JPH07209201A - Surface state inspection equipment, exposure apparatus employing it, and production of device using the exposure apparatus - Google Patents

Abstract

PURPOSE:To provide a surface state inspection equipment in which a foreign matter can be detected substantially at a constant sensitivity regardless of the position thereof while preventing erroneously detecting a circuit pattern as foreign matter CONSTITUTION:Linearly polarized lights LH, LV having different wavelength and intersecting perpendicularly, are reflected and deflected on a polygon mirror 36 and then passed through a scanning lens 101 and a polarization beam splitter 37 thus condensing the linearly polarized lights LH. LV, respectively, on a reticle 6 and a diffraction grating 21. The surface to be inspected of the reticle 6 and the diffraction grating 21 are then scanned, respectively, with the lights LH and LV by rotating the polygon mirror 36. During the scanning operation, the light scattering sideways from the reticle 6 is superposed on the light ditfracted sideways from the diffraction grating 21 by means of a half mirror 20. The superposed light impinges on a light receiving lens, which is telecentric on the inspecting surface side, and then converted into an electric signal by means of an optical detector.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface condition inspection apparatus, an exposure apparatus equipped with the surface condition inspection apparatus, and a method of manufacturing a device using the exposure apparatus.

[0002]

2. Description of the Related Art As an apparatus for inspecting foreign matters such as dust and scratches on a reticle (photomask), a scanning optical system for scanning the surface of the reticle with a laser beam and a scattered light generated from the reticle during scanning Optical axis (direction) of scanning optical system
There is a surface state inspection device including a light receiving optical system that receives light scattered sideways.

[0003]

However, in this surface condition inspection apparatus, since a part of the diffracted light or scattered light from the circuit pattern on the reticle is incident on the light receiving optical system, the circuit pattern on the reticle is treated as a foreign matter. In some cases, false detection was performed. In addition, since the light receiving optical system is placed on the side, the solid angle with respect to the light receiving optical system changes depending on whether the position of the foreign matter on the reticle is close to or far from the light receiving optical system. However, there is a problem in that the amount of scattered light entering the light receiving optical system is different.

[0004]

The first object of the present invention is to:
An object of the present invention is to provide a surface state inspection device which does not erroneously detect a circuit pattern as a foreign matter and can detect the foreign matter with a substantially constant sensitivity regardless of the foreign matter attachment position.

In order to achieve this first object, the surface state inspection apparatus of the present invention uses a first light of the first light and the second light whose wavelength and polarization direction are different from each other to inspect the surface to be inspected. Scanning means for scanning the diffraction grating or the light scattering member with the second light at the same time as scanning, scattered light generated laterally from the surface to be inspected, and diffracted light or scattered light laterally generated from the diffraction grating or light scattering member. And a photoelectric conversion means for converting light from the light receiving optical system into an electric signal, and the light receiving optical system is an optical system in which the surface to be inspected is a telecentric optical system. Since the foreign matter can be detected based on the beat signal based on the heterodyne interference of the scattered light and the diffracted light or the scattered light obtained from the photoelectric conversion means, the circuit pattern is erroneously detected as the foreign matter. It not, moreover the light receiving optical system the inspected surface side is able to perform foreign object detection at a substantially constant speed regardless of the attachment position of the foreign matter since the configuration from the telecentric optical system.

A second object of the present invention is to provide a surface state inspection apparatus capable of detecting foreign matter with a more constant sensitivity, and further, to arrange the light receiving surface of the photoelectric conversion means in the light receiving optical system. By providing the position of the aperture stop or the position conjugate with the position of the aperture stop of the light receiving optical system, the scattered light from each point on the surface to be inspected and the diffraction grating at a fixed position of the light receiving surface of the photoelectric conversion means during scanning. Diffracted light or scattered light from each point above is made incident to stabilize the sensitivity.

