JPH07175078A - Packaging structure of panel - Google Patents

Abstract

PURPOSE:To make it possible to perform the connection even for electrode terminals of a fine pitch, with high reliability. CONSTITUTION:Electrode terminals 16 are embedded in a flexible substrate 15 and project slightly from the flexible substrate 15 within a range of 0 to 2X10<-3>mm. The apparent thickness e of the electrode terminals 16 is made small and the etching accuracy of a top plate 23 is improved while the rigidity of the electrode terminals 16 is maintained by embedding the electrode terminals 16 in the flexible substrate 15 in such a manner. The ratio of the thickness f of an anisotropically conductive film 17 and the diameter g of conductive particles 22 is made approximately to be '1' by decreasing the projecting rate e of the electrode terminals 16, thereby, the movement of the conductive particles 22 is lessened and the decreasing of the number of the conductive particles 22 between both electrode terminals 13 and 16 is prevented. Further, the flow in of the conductive particles 22 into the space parts between the adjacent electrode terminals 16 is prevented. The connection of a panel and the circuit board by the electrode terminals of the fine pitch is made possible with the high reliability.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a panel for connecting different electrode terminals of a panel and a circuit board, and more particularly to a mounting structure of a display panel using electroluminescence, plasma, liquid crystal or the like.

[0002]

2. Description of the Related Art Conventionally, a panel having electrode terminals is connected to a circuit board as follows. That is, as shown in FIGS. 12 and 13 (cross-sectional view taken along the line AA of FIG. 12), the electrode terminals 4 on the flexible substrate 2 on which the driving IC (integrated circuit) 1 is mounted are connected to the conductive particles 5. Diameter d
(8 × 10 ⁻³ mm to 10 × 10 ⁻³ mm), the film thickness b (20
X 10 ⁻³ mm to 30 × 10 ⁻³ mm) is very thick (b >> d), and an anisotropic conductive film 6 having a number of conductive particles 5 is several in the thickness direction. The electrode terminals 7 are connected by thermocompression bonding. At this time, the electrode terminal 4 on the flexible substrate 2 is bonded to the flexible substrate 2 via the reinforcing adhesive sheet 3 by a copper foil sheet, and the copper foil sheet is etched to obtain a thickness a (= 18 × 1).
It is formed on the 0 ^-3 mm or more).

When connecting the flexible substrate 2 on which the driving IC 1 is mounted to the panel 8 having electrode terminals with a finer pitch, the insulating film 9 is formed around the conductive particles 5 in the anisotropic conductive film 6. Coating with. Then, the insulating film 9 in the thickness direction (electrode terminal connecting direction) of the anisotropic conductive film 6 is peeled off by pressure when the electrode terminal 4 on the flexible substrate 2 side is thermocompression-bonded to the electrode terminal 7 on the panel 8 side. Both electrode terminals 4 and 7 are electrically connected (for details, Suzuki:
"Joint mounting technology of LCD panel and LSI" Electronic material 19
(November 1992).

[0004]

The following two factors are required as the factors required for connecting the electrode terminals having a fine pitch.

(1) Improvement of etching accuracy of the top surface of the electrode terminal 4 when the electrode terminal 4 is formed by etching on the flexible substrate 2 on which the driving IC 1 is mounted.

(2) Securing the required number of conductive particles 5 existing between the electrode terminals 7 on the panel 8 side and the electrode terminals 4 on the flexible substrate 2 side during thermocompression bonding.

With respect to the above two factors, the method of connecting the panel 8 having the conventional electrode terminals 7 to the flexible substrate 2 will be examined below.

First, the etching accuracy of the top surface of the electrode terminal is
It is approximately inversely proportional to the thickness a of the electrode terminal 4 to be etched.
Therefore, in order to improve the etching accuracy, the thickness a of the electrode terminal 4 may be reduced. However, if the thickness a of the electrode terminal 4 is simply reduced, there is a problem that the electrode terminal 4 is bent or easily broken due to stress applied when the driving IC 1 is mounted later.

