JPH07170077A - Manufacture of injection-molded circuit part - Google Patents

Abstract

PURPOSE:To enhance a circuit part in wiring density by a method wherein a positioning hole provided with a part of a conductor circuit on its inner surface is so provided to each of injection-molded circuit members possessed of conductor circuits as to be arranged in a line when the circuit members are laminated, a spacing projection and a projection receiving recess are provided to the circuit member, and the circuit members are laminated to constitute multilayered conductor circuits. CONSTITUTION:Positioning holes 10 provided with parts of conductor circuits 5, 6, 7, and 8 on their inner surfaces are so provided to injection-molded circuit members 1, 2, 3, and 4 possessed of conductor circuits 5, 6, 7, and 8 as to be arranged in a line when the circuit members 1, 2, 3, and 4 are laminated. Furthermore, spacing projections 11 and/or projection receiving recesses 12 are provided to the circuit member 1, 2, 3, and 4 respectively so as to provide a prescribed gap between the injection-molded circuit members 1, 2, 3, and 4 respectively. The circuit member 1, 2, 3, and 4 are laminated together making the spacing projections 11 be fitted into the recesses 12 and set in a molding die 13, and the positioning holes 10 are fixed by a positioning pin 14 provided inside the molding die 13. After the setting is finished, gaps 15, 16, and 17 provided between the circuits 1 to 4 are filled with resin by injection. Thus the conductor circuit 5 to 8 provided to both the sides of the circuit members 1 to 4 are electrically connected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing injection molded circuit parts, and more particularly to a method for manufacturing multi-layered injection molded circuit parts.

[0002]

2. Description of the Related Art In a conventional injection molded circuit component, as shown in FIG. 11, an electric conductor circuit 32 is provided on both surfaces of an injection molded product 31 having a through hole 30 and an electric conductor film is formed on the inner surface of the through hole 30. Then, the electric conductor circuits 32 on both sides are electrically connected.

[0003]

By the way, in the injection-molded circuit component, it is only possible to provide electric conductor circuits on both sides of the injection-molded article and electrically connect the electric conductor circuits on both sides by the through holes. Since there is no wiring, the density of the wiring is limited to both sides of the injection-molded product, and the density cannot be further increased.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems of the prior art and to provide a novel method for producing an injection-molded circuit component in which the electric conductor circuit is multi-layered and the wiring density can be increased.

[0005]

In order to achieve the above-mentioned object, a method of manufacturing an injection molded circuit component according to the present invention comprises laminating a plurality of injection molded circuit members having an electric conductor circuit on the surface thereof. At this time, a spacing projection and this spacing projection are formed so as to form a positioning hole linearly arranged and a part of the electric conductor circuit is formed on the inner surface and to form a predetermined gap between the circuit members. To form a spacing projection receiving hole, stack these injection molded circuit members, insert positioning pins into these positioning holes, and fill and solidify the resin between the circuit members to form the circuit members. Then, an electric conductor coating is formed on the inner surface of the through hole formed by the positioning pins to form the electric conductor circuit formed on the surface of each injection molded circuit member. It is obtained mutually electrically connected (claim 1).

Further, it is preferable that a part of the electric conductor circuit formed on the surface of the injection molded circuit member is formed in the spacing projection and the spacing projection receiving hole (claim 2). Furthermore, it is preferable to provide a crack along the direction of the protrusion at the tip of the spacing protrusion (claim 3). Furthermore, it is preferable that the spacing projection receiving hole includes a receiving seat for receiving the tip of the spacing projection and a through hole having a diameter smaller than that of the receiving seat (claim 4). Further, the electric conductor circuits are provided on both surfaces of the injection molded circuit member, and the injection molded circuit member has
It is preferable to provide a through hole having an electric conductor coating for electrically connecting the electric conductor circuits on both surfaces to the inner surface (claim 5).

