JP2954387B2 - Two-layer double-sided TAB tape and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a T
AB (Tape Automated Bondin)
g) Regarding the method of manufacturing the tape, more specifically, a two-layer double-sided T
The present invention relates to a method for producing an AB tape.

[0002]

2. Description of the Related Art In recent years, progress in semiconductor mounting technology has been remarkable. Particularly, TAB can easily cope with the increase in the number of pins because a conductor pattern can be formed at an extremely high density, and a wire is used for bonding. Since the entire lead can be connected to the semiconductor element at a time without any trouble, the development is being actively promoted at the present time when high-density mounting technology is required. Above all, a double-sided T that can reduce the impedance by providing a ground layer on the lower surface and reduce the influence of noise
AB is beginning to be considered for high-speed ICs.

There are two types of TAB tapes, a two-layer structure and a three-layer structure. A three-layer structure (hereinafter abbreviated as three-layer TAB) is generally a conductor foil such as a copper foil and a heat-resistant resin film. It is possible to make full use of its properties because it has an adhesive layer with inferior heat resistance even if a polyimide film with excellent properties such as heat resistance and chemical resistance is used as a film. Did not.

[0004] On the other hand, a double-sided TAB having a two-layer structure (hereinafter abbreviated as a two-layer TAB) has excellent heat resistance as a TAB because it has no adhesive layer on a base film. Was rarely offered. That is, as a method of manufacturing the two-layer TAB, a conductor layer is provided on a heat-resistant film such as polyimide by using a thin film forming technique such as sputtering, vapor deposition, plating, and the like. Although it is manufactured by a method of forming a predetermined opening such as a sprocket hole, and a conductor pattern, it is impossible to use a rolled foil having excellent flexibility or an Fe-Ni alloy foil having excellent strength, Because it is necessary to provide the aperture using the etching method to form the film aperture,
There is a problem that productivity is significantly reduced as compared with the three-layer TAB punching method.

[0005]

An object of the present invention is to provide a two-layer double-sided TAB having no adhesive layer without lowering the inherent heat resistance, alkali resistance, solvent resistance, and electrical properties. An object of the present invention is to provide a method for producing a two-layer TAB tape which is excellent in productivity and has no curl and has good adhesion between a copper foil and a film.

[0006]

SUMMARY OF THE INVENTION The present invention is directed to a 3,3 ',
4,4'-biphenyltetracarboxylic dianhydride (BP
DA) and 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and / or pyromellitic dianhydride (PMDA) in molar ratio (BPDA: BTD)
A and / or PMDA) of 100: 0 to 30:70, and an aromatic tetracarboxylic dianhydride component, and 2,2-bis [4- (4-aminophenoxy) phenyl] propane (BAPP), 3-bis (3-aminophenoxy)
Benzene (APB), P-phenylenediamine (PP
Among the three aromatic diamines of D), the intermediate layer has a polyimide obtained from an aromatic diamine component having a molar ratio of BAPP and / or APB: PPD of 100: 0 to 50:50. A two-layered double-sided TAB tape and a varnish of a precursor solution of the polyimide are applied to a conductor foil, dried and imidized to form a two-layer substrate. And press-bonding the same with a polyimide film surface to form a required pattern on a conductive foil, and a method for manufacturing a two-layer double-sided TAB tape.

[0007] A method of casting a polyimide precursor (hereinafter referred to as polyamic acid) solution onto a metal foil to obtain a two-layer substrate is performed by a known coating method such as a rotary coater, a knife coater, a doctor blade, or a flow coater. 1
A method of casting and coating to a uniform thickness of 000μ is used.

In addition, when the solvent is removed from the polyamic acid solution by heating, if the heating is performed intensely from the beginning, the surface becomes rough or tight. Therefore, it is preferable to gradually increase the heating from a low temperature. For example, heating is continuously performed from 100 ° C. to 350 ° C. over 0.5 hour or more. If the time is less than 0.5 hour, depending on the film thickness, the solvent may not be sufficiently removed, or the imide may not be sufficiently ring-closed to exhibit no characteristics. Also, for example, at 100 ° C. for 30 minutes, then at 150 ° C.
30 minutes at 200 ° C, 30 minutes at 250 ° C, 3 minutes
The temperature may be increased stepwise at 00 ° C. for 30 minutes and at 350 ° C. for 30 minutes. In some cases, the heating atmosphere may be in the air. However, when a metal foil that is easily oxidized such as a copper foil is used as the metal foil, it is preferable that the heating is performed under reduced pressure or in a non-oxidizing state while flowing an inert gas. The polyimide film layer thus formed generally has a thickness of 10-20.
0μ.

Punching, cutting, and the like can be used as a method of providing an opening in a two-layer substrate. After crimping the two-layer substrate and the conductor foil, a predetermined resist pattern is formed on the conductor foil, and when performing an etching process, the opening portion is filled with a necessary filling material to perform etching from the opening portion. It must be prevented. After forming the conductor pattern, the resist and the filling material remaining on the conductor foil are removed, and a sprocket hole is formed by punching.

