device. In this case, the stress generated at the moment when the chip position correcting device comes into contact with the semiconductor chip is relieved, and cracking or chipping of the semiconductor chip is prevented in advance.

Even in a semiconductor manufacturing apparatus in which an ultrasonic oscillator is attached to the chip control stage, the ultrasonic oscillator vibrates the chip control stage, so that air thermal expansion occurs at the moment when the semiconductor chip is attracted to the chip control stage. The membrane will be thrown away,
It is possible to effectively prevent the slide adsorption of the semiconductor chip. Further, since the stress generated at the moment when the chip position correcting device comes into contact with the semiconductor chip due to the vibration of the chip control stage is relieved, cracking or chipping of the semiconductor chip is prevented.

Further, also in the semiconductor manufacturing apparatus in which the suction groove is formed on the chip control stage and the ultrasonic oscillator is attached, the slide suction of the semiconductor chip is similarly prevented, and the semiconductor chip is cracked by the contact of the chip position correcting device. Prevents chipping.

According to the semiconductor chip position correcting method of the present invention, the position of the semiconductor chip is determined by the relative positional relationship with the chip control stage by the recognition pattern formed on the chip control stage. It becomes possible to control the chip at a predetermined position with high accuracy.

[0022]

Embodiments of the present invention will now be described in more detail with reference to the drawings.

(Embodiment 1) FIG. 1 is an explanatory view showing a semiconductor manufacturing apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing a chip control stage of the semiconductor manufacturing apparatus, and FIG. 3 is a chip control stage thereof. 4 is a cross-sectional view taken along line IV-IV of FIG. 3, FIG. 5 is a plan view showing a state in which a semiconductor chip is attracted to the chip control stage, and FIG.
It is sectional drawing which follows the VI-VI line.

The semiconductor manufacturing apparatus 1 of this embodiment is a semiconductor integrated circuit device having a LOC (lead on chip) structure in which a lead frame 3 is electrically connected to the upper surface of a semiconductor chip 2 (FIGS. 5 and 6). (Not shown),
As shown in FIG. 1, the semiconductor chip 2 is adsorbed and heated by the chip control stage 4 and is held at a predetermined position, and is bonded to the lead frame 3 by the bonding portion 5.

An operation panel 6 is provided on the front surface of the semiconductor manufacturing apparatus 1.
Is provided, and the operation panel 6 is operated to cause the semiconductor manufacturing apparatus 1 to perform a desired operation, so that the semiconductor integrated circuit device having the LOC structure is completed.

A semiconductor wafer 7 is placed in front of the semiconductor manufacturing apparatus 1, and a semiconductor chip 2 diced from the semiconductor wafer 7 is transferred to a chip control stage 4 by a pick-up arm 8. Has become.

As shown in FIG. 2, the chip control stage 4 has a shape in which two columnar bodies having different diameters are concentrically joined to each other, and has a small-diameter base portion 4a located below,
It is composed of a large-diameter suction portion 4b located in the upper part. An ultrasonic oscillator 9 is attached to the base portion 4a, and the chip control stage 4 is ultrasonically vibrated by the ultrasonic oscillator 9.

Further, as clearly shown in FIG. 3, suction grooves 10 a are formed concentrically and radially on the upper surface of the mirror-finished suction portion 4 b and are provided inside the chip control stage 4. By connecting the suction groove 10a to the vacuum chamber 11 (FIG. 4) connected to a vacuum pump (not shown), the semiconductor chip 2 can be sucked by a vacuum suction action.
Are adsorbed. Further, the suction part 4b is provided with a heater 12 for heating the sucked semiconductor chip 2 to, for example, about 400 ° C., so that the lead frame 3 with a tape can be securely pressure-bonded.