Next, the number of the conductive particles 5 between the two electrode terminals 4 and 7 at the time of thermocompression bonding is determined when the conductive particles 5 existing in the anisotropic conductive film 6 are just connected by thermocompression bonding. It depends on the ratio between the two electrode terminals 4 and 7. And
In order to maintain reliable connection strength, the space between the adjacent electrode terminals 4, 4 on the flexible substrate 2 side must be sufficiently filled with the anisotropic conductive film 6,
The anisotropic conductive film 6 needs to have a film thickness corresponding to the thickness a of the electrode terminal 4 on the flexible substrate 2 side. However, since the thickness a of the electrode terminal 4 is sufficiently larger than the conductive particle diameter d as described above, the thickness of the anisotropic conductive film 6 is also sufficiently larger than the conductive particle diameter d. As a result, the flow of the resin portion of the anisotropic conductive film 6 becomes active during thermocompression bonding, and the conductive particles 5 also flow due to the stress during the resin flow. Therefore, the number of conductive particles 5 between the two electrode terminals 4 and 7 is reduced, and the number required for conduction cannot be secured. In addition, the flexible substrate 2
There is also a problem that the conductive particles 5 that have flowed into the space between the adjacent electrode terminals 4 and 4 on the side are aggregated to cause a leak between the adjacent electrode terminals 4 and 4.

From the above points, it is difficult to connect electrode terminals having a fine pitch of 8 × 10 ⁻² mm or less by the conventional method of connecting the panel 8 having the electrode terminals 7 to the flexible substrate 2.

It is also conceivable to form an insulating film 9 around the conductive particles 5 in the anisotropic conductive film 6 in order to reduce the leak between the adjacent electrode terminals 4, 4. However, in that case, it is necessary to peel off the insulating film 9 by the pressure at the time of thermocompression bonding, and the panel 8 may be destroyed by the strong pressure at that time. In addition, the insulating film 9
May not be completely peeled off.

Therefore, an object of the present invention is to provide a mounting structure of a panel capable of highly reliable connection even with fine pitch electrode terminals.

[0013]

In order to achieve the above object, the invention according to claim 1 mounts a connecting terminal formed on the peripheral portion of one surface of a panel and a driving integrated circuit for driving the panel. In a mounting structure of a panel in which the connection terminals formed on the flexible substrate and connected to the driving integrated circuit are connected via an anisotropic conductive film, the connection terminals on the flexible substrate are separated from the substrate material. The protrusion amount is set to 1 × 10 ⁻² mm or less, and the film thickness of the anisotropic conductive film is set to be substantially equal to the outer diameter of the conductive particles contained therein.

According to a second aspect of the present invention, the driving terminals are formed on a flexible substrate on which connection terminals formed on the peripheral portion of one side of the panel and a driving integrated circuit for driving the panel are mounted. The first connection terminal connected to the integrated circuit is connected through an anisotropic conductive film, and the second connection terminal formed on the flexible substrate and connected to the driving integrated circuit is connected to the second connection terminal. In a mounting structure of a panel in which a connecting terminal of a wiring board that transmits a signal from the outside to an integrated circuit for driving is connected through an anisotropic conductive film,
The amount of protrusion from the substrate material in each connection terminal formed on the flexible substrate is set to 1 × 10 ⁻² mm or less, and the thickness of the anisotropic conductive film used for connecting each connection terminal is , And is set substantially equal to the outer diameter of the conductive particles contained therein.

According to a third aspect of the invention, in the panel mounting structure of the first or second aspect of the invention, each connection terminal formed on the flexible substrate is formed by being embedded in a substrate material. It is characterized in that the upper surface of the connection terminal and the surface of the substrate material are parallel to each other. The invention according to claim 4 is the panel mounting structure according to claim 1 or 2,
Each connection terminal formed on the flexible substrate is formed by filling an insulating film between each connection terminal on the substrate material and projecting only the head, and the upper surface of the connection terminal and the surface of the substrate material. Is characterized by being parallel.

According to a fifth aspect of the present invention, in the panel mounting structure according to any one of the first to fourth aspects, the connection terminals on the flexible substrate are plated with metal. It is characterized by being.

