JPH07183357A - Substrate arrangement pitch converter - Google Patents

Abstract

PURPOSE:To obtain a substrate pitch converter which can be manufactured easily with a simple configuration. CONSTITUTION:The title converter converts the arrangement pitch of substrates and is provided with a plurality of substrate retention members 40, a plurality of approach members 41, a cylinder 49, and a traveling means 43. A plurality of substrate retention members 40 are provided with a retention groove where substrates can be retained at the upper part and can move freely in the arrangement direction of substrates. A plurality of approach members 41 can enter between adjacent substrate retention members 40. The cylinder 49 is a means for enabling a plurality of approach members 41 to approach between the substrate retention members 40 and at the same time to be withdrawn between the substrate retention members 40. The traveling means 43 moves a plurality of substrate retention members 40 in mutually approaching directions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate array pitch conversion device for narrowing the array pitch of substrates, or conversely widening it.

[0002]

2. Description of the Related Art A substrate processing apparatus is used for surface treatment of a thin substrate to be processed (hereinafter simply referred to as a substrate) such as a semiconductor substrate or a glass substrate for liquid crystal. The substrate processing apparatus is provided with a transfer robot that transfers a carrier that stores a plurality of substrates, a processing tank that performs a surface treatment of a plurality of substrates with a treatment liquid, and a drying unit that dries the treated substrate surfaces. There is. When the substrates are dipped in the processing bath, a carrier batch system in which the carrier is dipped in the processing bath and a carrierless system in which a plurality of substrates taken out from the carrier are held by a chuck and transported to the processing bath are used.

Here, in order to be able to process a large number of substrates in the processing tank at one time, a substrate array pitch for holding the substrates in the substrate holder of the processing tank at a pitch narrower than the substrate array pitch in the transfer robot. Conversion devices have been proposed in the past. For example, in the apparatus disclosed in JP-A-2-303140, a pair of left and right wafer holding claws are driven by respective cam shafts, and the pitch of the substrate group held is adjusted by controlling the rotation amount of the cam shafts. ing. Further, in the apparatus described in Japanese Patent Laid-Open No. 3-273662, pitch conversion grooves inclined in the vertical direction are formed on a pair of plate surfaces, and the substrates are arrayed by moving the substrates along the pitch conversion grooves. Converting pitch.

[0004]

In the above-mentioned conventional pitch conversion device, the former device has a very complicated mechanism for performing pitch conversion, and the entire device becomes expensive. Further, it is necessary to rotate the pair of left and right cam shafts in synchronization, and if the rotation angle of the cam shafts is misaligned, the substrate is twisted and the substrate is damaged. Further, in the latter device, it is necessary to form the grooves inclined in the up-down direction with high accuracy and to arrange the grooves of the pair of plates facing each other with high accuracy. In this device, if the positions of the plates are misaligned between the grooves, the substrate is twisted in the same manner as described above, and the substrate is damaged.

As described above, the conventional pitch conversion device has a problem that the structure is complicated and the processing, assembling and operation are required to be performed with high accuracy, and the device becomes large and expensive. An object of the present invention is to make it possible to easily perform pitch conversion of a substrate array with a simple structure.

[0006]

A substrate array pitch conversion device according to the present invention is a device for converting the array pitch of substrates, and includes a plurality of substrate holding members, a plurality of entry members,
It is provided with an advancing member driving means and a moving means. Each of the plurality of substrate holding members has a substrate holding groove on the upper part thereof capable of holding the substrate, and is movable in the substrate arrangement direction. The plurality of entry members can enter between adjacent substrate holding members. The approaching member driving means is a means for causing a plurality of approaching members to enter between the substrate holding members and pulling them out from between the substrate holding members. The moving means is means for moving the plurality of substrate holding members in the directions in which they approach each other.

[0007]

In the substrate array pitch conversion device according to the present invention, when the substrate array pitch is widened from a narrow pitch to a wide pitch, first, the plurality of substrate holding members are placed in a state in which the entry member does not enter between them. To do. In this state, the plurality of substrate holding members are brought into close proximity to each other by the moving means, and the arrangement pitch of the substrate holding grooves on the substrate holding member is narrow. In this state, each substrate holding member holds the substrate. Next, the plurality of entry members are caused to enter between the adjacent substrate holding members by the entry member driving means. When the advancing member enters between the adjacent substrate holding members, the adjacent substrate holding members are separated from each other, and the arrangement pitch of the plurality of substrates held by them is widened.

