JPH07151800A - Resistivity measuring instrument - Google Patents
Resistivity measuring instrumentInfo
- Publication number
- JPH07151800A JPH07151800A JP32613993A JP32613993A JPH07151800A JP H07151800 A JPH07151800 A JP H07151800A JP 32613993 A JP32613993 A JP 32613993A JP 32613993 A JP32613993 A JP 32613993A JP H07151800 A JPH07151800 A JP H07151800A
- Authority
- JP
- Japan
- Prior art keywords
- resistivity
- head
- motor
- measuring
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measurement Of Resistance Or Impedance (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は半導体素子製造工程に於
いて、半導体ウェーハの比抵抗を測定する比抵抗測定装
置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistivity measuring device for measuring the resistivity of a semiconductor wafer in the process of manufacturing a semiconductor device.
【0002】[0002]
【従来の技術】図3に於いて、従来の比抵抗測定装置に
ついて説明する。2. Description of the Related Art A conventional resistivity measuring device will be described with reference to FIG.
【0003】図中1は、ウェーハ2を受載して水平2方
向に移動するステージ、3は比抵抗測定ヘッドであり、
該比抵抗測定ヘッド3は昇降アーム4の先端に固着され
ている。又、前記昇降アーム4の基端は昇降スライダ5
に設けられ、該昇降スライダ5は支柱6に昇降自在に設
けられている。該支柱6に取付けられた昇降モータ7の
回転軸にはカム8が固着され、該カム8は前記昇降スラ
イダ5のカム従動板9に当接し、該カム従動板9はカム
8の回転を昇降動作に変換し、前記昇降スライダ5に伝
達する。In the figure, 1 is a stage for receiving a wafer 2 and moving it in two horizontal directions, 3 is a specific resistance measuring head,
The specific resistance measuring head 3 is fixed to the tip of the elevating arm 4. The base end of the lifting arm 4 is a lifting slider 5
The lift slider 5 is mounted on a column 6 so as to be lifted and lowered. A cam 8 is fixed to a rotation shaft of a lifting motor 7 attached to the column 6, the cam 8 contacts a cam driven plate 9 of the lifting slider 5, and the cam driven plate 9 lifts the rotation of the cam 8. It is converted into a motion and transmitted to the elevating slider 5.
【0004】而して、前記昇降モータ7によりカム8を
回転させることで、昇降スライダ5、昇降アーム4を介
して前記比抵抗測定ヘッド3が昇降する。尚、図3は比
抵抗測定ヘッド3の上昇状態を示し、又図4に示す様
に、前記昇降モータ7により比抵抗測定ヘッド3を下降
させることで、比抵抗測定ヘッド3の探針10が前記ウ
ェーハ2に接触し、1点についての比抵抗の測定が開始
される。1点についての比抵抗の測定が完了すると前記
昇降モータ7により比抵抗測定ヘッド3を上昇させ、前
記ステージ1により前記ウェーハ2を所要量移動させ、
更に前記比抵抗測定ヘッド3を下降させ、次の点での比
抵抗を測定する。By rotating the cam 8 by the elevating motor 7, the specific resistance measuring head 3 moves up and down via the elevating slider 5 and the elevating arm 4. 3 shows the elevated state of the resistivity measuring head 3, and as shown in FIG. 4, the probe 10 of the resistivity measuring head 3 is moved by lowering the resistivity measuring head 3 by the lifting motor 7. The wafer 2 is brought into contact with the wafer 2 and the measurement of the specific resistance at one point is started. When the measurement of the resistivity at one point is completed, the lift motor 7 raises the resistivity measuring head 3, and the stage 1 moves the wafer 2 by a required amount.
Further, the specific resistance measuring head 3 is lowered to measure the specific resistance at the following points.
【0005】又、比抵抗の測定は、1枚のウェーハに対
して数十箇所から数百箇所行われている。Moreover, the measurement of the specific resistance is performed at several tens to several hundreds of points on one wafer.
【0006】[0006]
【発明が解決しようとする課題】前記した様に比抵抗の
測定は、1枚のウェーハに対して数十箇所から数百箇所
行っているので、一点の測定時間の長短が比抵抗測定の
効率に大きく影響する。As described above, the resistivity measurement is carried out at several tens to several hundreds of spots on one wafer. Therefore, the length of one measurement time is the efficiency of the resistivity measurement. Greatly affect the.