According to a sixth aspect of the present invention, in the panel mounting structure according to the fifth aspect of the invention, the metal plating for the connection terminal on the flexible substrate is projected on the substrate material of the connection terminal. The feature is that it is applied to all the places.

The invention according to claim 7 is the panel mounting structure according to claim 5 or 6, wherein:
The metal plating on the connection terminal on the flexible substrate is applied only to the region connected to at least one of the first connection terminal on the panel side and the second connection terminal on the wiring board side, and the metal plating on the panel side is performed. A region which is not connected to the first connection terminal and the second connection terminal on the side of the wiring board is covered with an insulating film.

The invention according to claim 8 is the panel mounting structure according to any one of claims 5 to 7, wherein the metal plating for the connection terminals on the flexible substrate is one connection. In the terminal, an insulating film having the same thickness as that of the metal plating is alternately formed in the longitudinal direction, and the positional relationship between the metal plating region and the insulating film region is reversed between adjacent connection terminals. The metal plating region and the insulating film region of the plurality of connection terminals arranged in parallel on the flexible substrate are formed in a checkered pattern.

According to a ninth aspect of the present invention, in the panel mounting structure according to any one of the second to eighth aspects, the first connection terminal on the flexible substrate and the panel are mounted. A connection between the connection terminal, a first connection terminal on the flexible substrate and a first connection of the driving integrated circuit;
Connection between the second connection terminal on the flexible board and the connection terminal on the wiring board, and the second connection terminal on the flexible board and the driving integrated circuit. The connection with the second connection terminal of the circuit is characterized by being performed through the same anisotropic conductive film.

[0021]

In the inventions according to claims 1 to 9, the connection terminal provided on the flexible substrate on which the driving IC for driving the panel is mounted and connected to the driving IC is formed from the substrate material. The amount of protrusion is set to be extremely small at 1 × 10 ⁻² mm or less, and the top surface of the connection terminal has high etching accuracy. The connection terminals on the side of the flexible substrate are the connection terminals formed on the peripheral portion of one surface of the panel or the connection terminals of the wiring board for transmitting a signal from the outside to the driving IC, and the outer diameter of the conductive particles. Connection is made through an anisotropic conductive film whose film thicknesses are set to be substantially equal. Therefore, the conductive particles of the anisotropic conductive film do not flow during thermocompression bonding, and the number of conductive particles existing between the connection terminal on the panel side or the wiring board side and the connection terminal on the flexible board side is conducted. You can secure as many as you need. In this way, the panel, the flexible substrate and the wiring substrate are connected with high reliability even between the electrode terminals having a fine pitch of 8 × 10 ^-2 mm or less.

Further, in the invention according to claim 8, since the metal plating region and the insulating film region in the plurality of connection terminals arranged in parallel on the flexible substrate are in a checkered pattern, In the adjacent connection terminals, the metal plating region and the insulating film region are adjacent to each other, and leakage of anisotropic conductive film between the adjacent connection terminals due to conductive particles is prevented.

Further, in the invention according to claim 9, between the first connection terminal on the flexible substrate and the connection terminal on the panel, the first connection terminal on the flexible substrate and the driving integrated circuit. Between the second connection terminal on the flexible board and the connection terminal on the wiring board, and between the second connection terminal on the flexible board and the driving integrated circuit. And the second connection terminal of are connected in one step through the same anisotropic conductive film.

[0024]

The present invention will be described in detail below with reference to the embodiments shown in the drawings. FIG. 1 is a cross-sectional view of a panel and a flexible substrate that realize the panel mounting structure of this embodiment. 2 is an enlarged cross-sectional view taken along the line BB in FIG.

In FIG. 1, the glass substrate 1 of the panel 11
2 and the panel electrode terminal 13 formed on the drive IC 1
The connection with the first electrode terminal 16 formed on the flexible substrate 15 on which 4 is mounted is performed via the anisotropic conductive film 17. Further, the second electrode terminal 18 formed on the flexible substrate 15 and the electrode terminal 20 on the wiring substrate 19 are also connected via the anisotropic conductive film 21, and the wiring substrate 19 side is used for driving on the flexible substrate 15. A signal can be supplied to the IC 14.

