JPH07171765A - Grinding solution filling auxiliary tool and grinding solution filling method - Google Patents

Grinding solution filling auxiliary tool and grinding solution filling method

Info

Publication number
JPH07171765A
JPH07171765A JP31823793A JP31823793A JPH07171765A JP H07171765 A JPH07171765 A JP H07171765A JP 31823793 A JP31823793 A JP 31823793A JP 31823793 A JP31823793 A JP 31823793A JP H07171765 A JPH07171765 A JP H07171765A
Authority
JP
Japan
Prior art keywords
grinding
outer peripheral
grindstone
grinding fluid
grinding solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31823793A
Other languages
Japanese (ja)
Inventor
Yasuhiro Fujiwara
康弘 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP31823793A priority Critical patent/JPH07171765A/en
Publication of JPH07171765A publication Critical patent/JPH07171765A/en
Pending legal-status Critical Current

Links

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Magnetic Heads (AREA)

Abstract

PURPOSE:To machine a section to a high-precision flatness by feeding a grinding solution efficiently to a grinding point in the cutting and recessing of hard-to-cut material such as ceramics by a peripheral cutting edge type grinder. CONSTITUTION:A grinding solution filling auxiliary tool 3 with a decompression part 6 is provided in the vicinity of a peripheral cutting edge type grinding wheel 1 in such a way as to insert the peripheral cutting edge type grinding wheel 1 therein, and a grinding solution is filled from a grinding solution lead-in part 7 through the decompression part 6. The grinding solution can be thereby fed efficiently being hardly impeded by an air layer 8 of positive pressure near the peripheral cutting edge type grinding wheel 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、コンピューター用外部
記憶装置、主に固定型磁気ディスク装置に用いられる磁
気ヘッドの切断・溝入れ等研削加工あるいはセラミック
ス等の難削材の切断・溝入れ等研削加工等に用いられる
研削液注入補助具及び研削液注液方法に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an external storage device for a computer, a grinding process such as cutting and grooving of a magnetic head used mainly in a fixed magnetic disk device, or a cutting and grooving process of difficult-to-cut materials such as ceramics. The present invention relates to a grinding fluid injection aid used for grinding and the like and a grinding fluid injection method.

【0002】[0002]

【従来の技術】以下、薄膜磁気ヘッドの加工を例に説明
する。
2. Description of the Related Art Processing of a thin film magnetic head will be described below as an example.

【0003】近年、コンピューター用外部記憶装置であ
る磁気ディスク装置における高記録密度化対応の為、薄
膜磁気ヘッドの使用が益々増加している。これに伴い高
精度加工技術の開発も急務となっている。
In recent years, the use of thin film magnetic heads has been increasing more and more in order to cope with higher recording density in magnetic disk devices which are external storage devices for computers. Along with this, the development of high-precision machining technology has become an urgent task.

【0004】図3に薄膜磁気ヘッドの斜視図を示す。ま
た、図4に図3のA−A断面を拡大して示す。このよう
な薄膜磁気ヘッドの製造は、基板9上に複数個の薄膜磁
気ヘッド素子部10を形成した後、数個の素子単位のブ
ロックに外周刃砥石を用い切断する。その後、空気浮動
面11を研磨加工し、これを個々の薄膜磁気ヘッドに切
断する事によって行われる。
FIG. 3 shows a perspective view of a thin film magnetic head. Further, FIG. 4 shows an enlarged cross section taken along the line AA of FIG. In the manufacture of such a thin film magnetic head, a plurality of thin film magnetic head element portions 10 are formed on a substrate 9, and then a plurality of element unit blocks are cut using an outer peripheral grindstone. After that, the air floating surface 11 is polished, and this is cut into individual thin film magnetic heads.

【0005】このような、薄膜磁気ヘッドの製造におい
て特に高精度加工を要する部分は、図4に示すギャップ
デプス寸法12である。
In the production of such a thin film magnetic head, the portion which requires particularly high precision processing is the gap depth dimension 12 shown in FIG.