A third object of the present invention is to provide a surface state inspection device in which the adverse effect of scattered light from a surface other than the surface to be inspected is reduced, and further, the light receiving optical system and the surface to be inspected are By providing the field stop at the conjugate position, the amount of scattered light incident on the photoelectric conversion means from the surface other than the surface to be inspected is reduced by the field stop, and the pattern or foreign matter on the surface other than the surface to be inspected is inspected. Reduces false detections with foreign matter above.

A fourth object of the present invention is to provide a surface condition inspection apparatus in which the adverse effect of scattered light from a surface other than the surface to be inspected is further reduced, and further, the field stop is the surface to be inspected. By tilting it along the image forming plane that satisfies the Scheimpflug condition, the amount of scattered light from the surface other than the surface to be inspected incident on the photoelectric conversion means by the field stop is significantly reduced, and The erroneous detection of a pattern or foreign matter on a surface other than the surface as a foreign matter on the surface to be inspected is suppressed.

A fifth object of the present invention is a surface condition inspection capable of obtaining a beat signal with a stable S / N ratio by a simple optical system and reducing adverse effects of scattered light from a surface other than the surface to be inspected. In order to provide an apparatus, the light receiving optical system further includes a first lens, an aperture stop, a second lens, and a field stop in order from the surface to be inspected and the diffraction grating or the light scattering member side. The aperture stop is provided in the vicinity of the focal position, the field stop is provided at the image forming position of the surface to be inspected by the first and second lenses, and the light receiving surface of the photoelectric conversion means is at the position of the aperture stop or the aperture stop. By arranging it at a position conjugate with the position of, the amount of scattered light incident on the photoelectric conversion means from the surface other than the surface to be inspected is reduced and the pattern or foreign matter on the surface other than the surface to be inspected And reduce false detection, light during scanning The scattered light from each point on the surface to be inspected and the diffracted light or scattered light from each point on the diffraction grating or the light scattering member are made incident on a fixed position on the light receiving surface of the conversion means, and the S / N ratio of the beat signal is set. Is stabilizing.

A sixth object of the present invention is to provide a surface state inspection device equipped with scanning means capable of simultaneously scanning the surface to be inspected and the diffraction grating or the light scattering member with different lights.
The scanning means supplies the first and second lights in a superimposed state, a rotating mirror for deflecting and scanning the overlapping first and second lights, and the first mirror from the rotating mirror. 1
And a scanning optical system for converging second light on the surface to be inspected and on the diffraction grating or the light scattering member, respectively. The scanning optical system is configured to direct the first light to the surface to be inspected. A light splitter for defining an optical path and an optical path of the second light to the diffraction grating or the light scattering member;
By using a common optical member for scanning and condensing the second light, the structure of the scanning means is simplified.

A seventh object of the present invention is to provide an exposure apparatus equipped with a surface condition inspection device which does not erroneously detect a circuit pattern as a foreign matter and can detect the foreign matter with a constant sensitivity regardless of the foreign matter attachment position. In view of the above, the exposure apparatus of the present invention is characterized by including any one of the above-mentioned surface condition inspection apparatuses, which accurately detects the presence or absence of foreign matter on the reticle, and uses the reticle that does not have a problematic foreign matter adhesion. It has high reliability of performing only exposure.

An eighth object of the present invention is to use an exposure apparatus equipped with a surface condition inspection device which does not erroneously detect a circuit pattern as a foreign matter and can detect the foreign matter with a certain sensitivity regardless of the foreign matter attachment position. IC, LSI, magnetic head,
It is to provide a device manufacturing method for manufacturing a device such as a liquid crystal panel and a CCD. The device manufacturing method of the present invention is characterized by detecting the presence or absence of a foreign matter on a reticle by any one of the surface state inspection devices. Since the presence or absence of foreign matter on the reticle can be accurately detected and the device pattern of the reticle free from the problematic foreign matter can be transferred onto the substrate, a device with few defects can be obtained.

