JPH0718014B2 - Meat processing equipment - Google Patents
Meat processing equipmentInfo
- Publication number
- JPH0718014B2 JPH0718014B2 JP61237594A JP23759486A JPH0718014B2 JP H0718014 B2 JPH0718014 B2 JP H0718014B2 JP 61237594 A JP61237594 A JP 61237594A JP 23759486 A JP23759486 A JP 23759486A JP H0718014 B2 JPH0718014 B2 JP H0718014B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- workpiece
- laser
- ultrasonic
- irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は化学メッキ若しくは電気メッキするメッキ加工
装置に関する。Description: FIELD OF THE INVENTION The present invention relates to a plating apparatus for chemical plating or electroplating.
〔従来技術及び問題点〕 従来、被加工体のメッキ部分にレーザービームを照射し
て加工することが公知である。レーザ照射による照射点
が加熱し活性化するためメッキ効率が向上し、他の部分
と選択的にメッキすることができ、例えば印刷配線基板
等を作るとき、マスクを不要にし、レーザ照射点をNC制
御により走査することによって容易に所要形状の配線基
板をメッキ形成できる効果がある。[Prior Art and Problems] It is conventionally known to irradiate a plated portion of a workpiece with a laser beam for processing. Since the irradiation point by laser irradiation is heated and activated, plating efficiency is improved, and it is possible to selectively plate with other parts.For example, when making a printed wiring board, a mask is not required and the laser irradiation point is NC. There is an effect that a wiring board having a desired shape can be easily formed by plating by scanning under control.
しかしながら、照射するレーザによりメッキ液からガス
が発生して妨害するからメッキ速度が低下し、接着力が
低下するといった欠点があった。However, there is a drawback in that a gas is generated from the plating solution by the irradiation laser and interferes with the plating solution, so that the plating speed is reduced and the adhesive force is reduced.
本発明はこの欠点を改良するためになされたもので、被
加工体のメッキ加工部分にレーザ照射と超音波とを同時
にするようにしたことを特徴とする。The present invention has been made in order to improve this drawback, and is characterized in that a portion to be plated on a workpiece is simultaneously irradiated with a laser and an ultrasonic wave.
〔実施例〕 以下図面の一実施例により本発明を説明する。１は被加
工体で、薄板テープであり、リール２に巻回貯蔵してあ
り、他のリール３に掛渡し、移動しながらできるように
したものである。４は超音波振動ホーンを兼ねる電極、
５が超音波振動子、６は電極４と被加工体１間にメッキ
用電流を通電する電源端子、７はメッキ液噴流ノズル、
８はレーザ発振器、９は反射鏡、10は集束レンズで、被
加工体テープ１のメッキ面と反対の裏側からレーザ照射
する。11はリール2,3を固定するテーブルでモータ12,13
により紙面に直交するXY平面に移動制御される。14はそ
の制御用のNC装置である。[Embodiment] The present invention will be described below with reference to an embodiment of the drawings. Reference numeral 1 denotes a work piece, which is a thin tape, which is wound around a reel 2 and stored, and is wound around another reel 3 so that it can be moved while moving. 4 is an electrode that also serves as an ultrasonic vibration horn,
Reference numeral 5 is an ultrasonic oscillator, 6 is a power supply terminal for supplying a plating current between the electrode 4 and the workpiece 1, 7 is a plating solution jet nozzle,
Reference numeral 8 is a laser oscillator, 9 is a reflecting mirror, and 10 is a focusing lens, and laser irradiation is performed from the back side opposite to the plated surface of the tape to be processed 1. 11 is a table for fixing reels 2 and 3, and motors 12 and 13
The movement is controlled by the XY plane orthogonal to the paper surface. 14 is an NC device for controlling the control.
被加工体１の加工部分にノズル７から供給するメッキ液
を介して電解電極を対向し、裏側からレンズ10で集束し
たレーザビームを照射する。レーザビームの照射点は急
速に加熱され、加熱部分に選択的にメッキ層が形成され
る。電極４には振動子５によって超音波振動が作用し、
対向する被加工体１のメッキ部分に超音波照射をする。
この超音波によって介在するメッキ液は液中混合気泡等
を排除して被加工体メッキ部分に高密度メッキ液を介在
させたことができ、電解電流を増加し高密度電流により
急速な高密度の析出メッキ層を形成することができる。
レーザビーム照射による加熱によってメッキ液のガス発
生増加は避けられないが、超音波照射によって発生ガス
を排除しながらメッキ析出することができ、レーザーメ
ッキによるメッキ効果を高め照射部分に選択的に高密度
の被加工体母材との接着力の強いメッキ層を被覆形成す
ることができる。従って加工中被加工体１をNC装置14の
制御によってモータ12,13を駆動し、加工形状に相対移
動しながらメッキを続けることによりマスクなしに所望
パターンのメッキ層を容易に形成することができる。こ
うして被加工体１の加工された部分はリール３に巻取リ
ール２から新しい部分を供給して加工を続けることによ
り連続してメッキ加工を続けることができる。The electrolytic electrode is opposed to the processed portion of the workpiece 1 through the plating liquid supplied from the nozzle 7, and the laser beam focused by the lens 10 is irradiated from the back side. The irradiation point of the laser beam is rapidly heated, and a plating layer is selectively formed on the heated portion. Ultrasonic vibration acts on the electrode 4 by the vibrator 5.