In the present invention, the condition for heating and pressing the two-layer substrate and the conductor foil is 300 to 300 in the case of a press type.
500 ° C., 5 to 100 kg / cm ² , 5 to 30 minutes, 300 to 500 ° C., 1 to 50 k for a roll laminator
The conditions of g / cm and 0.1 to 10 m / min are appropriate, and it is particularly desirable to carry out the reaction at a temperature 50 to 100 ° C. higher than the drying temperature of the polyamic acid film.

The polyamic acid solution used in the present invention may have a film-forming ability, an excellent adhesion to a metal foil, and a thermoplastic property, but the following polyamic acid is most suitable. That is, upon reacting the tetracarboxylic dianhydride component with the diamine component,
3 ', 4,4'-biphenyltetracarboxylic dianhydride (BPDA), 3,3', 4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and / or pyromellitic dianhydride (PMDA) ) And the molar ratio (BPDA:
BTDA and / or PMDA) from 100: 0 to 30: 7
An aromatic tetracarboxylic dianhydride component which is 0;
2-bis [4- (4-aminophenoxy) phenyl] propane (BAPP), 1,3-bis (3-aminophenoxy) benzene (APB) and P-phenylenediamine (PPD) Among them, the molar ratio of BAPP and / or APB: PPD is 100: 0 to 50:
And a polyamic acid obtained from an aromatic diamine component of 50.

The tetracarboxylic dianhydride used in the present invention is 3,3 ', 4,4'-biphenyl, tetracarboxylic dianhydride, 3,3', 4,4'-benzophenonetetracarboxylic dianhydride. And pyromellitic dianhydride. Other acids such as 2,3,3 ', 4, -biphenyltetracarboxylic dianhydride and 3,3', 4,4'-P
-Terphenyltetracarboxylic dianhydride, 2,3
6,7-naphthalenetetracarboxylic dianhydride, 3,
Acid dianhydrides such as 3 ', 4,4'-P-terphenyltetracarboxylic dianhydride and 4,4'-hexafluoroisopropylidenebis (phthalic anhydride) are also provided within the range where the properties are not impaired. Can be used together.

The diamine used in the present invention is 2,2-bis [4- (4-aminophenoxy) phenyl] propane,
1,3-bis (3-aminophenoxy) benzene and P
Phenylenediamine, but other amines such as 4,4'-diaminodiphenylmethane, 3,3'-dimethylbenzidine, 4,4'-diamino-P-terphenyl, 4,4'-diamino-P-quarter Phenyl,
Diamines such as 2,8-diaminodiphenylene oxide can be used in combination as long as the properties are not impaired.

The reaction between the tetracarboxylic dianhydride component and the diamine component is carried out with an acid component / amine component (molar ratio) of 0.90.
It is preferably carried out at １．０1.00, and when it is lower than 0.90, the degree of polymerization does not increase and the film properties after curing are poor. If it is larger than 1.00, gas is generated at the time of curing, and a smooth film cannot be obtained.

The reaction is usually carried out in an organic polar solvent which does not react with tetracarboxylic dianhydrides and / or diamines. In addition to being inert to the reaction system and being a solvent for the product, the organic polar solvent must be a good solvent for at least one of the reaction components, preferably both. Typical examples of this type of solvent include N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfone, dimethyl sulfoxide, N-methyl-2-pyrrolidone, and the like. These solvents may be used alone or in combination. used. In addition, benzene, which is used in combination as a solvent,
Non-polar solvents such as dioxane, xylene, toluene, cyclohexane and the like are used as a dispersion medium of a raw material, a reaction regulator or a volatilization regulator from a product, a film smoothing agent and the like.

The reaction is generally preferably carried out under anhydrous conditions. This is because the tetracarboxylic dianhydride may be ring-opened by water, inactivated, and stop the reaction. Therefore, it is necessary to remove both the water in the raw materials and the water in the solvent. But on the other hand, it regulates the progress of the reaction,
Water is also added to control the degree of polymerization of the resin. The reaction is preferably performed in an inert gas atmosphere. This is to prevent oxidation of diamines. Dry nitrogen gas is generally used as the inert gas.

Examples of the material that can be used for the conductor layer include metal foils such as Fe—Ni alloy and Fe—Cr—Al alloy in addition to simple metal foils such as copper, aluminum and nickel.

[0018]

According to the present invention, a hole is formed in a two-layer substrate obtained by applying and drying a specific polyamic acid solution on a conductive foil,
Furthermore, by performing a step of forming a conductor wiring by applying heat and pressure to the conductor foil, a two-layer double-sided TAB tape can be obtained easily and inexpensively with high productivity and yield.