【0007】従来の比抵抗測定装置では、特にモータの
速度制御を行ってなく、定速で回転させているので、一
点の測定時間を短縮する為にはモータの回転速度を大き
くしなければならないが、速度を増大すると前記探針1
0がウェーハ2に接触する際の衝撃が大きくなり、ウェ
ーハ2表面の損傷が大きくなる。ウェーハ2表面の損傷
は比抵抗測定精度の低下を招き、測定精度を確保する為
にはモータの回転速度を所定の速度以下にしなければな
らないという制限があり、比抵抗測定の効率向上の大き
な制約となっていた。In the conventional resistivity measuring apparatus, the motor speed is not controlled, and the motor is rotated at a constant speed. Therefore, in order to shorten the measurement time at one point, the motor rotation speed must be increased. However, as the speed increases, the probe 1
The shock when 0 contacts the wafer 2 becomes large, and the damage on the surface of the wafer 2 becomes large. Damage to the surface of the wafer 2 leads to a decrease in the resistivity measurement accuracy, and there is a restriction that the rotation speed of the motor must be lower than a predetermined speed in order to ensure the measurement accuracy, which is a major limitation for improving the efficiency of the resistivity measurement. It was.
【0008】本発明は斯かる実情に鑑み、ウェーハ表面
の損傷を防止しつつ一点の測定時間の短縮を図り、比抵
抗測定の効率を向上させようとするものである。In view of the above situation, the present invention aims to shorten the measurement time at one point while preventing damage to the wafer surface, and improve the efficiency of resistivity measurement.
【0009】[0009]
【課題を解決するための手段】本発明は、測定点に対し
て測定ヘッドを昇降させ比抵抗を測定する比抵抗測定装
置に於いて、前記測定ヘッドを昇降させるモータと、該
モータ速度の増減速の制御を行う主制御部を具備し、少
なくとも下降停止前の減速の加速度を小さくする様構成
したことを特徴とするものである。SUMMARY OF THE INVENTION The present invention relates to a resistivity measuring apparatus for raising and lowering a measuring head with respect to a measuring point to measure a specific resistance, a motor for raising and lowering the measuring head, and an increase or decrease of the motor speed. It is characterized in that it comprises a main control unit for controlling speed, and is configured to reduce at least deceleration acceleration before stopping to descend.
【0010】[0010]
【作用】少なくとも下降停止前の減速の加速度を小さく
し、急激な速度減少を避け、被測定物に与える衝撃を減
少させ、被測定物の損傷を防止し、測定精度の向上を確
保し、更に測定ヘッドの昇降に要する時間を短縮し、測
定効率を向上させる。[Function] At least the deceleration acceleration before descending and stopping is reduced to avoid a rapid decrease in speed, reduce the impact on the object to be measured, prevent damage to the object to be measured, and improve the measurement accuracy. The time required to move the measuring head up and down is shortened and the measurement efficiency is improved.
【0011】[0011]
【実施例】以下、図面を参照しつつ本発明の一実施例を
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【0012】図1は本発明に係る実施例の要部を示すも
のであり、図1中、図3中で示したものと同一のものに
は同符号を付してある。図中、11は前記カム従動板9
に相当するカム従動片である。FIG. 1 shows an essential part of an embodiment according to the present invention. In FIG. 1, the same parts as those shown in FIG. 3 are designated by the same reference numerals. In the figure, 11 is the cam follower plate 9
Is a cam driven piece corresponding to.
【0013】主制御部12によりモータコントローラ1
3、モータドライバ14を介して昇降モータ7を駆動可
能にし、前記主制御部12には操作部15を接続する。The main controller 12 controls the motor controller 1
3. The elevating motor 7 can be driven through the motor driver 14, and the operation unit 15 is connected to the main control unit 12.
【0014】該操作部15からはウェーハの厚みの情報
を前記主制御部12に入力すると共に図2(A)(B)
に示すモータ速度制御の情報を入力する。Information on the thickness of the wafer is input to the main controller 12 from the operation unit 15 and, as shown in FIGS.
Input the motor speed control information shown in.
【0015】従って、前記比抵抗測定ヘッド3の下降位
置は前記ウェーハの厚みの情報により決定され、又モー
タの速度制御について比抵抗測定ヘッド3の下降は前記
図2(A)のモータ速度制御の情報により、又比抵抗測
定ヘッド3の上昇については図2(B)のモータ速度制
御の情報により制御される。Therefore, the descending position of the resistivity measuring head 3 is determined by the information on the thickness of the wafer, and regarding the motor speed control, the descending position of the resistivity measuring head 3 depends on the motor speed control of FIG. 2 (A). Information, and the rise of the specific resistance measuring head 3 is controlled by the information of the motor speed control of FIG. 2 (B).
【0016】図2(A)に示すモータ速度制御による比
抵抗測定ヘッド3の下降では、下降の開始時には加速度
を大きくし、定速状態に達する迄の時間を短縮し、又停
止前(探針10がウェーハ2に接触する前)は徐々に減
速して探針10がウェーハ2に接触した際の衝撃を減少
させる。When the specific resistance measuring head 3 is lowered by the motor speed control shown in FIG. 2A, the acceleration is increased at the start of the descent to shorten the time until the constant velocity state is reached and before stopping (probe). (Before 10 contacts the wafer 2), the speed is gradually reduced to reduce the impact when the probe 10 contacts the wafer 2.