On the contrary, when converting the board arrangement pitch from the wide pitch to the narrow pitch, the advancing members are inserted between the adjacent substrate holding members. In this state, the substrate holding grooves in the upper part of the substrate holding member have a wide array pitch, and the substrates held by these have a wide array pitch. From this state, each of the plurality of entry members is pulled out from between the adjacent substrate holding members by the entry member drive means. Then, the plurality of substrate holding members move in a direction in which they are in close contact with each other by the moving means, and the arrangement pitch of the substrate holding members, that is, the arrangement pitch of the substrates becomes a narrow pitch.

In this case, the pitch of the substrate arrangement can be easily changed with a simple structure simply by inserting or pulling out the inserting member between the plurality of substrate holding members.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment FIG. 1 shows a substrate processing apparatus in which a substrate array pitch conversion device according to the present invention is adopted. This substrate processing apparatus 1
Is a substrate transfer section 4 for taking out the substrate W from the carrier 2 for transport and transferring it to the carrier 3 for surface treatment, a surface treatment section 5 for the substrate W, a substrate drying section 6, and a carrier for cleaning the carrier 2 for transport. It has a cleaning section 7 and a maintenance work area 8.

In the substrate processing apparatus 1, the carrier transfer robot 11 provided along the carrier loading / unloading section 10, the substrate chuck 12 provided along the substrate transfer section 4, and the substrate transfer. A carrier transfer robot 13 provided from the unit 4 to the substrate surface treatment unit 5 and the substrate drying unit 6 is movably provided. As shown in FIGS. 1 and 2, the carrier loading / unloading unit 10 includes the carrier transfer robot 11 described above, a stage 15 on which a plurality of transported carrier 2 are placed, and an opening 15 a of the stage 15. , 15b, and a matching roller 16 provided below. Carrier transfer robot 11
Are provided so as to be movable, rotatable, and vertically movable along the stage 15. Then, in the carrier loading / unloading unit 10, the substrate W in the carrier 2 carried into one end of the stage 15 is aligned by the aligning roller 16, and the carrier 2 is transferred by the carrier transfer robot 11 to the substrate transfer unit. No. 4 turntable 17 is transferred. Further, the carrier 2 for transporting the processed substrate W is transferred to the other end of the stage 15 by the carrier transfer robot 11, and the carrier 2 for transfer thus transferred is carried out toward the subsequent processing step. To be done.

As shown in FIG. 2, the substrate transfer section 4 includes a substrate chuck 12 and a carrier mounting table 20 described above.
And a first unit arranged below the carrier mounting table 20.
Substrate transfer device 21 and substrate array pitch conversion device 22
And a second substrate delivery device 23. The substrate chuck 12 is provided on one side of the carrier mounting table 20 and is movable along the carrier mounting table 20. Then, in the substrate transfer section 4, a plurality of substrates W arranged at a standard pitch are taken out from the two carrier carriers 2 carried by the carrier transfer robot 11, and the array pitch is divided into two parts of the standard pitch. 1 is reduced to a half pitch and transferred to another surface treatment carrier 3.

An outline of the first substrate transfer device 21 is shown in FIG. As shown in FIGS. 2 and 3, the first substrate transfer device 21 includes a drive motor 30 for horizontally rotating a pair of turntables 17 provided on a carrier mounting table 20, and a turntable 17 for each turntable 17. A board transfer tool 31 that is arranged below and goes up and down through the central opening of the turntable 17, and each board transfer tool 3 via an elevating base frame 32.
It is composed of a lifting drive means 33 for lifting and lowering 1 and a link drive means 34 for moving the substrate transfer tools 31 toward and away from each other. The turntable 17 rotates the direction of the carrier 2 transferred on the turntable 17 by the carrier transfer robot 11 by 90 ° so that the accommodation direction of the substrate W corresponds to various subsequent devices. And is not necessarily required by the array of subsequent devices.

