JPH0719015Y2 - Constant temperature bath device for IC test - Google Patents

Description

[Detailed Description of the Invention] "Industrial Application Field" The present invention relates to a thermostatic oven device used for testing an IC (semiconductor integrated circuit).

"Prior art" In order to know the quality and characteristics of the IC at high temperature such as 125 ° C or low temperature such as -30 ° C, a constant temperature bath for testing the IC under such high temperature or low temperature As a conventional device, as shown in FIG. 3, a connection part 20 such as an IC socket for connecting an IC to be tested to an external test circuit, a pair of rails 61, 62, and a rail 61 facing each other are provided in a constant temperature bath 90. X stage 63 moving in the front-back direction on Y, 64, Y stage 64 moving in the left-right direction with respect to X stage 63, and Y stage 64
A head drive mechanism 60 having a Z stage 65 that moves in the vertical direction with respect to the first tray, and the head 50 for adsorbing an IC is attached to the Z stage 65 of the head drive mechanism 60.
A large number of ICs to be tested are placed on the 30 (not shown in the figure), the first tray 30 is placed in the constant temperature bath 90, and, for example, two second trays 41, 41 are placed in the constant temperature bath 90. The inside of the constant temperature tank 90 is heated or cooled to supply high temperature or low temperature inside the constant temperature tank 90. In this state, the head drive mechanism 60 moves the head 50 to move the head 50 to the first tray. The IC to be tested on 30 is carried to the connecting portion 20 and connected to a test circuit for testing, and the tested IC is moved by the head 50 onto the second tray 41 or the second tray 42 depending on the test result. Something to convey is considered and used.

[Problems to be solved by the invention] However, in the above-described conventional IC test thermostatic bath apparatus shown in FIG. 3, the volume of the thermostatic bath 90 becomes large because the head drive mechanism 60 is provided in the thermostatic bath 90. So a constant temperature bath
It takes time for the inside of 90 to rise to a predetermined temperature, and it is difficult to reliably maintain the inside of the constant temperature bath 90 at the predetermined temperature. Further, since the head drive mechanism 60 is provided in the constant temperature bath 90, it is difficult to always control the position of the head 50 accurately due to thermal expansion or contraction of the head drive mechanism 60.

Therefore, in this invention, a head driven by a head driving mechanism tests an IC to be tested on the first tray in a constant temperature tank by carrying it to a connection portion, and the tested IC is tested in a constant temperature tank. In an IC test thermostatic chamber device that conveys onto two trays, the temperature inside the thermostatic chamber can be reliably brought to a predetermined temperature in a short time, and the position of the head can always be accurately controlled. Is.

[Means for Solving the Problems] In the present invention, the first tray on which the IC to be tested is placed is placed on the table, and a connecting section for connecting the IC to be tested to the test circuit is provided to perform the test. The second tray on which the IC is placed is arranged, and the first tray arranged on the base portion, the connecting portion, the second tray arranged on the base portion, and the IC tray for IC transportation are arranged with respect to the base portion. The head is housed inside and the head drive mechanism that moves the head in the front-rear direction, the left-right direction, and the up-down direction is arranged outside, so that a closed thermostatic chamber is formed on the base part. A cover body consisting of an inner cover and an outer cover that are elastic and do not contact each other is attached.

"Operation" In the constant temperature bath device for IC test of the present invention configured as described above, each expands and contracts as the head moves,
The inside of the constant temperature chamber and the outside of the constant temperature chamber are insulated by the cover body of the double mechanism consisting of the inner cover and the outer cover that do not contact each other, and the volume of the constant temperature chamber is increased because the head drive mechanism is arranged outside the constant temperature chamber. Since it can be made small, when supplying heated or cooled air to the constant temperature chamber to raise or lower the temperature inside the constant temperature chamber, the temperature inside the constant temperature chamber rises to the specified temperature in a short time and the temperature inside the constant temperature chamber is kept constant. Is maintained at a predetermined temperature. Further, since the head drive mechanism is arranged outside the constant temperature bath, the head position hardly always expands or contracts, and the position of the head can always be controlled accurately.

When supplying cooled air into the constant temperature chamber to lower the temperature inside the constant temperature chamber, dew condensation is achieved by injecting dry air between the inner cover and outer cover of the double structure cover body. Can be prevented.

"Embodiment" FIGS. 1 and 2 show an example of an IC test thermostatic chamber apparatus of the present invention.

As shown in the figure, a connecting portion 20 such as an IC socket for connecting an IC to be tested to an external test circuit is provided on the base 10.
A shutter 11 is provided on the back surface of the base 10, and when the shutter 11 is opened, an IC to be tested is placed on the base 10 (not shown in the drawing) and the connecting portion 20. The two second trays 41, 42 on which the ICs tested in 1 are placed are arranged. The shutter 11 is closed during the test. A pipe 12 for supplying heated or cooled air from the air supply source to the base 10 is provided on the side surface of the base 10.
Are connected.