[0013]

1 and 2 are views showing an embodiment of the surface condition inspection apparatus of the present invention. FIG. 1 shows an illumination system of the surface condition inspection apparatus, and FIG. 2 shows a light receiving system of the surface condition inspection apparatus. Show. The surface state inspection apparatus of the present embodiment, in the laser light scanning type foreign matter inspection apparatus, detects scattered light laterally generated from the foreign matter as a beat signal by utilizing heterodyne interference, and scattered light generated from a portion other than the foreign matter and The diffracted light is detected as a non-beat signal to distinguish the foreign matter from the other. The foreign matter detection using the heterodyne interference of the surface state inspection apparatus of the present embodiment is disclosed in European Patent Publication 567701 of the applicant of the present application issued on June 16, 1993.

In FIG. 1, a laser beam L _O emitted from a laser 30 passes through a phase plate or a polarizing plate 100 and then enters a polarization light splitter 31, and the light splitter 31 causes two straight lines whose polarization directions are orthogonal to each other. It is divided into polarized light L _V and L _H. The linearly polarized light L _V is the polarized light reflected by the light splitting surface of the light splitter 31, and the linearly polarized light L _H is the polarized light that has passed through the light splitting surface of the light splitter 31, and the linearly polarized light L _V , L _H
Respectively pass through the frequency shifters 41 and 43 and enter the folding mirrors 33 and 32, and
It is reflected by the beam splitter 2 toward the light splitter (light combiner) 34. The frequency shifters 41 and 43 are the driving sources 40 and
The linearly polarized light L _V and L _H are driven by the linearly polarized light L _V and L _H to form a surface acoustic wave having a certain frequency in the optical path, thereby changing the frequency of the linearly polarized light L _V and L _H.
The frequencies of _V and L _H are slightly shifted. As a result, two lights having different wavelengths and polarization directions are obtained.

The polarized light splitter 34 combines the linearly polarized lights L _V and L _H whose wavelengths and polarization directions are different from each other, superimposes them, and makes them incident coaxially on the bending mirror 35. The folding mirror 35 reflects the overlapping linearly polarized light L _V and L _H toward a rotating mirror 36 such as a polygon mirror or a galvano mirror. The rotating mirror 36 reflects the linearly polarized light L
_{The V} and L _H are reflected and deflected to enter the scanning lens 101 and the polarized light splitter 37. Overlapping linearly polarized light L _V , L
_H are separated from each other by the polarizing beam splitter 37, linearly polarized light L _V on the surface of the circuit pattern of the reticle 6 is formed, linearly polarized light L _H is incident on the diffraction grating 21 of the reference beam formation. The scanning lens 101 is configured to collect the linearly polarized lights L _V and L _H on the reticle 6 and the diffraction grating 21, respectively, and the linearly polarized lights L _V and L _H are respectively rotated by rotating the rotating mirror 36. The diffraction grating 21 is scanned on the reticle 6 in the x direction perpendicular to the paper surface. On the other hand, since the reticle 6 is moved in the z (−z) direction, the linearly polarized light L _V
By scanning (moving) in the x direction and moving the reticle 6 in the z (−z) direction, the entire surface to be inspected of the reticle 6 is illuminated with the linearly polarized light L _V.

The diffraction grating 21 has a grating line inclined with respect to the scanning direction, and causes incident light to be reflected and diffracted laterally to generate a plurality of diffracted lights. In the present embodiment, a diffracted light of a specific order among a plurality of diffracted lights generated laterally is used for heterodyne interference. Instead of the diffraction grating 21, a light scattering member that scatters incident light to generate scattered light may be used.

The surface state inspecting device of this embodiment, linearly polarized light and the wavelength and the polarization directions are different from each other L _V, supplied in a superimposed state to L _H, scan linearly polarized light L _V, the L _H, collecting Common optical members 35, 36, 37, 101 for illuminating
Is used, the structure of the scanning means is simplified.