In this substrate delivery device 21, each substrate delivery tool 31 is raised and its substrate holding portion 31a holds a plurality of substrates W in an upright aligned state. That is, each substrate delivery tool 31 receives the plurality of substrates W from each carrier 2 in a standing posture while being separated from each other. Therefore, at this stage, the substrates for two carriers held by the two substrate transfer tools 31 are separated into the front substrate W1 and the rear substrate W2, respectively, as shown by the solid line in FIG. Has become.

In such a state, the substrate transfer tools 31 are brought close to each other in the substrate alignment direction. As a result, as shown by the alternate long and two short dashes line in FIG. 3, the substrates separated into the front group W1 and the rear group W2 are aligned at substantially the same pitch P, and are aligned with the substrate holding groove of the chuck hand 35 of the substrate chuck 12. Position alignment. Therefore, the substrates can be collectively held by the substrate transfer tool 31. After that, these substrates W are collectively clamped and transferred by the substrate chuck 12 and transferred to the substrate array pitch conversion device 22.

As shown in FIG. 4, the substrate array pitch conversion device 22 includes a plurality of substrate holding members 40 each holding a substrate W, and a plurality of entry members 41 arranged below the plurality of substrate holding members 40. It has a drive means 42 for moving up and down the plurality of entry members 41, and a moving means 43 for moving the plurality of substrate holding members 40 in the directions in which they approach each other.

The substrate holding member 40, the advancing member 41, the driving means 42 and the moving means 43 are housed in the first frame 44. As shown in FIG. 4, the first frame body 44 has a U-shape in a side view, and as shown in FIG. 2, is driven up and down by an up-and-down drive means 45 composed of a ball screw, a motor and the like. The substrate holding member 40 is shown in FIG.
Further, as shown in FIG. 5, it is a plate-like member, and has a substrate holding groove 40a for holding the substrate W in the upper portion. The substrate holding groove 40a is formed in an arc shape that is recessed downward so as to match the shape of the substrate W. Also, the substrate holding member 4
At the lower end of 0, as shown in FIG. 6, guide surfaces 40b are formed on both side surfaces, the guide surfaces 40b being inclined so that the thickness thereof becomes thinner toward the lower side. Therefore, a wedge-shaped space is formed between the adjacent holding members 40. Also,
A notch 40c is formed in a substantially central portion of the holding member 40,
Guide holes 40d are formed on both sides of the notch 40c. The plurality of substrate holding members 40 are horizontally movable along the guide rods 46 that penetrate the respective guide holes 40d. Both ends of the guide rod 46 are supported by the first frame body 44.

The advancing member 41 is composed of a plate-like member having the same width as one pitch of the arrangement pitch (half pitch) when the substrate holding member 40 is in close contact. The upper surface of the substrate holding member 40 has a wedge surface 41a formed along the guide surface 40b. The wedge surface 41a has substantially the same shape as the wedge-shaped space formed between the adjacent substrate holding members 40. Further, guide holes 41b are formed on the left and right sides of the plurality of ingress members 41, respectively. A guide rod 47 penetrates through the guide hole 41b, and the plurality of entry members 41 are connected to the guide rod 47.
It is free to move horizontally along. Guide rod 47
Is supported on the upper end of the second frame 48 having a U-shape in a side view, as shown in FIG.

The drive means 42 for the advancing member is composed of the guide rod 47 and the second frame body 48, and a cylinder 49 for raising and lowering the second frame body 48. The cylinder 49 is fixed to the first frame body 44, and its rod tip is fixed to the center of the bottom surface of the second frame body 48.
The moving means 43 is composed of a pair of support plates 50 and a tension spring 51 inserted between the pair of support plates 50. One of the pair of support plates 50 is fixed to a stopper plate 52 fixed to the first frame body 44. The other support plate 50
Of the plurality of substrate holding members 40 are fixed to the substrate holding member 40 on the side farthest from the stopper plate 52. The tension spring 51 is arranged so as to penetrate the notch 40c of the substrate holding member 40.
The plurality of substrate holding members 40 are urged in a direction in which they approach each other.

The second substrate delivery device 23 has one substrate delivery tool 55 and elevating means 56 for raising and lowering the substrate delivery tool 55. Here, the lifting means 5
The substrate transfer tool 55 is raised by 6 and the substrate holding section 55a of the substrate transfer tool 55 collectively receives the substrate groups in the half pitch array from the substrate chuck 12 in the upright alignment state and stores them in the surface treatment carrier 3.