【0006】このギャップデプス寸法12は、空気浮動
面11の研磨加工により規制される。その具体例を図5
に示し説明する。図に示すように、複数個の素子を有す
るブロック14を高精度に加工された治具15に接着し
ブロックの空気浮動面11を加工する。
The gap depth dimension 12 is regulated by polishing the air floating surface 11. A specific example is shown in FIG.
Will be explained. As shown in the figure, a block 14 having a plurality of elements is adhered to a jig 15 which is processed with high precision, and the air floating surface 11 of the block is processed.

【0007】しかしながら、ブロック14の治具15へ
の接着面は、外周刃砥石1によりブロック14に切断す
る際のうねり等により平面度が悪く、接着を行った時、
結果的に治具15底面から図4に示すギャップデプスの
起点であるAPEX13までの距離16は、各々の素子
で異なってしまう。その為、高精度に加工が施されたと
しても、ブロック14内でそれぞれの素子のギャップデ
プス寸法12は、ばらつきを持ってしまう。この是正の
為には、ブロック切断における切断面平面度の向上が必
要であるが、外周刃による切断では、加工時の研削点に
供給される研削液量が重要であり、この不足により切断
面精度が悪化することもある。従来の技術では、研削液
の流量,流速を大きくする方法を用いていた。しかしな
がら、加工時に砥石は高速回転(例えば、10,000
〜20,000min-1)しておりその為、図6に示す
様に砥石近傍には正圧の空気層8が発生し、研削点2に
研削液を注入しようとしてもこの空気層に阻害されて十
分注液できないという問題を有していた。
However, the bonding surface of the block 14 to the jig 15 has a poor flatness due to the undulation when the outer peripheral blade grindstone 1 cuts the block 14, and when the bonding is performed,
As a result, the distance 16 from the bottom surface of the jig 15 to the APEX 13, which is the starting point of the gap depth shown in FIG. 4, is different for each element. Therefore, even if the processing is performed with high accuracy, the gap depth dimension 12 of each element in the block 14 has variations. To correct this, it is necessary to improve the flatness of the cutting surface in block cutting, but in cutting with the outer peripheral blade, the amount of grinding fluid supplied to the grinding point during processing is important, and due to this shortage, the cutting surface The accuracy may deteriorate. In the conventional technique, a method of increasing the flow rate and flow velocity of the grinding fluid was used. However, during processing, the grindstone rotates at high speed (for example, 10,000
~20,000min -1) to which Therefore, positive pressure of the air layer 8 is generated in the grinding wheel near as illustrated in FIG. 6, also inhibited the air layer in an attempt to inject a grinding fluid to the grinding point 2 However, there was a problem that it was not possible to inject the liquid sufficiently.

【0008】[0008]

【発明が解決しようとする課題】上記のように従来の薄
膜磁気ヘッドの加工では、充分な研削液が供給されない
為、外周刃砥石による切断加工時の切断面平面度悪化に
起因するブロックのうねりにより高精度加工が難しく、
ブロック内のヘッド素子のギャップデプス寸法がばらつ
くという問題点があった。
As described above, in the conventional processing of the thin film magnetic head, since the sufficient grinding liquid is not supplied, the undulation of the block caused by the deterioration of the flatness of the cutting surface at the time of the cutting processing by the outer peripheral blade grindstone. High precision machining is difficult due to
There is a problem that the gap depth size of the head element in the block varies.

【0009】本発明は、上記問題点を解決するもので、
切断面の平面度を良好に切断加工できることを目的とし
ている。
The present invention solves the above problems.
The purpose is to be able to cut the flatness of the cut surface well.

【0010】[0010]

【課題を解決するための手段】上記目的を解決する為
に、本発明では、外周刃式研削盤の外周刃砥石近傍に研
削液注液の為の補助具を設け研削点に効率良く注液する
ことにより切断面平面度を向上させようとするものであ
る。
In order to solve the above-mentioned object, in the present invention, an auxiliary tool for pouring a grinding fluid is provided in the vicinity of an outer peripheral edge grinding wheel of an outer peripheral edge type grinding machine to efficiently inject a grinding point. By doing so, it is intended to improve the flatness of the cut surface.