As a method for forming an injection-molded circuit member, (a) a resin (blended resin) containing a catalyst for electroless plating is first injection-molded, and then an electric conductor circuit is formed on the resin. Secondary injection molding of a resin (non-blended resin) that does not contain the electroless plating catalyst so as to expose the pattern, and then the exposed resin (blended resin)
To form an electric conductor circuit on the surface of the electroless plating method, (b) After the primary injection molding of the non-compounded resin, the secondary injection molding of the compounded resin to form the pattern for forming the electrical conductor circuit Then, a method of forming an electric conductor circuit on the surface of the compounded resin by electroless plating, (c)
An electric conductor coating is formed on the surface of a resin injection-molded product, a resist film is formed on the portion of the electric conductor coating that remains as an electric conductor circuit, and then the electric conductor coating on the portion where the resist film is not present is chemically removed. The method of forming an electric conductor circuit by (d) applying a photosensitive catalyst for electroless plating on the surface of an injection-molded product of resin, irradiating only the pattern portion for forming an electric conductor circuit with light, and leaving the remainder. There is a method of forming an electric conductor circuit by an electroless plating method after washing the photosensitive catalyst in the part of (1), but the method is not particularly limited thereto, and an injection molded circuit member can be formed by a wide range of methods. it can.

Injection molding, transfer molding, injection molding,
Although there are methods such as reaction injection molding, the method is not particularly limited to these and a wide range of methods can be applied.

As a base resin for injection molded circuit members,
In the case of the above methods (a) and (b), polysulfone, polyether sulfone, polyallyl sulfone, polyether imide, polyoxybenzoic acid type liquid crystal polymer, epoxy resin for injection molding and inorganic fillers for them are used as the compounding resin. However, the present invention is not limited to these. Examples of the non-blended resin include polyphenylene sulfide, polybutylene terephthalate, polyethylene terephthalate, and these blended with an inorganic filler, in addition to those in the same group as the blended resin, but are not particularly limited thereto. The mixed resin and the non-mixed resin may be the same, but it is preferable to use different kinds as much as possible. In the case of the above methods (C) and (d), as the base resin of the injection molded circuit member E, polysulfone, polyether sulfone, polyetherimide, polyoxybenzoic acid type liquid crystal polymer, injection molding epoxy resin and these In addition to those containing an inorganic filler, it is not particularly limited thereto. The above resin may be used alone, and inorganic powder, inorganic fiber or the like may be mixed and used as long as the electrical insulation property is maintained. Further, the plurality of injection-molded circuit members to be combined may have different shapes and may have different base resin materials as long as they satisfy the structural requirements.

[0010]

A plurality of injection-molded circuit members having an electric conductor circuit, a positioning hole, a spacing projection and a spacing projection receiving hole are laminated and a positioning pin is inserted into these positioning holes, and a resin is provided in a gap between these circuit members. Are filled and solidified to form a multi-layered circuit member, and then an electric conductor coating is formed on the inner surface of the through hole formed by the positioning pin to form an electric conductor circuit on the surface of each injection molded circuit member. By electrically connecting the two to each other, it is possible to form a multilayer injection-molded circuit component in which electric conductor circuits are connected to each other, and it is possible to increase the wiring density (claim 1).

Further, by forming a part of the electric conductor circuit in the spacing protrusion and the spacing protrusion receiving hole,
When these are fitted together, the electric conductor circuits of the respective injection molded circuit members are electrically connected, so that the electric conductor circuits of the respective injection molded circuit members can be electrically connected more reliably ( Claim 2).

Furthermore, by providing a crack at the tip of the spacing protrusion along the direction of the protrusion, the spring action due to the presence of the crack improves the fitability with the spacing protrusion receiving hole, and as a result, By thus forming a part of the electric conductor circuit in the spacing protrusion and the spacing protrusion receiving hole, the reliability of the electrical connection can be improved (claim 3).

Furthermore, the spacing projection receiving hole comprises a seat for receiving the tip of the spacing projection and a through hole. As described above, the spacing projection and the spacing projection receiving hole are provided with an electric conductor circuit. When a spacing projection and a spacing projection receiving hole are fitted together by forming a part of the above, the electric conductor circuit on one side of the injection molded circuit member on the side where the spacing projection exists is connected to the spacing projection receiving hole. It is possible to connect the electric conductor circuits on both surfaces of the existing injection-molded circuit member (claim 4).

Further, the electric conductor circuits are provided on both surfaces of the injection molded circuit member, and the injection molded circuit member is provided with a through hole having an electric conductor coating film electrically connecting the electric conductor circuits on both surfaces to the inner surface. Thus, when three or more injection-molded circuit members are multi-layered, if electric conductor circuits are provided on both surfaces of the injection-molded circuit member located in the middle and the inner surfaces are connected by through holes having an electric conductor coating, When the resin is filled, the resin flows through the through holes, which facilitates the filling. Further, after the resin is solidified, each injection molded circuit member can be fixed through the through hole (claim 5).