The surface-treating carrier 3 is provided with a substrate accommodating groove having a half pitch of the substrate accommodating groove of the carrier 2 for carrying. Thereby, the surface treatment carrier 3
The number of substrates accommodated in the substrate increases, and the processing capacity improves.
As shown in FIGS. 1 and 2, the substrate surface processing unit 5 includes a processing tank 60a for performing acid cleaning without overflow.
And an overflow type pure water cleaning tank 60b. Then, the carrier 3 for surface treatment is sequentially dipped into the respective treatment baths 60a and 60b by the carrier transfer robot 13 to perform the planar treatment of the substrate W. In addition, each processing tank 60a, 6
On the lower side of 0b, the processing liquid recovery unit 61a and the processing liquid supply unit 6 are provided.
1b are provided.

The substrate drying unit 6 accommodates the surface treatment carrier 3 and drains and dries by centrifugal force to dry the centrifugal dehydrator 6
Have five. Instead of the centrifugal dehydrator / dryer 65, it is also possible to employ one that accelerates drying by using a solvent or one that accelerates drying by a depressurization method. The carrier cleaning unit 7 is for cleaning the carrier 2 that has been emptied by removing the substrate W while the surface treatment of the substrate W is being performed. Surface treatment carrier 3 in substrate transfer section 4
It is transferred to the cleaned carrier 2 from.

Next, the operation of the substrate array pitch 22 will be described. When accommodating an untreated substrate that has not been surface treated in the surface treatment carrier 3, the two substrate groups arranged at the standard pitch are changed to the half pitch. In this case, first, the cylinder 49 is operated to cause the rod 49a to project. As a result, the plurality of entry members 41 are raised via the second frame body 48. As shown in FIG. 4, each of the plurality of approaching members 41 has a wedge surface 41a at the tip thereof entering between two adjacent substrate holding members 40. The space between the substrate holding members 40 expands, and each substrate holding member 40 moves to the right in FIG. 4 against the biasing force of the tension spring 51. As a result, the distance between each of the plurality of substrate holding members 40 becomes the standard pitch as shown in FIG. 4 and 7, the leftmost support plate 5
The position of 0 is fixed by a stopper plate 52. Therefore, the plurality of substrate holding members 40 move to the right with reference to the leftmost substrate holding member.

A plurality of substrates are mounted by the substrate chuck 12 on the state as shown in FIG. 7, that is, on the plurality of substrate holding members 40 arranged at the standard pitch. Next, the entry member 41 is lowered by the cylinder 49 via the second frame 48. When the advancing member 41 descends and is pulled out from between the substrate holding members 40, the plurality of substrate holding members 40 are moved by the springs 51 in the directions in which they approach each other. When the entry member 41 is completely pulled out from between the plurality of substrate holding members 40, the state shown in FIG. 4 is obtained.
As a result, the substrate holding members 40 and the substrates, which were arranged at the standard pitch, are arranged at the half pitch.

Next, the substrate chuck 12 chucks these substrate groups arranged at a half pitch, and delivers them to the second substrate transfer device 23 side. Such operation 2
By repeating the process repeatedly, it becomes possible to accommodate the substrate group accommodated in the two carrier carriers 2 arranged at the standard pitch in the one surface treatment carrier 3 at the half pitch.

On the other hand, since the processed substrates are arranged at a half pitch, when the processed substrates are delivered to the carrier 2 side, the operation reverse to the above is performed. That is,
From the second transfer device 23 side, half of the substrate group arranged at half pitch by the substrate chuck 12 is placed on the plurality of substrate holding members 40 arranged at half pitch as shown in FIG. Next, the entrance member 41 is raised by the cylinder 49, and the interval between the plurality of substrate holding members 40 is set to the standard pitch. As a result, the plurality of substrates are arranged at the standard pitch. The substrate in this state is chucked by the substrate chuck 12, and the first substrate transfer device 21
Transfer to the carrier carrier 2 waiting on the side. The remaining half-pitch array substrate group is transferred to another transport carrier 2 by the same operation.

In such an embodiment, a plurality of entry members 4
It is possible to arrange a plurality of substrates at a standard pitch or at a half pitch by inserting or pulling out each one between the adjacent substrate holding members 40. Here, since the structure is simple and it is not necessary to incline the holding groove unlike the conventional device, the processing is easy. Further, it is not necessary to synchronize the pair of left and right members.

