JP2954388B2 - Method for manufacturing two-layer TAB tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a T
AB (Tape Automated Bondin)
g) Regarding a method of manufacturing a tape, more specifically, a two-layer TAB
The present invention relates to a tape manufacturing method.

[0002]

2. Description of the Related Art In recent years, there has been a remarkable progress in semiconductor mounting technology. Among them, TAB can easily cope with an increase in the number of pins because a conductor pattern can be formed at an extremely high density, and a wire is used for bonding. Since the entire lead can be connected to the semiconductor element at a time without any trouble, the development is being actively promoted at the present time when high-density mounting technology is required.

There are two types of TAB tapes, a two-layer structure and a three-layer structure. A three-layer structure (hereinafter abbreviated as three-layer TAB) is generally a conductor foil such as a copper foil and a heat-resistant resin film. It is possible to make full use of its properties because it has an adhesive layer with inferior heat resistance even if a polyimide film with excellent properties such as heat resistance and chemical resistance is used as a film. Did not.

On the other hand, a two-layered TAB (hereinafter, abbreviated as a two-layered TAB) generally has excellent heat resistance as a TAB because it does not have an adhesive layer on a base film. It was rarely offered. That is, as a method of manufacturing the two-layer TAB, a conductor layer is provided on a heat-resistant film such as polyimide by using a thin film forming technique such as sputtering, vapor deposition, plating, and the like. A method of forming a predetermined opening portion, which is a sprocket hole, and a conductor pattern, and directly applying a varnish of a heat-resistant resin such as a polyimide on a conductor foil such as a copper foil and drying to form a two-layer substrate, and then forming a resin layer And a method of forming a predetermined opening portion and a conductor pattern by performing an etching treatment on a conductor foil, and in the former, a rolled foil having excellent flexibility and a Fe- The problem of not being able to use Ni alloy foil and the like, and the fact that the opening must be provided by using an etching method to form the base film opening, the three-layer Productivity as compared to come method significantly decreases. On the other hand, also in the latter, in order to prevent the occurrence of curls and wrinkles, it is necessary to match the linear expansion coefficient of the resin used with the copper foil as the conductor layer, but such resins are generally rigid and have excellent solvent resistance. For this reason, alkali etching is often difficult, and dry etching such as excimer laser must be performed in order to provide openings in the film layer, which has a problem that productivity and cost are disadvantageous. .

[0005]

An object of the present invention is to produce a two-layer TAB without an adhesive layer without deteriorating the inherent heat resistance, alkali resistance, solvent resistance, and electrical characteristics. An object of the present invention is to provide a method for producing a two-layer TAB tape having excellent adhesiveness, no curl, and excellent adhesion between a copper foil and a film.

[0006]

SUMMARY OF THE INVENTION The present invention provides a method for producing a 3,3 ',
4,4'-biphenyltetracarboxylic dianhydride (hereinafter abbreviated as BPDA), 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride (hereinafter abbreviated as BTDA) and / or pyromellitic dianhydride Ratio (BPDA: BTDA and / or PMD)
A) an aromatic tetracarboxylic dianhydride component having a ratio of 100: 0 to 30:70, 2,2-bis [4- (4-aminophenoxy) phenyl] propane (hereinafter abbreviated as BAPP), 1,3 Among three aromatic diamines of -bis (3-aminophenoxy) benzene (hereinafter abbreviated as APB) and P-phenylenediamine (hereinafter abbreviated as PPD), BAP
The molar ratio of P and / or APB: PPD is 100: 0 to 5
A polyimide film is prepared by a usual method using a varnish of a polyamic acid obtained from an aromatic diamine component of 0:50, a predetermined opening is provided in the film, and the polyimide film is laminated on a conductor foil. And press-bonding to form a required pattern on the conductor foil.

[0007] As a method of forming an opening in the polyimide film, punching, cutting, alkali etching, laser processing, or the like can be used, but punching is preferable in terms of productivity and cost. When a predetermined resist pattern is formed on a conductive foil and an etching process is performed, it is necessary to fill a required hole filling material in the opening to prevent etching from the opening. After forming the conductor pattern, the resist and the filling material remaining on the conductor foil are removed, and a sprocket hole is formed by punching.

In the present invention, the conditions for heating and pressing the polyimide film and the conductor foil are 300 to 500 ° C., 5 to 100 kg / cm ² ,
30 minutes, 300-500 in case of roll type laminator
C., 1 to 50 kg / cm and 0.1 to 10 m / min are appropriate, and it is particularly desirable to carry out the process at a temperature 50 to 100.degree. C. higher than the drying temperature of the polyimide film.