Here, the electrode terminals 16 on the flexible substrate 15 are formed by being embedded in the flexible substrate 15 by pressure contact or the like. At that time, the electrode terminal 1
6 has a thickness h of 10 × 10 ⁻³ mm or less, and the electrode terminal 1
Height (projection amount) 6 at which 6 projects from the flexible substrate 15
Is in the range of 0 to 2 × 10 ⁻³ mm.

As described above, the structure in which the electrode terminal 16 is embedded in the flexible substrate 15 makes it possible to
The apparent thickness (that is, the amount of protrusion from the flexible substrate 15) e of the electrode terminal 16 can be reduced. Therefore, in inverse proportion to the decrease in the thickness e of the electrode terminal 16, the etching accuracy of the top surface 23 at the time of forming the electrode terminal 16 is improved. At that time, since the actual thickness h of the electrode terminal 16 is 10 × 10 ⁻³ mm or less, which is sufficient, the electrode terminal 16 can sufficiently withstand the stress when the driving IC 14 is mounted on the flexible substrate 15. Can be done.

Further, as described above, by reducing the protrusion amount e of the electrode terminal 16 of the flexible substrate 15, the space between the adjacent electrode terminals 16 and 16 is maintained in order to maintain reliable connection strength. The amount of resin to be filled can be reduced. As a result, the thickness f of the anisotropic conductive film 17 used when connecting with the panel 11 can be reduced.

Therefore, in the present embodiment, the diameter g of the conductive particles 22 in the anisotropic conductive film 17 is 1 to 3 × 10 ^-3.
mm, which is sufficiently smaller than the conventional one, and the ratio of the thickness f of the anisotropic conductive film 17 to the diameter g of the conductive particles 22 (g / f).
Is set to be approximately "1". Thus, the thickness f of the anisotropic conductive film 17 and the diameter g of the conductive particles 22 are
By setting the ratio (g / f) to approximately “1”, the resin portion of the anisotropic conductive film 17 moves in a direction orthogonal to the longitudinal direction of the electrode terminal 16 during thermocompression bonding. Is eliminated, and the movement of the conductive particles 22 associated therewith is eliminated. Therefore, the number of conductive particles 22 between the electrode terminal 16 on the side of the flexible substrate 15 and the panel electrode terminal 13 on the side of the panel 11 does not decrease when the thermocompression bonding is performed, and the number required for conduction is secured. Is done.

Since the conductive particles 22 do not flow into the space between the adjacent electrode terminals 16 and 16 on the flexible substrate 15 side, the adjacent electrode terminals 16 and 1
The cause of the leak between 6 can be picked up.

From the above, according to the present embodiment, 8 × 10 which is impossible with the conventional panel mounting structure.
It is possible to realize the connection between the panel having the electrode terminals with a fine pitch of ^-2 mm or less and the circuit board.

In this embodiment, the wiring board 1 and the second electrode terminals 18 formed on the flexible board 15 are formed.
It is also connected to the electrode terminal 20 on 9 via an anisotropic conductive film 21. Therefore, it is possible to connect the circuit board and the wiring board by means of electrode terminals having a fine pitch.

In the embodiment shown in FIG. 3, the protruding portions from the flexible substrate 15 in the electrode terminals 16 and 18 (only the electrode terminal 16 is shown in the drawing) embedded in the flexible substrate 15 are extremely A thin metal plating 25 of Sn, Ni, Au, solder or the like is applied. By doing so, the oxidation of the electrode terminals 16 and 18 can be prevented. The metal plating 25 applied to the electrode terminals 16 and 18 on the flexible substrate 15 corresponds to the electrode terminals 16 and 18.
Although it may be applied to the entire surface of the electrode 18 in the longitudinal direction, it may be applied only to the connection region C in the electrode terminals 16 and 18 and the region other than the connection region C is covered with the resist 30 as shown in FIG.

Further, the connecting portion of the driving IC 14 in the flexible substrate having the above-described structure may be of a type in which the window 31 is provided like the flexible substrate 15 shown in FIGS. 1 and 4, or the flexible portion shown in FIG. Board 3
It may be a type in which no window is provided as in the case of 2. In addition, as shown in FIGS. 6 and 7, the electrode terminals 16 and 18 formed on the flexible substrates 15 and 32, respectively.
At the connection point with the driving IC 14 in
Can also be formed.

