JPH07193131A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To discriminate the type of a packaged semiconductor integrated circuit device and effectively use a terminal pin. CONSTITUTION:Power source lines VE1 and VE2, which have the same potential, are electrically separated in the semiconductor pellets 11, 12 and 12 for each type, and resistances R1, R2 and R3 which have the specific resistance value for each type are connected between the power source lines VE1 and VE2. Even after the semiconductor pellet is packaged, when the resistance value between the terminal pins L1 and L2 connected to the pads P1 and P2 which are connected to the power source lines VE1 and VE2 is measured, the type of the semiconductor integrated circuit device is discriminated based on the resistance value. An exclusive terminal pin for discriminating the type is not necessary arranged and the terminal pin is effectively used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device, and more particularly to a semiconductor integrated circuit device which simplifies identification of pellets in an inspection process after assembling semiconductor pellets.

[0002]

2. Description of the Related Art Heretofore, in the case of manufacturing a small number of semiconductor integrated circuit devices in a large variety, there are cases where a plurality of types of semiconductor integrated circuit devices are manufactured on one wafer. In this case, after assembling the semiconductor pellets after cutting the wafer into individual semiconductor pellets, if only the semiconductor pellets of the same type are selected and assembled, the subsequent process is simplified. There is a problem in that a large number of man-hours are required for the work of selecting the semiconductor pellet, and the cost becomes high. Further, it is considered that the semiconductor pellets of each kind are assembled in a mixed state and the semiconductor pellets are selected after the assembly.

As a sorting method in this case, Japanese Patent Laid-Open No. 63-1
There is one described in Japanese Patent No. 22242. In this method, as shown in FIG. 2A, for example, three types of semiconductor pellets 21, 22, and 23 are formed on the same wafer 2. Each semiconductor pellet 21, 22, 23
Between the test pad PT and the ground line VE provided in the above, one of the resistors R1, R2, and R3 having a resistance value unique to each product type is connected. Therefore, after packaging and assembling the semiconductor integrated circuit device,
As shown in (b), if the resistance value between the terminal pads L3 and L4 of the test pad TP and the ground pad PE connected to the ground line VE is measured by the resistance value measuring device TEST, it is possible to select the product type. is there.

[0004]

However, in this method, in order to connect the test pad TP and the ground line VE to the resistance value measuring device TEST, the test pad TP and the ground pad PE are respectively connected to the terminals of the semiconductor integrated circuit device. Pin L
3, must be connected to L4. Therefore, the ground pin L4 can be used for grounding the semiconductor integrated circuit device, but the terminal pin L3 to which the test pad is connected is dedicated to product selection, and is unnecessary for actual operation after product selection. Therefore, a semiconductor integrated circuit device having a high degree of integration and a large number of pins has a problem that it is an obstacle to effective use of the pins. An object of the present invention is to provide a semiconductor integrated circuit device which enables effective selection of terminal pins while enabling selection of types after manufacturing.

[0005]

SUMMARY OF THE INVENTION The present invention has a power line of the same potential that is electrically isolated in one semiconductor pellet, and when the semiconductor pellet is packaged, each power line is In a semiconductor integrated circuit device that is individually connected to terminal pins, a resistor having a resistance value peculiar to the type of semiconductor integrated circuit device is connected between each power supply line. Further, it is preferable that at least a part of the wiring that connects each power supply line to the resistor is blown by an overcurrent. Here, each semiconductor pellet is formed with a number of resistors having different resistances corresponding to the number of types, and a configuration in which these resistors are selected for each type and connected to each power line, or each semiconductor pellet has a type A configuration is adopted in which resistors having different resistance values are formed for each. Further, it goes without saying that the power supply line may be a ground line as a low potential side power supply line.

[0006]

Even if the semiconductor pellet is packaged as a semiconductor integrated circuit device, if the resistance value between the two terminal pins for the power supply of the same potential is measured, the semiconductor integrated circuit is obtained based on the resistance value. It becomes possible to select the type of the device, and it is not necessary to provide a dedicated terminal pin for identifying the type, and the terminal pin can be effectively used. Further, after selecting the product type, the line is melted by an overcurrent to separate the resistor from the power supply line, thereby preventing interference between the power supply lines.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1A is a diagram showing an embodiment of a semiconductor integrated circuit device of the present invention. A plurality of types of semiconductor pellets 11, 12, and 13 are formed on the semiconductor wafer 1, and each semiconductor pellet 11, 12, and 13 is cut and separated into individual semiconductor pellets in a subsequent process, and each package is independently processed. That is, it is configured as an individual semiconductor integrated circuit device. Here, the semiconductor pellets 11,
The power supply lines provided in the circuits 12 and 13 are generally arranged separately for each circuit block in order to prevent interference between the circuit blocks. In this example, the ground line as the power line on the low potential side is separated into two ground lines VE1 and VE2, which are connected to separate ground pads P1 and P2. Therefore, when the semiconductor pellet having this structure is packaged as a semiconductor integrated circuit device, each ground pad P1,
P2 will be connected to each individual terminal pin.

