JPH07154947A - Power semiconductor device - Google Patents

Abstract

PURPOSE:To provide a power semiconductor device in which a molded IC can be mounted integrally without resin-molding a connector member in advance. CONSTITUTION:In an actuator, a signal from a molded IC 3 to be used as an ECU which has been formed as an IC is received, and a motor 8 inside is driven. In the actuator, a molded-IC internal-installation part 7 and a connector part 2 are formed in a case 1 for the actuator, and the molded IC is arranged and installed. The molded IC 3 and the motor 8 are connected by a wiring 6 at the inside of the case 1 for the actuator.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power semiconductor device for an actuator.

[0002]

2. Description of the Related Art In recent years, the demand for miniaturization of electrical components for automobiles has become particularly strong. On the other hand, the number of electronic components has been increasing year by year with the progress of electronics. It's getting harder.
For small-scale electrical components, miniaturization of actuators-body mounting is essential, and heat dissipation effect is also taken into consideration-body mounting technology is important.

Therefore, conventionally, an EC for driving an actuator is used.
Taking U as an example, E
There is an attempt to reduce the size of a power semiconductor device by integrating the CU. FIG. 3 is a cross-sectional view of a main part of a connector 9 that is separately connected. A molded IC 10, which is an ECU that has been downsized by making it IC, is fitted into a resin-molded connector member 11 to be integrated. Mold IC 10 is lead frame 1
2 and an IC sealing mold material 13, and the connector member 11 is provided with a connector portion 14.
Then, the connector 9 having such a configuration is connected to a connector on the actuator side (not shown) to implement the power semiconductor device in a miniaturized body.

[0004]

In the conventional miniaturized-body-mounted power semiconductor device described above, a connector in which a molded IC is incorporated into a connector member prepared by resin molding in advance is connected to the actuator. Since at least two resin-molded parts are combined with each other, the structure is complicated, and there is a limit to miniaturization. Further, the material cost and the processing cost in the manufacturing stage of the connector member also increase the cost of the entire device.

Therefore, an object of the present invention is to provide a power semiconductor device in which a molded IC can be integrally mounted without resin-molding a connector member in advance.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above object, and receives electric power from an actuator which drives a motor installed therein by receiving a signal from a mold IC which is an IC ECU. In a semiconductor device for a vehicle, a molded IC internal part and a connector part are provided in an actuator case, the molded IC is installed in the molded IC internal part, and the molded IC and the motor are wired inside the actuator case. It is characterized by being connected in.

[0007]

According to the present invention, the signal from the molded IC, which is an IC-equipped ECU, is transmitted through the connected wiring,
The internally installed motor is driven as instructed by the signal.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of miniaturization-body mounting of the present invention,
It is a perspective view of the actuator which made a principal part a section. Motor 8 and molded IC inside actuator case 1
3 were provided, and each was connected by the wiring 6. The molded IC 3 is an example of an ECU that has been downsized by making it an IC, and by using this, downsizing can be implemented as a body.

The connector, which is a feature of the actuator having such a structure, is shown in FIG. 2 as an enlarged view of a portion A. The actuator case 1 is molded from resin and has a shape that includes a connector portion 2 having a shape that can be connected to a connector (not shown) for external input and a molded IC internal portion that is a space in which the molded IC 3 can be mounted. The mold IC 3 was fixed by the fixing screw 5. Further, the lead frame 4 which is the minus part of the molded IC 3 has the minus end for the connector part 2 and the other end for connection with the motor 8, and is electrically connected to the motor 8 by soldering using the wiring 6. I got a continuity.

In the actuator power semiconductor device having the above-described structure, the connector portion 2 and the molded IC internal portion 7 in the actuator case 1 can be easily resin-molded. The molded IC can be integrally mounted on the power semiconductor device without molding. Further, since the wiring 6 is connected inside the actuator case 1, it is not necessary to draw a wire harness (not shown) outside.

Further, if a resin material having a high heat conductivity is selected for the actuator case 1, even if the mold IC 3 generates heat, the actuator case 1 directly functions as a heat sink and a sufficient heat radiation effect can be obtained. Furthermore, by using a metal as the material of the actuator case 1, it is possible to make the heat dissipation of the molded IC 3 more effective.

The mold IC 3 can be similarly fixed by using an adhesive instead of the fixing screw 5 used in this embodiment. Further, although the lead frame 4 and the motor 8 are connected by the wiring 6 by soldering, welding, screwing or the like may be used.

[0013]

According to the present invention, since the molded IC is provided in the actuator case having the motor, the molded IC can be integrally mounted without resin molding the connector member in advance. .

[Brief description of drawings]

FIG. 1 is a perspective view showing a cross section of a main part of an actuator of this embodiment.

FIG. 2 shows an enlarged view of part A of FIG.

FIG. 3 shows a cross section of a main part of another conventional connector.

[Explanation of symbols]

 1 Actuator case 2 Connector part 3 Molded IC 4 Lead frame 6 Wiring 7 Molded IC internal part

Claims (1)

[Claims] 1. A power semiconductor device for an actuator, which receives a signal from a molded IC, which is an integrated circuit (IC) ECU, and drives a motor installed therein, wherein a molded IC internal part and a connector part are provided in an actuator case, The molded IC is installed in the molded IC internal portion.
A semiconductor device for electric power, characterized in that the molded IC and the motor are connected by wiring inside the actuator case.