[Modification] (a) FIG. 8 shows another example of the substrate array pitch conversion device. In the embodiment, the substrate holding member at one end of the plurality of substrate holding members is used as a reference to move the other substrate holding member to the other side, but in the example shown in FIG. The substrate holding member located in the middle of 40 is used as a reference. That is, the stopper plate 70 is engaged with the substrate holding member 40e located in the middle, and the stopper plate 70 is attached to the first frame body 44 by the bolt 7 and the stopper plate 70.
It is fixed by 1. The other structure is similar to that of the above embodiment.

In this embodiment, when the first frame 48 and the advancing member 41 are raised by the cylinder 49, the advancing member 41 enters between the two adjacent substrate holding members 40. At this time, since the movement of the substrate holding member 40e at the intermediate position is prohibited by the stopper plate 70, the substrate holding member 40 on the left side of the substrate holding member 40e moves to the left, and conversely on the right side. The holding member 40 moves to the right. The arrangement of the substrate holding members 40 after the movement is the same as that shown in FIG.

With this embodiment, the same effect as that of the above embodiment can be obtained. (B) In the above-mentioned two embodiments, the entry member 41 is completely inserted between the adjacent substrate holding members 40, and the arrangement pitch is converted between the half pitch and the standard pitch. Instead, by using a motor or the like to stop the entrance of the entrance member 41 on the way, it becomes possible to convert to an arbitrary array pitch between the standard pitch and the half pitch. Second Embodiment FIGS. 9 to 11 show a second embodiment of the substrate array pitch conversion device.

The substrate array pitch converting device 70 is provided with a plurality of substrate holding members 71, a plurality of advancing members 72 arranged below the substrate holding member 71 so as to be movable up and down, and a plurality of advancing members 72 for raising and lowering. It has a cylinder 73 and a moving means 74 for moving the plurality of substrate holding members 71 in the direction of approaching each other. As shown in the enlarged view of FIG. 11, the substrate holding member 71 has a holding groove 71a for holding the substrate in the upper part. The substrate holding groove 71a is formed in an arc shape which is depressed downward in accordance with the shape of the substrate W, as in the above-described embodiment. In addition, at the lower end of the substrate holding member 71,
An inclined surface 71b for guiding the entrance of the entrance member 72 is formed. Further, guide holes 71c are formed on the left and right sides below the holding groove 71a.
A guide rod 75 penetrates 1c. Both ends of the guide rod 75 are supported by the support frame 76.
The support frame 76 is the first frame 44 in the first embodiment.
And can be moved up and down by an elevating means (not shown) (equivalent to the elevating means 45 of the first embodiment).

The lower ends of the advancing members 72 are connected to each other by a connecting portion 77 (see FIG. 10), and the tip of the rod of the cylinder 73 is fixed to the connecting portion 77. The upper end of each of the plurality of entry members 72 is an inclined surface 72.
It is a. The inclination of the inclined surface 72a is the same as the inclination of the inclined surface 71b at the lower end of the substrate holding member 71. The heights of the plurality of entry members 72 are different from each other. The difference in height between the adjoining advancing members 72 is such that one advancing member 72 completely enters between the substrate holding members 71 and then the other advancing member 72 starts advancing between the adjacent substrate holding members. There is such a difference in height.

The moving means 74 has a structure similar to that of the first embodiment, has support plates 80 at both ends, and a tension spring 81 is arranged between the support plates at both ends. Also,
The movement of one support plate 80 is prohibited by a stopper plate 82. A pair of tension springs 81 are provided on the left and right sides, and penetrate through the notches 71d formed in the substrate holding member 71, respectively.

In such an embodiment, when the entry member 72 is in the lowered position and has not entered between the substrate holding members 71, the plurality of substrate holding members 71 are arranged at a half pitch. On the other hand, when the plurality of approach members 72 are raised by the cylinder 73, the plurality of approach members 72 are
9 is guided by an inclined surface 71b formed at the lower end of the substrate holding member 71 from the left side of FIG. 9 to sequentially enter between two adjacent substrate holding members 71. FIG. 10 shows a state in which the entry member 72 having the lowest height has entered between the substrate holding members 71. In this example, all the plurality of entry members 72 enter between the adjacent substrate holding members 71, so that the plurality of substrate holding members 71 are arranged at the standard pitch.