In each of the semiconductor pellets 11, 12 and 13 formed on the semiconductor wafer 1, one of the resistors R1, R2 and R3 is connected between the two ground lines VE1 and VE2. In this case, these resistors R1 and R
The resistance values of R2 and R3 are set to specific values according to the type of semiconductor pellet. In this embodiment, each of the semiconductor pellets 11, 12, and 13 has a resistor R1, R2, R3 having a different resistance value.
This is realized by making each wiring different so as to be connected to each. Further, in this embodiment, the resistance R
The width of the line connecting 1, R2, R3 and the ground lines VE1, VE2 is formed to be sufficiently thin so that they are easily blown when an overcurrent is applied.

Therefore, this semiconductor wafer 1 is cut and separated into individual semiconductor pellets 11, 12, and 13, and different types of semiconductor pellets are collectively assembled.
As shown in (b), each semiconductor integrated circuit device IC is formed. . After that, the two ground lines VE1 and VE2
The resistance value between the two ground pads P1 and P2, that is, the terminal pins L1 and L2 connected to the
According to the resistance value, the type of semiconductor pellet can be easily selected. Since the two ground lines VE1 and VE2 are normally grounded to the same potential, there is little problem even if a resistor is connected between both terminal pins. Further, if independence between circuit blocks including each ground line is required, and there is a possibility that interference between circuit blocks will be affected via a resistor, if an overcurrent is passed between both terminal pins, Since a thin wire that connects the resistor and the ground wire is blown, such interference can be prevented.

Therefore, in this semiconductor integrated circuit device, since it is possible to select the type of the semiconductor pellet by using the terminal pin of the same potential which is originally provided, the terminal pin for selecting the type is special. There is no need to install it in. Therefore, it is possible to effectively utilize the terminal pins in the highly integrated and multi-pin semiconductor integrated circuit. In particular, when a plurality of types of semiconductor pellets are formed on the same wafer, such as a master slice, even after the semiconductor integrated circuit device is manufactured by packaging all the formed semiconductor pellets in the same process. The type of integrated circuit device can be easily selected, the above-described terminal pins can be effectively used, and the manufacturing cost can be reduced.

Although the resistor is connected between the two ground lines in the above embodiment, when two power lines on the high potential side are provided, the resistor should be connected between these power lines. You may comprise. In addition, in the above-described embodiment, resistors having different resistance values are formed and selected for each semiconductor pellet, but when space restrictions are imposed, one resistance value is different for each type of semiconductor pellets. May be formed. This method of manufacturing resistors having different resistance values can be easily realized by, for example, when the resistors are made of polycrystalline silicon, by making the vertical and horizontal dimensions of the polycrystalline silicon film different for each kind. That is,
It suffices that the mask shape for patterning the polycrystalline silicon film be different for each kind.

[0012]

As described above, the semiconductor integrated circuit device of the present invention is peculiar to the type of the semiconductor integrated circuit device between the power lines of the same potential which are electrically separated in one semiconductor pellet. Since a resistor having a resistance value of 1 is connected, even if the semiconductor pellet is packaged and configured as a semiconductor integrated circuit device, if the resistance value between the two terminal pins for power supply of the same potential is measured, It becomes possible to select the type of the semiconductor integrated circuit device based on the resistance value, and it is not necessary to individually provide a dedicated terminal pin for identifying the type, and the terminal pin can be effectively used.

[Brief description of drawings]

FIG. 1 is a plan view of a main part of a semiconductor pellet according to an embodiment of the present invention, and a diagram showing a state in which a product type is identified.

FIG. 2 is a plan view of a part of a conventional semiconductor pellet and a diagram showing a state in which the product type is identified.

[Explanation of symbols]

 1 Semiconductor Wafers 11, 12, 13 Semiconductor Chips VE1, VE2 Equipotential Power Supply Lines (Grounding Lines) R1 to R3 Resistors P1, P2 Pads L1, L2 Terminal Pins

Claims (5)

[Claims] 1. A semiconductor pellet having power lines of the same potential which are electrically separated from each other, and each of the power lines is individually connected to a terminal pin when the semiconductor pellet is packaged. In the semiconductor integrated circuit device according to the present invention, a resistor having a resistance value peculiar to a product type of the semiconductor integrated circuit device is connected between the power supply lines. 2. The semiconductor integrated circuit device according to claim 1, wherein at least a part of a wiring connecting the power supply line and the resistor is blown by an overcurrent. 3. The semiconductor pellets are formed with resistors having different numbers of resistors corresponding to the number of types, and these resistors are selected for each type and connected to each power line. Semiconductor integrated circuit device. 4. The semiconductor integrated circuit device according to claim 1, wherein each semiconductor pellet is formed with a resistor having a different resistance value for each type. 5. The power supply line is a ground line.
Any one of the semiconductor integrated circuit device.