Ultrasonic irradiation is applied to the plated portions of the workpiece 1 facing each other.
The plating solution intervened by this ultrasonic wave can eliminate the mixed bubbles in the solution and allow the high-density plating solution to intervene in the plated portion of the workpiece, increasing the electrolytic current and rapidly increasing the high-density current by the high-density current. A deposition plating layer can be formed.
Increasing gas generation of plating solution due to heating by laser beam irradiation is unavoidable, but plating can be performed while eliminating generated gas by ultrasonic irradiation, enhancing the plating effect by laser plating and selectively increasing the density of the irradiated area. It is possible to cover and form a plating layer having a strong adhesive force to the workpiece base material. Therefore, during processing, by driving the motors 12 and 13 of the work piece 1 under the control of the NC device 14 and continuing the plating while relatively moving to the processed shape, it is possible to easily form a plating layer of a desired pattern without a mask. . In this way, the processed portion of the workpiece 1 can be continuously plated by supplying a new portion from the take-up reel 2 to the reel 3 and continuing the processing.
例えば、Cuメッキに於てアルゴンレーザ1.5Wを照射して
加工するとき、同時に30KHz、振幅数10μｍの超音波を
同時に照射したとき、メッキ電流密度がレーザのみの場
合118A/cm2であったものが超音波照射によって約134A/c
m2に増大し、加工速度が約20％向上し、メッキ層の接着
力も約10％程度増大した。For example, when processing by irradiating an argon laser of 1.5 W for Cu plating, and simultaneously irradiating ultrasonic waves of 30 KHz and an amplitude of 10 μm, the plating current density was 118 A / cm 2 when only the laser was used. Is about 134 A / c due to ultrasonic irradiation
increased to m 2, the processing speed is improved by about 20%, the adhesive strength of the plating layer were also increased by about 10%.
尚、化学メッキするときは、電極４は単に超音波ホーン
の役目をし、メッキ部分に集中的超音波照射するように
する。When performing chemical plating, the electrode 4 merely serves as an ultrasonic horn so that the plated portion is irradiated with concentrated ultrasonic waves.
第２図は他の実施例で、被加工体のメッキ加工表面から
レーザビームと超音波を照射する例である。16が竪て支
持台17に固定支持した被加工体で、この表面にノズル７
からメッキ液を供給し、超音波ホーン18を対向して設け
る。ホーン18の中心には貫通孔を形成してあり、この貫
通孔を通してレーザビームを照射する。19はガラス、プ
ラスチック等の透明の容器壁で、これを通って外部から
レーザ発振器８による出力ビームをレンズ10で集束して
照射する。FIG. 2 shows another embodiment, which is an example of irradiating a laser beam and ultrasonic waves from the plated surface of the workpiece. 16 is a work piece which is vertically fixed and supported by a support stand 17, and the nozzle 7 is provided on this surface.
The plating solution is supplied from the above, and the ultrasonic horns 18 are provided facing each other. A through hole is formed at the center of the horn 18, and a laser beam is emitted through this through hole. Reference numeral 19 denotes a transparent container wall made of glass, plastic, or the like, through which the output beam from the laser oscillator 8 is focused by the lens 10 and irradiated from the outside.
電気メッキは端子６から通電し、化学メッキの場合は通
電を除去する。被加工体は加工中NC装置14によるモータ
12,13駆動によって加工形状の移動制御され、超音波ホ
ーン18の対向部を相対移動ながらメッキ形成することが
同様に行なわれ、NC制御により所要パターンのメッキ形
成がマスクなしに容易に加工することができる。レーザ
ビームの集束レンズ10は透明容器壁19の外側に設けてい
るからメッキ液による汚染を防止することができ、安定
したビーム照射を続けて高能率のメッキ加工を行なうこ
とができる。又メッキ液は竪て掛け支持した被加工体16
にノズル７から供給し流下させるようにしているので、
加工部以外の漏洩を防止し安定加工をすることができ
る。In electroplating, electricity is applied from the terminal 6, and in the case of chemical plating, electricity is removed. The workpiece is being machined by the NC device 14 motor
The movement of the machining shape is controlled by driving 12, 13 and plating is performed in the same manner while the opposite part of the ultrasonic horn 18 is relatively moved. By NC control, plating of the required pattern can be easily processed without a mask. You can Since the laser beam focusing lens 10 is provided on the outer side of the transparent container wall 19, it is possible to prevent contamination by the plating solution, and it is possible to perform stable beam irradiation and perform highly efficient plating. In addition, the work piece 16 that the plating solution was vertically hung and supported
Since it is supplied from the nozzle 7 and made to flow down,
It is possible to prevent leakage other than the processing part and perform stable processing.
