JP2586005Y2 - Wire soldering nozzle with cleaning function - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for automatically cleaning flux adhering to the tip of a wire soldering nozzle of a wire soldering apparatus mounted on a soldering robot or the like.

[0002]

2. Description of the Related Art In a wire soldering apparatus, generally, wire solder is guided to a soldering portion by a tube made of Teflon (trade name). However, in such an apparatus, flux smoke or the like generated at the time of soldering is generated. There has been a problem that the wire solder is gradually attached to the tip of the wire solder supply tube and clogs the tube, so that wire solder cannot be supplied from the nozzle tip. As a countermeasure, cleaning has conventionally been performed manually by hand.

[0003]

Since the flux clogging the nozzle opening end is manually removed as described above, workability is extremely poor. In particular, in the soldering of a robot device, it is urgently necessary to automate the flux removal work. Was.

An object of the present invention is to stably supply wire solder and improve workability by a wire solder supply nozzle having a cleaning function.

[0005]

In order to achieve these objects, first, the inside of the wire solder supply nozzle has a double structure of a wire solder supply tube and a guide pipe, and a minute gap is provided between the double structures. Then, the end of the gap is guided to the solder passage hole at the tip of the nozzle. Next, the fluid supply tube is guided to the gap on the upper surface of the wire solder supply tube through the hole of the guide pipe by the joint for fluid.

[0006]

With such a structure, the fluid to which an appropriate pressure has been applied reaches the upper surface of the wire solder supply tube through the fluid supply tube, the fluid joint, and the hole of the guide pipe, and further has a double-structured gap, It reaches the nozzle opening end through the passage of the passage hole, and disperses the flux in that portion.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing a partial cross section of the apparatus of the embodiment, and FIG. 2 is an enlarged view of a portion A shown in FIG. FIG.
, 1 is a wire solder supply nozzle, 2 is a guide pipe,
3 is a fluid joint, 4 is a resin fluid supply tube, 5 is a wire solder supply tube, 6 is a protection tube, 7 is a gap for a fluid passage, 8 is a wire solder passage hole at the nozzle tip, and 9 is a guide pipe fixed. A screw 10 is a hole in the guide pipe, and 11 is a wire solder.

The inside of the cylindrical portion of the nozzle 1 has a double structure of the guide pipe 2 and the wire solder supply tube 5, and a small gap 7 for fluid is provided between the double structure along the cylinder axis. is there. As shown in the enlarged view of FIG. 2, the inside of the tapered portion A at the tip of the nozzle 1 has a structure in which the end of the fluid gap 7 communicates with the wire solder passage hole 8, for example, as shown in FIG. Are also tapered to reduce air resistance. Also,
In the vicinity of the other end of the cylindrical portion of the nozzle 1, the guide pipe 2 is fixed with screws 7, and the fluid supply tube 4 is attached with the joint 3. The fluid supply tube 4 is guided to the hole 10 of the guide pipe through the joint 3,
To the gap 7 on the upper surface of the.

To operate this, the fluid supply tube 4
The fluid that has flowed into the fluid passage gap 7 through the joint 3 in the axial direction passes through the joint 3, enters the wire solder passage hole 8 near the inside of the taper of the nozzle 1, and disperses the residual flux at the opening end. (Dashed and solid arrows).

Utilizing the above-mentioned technique, the fluid can be automatically flowed after a predetermined time has elapsed, or the flux can be automatically cleaned using flux clogging or other detecting means.

[0012]

As described above, according to the present invention, the clogging of the wire solder due to the adhesion of the flux at the tip of the nozzle can be prevented, and the stable supply of the wire solder can be performed. Further, labor saving for cleaning is achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a partial cross section of a nozzle showing one embodiment of the present invention.

FIG. 2 is an enlarged view of a portion A shown in FIG.

[Explanation of symbols]

 Reference Signs List 1 wire solder supply nozzle 2 guide pipe 3 fluid joint 4 fluid supply tube 5 wire solder supply tube 6 protection tube 7 gap for fluid passage 8 wire solder passage hole 9 guide pipe fixing screw 10 guide pipe hole 11 wire solder

Claims (1)

(57) [Scope of request for utility model registration] 1. A tapered wire solder supply nozzle having a wire solder supply tube (5) mounted therein, wherein a guide pipe is provided around the outer periphery of the wire solder supply tube (5) via a fluid passage gap (7). Forming a double structure provided with (2), allowing the fluid passage gap (7) to communicate with the fluid supply tube (4) at the end of the nozzle cylinder, and communicating with the wire solder passage hole (8) within the tapered portion; A wire soldering nozzle with a cleaning function, characterized by the structure of the soldering.