In the embodiment shown in FIGS. 8 and 9 (a sectional view taken along the line DD in FIG. 8), the first and second electrode terminals 16 and 18 embedded in the flexible substrate 15 are provided.
The metal plating 25 and the metal plating 25 are formed on the upper surface of each of the electrodes (only the first electrode terminal 16 is shown in the drawing).
And an insulating film layer 34 having the same thickness as the above are alternately formed in the longitudinal direction. At that time, the adjacent first electrode terminals 16, 16
Alternatively, the positional relationship between the metal plating 25 and the insulating film layer 34 in the adjacent second electrode terminals 18 and 18 is reversed. That is, when the flexible substrate 15 is viewed from the electrode terminals 16 and 18, the metal plating 25 and the insulating film layer 34 have a checkered pattern. By doing so, the adjacent electrode terminals 1
Leakage due to the conductive particles 22 (see FIG. 9) of the anisotropic conductive film between 6, 16 or between the adjacent electrode terminals 18, 18 can be more reliably prevented.

In the embodiment shown in FIGS. 10 and 11 (enlarged perspective view of the flexible substrate 15 in FIG. 10), the first electrode terminal 16 embedded in the flexible substrate 15 and the panel electrode terminal 13 on the panel 11 side are embedded. Connection, connection between the second electrode terminal 18 embedded in the flexible substrate 15 and the electrode terminal 20 on the side of the wiring substrate 19, and the bump 33 and the electrode terminals 16 and 18 of the driving IC 14.
The connection with the drive IC connection terminals 35, 35 in FIG. By doing so, the connection between the first electrode terminal 16 and the panel electrode terminal 13, the connection between the second electrode terminal 18 and the electrode terminal 20, the bumps 33, 33 of the driving IC 14 and the driving IC
The connection with the connection terminals 35, 35 can be performed in one step, and the number of processing steps can be reduced.

In the above embodiments, the electrode terminal 1 is used.
The apparent thickness (projection amount) of 6,18 is 0 to 2 × 10 ^-3 m
Although the range is set to m, the above effect can be sufficiently obtained if the range is 1 × 10 ⁻² mm or less. Further, in each of the above-described embodiments, the first and second electrode terminals 16 and 18 on the flexible substrate 15 are formed by being embedded in the flexible substrate 15 by pressure contact or the like. However, the present invention is not limited to this,
An insulating film may be filled between the electrode terminals 16 and 16 of the electrode terminals 16 and 18 formed on the substrate material of the flexible substrate 15 or between the electrode terminals 18 and 18. The point is that each of the electrode terminals 16 and 18 may be projected from the flexible substrate 15 within a range of 1 × 10 ^-2 mm or less.

[0038]

As is apparent from the above, the panel mounting structure of the invention according to claim 1 is provided on a flexible substrate on which a driving IC for driving the panel is mounted and is connected to the driving IC. Since the protruding amount from the substrate material of the connected connection terminal is set to 1 × 10 ^-2 mm or less, the thickness of the connection terminal should be significantly thinner than the conventional thickness to improve the etching accuracy of the top surface. You can Therefore, highly reliable bonding can be performed.

Further, since the thickness of the anisotropic conductive film used for connecting the connection terminal of the panel and the connection terminal on the flexible substrate is set to be substantially equal to the outer diameter of the conductive particles, the above-mentioned is used for thermocompression bonding. The conductive particles in the anisotropic conductive film do not flow. Therefore, the number of conductive particles existing between the connection terminals on the panel side and the connection terminals on the flexible board side can be secured as many as necessary for conduction, and in the space portion between the connection terminals adjacent to each other on the flexible board side. It is possible to prevent the conductive particles from flowing and leaking. That is, according to the present invention, it is possible to provide a panel mounting structure capable of highly reliable bonding even with fine pitch electrode terminals.