In the vicinity of the chip control stage 4, the position of the sucked semiconductor chip 2 is recognized by image data, and the position of the chip control stage 4 is moved to move the lead frame 3 to the bonding section 5. A position recognizing device (position correcting means) 13 for correcting the positional deviation of the semiconductor chip 2 with respect to is provided. The position recognition device 13 includes a suction unit 4 a of the chip control stage 4.
The suction groove 10a formed on the upper surface is used as the recognition pattern 10b, and the mounting position of the semiconductor chip 2 is recognized by the relative positional relationship with the recognition pattern 10b. The position of the semiconductor chip 2 is corrected to a proper position by moving in the direction, and high-accuracy crimping with respect to the frame position of the lead frame 3 is possible.

A loader for supplying the lead frame 3 to which the semiconductor chip 2 is bonded to the bonding portion 5 is provided on one side of the semiconductor manufacturing apparatus 1, and an unloader for taking out the lead frame 2 to which the semiconductor chip 2 is bonded is provided on the other side. 15 is provided, and a frame feeder 16 for feeding the bonding portion of the lead frame is arranged on the same line as the loader 14 and the unloader 15.

Then, the semiconductor chip 2 transferred to the bonding section 5 by the chip control stage 4 is pressure-bonded to the lead frame 2 by a bonding tool (not shown) provided in the bonding section 5, and finally L
A semiconductor integrated circuit device having an OC structure will be manufactured.

In the semiconductor manufacturing apparatus 1 according to the present embodiment as described above, as shown in FIGS. 5 and 6, the suction groove 10a as described above is not sealed by the semiconductor chip 2 and has a small contact area. Since the chip control stage 4 is formed on the control stage 4 and is further vibrated by the ultrasonic oscillator 9, the air thermal expansion film at the moment when the semiconductor chip 2 is adsorbed by the chip control stage 4 heated by the heater 12. Is prevented, and the semiconductor chip 2 is prevented from sticking to the slide. As a result, the semiconductor chip 2 falls within the operating range of the position recognition device 13, and the position recognition device 13 can always correct the position.

When the position of the semiconductor chip 2 is corrected, the recognition pattern 10b formed on the chip control stage 4, that is, the suction groove 10a, causes the semiconductor chip 2 to move.
Since the position of is determined by the relative positional relationship with the chip control stage 4, the semiconductor chip 2 can be controlled to a predetermined position with high accuracy.

Then, by transferring the semiconductor chip 2 whose position is controlled with high accuracy to the bonding section 5, the lead frame 3 sent to the frame feeder 16 is transferred.
On the other hand, the semiconductor chip 2 can be mounted with high accuracy.

(Embodiment 2) FIG. 7 is an explanatory view showing a semiconductor manufacturing apparatus according to another embodiment of the present invention.

The semiconductor manufacturing apparatus 21 of this embodiment is a chip position correcting device (position correcting means) 23 as a means for correcting the position of the semiconductor chip 2 attracted to the chip control stage.
Is used, whereby the position of the semiconductor chip 2 is mechanically corrected.

The other constituent members such as the chip control stage 4 are the same as those in the first embodiment, and therefore, the same reference numerals as those in the first embodiment are used for the same constituent members.

The chip position correcting device 23 includes a body portion 23a.
And a correction claw 23b which is provided at the tip of the main body portion 23a and moves the semiconductor chip 2 to correct it at a predetermined position. The semiconductor chip 2 is held by the correction claw 23b and a chip position correction device is provided. The semiconductor chip 2 is mechanically moved and corrected to an appropriate position on the chip control stage 4 in a positional relationship with the bonding portion 5 by causing the 23 to perform a predetermined operation.

Here, in the semiconductor manufacturing apparatus 21 of this embodiment, when the semiconductor chip 2 is sucked, the suction groove 10 is formed.
The semiconductor chip 2 is sucked onto the chip control stage 4 uniformly and with an appropriate suction force due to the leak effect of the degree of vacuum due to a. An ultrasonic oscillator 9 is attached to the chip control stage 4, and the chip control stage 4 is vibrated by this.

Therefore, the stress generated at the moment when the correction claw 23b comes into contact with the semiconductor chip 2 adsorbed on the chip control stage 4 is relieved by these, so that the semiconductor chip 2 is prevented from being cracked or chipped before being adsorbed. It becomes possible to correct the position.