The polyamic acid solution used in the present invention may have a film-forming ability, an excellent adhesion to a metal foil, and a thermoplastic property, but the following polyamic acid is most suitable. That is, upon reacting the tetracarboxylic dianhydride component with the diamine component,
3 ′, 4,4′-biphenyltetracarboxylic dianhydride (BPDA), 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and / or pyromellitic dianhydride (PMDA) ) And the molar ratio (BPDA:
BTDA and / or PMDA) from 100: 0 to 30: 7
An aromatic tetracarboxylic dianhydride component which is 0;
2-bis [4- (4-aminophenoxy) phenyl] propane (BAPP), 1,3-bis (3-aminophenoxy) benzene (APB) and P-phenylenediamine (PPD) Among them, the molar ratio of BAPP and / or APB: PPD is 100: 0 to 50:
And a polyamic acid obtained from an aromatic diamine component of 50.

The tetracarboxylic dianhydride used in the present invention includes 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and 3,3', 4,4'-benzophenonetetracarboxylic dianhydride And pyromellitic dianhydride, but other acids such as 2,3,3 ', 4'-biphenyltetracarboxylic dianhydride and 3,3', 4,4'-P
-Terphenyltetracarboxylic dianhydride, 2,3
6,7-naphthalenetetracarboxylic dianhydride, 3,
Acid dianhydrides such as 3 ', 4,4'-P-terphenyltetracarboxylic dianhydride and 4,4'-hexafluoroisopropylidenebis (phthalic anhydride) are used in combination as long as the properties are not impaired. You can do it.

The diamine used in the present invention is 2,2-bis [4- (4-aminophenoxy) phenyl] propane,
1,3-bis (3-aminophenoxy) benzene and P
Phenylenediamine, but other amines such as 4,4'-diaminodiphenylmethane, 3,3'-dimethylbenzidine, 4,4'-diamino-P-terphenyl, 4,4'-diamino-P-quarter Phenyl,
Diamines such as 2,8-diaminodiphenylene oxide can be used in combination as long as the properties are not impaired.

The reaction between the tetracarboxylic dianhydride component and the diamine component is carried out in an acid component / amine component (molar ratio) of 0.90.
It is preferably carried out at １．０1.00, and when it is lower than 0.90, the degree of polymerization does not increase and the film properties after curing are poor. If it is larger than 1.00, gas is generated at the time of curing, and a smooth film cannot be obtained.

The reaction is usually carried out in an organic polar solvent which does not react with tetracarboxylic dianhydride and diamines.
In addition to being inert to the reaction system and being a solvent for the product, the organic polar solvent must be a good solvent for at least one of the reaction components, preferably both. Typical solvents of this type are N,
N-dimethylformamide, N, N-dimethylacetamide, dimethylsulfone, dimethylsulfoxide, N-
There are methyl-2-pyrrolidone and the like, and these solvents are used alone or in combination. In addition, non-polar solvents such as benzene, dioxane, xylene, toluene, and cyclohexane may be used in combination as solvents, as a dispersion medium of a raw material, a volatilization regulator from a reaction regulator or a product, a volatilization regulator from a product, a film smoother, and the like. used.

The reaction is generally preferably carried out under anhydrous conditions. This is because the tetracarboxylic dianhydride may be ring-opened by water, inactivated, and stop the reaction. Therefore, it is necessary to remove both the water in the raw materials and the water in the solvent. But on the other hand, it regulates the progress of the reaction,
Water is also added to control the degree of polymerization of the resin. The reaction is preferably performed in an inert gas atmosphere. This is to prevent oxidation of diamines. Dry nitrogen gas is generally used as the inert gas.

Examples of the material that can be used for the conductor layer include metal foils such as Fe—Ni alloy and Fe—Cr—Al alloy in addition to simple metal foils such as copper, aluminum and nickel.

[0016]

According to the present invention, a hole is formed by using a thermoplastic polyimide film obtained from a specific polyamic acid solution, and furthermore, a step of heating and pressure bonding with a conductive foil to form a conductive wiring is adopted. And low cost, productivity
A two-layer TAB tape can be obtained with high yield.