Above the platform 10, the IC to be tested on the first tray 30 is adsorbed and conveyed to the connecting portion 20, and the IC tested at the connecting portion 20.
Is adsorbed on the second tray 41 or the second tray 41 depending on the test result.
A head 50 that conveys onto the tray 42 is provided supported by a head drive mechanism 60. The head drive mechanism 60 is the head 50
To move in the front-back direction, left-right direction and up-down direction,
A pair of rails 61, 62 facing each other, an X stage 63 moving in the front-rear direction on the rails 61, 61, a Y stage 64 moving in the left-right direction with respect to the X stage 63, and a vertical movement with respect to the Y stage 64. It has a Z stage 65 and the head 50
It is attached to the Z stage 65.

Then, from the upper edge of the periphery of the base portion 10 to the Y of the head drive mechanism 60.
A cover body 70 having a dual structure including an inner cover 71 and an outer cover 72 is attached to the periphery of the lower end of the stage 64, and a sealed constant temperature bath 80 is formed on the base 10.
Therefore, the connecting portion 20, the first tray 30, the second trays 41, 4
Although the head 2 and the head 50 are housed in the constant temperature bath 80, the head drive mechanism 60 is arranged outside the constant temperature bath 80 except for the Z stage 65.

Each of the inner cover 71 and the outer cover 72 of the cover body 70 is formed of a material having heat resistance and elasticity, and has heat resistance by forming a heat-resistant fiber or heat-resistant rubber into a bellows shape. In addition, the head 50 is expanded and contracted as the head 50 moves in the front-rear direction and the left-right direction, and is prevented from coming into contact with each other. In order to inject dry air into the outer cover 72 between the inner cover 71 and the outer cover 72 from the air supply source when supplying the cooled air into the constant temperature bath 80 to cool the inside of the constant temperature bath 80. The pipe 73 of is connected.

In the IC test thermostatic chamber apparatus configured as described above, a cover having a double structure including an inner cover 71 and an outer cover 72 that do not contact each other and expand and contract with the movement of the head 50 in the front-rear direction and the left-right direction, respectively. The body 70 insulates the inside of the constant temperature tank 80 and the outside of the constant temperature tank 80, and since the head drive mechanism 60 is arranged outside the constant temperature tank 80, the volume of the constant temperature tank 80 can be reduced, so that the pipe 12 When the heated or cooled air is supplied to the inside of the constant temperature bath 80 to raise or lower the temperature inside the constant temperature bath 80, the temperature inside the constant temperature bath 80 rises to a predetermined temperature in a short time and the inside of the constant temperature bath 80 is surely set to the predetermined temperature. Hold at temperature. In addition, the head drive mechanism 60
Since it is disposed outside the constant temperature bath 80, the position of the head 50 can always be accurately controlled with almost no thermal expansion or contraction.

Further, when the cooled air is supplied into the constant temperature bath 80 to lower the temperature inside the constant temperature bath 80, since dry air is injected between the inner cover 71 and the outer cover 72 through the pipe 73, Condensation is prevented.

When testing the IC only at high temperatures, the inner cover
No means such as pipe 73 for injecting dry air between 71 and outer cover 72 is required. Conversely, when testing the IC only at low temperatures, the inner cover 71 and outer cover 72
Need not be particularly heat resistant.

When the tested ICs are classified into three or more types according to the test result, three or more trays may be arranged on the base 10 as the second tray. In addition, the IC transport head 50
May carry an IC.

[Advantage of the Invention] As described above, according to the present invention, the temperature inside the constant temperature bath can be surely brought to a predetermined temperature in a short time, and
The position of the IC transport head can always be controlled accurately.

[Brief description of drawings]

1 and 2 are a perspective view showing an example of an IC test thermostatic chamber apparatus of the present invention and a partial sectional front view, and FIG. 3 is an example of a conventional IC test thermostatic chamber apparatus. It is a perspective view shown.

Claims (1)

[Scope of utility model registration request] 1. A pedestal part, and a first IC mounted on the pedestal part on which an IC to be tested is mounted.
A tray, a connecting part provided on the base part for connecting an IC to be tested to a test circuit, and a second tray arranged on the base part on which the IC tested at the connecting part is placed. And carrying the IC to be tested placed on the first tray arranged on the table part to the connection part, and the IC tested at the connection part on the first plate arranged on the table part. A head that conveys onto two trays, a head drive mechanism that moves the heads in the front-rear direction, the left-right direction, and the up-down direction, the first tray that is arranged on the base portion, the connection portion,
A constant temperature bath which is mounted on the base so that the second tray and the head arranged on the base are accommodated inside and the head drive mechanism is arranged outside, and which is sealed on the base. An IC test thermostatic chamber apparatus, comprising: a cover body that forms an inner wall and an outer cover that form an inner cover and an outer cover that do not contact each other and that expand and contract as the head moves.