JPH07161776A - Manufacture of two-layered tab tape - Google Patents

Abstract

PURPOSE:To obtain a two-layered TAB tape material excellent in productivity without deteriorating it in dimensional stability and evenness by a method wherein device holes are provided crosswise to a polyamic acid film, and a set of sprocket holes are provided in both the edges of the film per device hole, the polyamic acid film is bonded to a conductor foil by pressure and turned into imide by burning as it is kept wide. CONSTITUTION:Device holes are provided crosswise to a polyamic acid film which is not completely turned into imide yet by heating and drying through a conventional polyimide film manufacturing device and a set of sprocket holes are provided in both the edges of the film per device hole, the wide polyamic acid film is bonded to a conductor foil by pressure, and the wide polyamic acid film provided with the conductor foil is fully turned into imide by a continuous dryer used in a conventional two-layered flexible printed circuit board manufacturing process to form a conductor wire. By this setup, a two-layered TAB tape can be easily obtained high in productivity and yield and low in cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a T for mounting a semiconductor element.
The present invention relates to a method for manufacturing an AB (Tape Automated Bonding) tape, and more particularly to a method for manufacturing a double-layer TAB tape.

[0002]

2. Description of the Related Art Although semiconductor packaging technology has made remarkable progress in recent years, TAB, in particular, can easily cope with an increase in the number of pins because a conductor pattern can be formed with extremely high density, and a wire is used for bonding. Since it is possible to wire-connect the entire lead to the semiconductor element at a time without incident, high-density mounting technology is currently required, and development is actively underway.

There are two types of TAB tapes, a two-layer structure and a three-layer structure. The three-layer structure (hereinafter abbreviated as three-layer TAB) generally has a conductor foil such as copper foil and a heat-resistant resin film. It is made by sticking together with an adhesive, and even if a polyimide film with excellent properties such as heat resistance and chemical resistance is used as a film, it has an adhesive layer with poor heat resistance, so it is possible to make full use of that property. There wasn't.

On the other hand, a two-layer structure TAB (hereinafter abbreviated as two-layer TAB) is generally excellent in heat resistance as a TAB because it does not have an adhesive layer on the base film, but is practically used because of its difficult manufacturing method. It was rarely offered. That is, as a method for manufacturing a two-layer TAB, a conductor layer is provided on a heat-resistant film such as polyimide by using a thin film forming technique such as sputtering, vapor deposition, and plating, and then etching treatment is performed on the base film and the conductor layer to form device holes and A method of forming a predetermined opening such as a sprocket hole and a conductor pattern, and a varnish of a heat-resistant resin such as polyimide is directly applied on a conductor foil such as a copper foil and dried to form a two-layer substrate, and then a resin layer and a conductor foil. It is manufactured by two kinds of methods, that is, a method for forming a predetermined opening portion or a conductor pattern by performing an etching treatment on the. In the former, a rolled foil having excellent flexibility and a Fe-Ni alloy foil having excellent strength are used. Since it is necessary to use the etching method to form the openings in the base film, it is not possible to use a 3-layer TAB. Productivity as compared to come method significantly decreases. On the other hand, also in the latter, in order to prevent the occurrence of curls and wrinkles, it is necessary to match the linear expansion coefficient of the resin used with that of the copper foil which is the conductor layer, but such a resin is generally rigid and excellent in solvent resistance. Therefore, alkali etching is difficult in many cases, and dry etching such as excimer laser must be performed to provide an opening in the film layer, which is disadvantageous in productivity and cost. .

Most of these problems can be solved by using a method in which the polyamic acid film is perforated, thermocompression-bonded to the conductor foil, and then fired, but most of these problems are solved during firing. Since it is necessary to dry each tape at a high temperature while holding it so that it does not come into contact with any part, it was difficult to heat-treat a large amount of tape at a time.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to manufacture a two-layer TAB having no adhesive layer, and a plurality of device holes in the width direction, and one end of each device hole at each end. Sprocket hall 1
After providing the set, by pressing the wide polyamic acid film to the conductor foil, by baking and imidizing the wide width,
The present invention provides a method for producing a two-layer TAB tape material having excellent productivity without impairing dimensional stability and smoothness.

[0007]

According to the present invention, a semi-cured polyamic acid film is provided with a plurality of device holes in the width direction and one set of sprocket holes at each end of each device hole, and then a conductor foil is formed. The present invention relates to a method for producing a two-layer TAB tape, characterized by using a wide two-layer TAB tape material obtained by completing the imidization by pressure bonding and heat treatment. Form the required pattern on the conductor foil as it is, or slit it in the width of the device hole and one set of sprocket holes formed at both ends,
This is a method for producing a two-layer TAB tape, which comprises forming an independent TAB tape having the same width as a normal TAB tape and then forming a required pattern on the conductor foil.

