JPH0715157U - Wire solder supply nozzle with cleaning function - Google Patents

Abstract

(57) [Summary] [Purpose] The flux attached to the tip of the wire solder supply nozzle is easily and reliably removed to stabilize the wire solder supply. [Structure] The inside of a cylinder of a wire solder supply nozzle 1 having a tapered tip has a double structure of a wire solder supply tube 5 and a guide pipe 2, and a small gap 7 serving as a fluid passage is formed between the double structures. . The end of the fluid supply tube 4 attached to the cylindrical portion of the nozzle 1 communicates with the fluid passage gap 7 through the hole 10 of the guide pipe, and the fluid passage gap 7 is line solder inside the taper of the nozzle 1. It communicates with the passage hole 8. The fluid sent from the fluid supply tube 4 at an appropriate pressure advances in the fluid passage gap 7 in the axial direction, enters the wire solder passage hole 8, and is blown out from the tip of the nozzle.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a device for automatically cleaning flux attached to the tip of a wire solder supply nozzle of a wire solder supply device mounted on a soldering robot or the like.

[0002]

[Prior art]

 Generally, in a wire solder supply device, the wire solder is guided to the soldering part by a tube made of Teflon (trademark). However, in such a device, the smoke of flux generated at the time of soldering is supplied to the wire solder supply tube. There was a problem that the tube adhered to the tip and clogged the tube gradually, and the wire solder could not be supplied from the tip of the nozzle. As a countermeasure, conventionally, manual cleaning was performed on a regular basis.

[0003]

[Problems to be solved by the device]

 Since the flux clogging the nozzle opening end is manually removed in this way, workability is extremely poor, and automation of flux removal work is an urgent task, especially when soldering robot equipment.

An object of the present invention is to stably supply wire solder and improve workability by a wire solder supply nozzle having a cleaning function.

[0005]

[Means for Solving the Problems]

 In order to achieve these objectives, first of all, the inside of the wire solder supply nozzle has a double structure of a wire solder supply tube and a guide pipe, and a minute gap is provided between the double structures, and the end of the gap is the tip of the nozzle. Lead to the solder passage hole. Next, the fluid supply tube is guided to the gap on the upper surface of the wire solder supply tube through the hole of the guide pipe by the fluid joint.

[0006]

[Operation] Due to this structure, the fluid to which appropriate pressure is applied reaches the upper surface of the wire solder supply tube through the fluid supply tube, the fluid coupling, and the hole of the guide pipe. , It reaches the nozzle opening end through the route of the solder passage hole and diffuses the flux in that part.

[0007]

【Example】

 Next, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing a partial cross section of the embodiment apparatus, and FIG. 2 is an enlarged view of a portion A shown in FIG. In FIG. 1, 1 is a wire solder supply nozzle, 2 is a guide pipe, 3 is a fluid joint, 4 is a resin fluid supply tube, 5 is a wire solder supply tube, 6 is a protective tube, and 7 is a fluid passage gap. , 8 is a wire solder passage hole at the tip of the nozzle, 9 is a guide pipe fixing screw, 10 is a guide pipe hole, and 11 is wire solder.

The inside of the cylindrical portion of the nozzle 1 has a double structure of a guide pipe 2 and a wire solder supply tube 5, and a minute gap 7 for fluid is provided along the cylinder axis between the double structures. is there. As shown in the enlarged view of FIG. 2, the inside of the tapered portion A at the tip of the nozzle 1 has a structure in which the end of the fluid gap 7 communicates with the wire solder passage hole 8. For example, as shown in FIG. Is also tapered to reduce air resistance. Further, the guide pipe 2 is fixed by a screw 7 near the other end of the cylindrical portion of the nozzle 1, and the fluid supply tube 4 is attached by a joint 3. The fluid supply tube 4 is guided to the hole 10 of the guide pipe through the joint 3 and communicates with the gap 7 on the upper surface of the wire solder supply tube 5.

To operate this, the fluid that has flowed into the fluid supply tube 4 at an appropriate pressure advances axially through the fluid passage gap 7 through the joint 3, and near the inside of the taper of the nozzle 1 the wire solder passage hole 8 is formed. It enters and diffuses the residual flux at the open end. (Dashed and solid arrows).

By using the above-mentioned technique, the fluid is automatically flowed after a predetermined time has passed, and the flux cleaning can be automated by using the clogging of the flux or other detecting means.

[0012]

[Effect of device]

 As described above, according to the present invention, the clogging of the wire solder due to the adhesion of flux at the nozzle tip can be prevented, and the wire solder can be stably supplied. Furthermore, labor saving for cleaning can be achieved.

[Brief description of drawings]

FIG. 1 is a perspective view of a partial cross section of a nozzle showing an embodiment of the present invention.

FIG. 2 is an enlarged view of a portion A shown in FIG.

[Explanation of symbols]

 1 wire solder supply nozzle 2 guide pipe 3 fluid joint 4 fluid supply tube 5 wire solder supply tube 6 protective tube 7 fluid passage gap 8 wire solder passage hole 9 guide pipe fixing screw 10 guide pipe hole 11 wire solder

Claims (1)

[Scope of utility model registration request] 1. A tip-tapered line solder supply nozzle having a line solder supply tube (5) mounted therein, wherein a guide pipe is provided on the outer periphery of the line solder supply tube (5) via a fluid passage gap (7). (2) is provided to form a double structure, the fluid passage gap (7) communicates with the fluid supply tube (4) at the end of the nozzle cylinder, and communicates with the wire solder passage hole (8) within the tapered portion. A wire solder supply nozzle with a cleaning function that is characterized by this structure.