【0011】[0011]

【作用】本発明によれば、切断面を平面度良く切断加工
できる為、薄膜磁気ヘッドの加工に応用すれば、ブロッ
ク切断面を平面度良く加工できる為、精度よくブロック
の位置規制ができ、ブロック内全ての素子のギャップデ
プス寸法をばらつきなく高精度に規制できる。
According to the present invention, since the cut surface can be cut with good flatness, if applied to the processing of a thin film magnetic head, the block cut surface can be processed with good flatness, so that the position of the block can be accurately regulated. The gap depth dimensions of all the elements in the block can be regulated with high accuracy.

【0012】[0012]

【実施例】以下に本発明の一実施例を示す。EXAMPLE An example of the present invention will be described below.

【0013】図1は、本発明の一実施例を示す概略図で
ある。これは、外周刃砥石1の近傍の研削点2付近に研
削液注入補助具3を配置している。この研削液注入補助
具3の概略図を図2に示すが、図に示す通り研削液注入
補助具3は、空気流入部4,空気圧縮部5,減圧部6に
研削液を導入する研削液導入部7により構成されてい
る。
FIG. 1 is a schematic view showing an embodiment of the present invention. In this, a grinding fluid injection assisting tool 3 is arranged in the vicinity of a grinding point 2 in the vicinity of the outer peripheral blade grindstone 1. A schematic diagram of the grinding fluid injection assisting tool 3 is shown in FIG. 2. As shown in the figure, the grinding fluid injection assisting tool 3 introduces the grinding fluid into the air inflow section 4, the air compression section 5, and the decompression section 6. It is configured by the introduction unit 7.

【0014】以上のように構成した本実施例の作用につ
いて、以下図1,図2を用いて説明する。まず図1,図
2に示す通り外周刃砥石1近傍をはさむ様に研削液注入
補助具3を配置する。外周刃砥石1の高速回転(10,
000〜20,000min -1)により発生する正圧の
空気層8は外周刃砥石1の回転に伴って研削液注入補助
具3の空気流入部4に衝突する。この時、空気層8の大
部分は外周刃砥石1近傍よりひきはがされる。また、残
りの空気層8は、空気流入部4より流入する。この空気
層8は空気圧縮部5で圧縮されその後、減圧部6で開放
される為、減圧されるこの減圧部6に研削液導入部7よ
り研削液を注入すれば研削液は、空気層8の大部分が外
周刃砥石1近傍よりひきはがされていることと、残りの
空気層8も減圧部6により減圧されている為に、空気層
8にあまり阻害されることなく研削点2に効率よく到達
することができる。この時、空気流入部4,空気圧縮部
5,減圧部6は、図2に示すように配置し、空気圧縮部
5の外周刃砥石1との隙間は、空気流入部4,減圧部6
の隙間よりも充分小さくし、かつ減圧部6における隙間
は、空気流入部4の隙間よりも大きくすることが必要で
ある。また、これらは面粗さを小さく段差等の無い一体
物で製作されることが好ましく、外周刃砥石1等の運動
物の外部例えば、砥石軸ハウジングより強固に固定する
ことにより所定の効果が得られる。
The operation of this embodiment constructed as described above will be described.
Therefore, description will be made below with reference to FIGS. First, Figure 1 and Figure
As shown in 2, inject grinding fluid so as to pinch the periphery of the grinding wheel 1
The auxiliary tool 3 is arranged. High-speed rotation of the peripheral edge grinding wheel 1 (10,
000 to 20,000 min -1) Of the positive pressure
The air layer 8 assists the injection of grinding fluid as the outer peripheral blade 1 rotates.
It collides with the air inflow part 4 of the tool 3. At this time, the air layer 8
The part is peeled off from the vicinity of the outer peripheral blade grindstone 1. Also, the rest
The further air layer 8 flows in from the air inflow part 4. This air
Layer 8 is compressed in air compression section 5 and then opened in decompression section 6.
Therefore, the grinding fluid introducing section 7 is connected to the depressurizing section 6 which is depressurized.
If the grinding fluid is injected, most of the air layer 8 will be
Being peeled from the vicinity of the peripheral whetstone 1 and the remaining
Since the air layer 8 is also decompressed by the decompression unit 6, the air layer
Efficiently reach the grinding point 2 without being disturbed by 8
can do. At this time, the air inflow part 4, the air compression part
The decompression unit 6 and the decompression unit 6 are arranged as shown in FIG.
The gap between the outer peripheral edge grinding wheel 1 and the outer peripheral blade 5 is the air inflow part 4, the pressure reducing part 6
Gap that is sufficiently smaller than the gap of
Needs to be larger than the gap of the air inflow part 4.
is there. In addition, these have a small surface roughness and are integrated without steps.
It is preferable to manufacture it with a thing, and the movement of the outer peripheral blade grindstone 1 etc.
External to the object, for example, fixed more firmly than the grindstone shaft housing
As a result, a predetermined effect can be obtained.

