JPH0720922Y2 - 電子基板の冷却構造 - Google Patents

電子基板の冷却構造

Info

Publication number
JPH0720922Y2
JPH0720922Y2 JP1989060433U JP6043389U JPH0720922Y2 JP H0720922 Y2 JPH0720922 Y2 JP H0720922Y2 JP 1989060433 U JP1989060433 U JP 1989060433U JP 6043389 U JP6043389 U JP 6043389U JP H0720922 Y2 JPH0720922 Y2 JP H0720922Y2
Authority
JP
Japan
Prior art keywords
refrigerant
coupler
drain
electronic substrate
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989060433U
Other languages
English (en)
Japanese (ja)
Other versions
JPH031541U (enExample
Inventor
晃 植田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989060433U priority Critical patent/JPH0720922Y2/ja
Publication of JPH031541U publication Critical patent/JPH031541U/ja
Application granted granted Critical
Publication of JPH0720922Y2 publication Critical patent/JPH0720922Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989060433U 1989-05-26 1989-05-26 電子基板の冷却構造 Expired - Lifetime JPH0720922Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989060433U JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989060433U JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Publications (2)

Publication Number Publication Date
JPH031541U JPH031541U (enExample) 1991-01-09
JPH0720922Y2 true JPH0720922Y2 (ja) 1995-05-15

Family

ID=31587792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989060433U Expired - Lifetime JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Country Status (1)

Country Link
JP (1) JPH0720922Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6369004B2 (ja) * 2013-10-22 2018-08-08 富士通株式会社 電子機器

Also Published As

Publication number Publication date
JPH031541U (enExample) 1991-01-09

Similar Documents

Publication Publication Date Title
US6219236B1 (en) Cooling system for multichip module
US7286355B2 (en) Cooling system for electronic devices
US7739883B2 (en) Computer cooling apparatus
US6725682B2 (en) Computer cooling apparatus
US6313990B1 (en) Cooling apparatus for electronic devices
US6603662B1 (en) Computer cooling system
US6865077B2 (en) Method of cooling system for a personal computer and personal computer
EP0630046B1 (en) Cooling apparatus for integrated circuit chips
CA2070062A1 (en) Cooling structure for integrated circuits
KR100813189B1 (ko) 냉각 장치
US20220240419A1 (en) Combined liquid and air cooling system for fail-safe operation of high power density asic devices
US20080037221A1 (en) Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus
US11910564B2 (en) Liquid cooling device and manufacturing method thereof
US20080006037A1 (en) Computer cooling apparatus
US20030218865A1 (en) Semiconductor thermal management system
TWI728336B (zh) 噴油螺桿壓縮機裝置
JPH0720922Y2 (ja) 電子基板の冷却構造
KR100718692B1 (ko) 콜드트랩
CN112894885A (zh) 智能机器人散热结构及散热方法
JP2500762B2 (ja) 集積回路の冷却構造
KR20040001731A (ko) 냉각장치가 구비된 옥외용 정보통신기기
JPH0528797Y2 (enExample)
CN112164681A (zh) 一种计算机芯片散热装置
JPH02224397A (ja) 浸漬電源の冷却構造
JPH0944062A (ja) 画像形成装置の冷却装置