Next, the light receiving system of the surface condition inspection apparatus of this embodiment will be described with reference to FIG.

FIG. 2 is a development view of the apparatus of FIG. 1 on the xy plane. The partial reflection mirror (half mirror) 20 scatters the linearly polarized lights L _V and L _H from the foreign matter on the reticle 6 and the diffraction grating 21 when the diffraction grating 21 scans the reticle 6 in the x direction. And the diffracted light generated laterally are combined. That is, the scattered light from the foreign matter on the reticle 6 is transmitted, and the diffracted light from the diffraction grating 21 is reflected so that they are overlapped and made incident on the light receiving lens 7. An aperture stop 8 is provided at the rear focal position of the light receiving lens 7, and the light receiving system is a telecentric optical system on the reticle 6 (diffraction grating 21) side. Therefore, the light receiving lens 7 receives scattered light emitted from the points A, B and C on the reticle 6 and the points A _R , B _R and C _R on the diffraction grating 21 in the direction parallel to the optical axis of the light receiving lens 7. Aperture stop 8 for the central ray of diffracted light
Focus on the center of the aperture. Light receiving lens 7 and aperture stop 8
The scattered light and the diffracted light that have passed through are incident on the photodetector 12 via the lens 9, the field stop 10 and the lens 11. The photodetector 12 generates a beat signal generated by heterodyne interference of scattered light and diffracted light having the same polarization direction, and the processing device 2
Enter 2. The processing device 22 compares the intensity of the beat signal, the generation time, and the like with the corresponding threshold value, and when the threshold value is exceeded, determines that there is a foreign matter in question.

The scattered light laterally generated from the foreign matter on the reticle 6 contains the same polarization component as the diffracted light laterally generated from the diffraction grating 21, while the scattered light laterally generated from the circuit pattern on the reticle 6 and the like. The diffracted light does not contain the same polarization component as the diffracted light generated laterally from the diffraction grating 21 and does not cause heterodyne interference. Therefore, according to the surface condition inspection apparatus of this embodiment, the circuit pattern is not erroneously detected as a foreign matter.

Further, since the reticle 6 and the diffraction grating 21 side use a telecentric light receiving system, the reticle 6
Light with a constant elevation angle and solid angle from and diffraction grating 2
Diffracted light with a constant elevation angle and solid angle from 1 (reference light)
Can be taken into the light receiving lens 7, and if the size of the foreign matter is the same regardless of the position of the foreign matter on the reticle,
Scattered light with a constant intensity is always received by the light receiving lens 7 (aperture stop 8)
Since the light beam is incident on the photodetector 12 and is always accurately overlapped with the diffracted light from the diffraction grating 21, the intensity of the beat signal from the photodetector 12 is stable. Therefore, it is possible to detect a foreign matter with substantially constant sensitivity regardless of the foreign matter attachment position.

The field stop 10 is provided at an image forming position on the surface (inspected surface) of the reticle 6 by the lenses 7 and 9.
The field stop 10 is tilted with respect to the optical axis of the light receiving system so as to be along the image forming plane that satisfies the Scheimpflug condition with the surface of the reticle 6. By providing the field stop in this way, it is possible to prevent scattered light or diffracted light from surfaces other than the surface of the reticle 6 from entering the photodetector 12.

On the other hand, the light receiving surface of the photodetector 12 is the lens 9,
It is set to the image forming position of the aperture stop 8 by 11, and by providing the photodetector (photoelectric conversion means) in this way, from each point on the surface of the reticle 6 to the fixed position of the light receiving surface of the photodetector. The scattered light and the diffracted light from each point on the diffraction grating 21 are made incident to stabilize the sensitivity.