According to a second aspect of the present invention, there is provided a panel mounting structure, wherein the panel mounting structure is connected to a driving IC for driving the panel mounted on a flexible substrate and is connected to a connection terminal of the panel. The protrusion amount from the substrate material in the second connection terminal connected to the connection terminal and the connection terminal of the wiring board is set to 1 × 10 ⁻² mm or less, and the thickness of the anisotropic conductive film used for each connection described above. Is set to be substantially equal to the outer diameter of the conductive particles, so that highly reliable bonding is possible even with fine pitch electrode terminals when connecting the panel and the flexible board and connecting the flexible board and the wiring board. Become.

According to a third aspect of the present invention, there is provided a panel mounting structure in which each connection terminal formed on the flexible board is formed by embedding it in a board material so that an upper surface of the connection terminal and a surface of the board material are formed. Since they are parallel to each other, the protrusion amount from the substrate material can be set to 1 × 10 ⁻² mm or less without reducing the actual thickness of the connection terminal on the flexible substrate. Therefore, according to the present invention, each connecting terminal on the flexible board can have a significantly smaller amount of protrusion from the board material while maintaining rigidity, and stress or the like when connecting the driving IC to the connecting terminal can be reduced. Will not damage the connection terminals.

According to a fourth aspect of the present invention, there is provided a panel mounting structure, wherein each connection terminal formed on the flexible substrate is formed by filling an insulating film between the connection terminals on the substrate material.
Since the upper surface of the connection terminal and the surface of the board material are parallel to each other, the amount of protrusion from the board material is set to 1 × 10 ^-2 mm or less without reducing the actual thickness of the connection terminal on the flexible board. The connection terminals can be easily formed.

Further, in the panel mounting structure of the invention according to claims 5 to 7, since the connection terminals on the flexible substrate are plated with metal, oxidation of the connection terminals on the flexible substrate can be prevented. . Therefore, according to the present invention, it is possible to perform the bonding with higher reliability.

Further, in the panel mounting structure according to the eighth aspect of the present invention, metal plating and an insulating film having the same thickness as the metal plating are alternately formed on one connection terminal on the flexible substrate, and , The metal plating region and the insulating film region are arranged such that the positional relationship between the metal plating region and the insulating film region is reversed between adjacent connection terminals so that the metal plating region and the insulating film region have a checkered pattern. Therefore, in the connection terminals adjacent to each other, the metal plating region and the insulating film region are adjacent to each other. Therefore, according to the present invention, it is possible to more surely prevent the leak due to the conductive particles of the anisotropic conductive film between the adjacent connection terminals on the flexible substrate.

According to a ninth aspect of the present invention, there is provided a panel mounting structure, wherein the first connecting terminal on the flexible substrate is connected to the connecting terminal on the panel, and the first connecting terminal on the flexible substrate is connected. Connection with the first connection terminal of the driving integrated circuit, connection between the second connection terminal on the flexible board and the connection terminal on the wiring board, and second connection terminal on the flexible board Since the connection with the second connection terminal of the driving integrated circuit is made through the same anisotropic conductive film, the respective connections are simultaneously connected in one step. Therefore, according to the present invention, it is possible to provide a panel mounting structure in which the number of processing steps can be reduced and the processing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a panel and a flexible substrate that realize a panel mounting structure of the present invention.

FIG. 2 is an enlarged cross-sectional view taken along the line BB in FIG.

FIG. 3 is a cross-sectional view of a flexible substrate different from that in FIG.

FIG. 4 is a cross-sectional view of a panel and a flexible substrate different from FIG.

FIG. 5 is a cross-sectional view of a flexible substrate different from FIGS. 1 and 4.

FIG. 6 is an explanatory diagram when bumps are provided on electrode terminals on a flexible substrate.

7 is a cross-sectional view of the flexible substrate shown in FIG.

FIG. 8 is a partial perspective view of a flexible substrate in which metal plating and an insulating film are formed in a checkered pattern on electrode terminals arranged in parallel.

9 is an enlarged cross-sectional view taken along the line DD of FIG.

FIG. 10 is a cross-sectional view of a panel and a flexible substrate different from those in FIGS. 1, 4, 5, and 7.

11 is a perspective view of the flexible substrate in FIG.