【0015】本発明の応用例を説明すると、例えば、薄
膜磁気ヘッドの加工においては、薄膜ヘッド基板の切断
の際、外周刃砥石1の板厚が例えば、0.5mm以下で
あるのに対し切断深さは、3mm以上であり、かつ外周
刃砥石1が高速回転している為、基板9内部にある研削
点2に到達する研削液量は、正圧の空気層8等に阻害さ
れ研削液供給量に対し非常に少なくその為に、外周刃砥
石1の目詰まり、目こぼれ等研削性の劣化をまねき切断
面平面度等切断面精度悪化や研削熱の発生による切断面
の変質の原因となっているが本実施例によれば研削点ま
で効率良く研削液を供給できる為、切断面精度の悪化や
切断面の変質を防止できる。
Explaining an application example of the present invention, for example, in the processing of a thin film magnetic head, when the thin film head substrate is cut, the peripheral edge grindstone 1 has a plate thickness of, for example, 0.5 mm or less. Since the depth is 3 mm or more and the outer peripheral blade grindstone 1 is rotating at a high speed, the amount of the grinding liquid reaching the grinding point 2 inside the substrate 9 is obstructed by the positive pressure air layer 8 and the like. It is very small compared to the supply amount, so that it causes clogging of the outer peripheral edge grinding wheel 1, deterioration of grindability such as spillage, and causes deterioration of cutting surface accuracy such as cutting surface flatness and deterioration of cutting surface due to generation of grinding heat. However, according to the present embodiment, since the grinding liquid can be efficiently supplied up to the grinding point, it is possible to prevent deterioration of the cutting surface accuracy and deterioration of the cutting surface.

【0016】本実施例では薄膜磁気ヘッド加工を例に説
明したが、薄刃の外周刃砥石1を高速回転で使用してい
る、セラミックス等の難削材の切断あるいは溝加工ある
いは、外周刃砥石1により平面を研削する場合において
も適応が可能である。
In the present embodiment, the thin film magnetic head processing has been described as an example. However, when the thin blade outer peripheral blade grindstone 1 is used at high speed, cutting or grooving of a difficult-to-cut material such as ceramics or the outer peripheral blade grindstone 1 is performed. It is possible to adapt even when grinding a flat surface.

【0017】[0017]

【発明の効果】本発明によれば、難削材の切断加工にお
いて砥石の研削性の劣化を防止し切断面の平面度を高精
度に加工できる。また、研削面の研削熱等に起因する加
工変質層も少なくすることが期待できる。本発明を磁気
ヘッドの加工に応用すれば、例えば薄膜磁気ヘッド等の
ギャップデプス寸法を、ばらつきを少なく高精度に規制
できる。
According to the present invention, it is possible to prevent the grindability of the grindstone from deteriorating in the cutting process of the difficult-to-cut material and process the flatness of the cut surface with high accuracy. In addition, it can be expected that the work-affected layer caused by the grinding heat of the ground surface and the like can be reduced. By applying the present invention to the processing of a magnetic head, for example, the gap depth dimension of a thin film magnetic head or the like can be regulated with high accuracy and with little variation.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例における研削液注入補助具を
示す概略図
FIG. 1 is a schematic view showing a grinding fluid injection assisting tool according to an embodiment of the present invention.