In order to obtain a high-contrast beat signal from the photodetector 12, the optical path length between the light receiving lens 7 and the reticle 6 and the optical path length between the light receiving lens 7 and the diffraction grating 21 are made substantially the same, and the reticle is used. 6 and the diffraction grating 21 are preferably arranged at substantially the same optical position with respect to the light receiving system.

FIG. 3 is a view showing a modification of the surface condition inspection device of FIGS. 1 and 2. 1 and 2, the optical axis of the light receiving system is in the plane that includes the scanning direction and is perpendicular to the surface of the reticle 6, but as shown in FIG. 3, the optical axis BK of the light receiving system is shown. Is arranged in a direction twisted with respect to the scanning direction B ₁ -B ₂ , and the light scattered laterally and slightly backward is made incident on the light receiving system. It is conceivable to make it difficult for the diffracted light to enter and to improve the detection accuracy of the foreign matter.

Although the surface condition inspection apparatus of FIGS. 1 to 3 moves the reticle 6, the reticle 6 is not moved and linearly polarized light L _V is two-dimensionally scanned.
It is conceivable to reduce the size of the entire device or the drive system.

In the surface condition inspection device of FIGS. 1 to 3,
Linearly polarized light L _V , L _H whose wavelength and polarization direction are different from each other
In order to obtain the above, there is also a mode in which the frequency shifter is placed only in the optical path of one polarized light and the number of members is reduced without placing the frequency shifter in the optical path of the other polarized light. There is also a mode in which an illumination system is simplified by using a laser that directly emits linearly polarized lights L _V and L _H having different wavelengths and polarization directions as the laser.

FIG. 4 is a schematic view showing an embodiment of the exposure apparatus of the present invention. In the figure, 1100 is an alignment scope, 1101 is an ultraviolet light source such as an excimer laser, and 11 is a light source.
Reference numeral 02 is an illumination system, 1109 is a projection optical system, 1110 is a wafer, 1111 is a stage for holding and moving the wafer 1111, 1113 is any of the above-mentioned foreign matter inspection apparatuses, 1114 is a reticle changer, and 1118 is a controller. The foreign matter inspection device 1113 inspects the presence or absence of foreign matter on the reticle taken out from the changer 1114 and conveyed to the exposure position EP. The exposure apparatus of the present embodiment performs exposure using only the reticle on which no problematic foreign matter is attached, and thus is a highly reliable apparatus.

Next, an embodiment of a device manufacturing method using the projection exposure apparatus of FIG. 4 will be described.

FIG. 5 shows a manufacturing flow of semiconductor devices (semiconductor chips such as IC and LSI, liquid crystal panels and CCDs). In step 1 (circuit design), a semiconductor device circuit is designed. In step 2 (mask production), a mask (reticle 304) on which the designed circuit pattern is formed is produced. On the other hand, in step 3 (wafer manufacturing), a wafer (wafer 306) is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by the lithography technique using the mask and the wafer prepared above. The next step 5 (assembly) is called a post-process, which is a process of making chips using the wafer prepared in step 4, and an assembly process (dicing, bonding
_B ring), a packaging process (chip encapsulation). In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed and shipped (step 7).

FIG. 6 shows a detailed flow of the wafer process. In step 11 (oxidation), the surface of the wafer (wafer 306) is oxidized. Step 12 (CV
In D), an insulating film is formed on the surface of the wafer. In step 13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted in the wafer. Step 15 (resist processing)
Then, a resist (photosensitive material) is applied to the wafer. In step 16 (exposure), the projection exposure apparatus exposes the wafer with an image of the circuit pattern of the mask (reticle 304). In step 17 (development), the exposed wafer is developed. In step 18 (etching), parts other than the developed resist are scraped off. In step 19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, a circuit pattern is formed on the wafer.

By using the manufacturing method of this embodiment, it becomes possible to manufacture a highly integrated device with few defects, which was difficult in the past.