[0015]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

Example 1 First, four types of injection molded circuit members 1, 2, 3 and 4 shown in FIGS. 1 to 4 were formed. Polyethersulfone containing 20% by weight of glass fiber was used as the base resin, and 10% by weight of kaolin with 0.1% by weight of palladium adsorbed was used as the catalyst for electroless plating. The electric conductor circuits 5, 6, 7, and 8 were formed on both surfaces, respectively. An electroless copper plating film was used as the electric conductor, and the average film thickness was 0.025 mm. These injection molded circuit members 1, 2, 3 and 4 are formed with through holes 9 having an electric conductor coating film on their inner surfaces so as to electrically connect the electric conductor circuits 5, 6, 7 and 8 on both sides. .

The injection molded circuit members 1, 2, 3 and 4 are arranged linearly when they are stacked in the order shown in FIGS. 1, 2, 3 and 4 from above, and A positioning hole 10 is formed in which a part of the electric conductor circuit 5, 6, 7, 8 is formed on the inner surface. Further, the injection molded circuit members 1, 2, 3 and 4 each have a plurality of spacing protrusions so that a predetermined gap is formed between the circuit members 1, 2, 3 and 4 when these are laminated. 11 and / or a plurality of spacing projection receiving holes 12 are formed.
Specifically, a plurality of spacing protrusions 11 are provided at predetermined positions on the upper surfaces of the injection-molded circuit members (the circuit member having the circuit member on top when laminated). In addition, spacing protrusions 11 protruding from the circuit members 2, 3 and 4 located below are formed on the lower surfaces of the injection-molded circuit members (the circuit members having the circuit member below when laminated) 1, 2 and 3. Is provided with a plurality of spacing projection receiving holes 12, and when the circuit members 1, 2, 3 and 4 are stacked, the spacing projections 11 and the spacing projection receiving holes 12 are fitted and the circuit member 1, A predetermined gap is formed between 2, 3, 4.

Next, these injection molded circuit members 1, 2,
3, 4 are stacked from the top in the order shown in FIGS. 1, 2, 3, and 4, and the spacing protrusion 11 and the spacing protrusion receiving hole 12 are fitted together. This is a mold 1 as shown in FIG.
3 into the injection molded circuit members 1, 2, 3,
The positioning holes 10 of No. 4 are fixed and set by the positioning pins 14 installed in the mold 13. After setting, the gap 1 between the injection molded circuit members 1, 2, 3, 4 formed by the spacing protrusion 11 and the spacing protrusion receiving hole 12
5, 16 and 17 were filled with resin 20 (see FIG. 6) by an injection molding method. Glass fiber as the resin 20 to be filled
A 20% by weight polyoxybenzoic acid-based liquid crystal polymer was used. The three gaps between the injection molded circuit members are 0.45 ~
Within 0.5 mm. In this way, when three or more injection molded circuit members 1, 2, 3, 4 are laminated, the electric conductor circuits 6, 6 are formed on both surfaces of the injection molded circuit members 2, 3 located in the middle.
7 is provided and is connected by the through hole 9 having the electric conductor coating film on the inner surface thereof, so that when the resin 20 is filled, the through hole 9
The resin 20 flows through the resin, which facilitates filling. Further, after the resin 20 is solidified, the injection molded circuit members 1, 2, 3, 4 can be fixed in the through holes 9.

After releasing the mold, a resist other than the through hole formed by the positioning pin 14 was covered with a resist, and the polyoxybenzoic acid type liquid crystal polymer on the inner surface of the through hole was roughened with a caustic soda aqueous solution and washed. After that, a catalyst for electroless plating is applied, electroless copper plating is applied, and as shown in FIG.
A multi-layer structure in which an electric conductor film is formed on the inner surface of 8 to electrically connect the electric conductor circuits 5, 6, 7, 8 formed on both surfaces of four types of injection molded circuit members 1, 2, 3, 4 It was possible to obtain the injection-molded circuit component 19 thus obtained. Incidentally, the resist film which coated the other part when the electric conductor film was formed on the inner surface of the through hole was removed after the electric conductor film was formed.

The injection-molded circuit component 19 according to the present invention thus obtained does not generate pinholes or short molds in the gaps 15, 16, 17 between the circuit members 1, 2, 3, 4. The injection-molded members 1, 2, 3, 4 were not much deformed, the electric conductor circuits 5, 6, 7, 8 were not broken, and there was no delamination, and the layers were good multi-layers.