【図2】本発明の一実施例における研削液注入補助具を
示す断面図
FIG. 2 is a sectional view showing a grinding fluid injection assisting tool according to an embodiment of the present invention.

【図3】薄膜磁気ヘッドを示す斜視図FIG. 3 is a perspective view showing a thin film magnetic head.

【図4】薄膜磁気ヘッドのA−A断面拡大図FIG. 4 is an enlarged cross-sectional view taken along the line AA of the thin film magnetic head.

【図5】薄膜磁気ヘッドの一加工方法の斜視図FIG. 5 is a perspective view of a method of processing a thin film magnetic head.

【図6】従来の研削液注入方法の概略図FIG. 6 is a schematic view of a conventional grinding fluid injection method.

【符号の説明】[Explanation of symbols]

1 外周刃砥石 2 研削点 3 研削液注入補助具 4 空気流入部 5 空気圧縮部 6 減圧部 7 研削液導入部 8 空気層 9 基板 10 薄膜磁気ヘッド素子部 11 空気浮動面 12 ギャップデプス寸法 13 APEX 14 ブロック 15 治具 16 距離 DESCRIPTION OF SYMBOLS 1 Peripheral blade grindstone 2 Grinding point 3 Grinding liquid injection aid 4 Air inflow part 5 Air compression part 6 Decompression part 7 Grinding liquid introduction part 8 Air layer 9 Substrate 10 Thin film magnetic head element part 11 Air floating surface 12 Gap depth dimension 13 APEX 14 blocks 15 jigs 16 distances

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】外周刃砥石を用い切断・溝入れを行う加工
に於いて、その外周刃砥石近傍に砥石を挟み込むように
設置される研削液注入補助具であって、外周刃砥石に発
生する空気を流入させる流入部と、前記流入部に入って
きた空気を前記外周刃砥石との間で加圧する加圧部と、
前記加圧部で加圧された空気を前記外周刃砥石との間で
減圧する減圧部と、前記減圧部に研削液を供給する供給
口とを備えた研削液注入補助具。
1. A grinding fluid injection assisting tool, which is installed in such a manner that a grindstone is sandwiched in the vicinity of a peripheral edge grindstone in a process of cutting and grooving using the outer peripheral edge grindstone, which occurs in the outer peripheral edge grindstone. An inflow part for inflowing air, and a pressurizing part for pressurizing the air entering the inflow part between the outer peripheral blade grindstone,
A grinding fluid injection assisting tool, comprising: a decompression section for decompressing the air pressurized by the pressure section with the outer peripheral blade grindstone, and a supply port for supplying a grinding fluid to the decompression section.
【請求項2】外周刃砥石近傍に発生する正圧の空気流を
圧縮、解放することによって減圧して、その減圧部に研
削液を注液することを特徴とする研削液注液方法。
2. A grinding fluid pouring method, characterized in that a positive pressure air flow generated in the vicinity of the outer peripheral blade grindstone is compressed and released to reduce the pressure and pouring the grinding fluid into the depressurized portion.
JP31823793A 1993-12-17 1993-12-17 Grinding solution filling auxiliary tool and grinding solution filling method Pending JPH07171765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31823793A JPH07171765A (en) 1993-12-17 1993-12-17 Grinding solution filling auxiliary tool and grinding solution filling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31823793A JPH07171765A (en) 1993-12-17 1993-12-17 Grinding solution filling auxiliary tool and grinding solution filling method

Publications (1)

Publication Number Publication Date
JPH07171765A true JPH07171765A (en) 1995-07-11