The invention made by the present inventor has been specifically described above based on the embodiments, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the suction groove 10a of the chip control stage 4 is formed in a concentric circular shape and a radial shape in the present embodiment, but the suction groove 10a is not limited to this and may be an arbitrary shape. it can. Further, although the suction groove 10a is formed over the entire surface, it is sufficient that the suction groove 10a has a larger vacuum area than the suction area of the semiconductor chip 2 to be sucked. It should be noted that the shape of the chip control stage 4 is not limited to the cylindrical body as in this embodiment.

Further, in this embodiment, the suction groove 10a is formed.
Is used as the recognition pattern 10b, it is possible to draw a predetermined pattern on the chip control stage 4 on which the semiconductor chip 2 is mounted by lines or dots and use this as the recognition pattern 10b. If there is no suction groove 10a, this method is used. The method of positioning the semiconductor chip 2 by the recognition pattern 10b is not applied only to the semiconductor manufacturing apparatuses 1 and 21 that manufacture the semiconductor integrated circuit device having the LOC structure according to the present embodiment. It can be used for various other semiconductor manufacturing apparatuses.

Further, in the present embodiment, the chip control stage 4 is provided with the suction groove 10a for sucking the semiconductor chip 2, and the chip control stage 4 is also provided with the ultrasonic oscillator 9 for vibrating the suction groove 10a. A manufacturing apparatus 1, 21 is disclosed, which discloses a suction groove 1
0a and the ultrasonic wave transmitting device 9 are used together to obtain a more desirable effect, but it is not necessary to provide both of them. Therefore, it is possible to use the semiconductor manufacturing apparatuses 1 and 21 provided with either one.

[0045]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

(1) That is, according to the semiconductor manufacturing apparatus in which the suction groove is formed in the chip control stage, since the suction groove is formed wider than the suction area of the semiconductor chip, the suction groove is sealed by the semiconductor chip. In addition, since the contact area between the semiconductor chip and the chip control stage is reduced by the suction groove, the generation of the air thermal expansion film at the moment when the semiconductor chip is sucked by the chip control stage is prevented. It is possible to prevent the semiconductor chip from sticking to the slide. Therefore, the semiconductor chip fits within the operating range of the position correction means, and the position correction means can always correct the position.

(2) Further, since the vacuum groove leaks due to the suction groove, the entire semiconductor chip is sucked onto the chip control stage with a uniform and appropriate suction force.
When the chip position correcting device corrects the suction position of the semiconductor chip, the stress generated at the moment when the chip position correcting device contacts the semiconductor chip is relieved, and cracking or chipping of the semiconductor chip can be prevented in advance.

(3) According to the semiconductor manufacturing apparatus in which the ultrasonic oscillator is attached to the chip control stage, the ultrasonic oscillator vibrates the chip control stage, so that the semiconductor chip is attracted to the chip control stage. The air thermal expansion film at the moment will be thrown away. Therefore, similarly to the above (1)., The slide suction of the semiconductor chip can be effectively prevented, and the position of the semiconductor chip can be corrected within the operating range of the position correcting means.

(4) Also, since the ultrasonic vibration of the chip control stage alleviates the stress generated at the moment when the chip position correcting device comes into contact with the semiconductor chip, the same as (2) above. It is possible to prevent the semiconductor chip from cracking or chipping.

(5) According to the semiconductor manufacturing apparatus in which the suction groove is formed on the chip control stage and the ultrasonic oscillator is attached, by using both of them together, the above-mentioned slide suction of the semiconductor chip and crack cracking are further improved. Effectively prevented.

(6) According to the semiconductor chip position correcting method of the present invention, the position of the semiconductor chip is determined by the relative positional relationship with the chip control stage by the recognition pattern formed on the chip control stage. So
Unlike the conventional method of controlling the position by recognizing the shape of the semiconductor chip itself, the semiconductor chip can be controlled to a predetermined position with higher accuracy.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a semiconductor manufacturing apparatus that is an embodiment of the present invention.

