JPH0718368U - Mold-in electronic components - Google Patents

Abstract

(57) [Abstract] [Purpose] In an electronic component in which a metal terminal is molded in, even if the contact portion side of the metal terminal has a connecting portion for preventing displacement during molding in, contact of the metal terminal To provide a mold-in electronic component that has a degree of freedom that can bend parts and can spread the shape of the contact in various ways. In an intermediate product for electronic parts, which includes a plurality of metal terminals 1 connected to each other by a connecting portion 14 and an insulator 3 in which the plurality of metal terminals 1 are collectively molded, the insulator 3 corresponds to the connecting portion 14. A transparent window 31 that exposes the connecting portion 14 is provided at a portion to be connected. The connecting portion 14 is formed so as to be cut from the metal terminal 1 through the transparent window 31. The connecting portion 14 is cut off from the intermediate product for electronic parts to form a mold-in electronic part. The connector includes this mold-in electronic component,
A contact is provided for connecting the metal terminal 1 to a mating connector.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to electronic components such as connectors and switches for molding metal terminals into molds, and more particularly to electronic components obtained by a mold-in method that increases the degree of freedom of configuration.

[0002]

[Prior art]

 FIG. 11 shows a manufacturing process of a conventional mold-in connector, in which a plate material P made of a conductive material is punched and formed, and a soldering portion 81 serving as a board mounting portion of a plurality of contacts 80 and a contact portion of a mating connector or the like. The space between the contact portions 83 that are in conductive contact with is molded in with an insulator 90 to obtain a mold-in connector as shown in FIG. Now, referring back to FIG. 11, each contact 80 is provided with connecting portions 82 and 84 which are connected to each other in a bridge shape in the vicinity of the tip of the soldering portion 81 and the root of the contact portion 83 to connect the contacts to each other. Punching in the state of This is to prevent displacement of the contacts 80 during mold-in.

By the way, the mold-in is of course carried out without including the connecting portions 82 and 84 connecting the respective contacts 80 to obtain an intermediate product. This connection part is cut after mold-in to separate the contacts 80 from each other to obtain a completed mold-in connector.

[0004]

[Problems to be solved by the device]

 However, in the above-described conventional mold-in connector, since the connecting portions 82 and 84 for connecting the contacts 80 to each other are located outside the insulator 90 at the time of mold-in, the bending of the contact 80 inside the insulator 90 is performed. It is difficult to provide a burred portion, and this has the drawback that the shape of the contact is limited.

In view of these facts, the technical problem of the present invention is to provide a connecting portion for preventing displacement during molding in an electronic component in which a metal terminal is molded in, even on the contact side of the metal terminal. In the case of existing electronic components, it is possible to bend the contact part of the metal terminal, and to provide a mold-in electronic component with a degree of freedom that allows the contact shape to be widely distributed. .

[0006]

[Means for Solving the Problems]

 An intermediate product for electronic parts according to the present invention is an intermediate product for electronic parts, which includes a plurality of metal terminals connected to each other by a connecting portion and an insulator in which the plurality of metal terminals are collectively molded. A connecting window is formed at a portion corresponding to the connecting portion to expose the connecting portion, and the connecting portion is cuttable from the metal terminal through the transmitting window.

The mold-in electronic component of the present invention is characterized in that the connecting portion is cut off from the intermediate product for electronic component.

The connector of the present invention is characterized in that it includes the mold-in electronic component and serves as a contact for connecting the metal terminal to a mating connector.

[0009]

[Action]

 According to the present invention having the above-mentioned configuration, the interconnecting portion provided on the contact side with the mating terminal for preventing the displacement of the metal terminal (contact) at the time of mold-in is located at the inner side of the insulator. Since the metal terminal is formed, the connecting portion does not become an obstacle when the metal terminal is bent, and the metal terminal in the insulator can be easily bent. Finally, the jig is inserted into the opening of the insulator to remove the connecting part and separate the metal terminals.

[0010]

[Embodiment] Next, an embodiment of the present invention will be described with reference to the accompanying drawings.

In FIG. 1, a conductive plate material which is a material of the contact 1 is press-punched and an insulator 3 is molded in. 2 is a bottom view of FIG.

The contact 1, which is a metal terminal, is formed by punching so as to have a connecting portion 11 with a substrate at one end and a contact portion 13 with a mating connector at the other end. In the press punching, the connection portion 11 of each contact 1 with the substrate is integrally connected to the carrier C via the bridge-shaped carrier connection portion 12. Further, the contact portion 13 of the contact 1 is connected by the connecting portion 14 at a portion where 13a and 13b are molded in 13c and 13d.