Family

ID=18096963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31823793A Pending JPH07171765A (en) 1993-12-17 1993-12-17 Grinding solution filling auxiliary tool and grinding solution filling method

Country Status (1)

Country Link
JP (1) JPH07171765A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2189245A2 (en) 2008-11-05 2010-05-26 Shin-Etsu Chemical Co., Ltd. Methods and apparatus for multiple cutoff machining of rare earth magnet blocks
EP2397254A1 (en) 2010-06-16 2011-12-21 Shin-Etsu Chemical Co., Ltd. Method for multiple cutoff machining of rare earth magnet

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2189245A2 (en) 2008-11-05 2010-05-26 Shin-Etsu Chemical Co., Ltd. Methods and apparatus for multiple cutoff machining of rare earth magnet blocks
US8568203B2 (en) 2008-11-05 2013-10-29 Shin-Etsu Chemical Co., Ltd. Method and apparatus for multiple cutoff machining of rare earth magnet block, cutting fluid feed nozzle, and magnet block securing jig
US8567383B2 (en) 2008-11-05 2013-10-29 Shin-Etsu Chemical Co., Ltd. Method and apparatus for multiple cutoff machining of rare earth magnet block, cutting fluid feed nozzle, and magnet block securing jig
US8753174B2 (en) 2008-11-05 2014-06-17 Shin-Etsu Chemical Co., Ltd. Method and apparatus for multiple cutoff machining of rare earth magnet block, cutting fluid feed nozzle, and magnet block securing jig
US9314892B2 (en) 2008-11-05 2016-04-19 Shin-Etsu Chemical Co., Ltd. Method and apparatus for multiple cutoff machining of rare earth magnet block, cutting fluid feed nozzle, and magnet block securing jig
EP2397254A1 (en) 2010-06-16 2011-12-21 Shin-Etsu Chemical Co., Ltd. Method for multiple cutoff machining of rare earth magnet
US10391602B2 (en) 2010-06-16 2019-08-27 Shin-Etsu Chemical Co., Ltd. Method for multiple cutoff machining of rare earth magnet

Similar Documents

Publication Publication Date Title
JP4079152B2 (en) How to make a donut glass substrate
JPH0516070A (en) Diamond grinding wheel, method and device for truing diamond grinding wheel and grinding-finished magnetic head
EP0868974A2 (en) Grinding method, surface grinder, work piece support mechanism, and work rest
US6398623B1 (en) Processing method of device and processing method of slider
JP2007152440A (en) Method for machining hard and brittle material
JPH07171765A (en) Grinding solution filling auxiliary tool and grinding solution filling method
JP5006011B2 (en) Manufacturing method of disk-shaped substrate
GB2025800A (en) Magnetic transducing core and method of forming the same
JP2001018164A (en) Pad with hard foam resin groove for working semiconductor device and tool for turning grooving of this pad
JP4123631B2 (en) How to make a glass substrate
US5681216A (en) High precision polishing tool
JPS63306864A (en) Method of grinding cutting tool for separating disk from rod-shaped or block-shaped work and separation method
JPH1133918A (en) Grinding wheel for working inside and outside diameter of substrate for magnetic recording medium, and method for working inside and outside diameter
JP2946554B2 (en) Grinding cutting method
JPS61114813A (en) Cutting method
JPH10217076A (en) Work method of disk substrate, work device and outer peripheral blade grinding wheel used in this work method
JP4526027B2 (en) Dressing device, grinding device, dressing method, and numerical control program
JPH11123365A (en) Ultrasonic vibrating combined processing tool
JP2762200B2 (en) Wafer Chamfer Polishing Buff Form Grooving Machine
JP2556694Y2 (en) Thin blade whetstone for magnetic head processing
JPH0592365A (en) Method of correcting ultra abrasive grain grinding wheel
JP3265963B2 (en) Wafer mirror chamfering device
JP5199542B2 (en) Manufacturing method of slider
JP2001273629A (en) Magnetic tape, and method and device for cutting the same
JPH10109242A (en) Chuck table