FIG. 2 is a perspective view showing a chip control stage of the semiconductor manufacturing apparatus.

FIG. 3 is a plan view of the chip control stage.

FIG. 4 is a sectional view taken along line IV-IV in FIG.

FIG. 5 is a plan view showing a state where a semiconductor chip is sucked onto a chip control stage.

6 is a sectional view taken along line VI-VI in FIG.

FIG. 7 is an explanatory diagram showing a semiconductor manufacturing apparatus according to another embodiment of the present invention.

[Explanation of symbols]

 1 Semiconductor Manufacturing Equipment 2 Semiconductor Chip 3 Lead Frame 4 Chip Control Stage 4a Base 4b Adsorption Part 5 Bonding Part 6 Operation Panel 7 Semiconductor Wafer 8 Pick-up Arm 9 Ultrasonic Oscillator 10a Adsorption Groove 10b Recognition Pattern 11 Vacuum Chamber 12 Heater 13 Position recognition device (position correction means) 14 Loader 15 unloader 16 Frame feeder 21 Semiconductor manufacturing device 23 Chip position correction device (position correction means) 23a Main body portion 23b Correction claw

Claims (7)

[Claims] 1. A semiconductor manufacturing apparatus, wherein a chip control stage for holding a semiconductor chip is formed with an adsorption groove for adsorbing the semiconductor chip over a range wider than the adsorption area of the semiconductor chip. 2. A semiconductor manufacturing apparatus characterized in that an ultrasonic oscillator for vibrating the chip control stage is attached to a chip control stage for holding a semiconductor chip. 3. An ultrasonic oscillator for vibrating the chip control stage, wherein a suction groove for sucking the semiconductor chip is formed on a chip control stage for holding the semiconductor chip over a wider area than the suction area of the semiconductor chip. A semiconductor manufacturing apparatus, wherein the semiconductor manufacturing apparatus is attached. 4. A chip control stage for adsorbing and heating a diced semiconductor chip, a position correcting means for correcting the position of the semiconductor chip on the chip control stage to an appropriate position, and the semiconductor chip being bonded. A loader for supplying a lead frame to the bonding section, an unloader for taking out the lead frame bonded with the semiconductor chip from the bonding section, and a bonding section for crimping the semiconductor chip transferred to the bonding section onto the lead frame, A semiconductor manufacturing apparatus, wherein a suction groove for sucking the semiconductor chip is formed on the control stage over a wider area than the suction area of the semiconductor chip. 5. A chip control stage that adsorbs and heats a diced semiconductor chip, a position correction unit that corrects the position of the semiconductor chip on the chip control stage to an appropriate position, and the semiconductor chip is bonded. A loader for supplying a lead frame to the bonding section, an unloader for taking out the lead frame bonded with the semiconductor chip from the bonding section, and a bonding section for crimping the semiconductor chip transferred to the bonding section onto the lead frame, A semiconductor manufacturing apparatus, wherein an ultrasonic oscillator for vibrating the chip control stage is attached to the control stage. 6. A chip control stage for adsorbing and heating a diced semiconductor chip, position correcting means for correcting the position of the semiconductor chip on the chip control stage to an appropriate position, and the semiconductor chip being bonded. A loader for supplying a lead frame to the bonding section, an unloader for taking out the lead frame bonded with the semiconductor chip from the bonding section, and a bonding section for crimping the semiconductor chip transferred to the bonding section onto the lead frame, The control stage is provided with an adsorption groove for adsorbing the semiconductor chip over a wider area than the adsorption area of the semiconductor chip, and an ultrasonic oscillator for vibrating the chip control stage is attached to the control stage. Manufacturing equipment. 7. The semiconductor chip is mounted on a chip control stage in which a recognition pattern is formed in a range wider than the mounting area of the semiconductor chip, and the position correction means is arranged to adjust the position by the relative positional relationship with the recognition pattern. A method of correcting a position of a semiconductor chip, which comprises recognizing a position of a semiconductor chip and correcting the semiconductor chip to an appropriate position.