【0017】次に、比抵抗測定ヘッド3を上昇させる場
合は、探針10によりウェーハ2を損傷させる心配がな
いので、開始時、停止前とも加速度を大きくし加減速時
間を短縮する。而して、測定に影響を及ぼす探針10が
ウェーハ2に接触する前の速度だけを減少させるように
したので、比抵抗測定ヘッド3の昇降に要する時間の短
縮が図れる。Next, when the resistivity measuring head 3 is raised, there is no risk of damaging the wafer 2 by the probe 10, so the acceleration is increased at the start and before the stop to shorten the acceleration / deceleration time. Since only the speed of the probe 10 that influences the measurement before contacting the wafer 2 is reduced, the time required for moving the resistivity measuring head 3 up and down can be shortened.
【0018】尚、前記モータ速度制御の情報については
種々変更が可能であることも言う迄もなく、更にカムの
形状に対応してモータ速度制御の情報が決定されること
も言う迄もない。又下降時の減速の態様に於いて、先ず
所定速度迄急激に減速し、その後徐々に減速してもよ
い。更に又、上記実施例は接触式の比抵抗測定装置につ
いて説明したが、非接触式の比抵抗測定装置についても
同様に実施可能であることは勿論である。Needless to say, the information on the motor speed control can be changed in various ways, and further, the information on the motor speed control is determined according to the shape of the cam. In the mode of deceleration at the time of descending, first, the speed may be rapidly reduced to a predetermined speed and then gradually decreased. Furthermore, although the above-described embodiments have been described with respect to the contact-type resistivity measuring device, it is needless to say that the non-contact-type resistivity measuring device can be similarly implemented.
【0019】[0019]
【発明の効果】以上述べた如く本発明によれば、ウェー
ハに与える損傷を増大させることなく測定精度を向上さ
せつつ、測定時間の短縮を図れ、比抵抗測定の効率をも
向上させることが可能となる。As described above, according to the present invention, it is possible to improve the measurement accuracy without increasing damage to the wafer, shorten the measurement time, and improve the efficiency of resistivity measurement. Becomes
【図1】本発明の一実施例を示す説明図である。FIG. 1 is an explanatory diagram showing an embodiment of the present invention.
【図2】(A)(B)はモータ速度制御情報の一例を示
す線図である。2A and 2B are diagrams showing an example of motor speed control information.
【図3】従来の比抵抗測定装置を示す説明図である。FIG. 3 is an explanatory diagram showing a conventional specific resistance measuring device.
【図4】従来の比抵抗測定装置を示す説明図である。FIG. 4 is an explanatory diagram showing a conventional resistivity measuring device.
2 ウェーハ 3 比抵抗測定ヘッド 7 昇降アーム 8 カム 12 主制御部 2 Wafer 3 Resistivity measuring head 7 Lifting arm 8 Cam 12 Main controller
Claims (1)
抵抗を測定する比抵抗測定装置に於いて、前記測定ヘッ
ドを昇降させるモータと、該モータ速度の増減速の制御
を行う主制御部を具備し、少なくとも下降停止前の減速
の加速度を小さくする様構成したことを特徴とする比抵
抗測定装置。1. In a resistivity measuring device for raising and lowering a measuring head with respect to a measuring point to measure a specific resistance, a motor for raising and lowering the measuring head and a main control unit for controlling acceleration and deceleration of the motor speed. A resistivity measuring device comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32613993A JPH07151800A (en) | 1993-11-30 | 1993-11-30 | Resistivity measuring instrument |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32613993A JPH07151800A (en) | 1993-11-30 | 1993-11-30 | Resistivity measuring instrument |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07151800A true JPH07151800A (en) | 1995-06-16 |
Family
ID=18184491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32613993A Pending JPH07151800A (en) | 1993-11-30 | 1993-11-30 | Resistivity measuring instrument |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07151800A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100498435B1 (en) * | 1998-08-31 | 2005-09-26 | 삼성전자주식회사 | Impact buffer apparatus of bulk loader in vertical type handler & its operation method |
JP2007095753A (en) * | 2005-09-27 | 2007-04-12 | Tokyo Seimitsu Co Ltd | Prober, prober contact method, and program therefor |
JP2012009618A (en) * | 2010-06-24 | 2012-01-12 | Hitachi Kokusai Denki Engineering Co Ltd | Resistivity measurement apparatus |
-
1993
- 1993-11-30 JP JP32613993A patent/JPH07151800A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100498435B1 (en) * | 1998-08-31 | 2005-09-26 | 삼성전자주식회사 | Impact buffer apparatus of bulk loader in vertical type handler & its operation method |
JP2007095753A (en) * | 2005-09-27 | 2007-04-12 | Tokyo Seimitsu Co Ltd | Prober, prober contact method, and program therefor |
JP2012009618A (en) * | 2010-06-24 | 2012-01-12 | Hitachi Kokusai Denki Engineering Co Ltd | Resistivity measurement apparatus |
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