[0019]

EXAMPLE 1 In a four-neck separable flask equipped with a thermometer, a stirrer, a reflux condenser and a dry nitrogen gas inlet, 20.53 g (0.05 m) of BAPP was placed.
ol) and 14.62 g (0.05 mol) of APB, a mixed solvent of 90% by weight of anhydrous N-methyl-2-pyrrolidone and 10% by weight of toluene was added thereto, and the solid content ratio in all the charged materials was 20% by weight. Was added and dissolved. Dry nitrogen gas was allowed to flow throughout the entire process from the preparation of the reaction to the removal of the product. Then purified B
20.60 g (0.07 mol) of PDA, BTDA9.
76 g (0.03 mol) was added little by little with stirring. Since the reaction was exothermic, cold water of about 15 ° C. was circulated through an external water tank to cool the mixture. After the addition, the internal temperature
The temperature was set at 0 ° C., and the mixture was stirred for 5 hours to complete the reaction, thereby obtaining a polyamic acid solution.

This polyamic acid solution is applied on a rolled copper foil by a spinner so that the thickness after imidization becomes 50 μm, and dried at 110 ° C. for 15 minutes and further at 250 ° C. for 20 minutes to obtain a two-layer substrate. Was. Drilling (device hole) using a mold, superimposing a polyimide film surface on the roughened surface of a commercially available rolled copper foil, 400 ° C., 40 kg / cm
^2. Heating / compression bonding was performed for 15 minutes to obtain a double-sided two-layer substrate having device holes.

Using the obtained double-sided two-layer substrate, a predetermined resist pattern is formed on the conductive foil and a hole filling material is formed in the opening,
After forming a conductor pattern by performing an etching process, the resist and the filling material remaining on the conductor foil were removed, and a sprocket hole was provided by punching to obtain a two-layer double-sided TAB tape.

Example 2 Using the same two-layer substrate with device holes as in Example 1, a polyimide film surface was superposed on the roughened surface, and a roll type laminator was used at 90 ° C. and 15 kg / cm. ^2. Heating / compression bonding was performed at 0.2 m / min to obtain a double-sided two-layer substrate having device holes. A two-layer TAB tape was obtained in the same manner as in Example 1 except that this double-sided two-layer substrate was used.

(Embodiment 3) Using the same apparatus and method as in Embodiment 1, 0.02 mol of PPD, 0.08 mol of APB,
A polyamic acid solution composed of 0.08 mol of BPDA and 0.02 mol of PMDA was obtained. Thereafter, a double-sided two-layer TAB tape was obtained in the same manner as in Example 1.

(Comparative Example 1) Using the same apparatus and method as in Example 1, 0.1 mol of P-phenylenediamine, BPDA
A polyamic acid solution consisting of 0.1 mol was obtained. Thereafter, an attempt was made to produce a double-sided two-layer substrate in the same manner as in Example 1, but no adhesion was observed even when thermocompression-bonded to a copper foil.

(Comparative Example 2) Using the same apparatus and method as in Example 1, 0.1 m of 4,4'-diaminodiphenyl ether was used.
ol and 0.1 mol of pyromellitic dianhydride were obtained as a polyamic acid solution. After that, an attempt was made to produce a double-sided two-layer substrate in the same manner as in Example 1, but no adhesion was observed even when thermocompression-bonded to a copper foil.

[0026]

According to the present invention, there is provided a curl-free copper foil and film having excellent heat resistance, chemical resistance and the like provided with device holes by punching with excellent productivity by using a specific polyamic acid. Both sides 2 with good adhesion to
A layer TAB can be obtained, and a double-sided two-layer TAB using a rolled foil that cannot be used by a vapor deposition method or the like can be manufactured. INDUSTRIAL APPLICABILITY The present invention can be easily applied to a continuous process using a continuous sheet, and is suitable as an industrial method for producing a double-sided two-layer TAB.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-294557 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 21/60 311

Claims (2)

(57) [Claims] 1. A method according to claim 1, wherein 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride (hereinafter abbreviated as BPDA) and
The molar ratio (BPD) with 3 ', 4,4'-benzophenonetetracarboxylic dianhydride (hereinafter abbreviated as BTDA) and / or pyromellitic dianhydride (hereinafter abbreviated as PMDA)
A: BTDA and / or PMDA) is 100: 0 to 3
0:70, an aromatic tetracarboxylic dianhydride component, 2,2-bis [4- (4-aminophenoxy) phenyl] propane (hereinafter abbreviated as BAPP), 1,3-bis (3-aminophenoxy) ) Of three aromatic diamines, benzene (hereinafter abbreviated as APB) and P-phenylenediamine (hereinafter abbreviated as PPD), BAPP and / or AP
A two-layer double-sided TAB tape comprising a polyimide obtained from an aromatic diamine component having a B: PPD molar ratio of 100: 0 to 50:50 in an intermediate layer. 2. Using a varnish of the polyimide precursor solution according to claim 1, coating and drying on a conductor foil to form a two-layer substrate, and then providing a predetermined opening portion, the polyimide of the conductor foil A method for producing a two-layer double-sided TAB tape, wherein the surfaces of the precursor films are pressed together and a required pattern is formed on the conductor foil.