Therefore, it is possible to form a multilayer injection-molded circuit component 19 in which the electric conductor circuits 5, 6, 7, and 8 are connected to each other, and the wiring density can be increased.

The injection molding circuit component 19 is a mold 1
Since the molding is performed using 3, the degree of freedom of the shape is large, and the structural component and the electric circuit component can be integrated. That is, it is possible to form the injection-molded circuit component 19 capable of high-density wiring in a three-dimensional shape having a function of a structural component with a degree of freedom which is not so different from the conventional one. Therefore, the electric conductor circuit 5,
6,7,8 can be miniaturized and highly integrated.

Further, since the interlayer resin thickness of the electric conductor circuits 5, 6, 7, 8 can be made thin within a range in which the insulation characteristic is allowed, the total thickness of the machine is required as a structural part. Since the electric conductor circuits 5, 6, 7 and 8 are made small and highly integrated by making the layers within the range in which the characteristics can be obtained, the electric conductor circuits can be made lighter than the case of using the conventional technique.

Furthermore, the injection molded circuit component 1 of the present invention.
In the electric / electronic device using 9, the number of electric conductor circuit components can be reduced by highly integrating the electric conductor circuits 5, 6, 7, and 8, so that the assembly process can be rationalized.

(Embodiment 2) In this embodiment 2, as shown in FIG. 7, an electroless copper plating film 21 is formed on the spacing protrusion 11 and the spacing protrusion receiving hole 12, and a part of the electric conductor circuit is formed. This is an example in which the spacing protrusion 11 and the spacing protrusion receiving hole 12 are configured.
Since the electric conductor circuits formed on the surfaces of the respective injection-molded circuit members are electrically connected when they are fitted together, connection points other than the through holes 9 can be provided. Therefore, the electric conductor circuit of each injection molded circuit member can be electrically connected more reliably, the design of the electric conductor circuit is facilitated, and the wiring of the electric conductor circuit can be simplified. In addition, except for this, an injection molded circuit component was formed by the same method as in Example 1 above. As a result, an electrically favorable connection portion having a low resistance value was obtained. Further, it was possible to obtain a good multi-layered injection-molded circuit component free from pinholes, short molds, breakage of electrical conductor circuits and delamination of layers.

(Embodiment 3) This embodiment 3 is an example in which, as shown in FIG. 8, a crack 22 is provided at the tip of the spacing projection 11 along the projecting direction. As shown in FIG. 9, by being fitted into the spacing projection receiving hole 12 in the elastically deformed state, the spring action due to the presence of the split 22 improves the fitability with the spacing projection receiving hole 12, and the split Assembling (lamination) of the injection molded circuit member is easier than that without 22 and the workability is improved. Further, as in the case of the second embodiment, an electroless copper plating film is formed on the spacing protrusion 11 and the spacing protrusion receiving hole 12 so as to form a part of an electric conductor circuit. An injection molded circuit component was formed in the same manner as in Example 1 by fitting the projection receiving holes. As a result, due to the spring action due to the presence of the cracks 22, the fitting property with the spacing projection receiving hole 12 is improved, and an electrically favorable connection portion having a low resistance value is obtained, and the reliability of the electrical connection is increased. We were able to. Also, good injection molded circuit parts without pinholes, short molds, disconnection of electrical conductor circuits and delamination could be obtained.

(Embodiment 4) In Embodiment 4, as shown in FIG. 10, a seat 23 for receiving the spacing projection receiving hole 12 at the tip of the spacing projection 11 and a through hole having a diameter smaller than that of the seat 23. This is an example in which the spacing protrusion 11 and the spacing protrusion receiving hole 12 form a part of the electric conductor circuit as in the second embodiment. And the spacing projection receiving hole 12 are fitted together, the electric conductor circuit on one side of the injection molding circuit member on the side where the spacing projection 11 is present is changed to the both sides of the injection molding circuit member on the side where the spacing projection receiving hole is present. The electric conductor circuit of can be connected.
In addition, except for this, an injection molded circuit component was formed by the same method as in Example 2 above. As a result, an electrically favorable connection portion having a low resistance value was obtained. Further, it was possible to obtain a good multi-layered injection-molded circuit component free from pinholes, short molds, breakage of electrical conductor circuits and delamination of layers.