以上のように本発明は被加工体のメッキ加工部分にレー
ザビームと超音波振動を照射するようにしたからマスク
なしにレーザ照射部分に選択的にメッキすることがで
き、被加工体との間に相対移動操作して形状加工すれば
所望パターンのメッキ層を容易に形成することができ
る。又同時に照射する超音波によって発生するガス等を
排除しなが高密度のメッキ層の形成ができ、母材との接
着強度が強く良好なメッキ層の形成ができる。これはレ
ーザ照射によって加工部分が加熱されるから、介在する
メッキ液がガス化することは避けられないが、発生する
ガスを超音波によって加工部分から排除するこができ、
高密度の通電ができ良好なメッキ加工が行なえるもので
ある。As described above, according to the present invention, since the laser beam and the ultrasonic vibration are applied to the plated portion of the workpiece, the laser-irradiated portion can be selectively plated without a mask. By performing a relative movement operation to form a shape, a plating layer having a desired pattern can be easily formed. Further, it is possible to form a high-density plating layer without excluding gas and the like generated by the ultrasonic waves that are simultaneously radiated, and it is possible to form a good plating layer having a strong adhesive strength with the base material. Since the processed portion is heated by laser irradiation, it is unavoidable that the interposing plating solution is gasified, but the generated gas can be removed from the processed portion by ultrasonic waves.
High density electricity can be applied and good plating can be performed.
第１図は本発明の一実施例構成図、第２図は他の実施例
構成図である。 １……被加工体 ４……電極 ５……振動子 ６……通電電源接続端子 ７……メッキ液ノズル ８……レーザ発振器 ９……反射ミラー 10……レンズ 12,13……モータ 14……NC装置FIG. 1 is a configuration diagram of an embodiment of the present invention, and FIG. 2 is a configuration diagram of another embodiment. 1 ... Workpiece 4 ... Electrode 5 ... Oscillator 6 ... Energizing power supply connection terminal 7 ... Plating liquid nozzle 8 ... Laser oscillator 9 ... Reflecting mirror 10 ... Lens 12, 13 ... Motor 14 ... … NC device
Claims (2)
於て、被加工体のメッキ加工部分にレーザービームを照
射する装置と超音波を照射する装置とを設け、且つ前記
レーザービーム照射点及び超音波照射点をメッキパター
ンに移動走査する相対移動制御装置を設けたことを特徴
とするメッキ加工装置。1. An apparatus for chemical plating or electroplating, which is provided with a device for irradiating a laser beam and a device for irradiating ultrasonic waves on a plated portion of a workpiece, and the laser beam irradiation point and the ultrasonic wave. A plating processing apparatus comprising a relative movement control device for moving and scanning an irradiation point on a plating pattern.
置を設けた特許請求の範囲第１項に記載のメッキ加工装
置。2. The plating apparatus according to claim 1, further comprising an ultrasonic wave irradiation device for applying ultrasonic waves to the plating electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61237594A JPH0718014B2 (en) | 1986-10-06 | 1986-10-06 | Meat processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61237594A JPH0718014B2 (en) | 1986-10-06 | 1986-10-06 | Meat processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6393871A JPS6393871A (en) | 1988-04-25 |
| JPH0718014B2 true JPH0718014B2 (en) | 1995-03-01 |
Family
ID=17017631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61237594A Expired - Lifetime JPH0718014B2 (en) | 1986-10-06 | 1986-10-06 | Meat processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0718014B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102817051B (en) * | 2012-09-14 | 2015-02-11 | 中国科学院半导体研究所 | Laser pulse electroplating system |
| CN107217245A (en) * | 2017-05-22 | 2017-09-29 | 北京科技大学 | A kind of backlight catalysis plating preparation method of light transmissive material surface metal pattern |
| CN114525559A (en) * | 2020-11-23 | 2022-05-24 | 余姚市爱迪升电镀科技有限公司 | Plating apparatus and plating method |
-
1986
- 1986-10-06 JP JP61237594A patent/JPH0718014B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6393871A (en) | 1988-04-25 |
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