FIG. 12 is a cross-sectional view of a panel and a flexible substrate in a conventional panel mounting structure.

13 is an enlarged cross-sectional view taken along the line AA in FIG.

[Explanation of reference numerals] 11 ... Panel, 12 ... Glass substrate, 13 ... Panel electrode terminal, 14 ... Driving IC, 15, 32 ... Flexible substrate, 16 ... First
Electrode terminals, 17, 21, 36 ... Anisotropic conductive film, 18
... second electrode terminal, 19 ... wiring board,
22 ... Conductive particles, 25 ... Metal plating,
33 ... Bump, 34 ... Insulating film,
35 ... Connection terminal for drive IC.

Claims (9)

[Claims] 1. A connection terminal formed on a flexible substrate on which a connection terminal formed on a peripheral portion of one side of a panel and a drive integrated circuit for driving the panel are mounted and connected to the drive integrated circuit. In a mounting structure of a panel in which and are connected via an anisotropic conductive film, the amount of protrusion of the connection terminal on the flexible substrate from the substrate material is set to 1 × 10 ⁻² mm or less, and The mounting structure of a panel, wherein the film thickness of the conductive conductive film is set to be substantially equal to the outer diameter of the conductive particles contained therein. 2. A connection terminal formed on the peripheral portion of one side of a panel and a flexible substrate on which a driving integrated circuit for driving the panel is mounted, and connected to the driving integrated circuit. The second connecting terminal connected to the first connecting terminal via the anisotropic conductive film, and further connected to the driving integrated circuit on the flexible substrate and the driving integrated circuit from the outside. In the mounting structure of the panel in which the connection terminals of the wiring board that transmits the signal are connected through the anisotropic conductive film, the amount of protrusion from the board material in each connection terminal formed on the flexible board is 1 ×. It is set to 10 ⁻² mm or less, and the thickness of the anisotropic conductive film used for connecting the connection terminals is set to be substantially equal to the outer diameter of the conductive particles contained therein. Of the panel Instrumentation structure. 3. The panel mounting structure according to claim 1 or 2, wherein each connection terminal formed on the flexible substrate is formed by being embedded in a substrate material, and the upper surface of the connection terminal is formed. A panel mounting structure characterized in that the surface of the substrate material is parallel. 4. The panel mounting structure according to claim 1, wherein each connection terminal formed on the flexible substrate is filled with an insulating film between the connection terminals on the substrate material. A panel mounting structure, wherein only the portion is formed to project, and the upper surface of the connection terminal is parallel to the surface of the substrate material. 5. The panel mounting structure according to claim 1, wherein the connecting terminals on the flexible substrate are plated with metal. Construction. 6. The panel mounting structure according to claim 5, wherein the metal plating for the connection terminals on the flexible substrate is applied to all the portions of the connection terminals that project on the substrate material. A panel mounting structure characterized by the above. 7. The panel mounting structure according to claim 5, wherein the metal plating on the connection terminals on the flexible substrate is performed by the first connection terminals on the panel side and the second connection terminals on the wiring board side. Is applied only to a region connected to at least one of the connection terminals, and a region not connected to the first connection terminal on the panel side and the second connection terminal on the wiring board side is covered with an insulating film. Characteristic panel mounting structure. 8. The panel mounting structure according to claim 5, wherein the metal plating on the connection terminal on the flexible substrate is the same as the metal plating on one connection terminal. The flexible film is formed by alternately forming a thick insulating film in the longitudinal direction, and between the adjoining connection terminals, the metal plating region and the insulating film region have a reverse positional relationship. A mounting structure for a panel, wherein the metal plating region and the insulating film region of a plurality of connection terminals arranged in parallel on a substrate form a checkerboard pattern. 9. The mounting structure for a panel according to claim 2, wherein the connection between the first connection terminal on the flexible substrate and the connection terminal on the panel, Connection between the first connection terminal on the flexible board and the first connection terminal of the driving integrated circuit, connection between the second connection terminal on the flexible board and the connection terminal on the wiring board ,and,
The connection between the second connection terminal on the flexible substrate and the second connection terminal of the driving integrated circuit is performed via the same anisotropic conductive film. Mounting structure.