[0028]

In summary, the present invention has the following excellent effects.

1) According to the structure of claim 1, it is possible to form a multi-layered injection-molded circuit component in which electric conductor circuits are connected between layers, and the wiring density can be increased.

2) According to the structure of claim 2, the electric conductor circuit of each injection molded circuit member can be electrically connected more reliably.

3) According to the configuration of claim 3, the fitting property between the spacing projection and the spacing projection receiving hole is improved.

4) According to the structure of claim 4, when the spacing protrusion and the spacing protrusion receiving hole form a part of the electric conductor circuit formed on the surface of the injection-molded circuit member, When the pacing projection and the spacing projection receiving hole are fitted together, the electric conductor circuit on one side of the injection molding circuit member on the side where the spacing projection exists is provided on both sides of the injection molding circuit member on the side where the spacing projection receiving hole exists. The electric conductor circuit of can be connected.

5) According to the structure of claim 5, when the resin is filled, the resin flows through the through hole, so that the filling becomes easy. Further, after the resin is solidified, each injection molded circuit member can be fixed through the through hole.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an injection molded circuit member of the present invention.

FIG. 2 is a cross-sectional view showing another example of the injection molded circuit member of the present invention.

FIG. 3 is a cross-sectional view showing another example of the injection molded circuit member of the present invention.

FIG. 4 is a cross-sectional view showing another example of the injection molded circuit member of the present invention.

5 is a cross-sectional view showing a state in which the injection molding circuit member shown in FIGS. 1 to 4 is mounted in a mold.

FIG. 6 is a sectional view showing an example of an injection molded circuit component of the present invention.

FIG. 7 is a cross-sectional view showing a state in which the spacing protrusion and the spacing protrusion receiving hole of the injection molded circuit component of the present invention are fitted together.

FIG. 8 is a cross-sectional view showing an example of a spacing protrusion of the present invention in which a crack is provided at a tip end portion thereof.

9 is a sectional view showing a state in which the spacing protrusion shown in FIG. 8 is fitted into the spacing protrusion receiving hole.

FIG. 10 is a cross-sectional view showing another example of the spacing projection receiving hole of the present invention.

FIG. 11 is a cross-sectional view showing an example of a conventional injection molded circuit component.

[Explanation of symbols]

 1, 2, 3, 4 Injection molding circuit member 5, 6, 7, 8 Electric conductor circuit 10 Positioning hole 11 Spacing protrusion 12 Spacing protrusion receiving hole 14 Positioning pin 15, 16, 17 Gap 18 Through hole 20 Resin

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ryo Sato 5-1-1 Hidaka-cho, Hitachi-shi, Ibaraki Hitachi Power Systems Co., Ltd.

Claims (5)

[Claims] 1. A positioning hole in which a plurality of injection-molded circuit members each having an electric conductor circuit on the surface are arranged linearly when these circuit members are laminated and a part of the electric conductor circuit is formed on the inner surface. And forming a spacing protrusion so that a predetermined gap is formed between the circuit members and a spacing protrusion receiving hole into which the spacing protrusion fits, and stacking these injection-molded circuit members together. A positioning pin is inserted into the positioning hole, a resin is filled and solidified in the gap between the circuit members to form a multilayer circuit member, and then an electric conductor coating is formed on the inner surface of the through hole formed by the positioning pin. And a method for manufacturing an injection molded circuit component, characterized in that the electric conductor circuits formed on the surface of each injection molded circuit member are electrically connected to each other. 2. The injection molding according to claim 1, wherein a part of the electric conductor circuit formed on the surface of the injection molding circuit member is formed in the spacing projection and the spacing projection receiving hole. Method of manufacturing circuit parts. 3. A crack is provided at the tip of the spacing protrusion along the protrusion direction.
Alternatively, the method for manufacturing an injection-molded circuit component according to item 2. 4. The spacing projection receiving hole comprises a receiving seat for receiving a tip of the spacing projection and a through hole having a diameter smaller than that of the receiving seat.
A method for manufacturing an injection molded circuit component according to any one of 1. 5. The electric conductor circuit is provided on both surfaces of the injection molded circuit member, and the injection molded circuit member is provided with a through hole having an electric conductor coating film electrically connecting the electric conductor circuits on both surfaces to the inner surface. The method for manufacturing an injection-molded circuit component according to any one of claims 1 to 4, characterized in that.