The connecting portion on the side of the connecting portion 11 with the substrate is cut and removed from the carrier C after mold-in. Further, the connecting portion 14 on the side of the contact portion 13 is also removed as will be described later. Therefore, as shown in FIG. 3, the connecting portion 14 on the side of the contact portion 13 is removed from the main body of the contact 1. Notches 14a and the like are formed in the cut portion so as to be easily broken.

In FIG. 1, reference numeral 3 is an insulator in which the contact 1 is molded in. An intermediate product is obtained by this mold-in. In this intermediate product, the portion of the insulator 3 corresponding to the connecting portion 14 on the contact portion 13 side of the contact 1 is as shown in FIGS. A transparent window 31 communicating with the outside is formed. Therefore, after the mold-in, when a jig or the like is inserted from the through window 31 and abutted against the connecting portion 14, the connecting portion 14 is broken and removed as shown in FIG. Then, the completed mold-in connector 4 is obtained.

In the embodiment of the present invention, the connecting portion 14 is located inside the insulator 3 even when a bending process such as changing the shape of the contact portion 13 is required after the contact is molded in. Therefore, bending can be easily performed. Then, after this bending process is completed and the desired bending state can be obtained in the contact portion, the connecting portion 14 is removed as described above.

FIG. 5 shows a state of the module according to the embodiment of the present invention immediately before being housed in the housing, FIG. 6 is a sectional view taken along line BB of FIG. 5, and FIG. 7 shows a state after housing the module in the housing. Shows. As shown in FIGS. 5 to 7, a predetermined number of modules, which have been molded in, bent, and removed the connecting portions 11 and 14, are housed in the housing 5 to obtain a connector having a desired number of cores. Is. It goes without saying that the structure of the housing 5 for accommodating each module here is not limited to the illustrated one.

8 to 10 show a state in which each module, that is, each insulator 3 in which the contact 1 is molded in is housed and incorporated in the housing 5, and FIG. 8 is a sectional view taken along the line CC of FIG. 8 is a sectional view taken along the line DD of FIG. 8, and FIG. 10 is a sectional view taken along the line EE of FIG. In these figures, 7 indicates a mating connector, and 71 indicates a contact of the mating connector 7. It should be noted that the molded part of the contact 1, the connection part 11 with the board, the contact part 13, the carrier connection part 12, the connection part 14 and the insulator 3, as well as the specific shape of the housing 5 and the mating connector, etc. It is needless to say that the structure is not limited to the one shown in the above drawings, and may be modified as appropriate without departing from the basic idea of the present invention.

Further, although the present invention is applied to the connector module in the above-described embodiment, the present invention can be applied not only to such a modular connector but also to a connector used alone. Furthermore, the present invention can be applied not only to the connector but also to other electronic parts in which the metal terminal is molded in.

[0019]

[Effect of device]

 As described above, according to the present invention, in order to prevent the contacts from being displaced during mold-in, the connecting portion on the contact portion side for connecting the metal terminals (contacts) is located inside the insulator. The contact part can be bent freely without bending the contact part when the contact part of the contact is bent, and the shape of the contact part of the metal terminal of the mold-in electronic component can be freely set. It becomes possible to have a degree.

[Brief description of drawings]

FIG. 1 is an explanatory view showing an embodiment of the present invention.

FIG. 2 is a bottom view of an embodiment of the present invention.

FIG. 3 is a partial explanatory view of an embodiment of the present invention,
It is the sectional view on the AA line in FIG.

FIG. 4 is a diagram illustrating the operation of the embodiment of the present invention.

FIG. 5 is a front sectional view showing an embodiment of the present invention.

6 is a sectional view taken along line BB in FIG.

FIG. 7 is a plan view of an embodiment of the present invention.

8 is a cross-sectional view taken along line CC in FIG.

9 is a sectional view taken along line DD in FIG.

10 is a cross-sectional view taken along the line EE in FIG.

FIG. 11 is a plan view showing an example of a manufacturing process of a conventional mold-in electronic component.

FIG. 12 is a perspective view showing an example of a conventional mold-in electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 metal terminal (contact) 3 insulator 5 housing 7 mating connector 11 board connecting part 12 carrier connecting part 13 contact part 14 connecting part 31 through window 80 contact 81 soldering part 82 connecting part 83 contact part 84 connecting part 90 insulator

Claims (3)

[Scope of utility model registration request] 1. An intermediate product for an electronic component, comprising: a plurality of metal terminals connected to each other by a connecting portion; and an insulator in which the plurality of metal terminals are collectively molded in, wherein the insulator corresponds to the connecting portion. An intermediate product for electronic parts, characterized in that it has a transparent window exposing the connecting part, and the connecting part can be cut off from the metal terminal through the transparent window. 2. A mold-in electronic component, wherein the connecting portion is cut off from the intermediate product for electronic components according to claim 1. 3. A connector comprising the mold-in electronic component according to claim 2, wherein the metal terminal is used as a contact for connecting to a mating connector.