In the method for producing a semi-cured polyamic acid film in the present invention, a polyamic acid solution is applied onto a release film and dried until a tack-free state is formed to form a polyamic acid film. Further, another polyamic acid film having the same composition or a different composition is aligned with the polyamic acid film surface, and if necessary, a predetermined number of polyamic acid films are inserted between them, and two or more sheets are simultaneously heated and pressure-bonded to form a thick polyamic acid film. You can also do it.

Next, the polyamic acid film is processed by a conventional method, for example, punching, cutting, alkali etching, laser or the like together with the release film, or only the polyamic acid film is opened to form holes such as device holes and sprocket holes. However, punching is preferable in terms of productivity and cost.

The polyamic acid film that has been subjected to hole processing is sufficiently imidized by heating and pressure bonding to the conductor foil and then baking, and if necessary, a device hole and a set of sprocket hole units formed at both ends thereof. After slitting with a width of 1 to form an independent TAB tape having a width equal to that of a normal TAB tape, a conductor pattern is formed.
At this time, as a method for drying the wide polyamic acid film pressure-bonded to the conductor foil, the same continuous dryer as that used when manufacturing a normal casting type two-layer flexible printed circuit board, that is, heating at 300 ° C. or more is used. A possible air-supported floating dryer or roll-support dryer can be used. Further, from the viewpoint of preventing the conductor foil from being oxidized, it is desirable that the inside of the dryer is replaced with nitrogen gas or the like to create an inert atmosphere. In the case of owning equipment for performing circuit processing in a wide width, it is preferable to perform circuit processing in a wide width from the viewpoint of productivity. On the other hand, even when a wide device capable of processing a circuit is not provided, a general processing device can be used by slitting it into a width equal to that of a normal TAB tape and forming an independent TAB tape.

In the present invention, suitable conditions for drying the polyamic acid solution to form a semi-cured polyamic acid film are 80 to 200 ° C. and 5 to 30 minutes.
If the temperature is lower than this and the time is short, the fluidity is large when heating and crimping with the conductor foil, bleeding and bleeding at the opening are large, and the variation in the film thickness is large, and the dimensional change after imidization Grows larger. If the temperature is higher and the time is longer than this, the fluidity is too small when heated and pressure-bonded to the conductor foil, the peel strength with the conductor foil decreases, and voids increase. Appropriate coating thickness of the amic acid is 200 μm or less after imidization. When the thickness is thicker than this, the film layer is thick, so that the evaporation rate of the solvent is slow and the productivity is remarkably lowered. Heat the polyamic acid films to each other or the polyamic acid film on the conductor foil.
The conditions for crimping are 70 to 200 for the press type.
℃, 5~100kg / cm ^2, 5~30 minutes, 70 to 200 ° C. in the case of a roll laminator, 1 to 50 kg / cm, a 0.1 to 10 m / min conditions appropriate polyamic acid film is a particularly temperature It is desirable to carry out the reaction at a temperature 10 to 30 ° C. lower than the drying temperature because no volatile matter is generated.

The polyamic acid in the present invention is usually obtained by reacting a diamine with an acid anhydride.
Examples of the diamine include phenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, and diaminodiphenyl ether, and examples of the acid anhydride include trimellitic anhydride, pyromellitic dianhydride, biphenyltetracarboxylic dianhydride, and benzophenonetetracarboxylic acid. It is possible to use dianhydride and the like, one for each
One kind or two or more kinds can be appropriately combined and used. The imidization ratio in the state of the polyamic acid film is preferably 10 to 50%, and more preferably 20 to 40%. If the imidization ratio is less than 10%, the tackiness remains and the workability is poor, and it becomes difficult to isolate the films one by one by adhering them to the backside of the release film after winding, and imidization of 50% or more. When the above is applied, the melting property deteriorates, and even if the amic acid surfaces are aligned and thermocompression bonded, they cannot be sufficiently integrated.

Materials that can be used as the release film include plastic films such as polypropylene, polyester, polyether sulfone, polyimide and polyethylene.

Examples of materials that can be used as the conductor layer include metal foils such as Fe—Ni alloys and Fe—Cr—Al alloys in addition to simple metal foils such as copper, aluminum and nickel.