[0033]

According to the surface condition inspection apparatus of the present invention, the surface to be inspected is scanned by the first light of the first and second lights having different wavelengths and polarization directions, and at the same time, diffracted by the second light. Scanning means for scanning a grating or a light scattering member, and light receiving optics for receiving and superposing scattered light generated laterally from the surface to be inspected and diffracted light or scattered light laterally generated from the diffraction grating or light scattering member. System, and a photoelectric conversion means for converting light from the light receiving optical system into an electric signal, wherein the light receiving optical system is characterized in that the surface to be inspected is composed of a telecentric optical system. Since the foreign matter can be detected based on the beat signal based on the heterodyne interference of the obtained scattered light and diffracted light or scattered light, the circuit pattern is not erroneously detected as a foreign matter,
Moreover, since the light receiving optical system is composed of an optical system in which the surface to be inspected is a telecentric optical system, it is possible to detect foreign matter with a substantially constant sensitivity regardless of the position where foreign matter is attached.

The surface condition inspection apparatus of the present invention further comprises:
By providing the light receiving surface of the photoelectric conversion means at the position of the aperture stop of the light receiving optical system or at a position conjugate with the position of the aperture stop of the light receiving optical system, a fixed position of the light receiving surface of the photoelectric conversion means is covered during scanning. The scattered light from each point on the inspection surface and the diffracted light or scattered light from each point on the diffraction grating or the light scattering member are made incident to stabilize the sensitivity.

The surface condition inspection apparatus of the present invention further comprises:
Since the light receiving optical system includes the field stop at a position conjugate with the surface to be inspected, the amount of scattered light from the surface other than the surface to be inspected incident on the photoelectric conversion means by the field stop is reduced, and the area other than the surface to be inspected is reduced. False detection of patterns and foreign matter on the surface as foreign matter on the surface to be inspected is reduced.

The surface condition inspection apparatus of the present invention further comprises:
The field stop is provided so as to be inclined with respect to the surface to be inspected along an image forming surface that satisfies the condition of Scheimpflug, so that scattered light from a surface other than the surface to be inspected which is incident on the photoelectric conversion means by the field stop. Is significantly reduced, and erroneous detection of a pattern or foreign matter on a surface other than the surface to be inspected as a foreign matter on the surface to be inspected is suppressed.

The surface condition inspection apparatus of the present invention further comprises:
The light receiving optical system includes a first lens, an aperture stop, a second lens, in order from the surface to be inspected and the diffraction grating or the light scattering member side.
A field stop is provided, the aperture stop is provided near the focal position of the first lens, the field stop is provided at an image forming position of the surface to be inspected by the first and second lenses, and the light receiving surface of the photoelectric conversion means is provided. By providing the position of the aperture stop or a position conjugate with the position of the aperture stop, the amount of scattered light from the surface other than the surface to be inspected incident on the photoelectric conversion means is reduced and the surface on the surface other than the surface to be inspected is reduced. Reduces false detection of patterns and foreign substances as foreign substances on the surface to be inspected, and scatters light from each point on the surface to be inspected and each point on the diffraction grating or light scattering member at a fixed position on the light receiving surface of the photoelectric conversion means during scanning. The diffracted light or scattered light from is incident to stabilize the S / N ratio of the beat signal. Therefore, a surface state inspection device capable of obtaining a beat signal with a stable S / N ratio with a simple optical system and reducing the adverse effect of scattered light from a surface other than the surface to be inspected is provided.

In the surface state inspection apparatus of the present invention, the scanning means supplies the first and second light in a superposed state, and deflects and scans the overlapping first and second light. And a scanning optical system for converging the first and second lights from the rotating mirror on the surface to be inspected and on the diffraction grating or the light scattering member, respectively. And a light splitter for defining an optical path of the first light to the surface to be inspected and an optical path of the second light to the diffraction grating or a light scattering member. By using a common optical member for scanning and condensing the above light, the structure of the scanning means is simplified.