[0017]

EXAMPLE 1 In a four-neck separable flask equipped with a thermometer, a stirrer, a reflux condenser and a dry nitrogen gas inlet, 20.53 g (0.05) of BAPP was placed.
mol) and 14.62 g (0.05 mol) of APB, and a mixed solvent of 90% by weight of anhydrous N-methyl-2-pyrrolidone and 10% by weight of toluene was added thereto. % And dissolved. Dry nitrogen gas was allowed to flow throughout the entire process from the preparation of the reaction to the removal of the product. Then, 20.60 g (0.07 mol) of purified BPDA, BTDA
9.76 g (0.03 mol) is added little by little with stirring. However, since it is an exothermic reaction, about 15 g is added to the external water tank.
This was cooled by circulating cold water at ℃. After the addition, the internal temperature was set at 20 ° C., and the mixture was stirred for 5 hours to complete the reaction, thereby obtaining a polyamic acid solution.

Using this polyamic acid solution, a polyimide film having a thickness of 50 μm was obtained by an ordinary method. Drilling (device hole) is performed using a mold, and a polyimide film is superimposed on the roughened surface of a commercially available rolled copper foil.
Heating and pressure bonding were performed at 0 ° C. and 40 kg / cm ² for 15 minutes to obtain a two-waste substrate having device holes.

Using the obtained two-layer substrate, a predetermined resist pattern and a hole-filling material are applied to the conductor foil, and a conductor pattern is formed by performing an etching process. Then, the resist and the hole-filling material remaining on the conductor foil are removed. The two-layer TAB tape was obtained by removing and providing a sprocket hole by punching.

Example 2 A polyimide film having device holes similar to that of Example 1 was used, a polyimide film surface was superimposed on a roughened surface of a rolled copper foil, and a roll type laminator was used at 90 ° C. and 15 kg. / Cm ² , 0.
Heating and pressure bonding were performed at 2 m / min to obtain a two-layer substrate having device holes. A two-layer TAB tape was obtained in the same manner as in Example 1 except that this two-layer substrate was used.

(Embodiment 3) Using the same apparatus and method as in Embodiment 1, 0.02 mol of PPD, 0.08 mol of APB,
A polyamic acid solution composed of 0.08 mol of BPDA and 0.02 mol of PMDA was obtained. Thereafter, a two-layer TAB tape was obtained in the same manner as in Example 1.

(Comparative Example 1) Using the same apparatus and method as in Example 1, 0.1 mol of P-phenylenediamine, BPDA
A polyamic acid solution consisting of 0.1 mol was obtained. Thereafter, an attempt was made to produce a double-sided two-layer substrate in the same manner as in Example 1, but no adhesion was observed even when thermocompression-bonded to a copper foil.

(Comparative Example 2) Using the same apparatus and method as in Example 1, 0.1 m of 4,4'-diaminodiphenyl ether was used.
ol and 0.1 mol of pyromellitic dianhydride were obtained as a polyamic acid solution. After that, an attempt was made to produce a double-sided two-layer substrate in the same manner as in Example 1, but no adhesion was observed even when thermocompression-bonded to a copper foil.

[0024]

According to the present invention, by using a specific thermoplastic polyimide film, a copper-free, curl-free, heat-resistant and chemical-resistant copper hole having device holes formed by punching with excellent productivity can be obtained. A two-layer TAB having good adhesion between the foil and the film can be obtained, and a two-layer TB using a rolled foil that cannot be used by a vapor deposition method or the like.
AB can also be manufactured. INDUSTRIAL APPLICABILITY The present invention can be easily applied to a continuous process using a continuous sheet, and is suitable as an industrial method for producing a two-layer TAB.

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/60 311

Claims (1)

(57) [Claims] 1. A method according to claim 1, wherein 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride (hereinafter abbreviated as BPDA) and 3,3 ′,
Molar ratio (BPDA: B) with 4,4′-benzophenonetetracarboxylic dianhydride (hereinafter abbreviated as BTDA) and / or pyromellitic dianhydride (hereinafter abbreviated as PMDA)
TDA and / or PMDA) from 100: 0 to 30:70
An aromatic tetracarboxylic dianhydride component,
-Bis [4- (4-aminophenoxy) phenyl] propane (hereinafter abbreviated as BAPP), 1,3-bis (3-aminophenoxy) benzene (hereinafter abbreviated as APB), P-phenylenediamine (hereinafter abbreviated as PPD) Among the three types of aromatic diamines, a polyimide film was prepared using a varnish of a polyamic acid obtained from an aromatic diamine component having a molar ratio of BAPP and / or APB: PPD of 100: 0 to 50:50, A method for producing a two-layer TAB tape, comprising: providing a predetermined opening portion in the film, superimposing a polyimide film on the conductor foil, and pressing the polyimide film to form a required pattern on the conductor foil.