[0015]

According to the present invention, a general polyimide film manufacturing apparatus is used, and heating and drying are not performed until completely imidized, and a plurality of device holes are formed in the width direction in the state of a polyamic acid film, and both end portions of each device hole are formed. After providing one set of sprocket holes, the wide polyamic acid film is pressure-bonded to the conductor foil, and this wide polyamic acid film with conductor foil is used together with the continuous dryer used for manufacturing a normal two-layer flexible printed circuit board. By completing the imidization and forming the conductor wire, a two-layer TAB tape can be obtained easily and inexpensively with good productivity and yield. On the other hand, even when a wide device capable of processing a circuit is not provided, a general processing device can be used by slitting it into a width equal to that of a normal TAB tape and forming an independent TAB tape.

[0016]

Example 1 In a four-neck separable flask equipped with a thermometer, a stirrer, a reflux condenser and a dry nitrogen gas inlet, 108 g of purified anhydrous paraphenylenediamine and 4,4′-diamino were placed. Take 200 g of diphenyl ether and dissolve it in a mixed solvent of anhydrous N-methyl-2-pyrrolidone (90% by weight) and toluene (10% by weight) in an amount sufficient to give a solid content of 20% by weight in the total raw materials. did. Dry nitrogen gas was allowed to flow in all steps from the reaction preparation stage to the product removal. Then purified anhydrous 3,
294 g of 3 ', 4,4'-biphenyltetracarboxylic dianhydride and 218 g of pyromellitic dianhydride are added little by little while stirring, but since it is an exothermic reaction, cold water of about 15 ° C is circulated in the external water tank. Allowed to cool. After adding the internal temperature
The temperature was set to 20 ° C., the mixture was stirred for 5 hours, the reaction was terminated, and a polyamic acid solution was obtained.

On a commercially available polyester film having a width of 540 mm, this polyamic acid solution was applied with a bar coater to a width of 500 mm.
Apply so that the thickness after imidization is 50 μm, and apply 130
After obtaining a polyamic acid film by drying at ℃ for 15 minutes,
Holes are formed using a die so that 10 device holes are formed in the width direction and one set of sprocket holes is formed at each end of each device hole (48 mm wide tape is 10
Arranged side by side in the assembly width direction), using a roll-type laminator, superimpose the polyamic acid film surface so that both ends of the copper foil are exposed 20 mm each on the roughened surface of the commercially available copper foil of 540 mm width.
Partial heating and pressure bonding were performed under the conditions of 110 ° C, 15 kg / cm, 0.5 m / min. After that, using a floating dryer that can remove the release film and replace it with a nitrogen atmosphere,
Heating was performed under the conditions of passing through the zones of 300 ° C. and 380 ° C. for 10 minutes respectively, imidization was completed, and a two-layer TAB substrate having 10 device holes in the width direction was obtained.

Using the obtained two-layer substrate, the copper foil in the sprocket hole portion is removed by etching to expose the sprocket hole, and then the conductor foil is subjected to a predetermined resist pattern and hole filling treatment, and then subjected to etching treatment. After forming the conductor pattern by, the resist and the filling material remaining on the conductor foil were removed to obtain a two-layer TAB tape.

(Example 2) Two-layer TA obtained in Example 1
Using the board for B, slit the device hole and a set of sprocket hole units (48 mm) formed on both ends of the device hole to make an independent TAB tape having a width of 48 mm, which is the same as a normal TAB tape. After removing the copper foil in the sprocket hole part by etching to expose the sprocket hole, a predetermined resist pattern and hole filling process are performed on the conductor foil, and after the conductor pattern is formed by performing the etching process, it remains on the conductor foil A two-layer TAB tape was obtained by removing the resist and the hole filling material.

[0020]

According to the present invention, a device hole can be formed by punching with excellent productivity, and further, continuous drying with a wide width is performed by using an ordinary continuous dryer for firing a two-layer flexible printed circuit substrate. By doing so, a two-layer TAB material having excellent heat resistance, chemical resistance, etc. is formed, and if necessary, slit to a width equal to that of a normal TAB tape, and form an independent TAB tape to use general processing equipment. be able to. Further, it becomes possible to produce a two-layer TAB tape using a rolled foil that could not be used by the vapor deposition method or the like, which is suitable as an industrial two-layer TAB tape production method.

Claims (4)

[Claims] 1. A semi-cured polyamic acid film having a plurality of device holes in the width direction and one set of sprocket holes at each end of each device hole, and then pressure-bonded to a conductor foil and baked to imidize. A method for producing a tape material for a two-layer TAB, characterized in that 2. A desired pattern is formed on a conductor foil while keeping the tape obtained in claim 1 wide.
Method for producing multi-layer TAB tape. 3. A two-layer TAB, wherein the tape obtained in claim 1 is slit with a width of a device hole and a set of sprocket holes formed at both ends thereof.
For manufacturing tape material for automobiles. 4. A method for producing a two-layer TAB tape, which comprises forming a required pattern on the conductor foil of the tape obtained in claim 3.