The exposure apparatus of the present invention is characterized by including any one of the above-mentioned surface condition inspection apparatuses. It accurately detects the presence or absence of foreign matter on the reticle, and only the exposure by the reticle is free from the problematic foreign matter. Have high reliability to do.

A device manufacturing method for manufacturing a device such as an IC, an LSI, a magnetic head, a liquid crystal panel, and a CCD according to the present invention is characterized by detecting the presence or absence of a foreign matter on a reticle by any of the above-mentioned surface condition inspection apparatuses. Since the presence or absence of foreign matter on the reticle can be accurately detected and the device pattern of the reticle free from the problematic foreign matter can be transferred onto the substrate, a device with few defects can be obtained.

[Brief description of drawings]

FIG. 1 is a diagram showing an illumination system of an embodiment of a surface state inspection device of the present invention.

FIG. 2 is a diagram showing a light receiving system of an embodiment of the surface state inspection device of the present invention.

FIG. 3 is a diagram showing a modification of the surface state inspection device shown in FIGS. 1 and 2.

FIG. 4 is a diagram showing an embodiment of the exposure apparatus of the present invention.

FIG. 5 is a diagram showing a manufacturing flow of a semiconductor device.

FIG. 6 is a diagram showing a wafer process in FIG.

[Explanation of symbols]

L _H , L _V Lights with different wavelengths and polarization directions 6 Reticle 7, 9, 11 Light receiving lens 8 Aperture stop 10 Field stop 12 Photodetector 20 Half mirror 21 Diffraction grating 22 Signal processing device 36 Rotating mirror 37 Polarized light splitting Device 101 scanning lens

Claims (8)

[Claims] 1. A scan for scanning a surface to be inspected by a first light of a first light and a second light having different wavelengths and polarization directions, and at the same time scanning a diffraction grating or a light scattering member by the second light. Means, a light receiving optical system for receiving and superposing scattered light generated laterally from the surface to be inspected and diffracted light or scattered light laterally generated from the diffraction grating or the light scattering member,
A surface condition inspection apparatus comprising: a photoelectric conversion unit that converts light from the light receiving optical system into an electric signal, and the light receiving optical system is an optical system in which the surface to be inspected is a telecentric optical system. 2. The surface state according to claim 1, wherein the light receiving surface of the photoelectric conversion means is provided at a position of the aperture stop of the light receiving optical system or at a position conjugate with the position of the aperture stop of the light receiving optical system. Inspection device. 3. The light receiving optical system comprises a field stop at a position conjugate with the surface to be inspected.
Surface condition inspection device. 4. The light receiving optical system comprises a first lens, an aperture stop, and an inspection stop in order from the surface to be inspected and the diffraction grating or the scattering member side.
A second lens and a field diaphragm are provided, the aperture diaphragm is provided in the vicinity of the focal position of the first lens, and the field diaphragm is provided at an image forming position of the surface to be inspected by the first and second lenses. The surface condition inspection apparatus according to claim 3, which is characterized in that. 5. The surface state inspection apparatus according to claim 3, wherein the field stop is provided so as to be inclined with respect to the surface to be inspected so as to be along an image forming surface satisfying a Scheimpflug condition. . 6. The scanning means supplies the first and second light in a superposed state, a rotary mirror that deflects and scans the overlapping first and second light, and the rotation. A scanning optical system for converging the first and second light beams from a mirror on the surface to be inspected and on the diffraction grating or the light scattering member, respectively, is provided. 3. The surface condition inspection apparatus according to claim 1, further comprising a light splitter for determining an optical path to the surface to be inspected and an optical path of the second light to the diffraction grating or the light scattering member. 7. An exposure apparatus comprising the surface condition inspection apparatus according to claim 1, wherein the substrate is exposed through a device pattern of a reticle inspected by the surface condition inspection apparatus. . 8. A device manufacturing method including a step of transferring a device pattern onto a substrate by using the exposure apparatus according to claim 7.