In the state shown in FIG. 10, the cylinder 73
When the plurality of approaching members 72 are lowered by means of the approaching members 72, the approaching members 72 are sequentially pulled out from between the substrate holding members 71 from the right side of FIG.
Is moved to the left side in FIG. 10 by the spring 81. And
When all the approach members 72 are completely pulled out from between the substrate holding members 71, the state shown in FIG. 9 is restored. As a result, the substrate holding members 71 arranged at the standard pitch are
It will be arranged at a half pitch.

The operation other than the substrate array pitch converting device 70 is the same as that of the first embodiment. According to the second embodiment as well, similar to the first embodiment, the arrangement pitch of the substrates can be easily converted with a simple structure. Further, in this embodiment, after one approaching member 72 has entered between the adjacent substrate holding members 71, the next adjacent approaching member 72.
Is configured to enter between two adjacent substrate holding members. Therefore, by changing the thickness of the entrance member 72, the arrangement pitch can be converted at an arbitrary ratio according to the thickness.

That is, when the thickness of the advancing member 72 is made larger than the thickness of the substrate holding member 71, the pitch conversion more than double is possible, and conversely, the thickness of the advancing member 72 is changed to the thickness of the substrate holding member 71. If it is smaller than this, it is possible to perform pitch conversion twice or less. In the above embodiment, the tension springs are used as the moving means for moving the substrate holding members 71 in the directions approaching each other, but instead of this, an air cylinder, a motor or the like is used, and all the advancing members 72 are used. After the substrates are completely pulled out from between the substrate holding members 71, the respective substrate holding members 71 may be collectively moved in a direction in which they approach each other.

[0038]

As described above, according to the present invention, it is possible to change the arrangement pitch of the substrates by inserting and withdrawing each of the plurality of ingress members between two adjacent substrate holding members. . Therefore, it is possible to realize a substrate array pitch conversion device having a very simple configuration and easy to manufacture.

[Brief description of drawings]

FIG. 1 is a perspective view of a substrate processing apparatus that employs a substrate array pitch conversion apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic vertical cross-sectional configuration diagram of the substrate processing apparatus.

FIG. 3 is a front view of a first substrate transfer device.

FIG. 4 is a side view of the substrate array pitch conversion device according to the first embodiment of the present invention.

FIG. 5 is a partial front view of the substrate array pitch conversion device.

FIG. 6 is an enlarged partial view of FIG.

FIG. 7 is a side view of the substrate array pitch conversion device.

FIG. 8 is a side view of a substrate array pitch conversion device according to a modification of the first embodiment.

FIG. 9 is a partial side view of a substrate array pitch conversion device according to a second embodiment of the present invention.

FIG. 10 is a partial side view of a substrate array pitch conversion device according to a second embodiment of the present invention.

FIG. 11 is a front partial view of the substrate array pitch conversion device of the second embodiment.

[Explanation of symbols]

 22 Substrate Arrangement Pitch Converter 40 Substrate Holding Member 40a Holding Groove 41 Entry Member 43 Moving Means 49 Cylinder W Substrate

Claims (3)

[Claims] 1. A substrate array pitch changing device for converting an array pitch of substrates, wherein a plurality of substrate holding grooves each having a substrate holding groove capable of holding the substrate are movable in the substrate array direction. A member, a plurality of advancing members that can enter between the substrate holding members adjacent to each other, and an advancing member driving means for advancing the plurality of advancing members between the substrate holding members and pulling them out from between the substrate holding members. A substrate array pitch conversion device, comprising: a moving unit that moves the plurality of substrate holding members in a direction in which they approach each other. 2. The substrate array pitch conversion device according to claim 1, wherein the plurality of entry members are arranged so as to enter between the substrate holding members that are adjacent to each other substantially simultaneously. 3. The substrate holding device according to claim 3, wherein the plurality of advancing members are adjacent to each other, and after one advancing member has entered between the adjacent substrate holding members, an advancing member adjacent to the advancing member already entered between the substrate holding members. Arranged to enter between the members,
The substrate array pitch conversion device according to claim 1.