JPH0714933A - Ic module for ic card - Google Patents

Abstract

PURPOSE:To reduce the effect of electrostatic charge by using a structure wherein the electrostatic charge near an IC module is not directly transferred to an IC chip through a wiring. CONSTITUTION:An external connection terminal 2 is laid out on one surface of a board 1, and on the other surface of it, a wiring pattern 4 connected to IC chips 3 and 4 is laid out, and in addition, a through hole 6 that connects the external connection terminal 2 with the wiring pattern 4 is provided, and around the IC chips 3 and the wiring pattern 4, a resin is molded, so that a non-conductive coating layer 8 consisting of an insulation resin or insulation paint is formed on at least the area containing the wiring pattern 4 and a through hole 7 exposed above the board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a microprocessor,
The present invention relates to an IC module for an IC card, which has an integrated circuit (IC chip) such as a memory and forms an IC card to be mounted on a card base material, etc., and particularly to protect the integrated circuit from the action of electrostatic charges charged on the card. The present invention relates to an IC module for an IC card capable of

[0002]

2. Description of the Related Art Currently, as a card-shaped personal information recording medium, a card called "IC card" having an integrated circuit such as a microprocessor and a memory has been developed. It is possible to store personal ID information (secret information) from private information and to protect the information from the outside and inside. However, this integrated circuit has data destruction, program runaway, etc. due to the action of electrostatic charge. In the worst case, the circuit may be destroyed.

This integrated circuit is mounted on a card by arranging an external connection terminal composed of a plurality of terminals for electrical connection with the outside on the substrate so that the external connection terminal is exposed on the surface of the card. The integrated circuit is arranged on the substrate opposite to the surface on which the formed surface is formed, and a conductive means for wiring / connecting each external connection terminal and the integrated circuit with a wiring pattern, a through hole or the like is incorporated. In this IC module, at least the integrated circuit is partially sealed on the substrate with an insulating synthetic resin or the like to be physically and electrically protected.

By the way, the above-mentioned IC card is a JIS
An insulating synthetic resin such as polyvinyl chloride (PVC) is often selected as a card base material satisfying the physical characteristics of an IC card defined by X6303 or the like in view of processability and cost. Most commonly used except for special applications.

This insulating synthetic resin such as polyvinyl chloride is apt to generate so-called static electricity, and since it is a portable article such as a card in particular, an electrostatic charge generated by friction during carrying is borne on the surface of the card, so that it is accumulated. The circuit will be affected by this electrostatic charge. Therefore, various countermeasures have been proposed as countermeasures against static charge, and (a) Japanese Patent Publication No. 62-27747 discloses a method in which the periphery of the external connection terminal is GN.
A method of covering with a conductor connected to the D terminal is described, (b)
Japanese Unexamined Patent Publication No. 56-157590 discloses a method of embedding an integrated circuit in an antistatic conductive elastomer.
(C) Japanese Patent Laid-Open No. 59-22353 discloses a method of forming external connection terminals on a semi-conductive circuit board and connecting terminals constituting the external connection terminals via a resistance element to disperse electrostatic charges. Further, (d) JP-A-59-22354 discloses a method of connecting each terminal constituting an external connection terminal to GND to disperse an electrostatic charge, and (e) JP-A-59-59.
No. 22355 discloses a method of attaching a semiconductive adhesive material so as to connect between terminals constituting external connection terminals when the IC module is embedded in a card base material.

Further, (f) Japanese Patent Application Laid-Open No. 61-286991, (g) Japanese Patent Application Laid-Open No. 61-286990, (h)
In JP-A-61-286989, the external connection terminal is not directly connected to the terminal device, but the external connection terminal is connected to the external connection terminal through a photoconductive resin, a conductive resin, and a pressure conductive resin. Describes how to connect with terminal equipment,
(I) A method for reducing the load of high-voltage electrostatic charges by forming a varistor circuit in which a varistor electrode and a wiring pattern are printed on a single substrate made of a thin varistor material as disclosed in JP-A-60-91489. Is listed.

Further, an IC module for an IC card used for an IC card (hereinafter referred to as an IC module) is
Since the size of the conventional IC chip is larger than that of the present, or a plurality of chips are used and the IC card has not been widely used, various problems such as inconvenience in using the IC card have not occurred. A conventional IC module in which the entire printed circuit board is resin-molded has been used. However, recently, the IC chip has been downsized, and the IC module has been downsized, but in the conventional IC module shape, the IC embedded in the IC card base material
When the IC card is bent, there arises a problem that the module is peeled off from the IC card base material, and the IC is formed substantially in the center of the substrate 11 so that the cross section shown in FIG.
The IC module 20 in which the chip 13 is arranged and the resin mold 19 is formed has come to be used.

Further, as shown in FIG. 6, the external connection terminals 2 (existing on the opposite surface side) are provided on one surface of the substrate 11, and the IC chip 13, the IC chip and wire bonding (in FIG. 7, in FIG. 7) on the other surface. A wiring pattern 14 that is electrically connected by a bonding wire 15), a bump or the like is provided, and a through hole 16 that connects the external connection terminal 12 and the wiring pattern 14 is penetrated through the substrate 11,
A through hole 17 is formed on the surface, and I
For fixing and protecting the C chip 13, a resin mold 19 is formed by molding the periphery including the IC chip 13 with a resin.

Further, as shown in FIG. 5, the recess 22 of the IC card substrate 21 in which the IC module 20 is embedded also has the recess 23 in which the substrate 11 is arranged so as to correspond to the convex shape of the IC module 20, and further. A concave portion 24 in which the resin mold 19 including the IC chip 13 is disposed is formed, and although not shown, when the IC module 20 is embedded in the concave portion 22, the external connection terminal surface has an IC card base material. The recess 22 is formed so as to be substantially flush with the surface. According to this, the stress due to bending is
3 is dispersed and absorbed, including the part of the substrate 11 where there is no,
Since the load of the stress due to the direct bending on the IC chip 13 is reduced, the cracking of the IC chip 13 and the peeling of the IC module 20 can be prevented.

[0010]

However, the structure and method of the above-mentioned application have some effect in protecting the integrated circuit against the effect of electrostatic charge, but completely eliminate the data error such as the data error due to the intrusion of noise. The influence of electrostatic charge cannot be prevented, and the IC having a convex shape as shown in FIG.
The structure of the IC module is changed like a module,
It is vulnerable to electrostatic charge. That is, since wiring patterns and through-holes are exposed on the board, wiring patterns and through-holes that expose electrostatic charges that are charged in the gap between the recess of the IC card substrate and the IC module are picked up. The IC chip may be destroyed or the IC chip may malfunction, which is one of the causes of the defect of the IC card.

Further, in the structures and methods described in the above-mentioned prior applications (a) to (i), the structure of the IC module is complicated and the size is increased, so that the IC module is separated from the IC card. There was another problem that it became easier to do.

That is, the present IC module structure is vulnerable to electrostatic charge, and the electrostatic charge accumulated on the entire IC card, particularly due to the influence of the accumulated charge in the IC module proximity portion, is not included in the above-mentioned applications. In the method described,
It cannot completely remove the electrostatic charge. Further, the resistors and varistors of the above application complicate the IC module and make it difficult to miniaturize it, and cannot meet the demand for making the IC module as small as possible.

Therefore, according to the present invention, a coating layer made of an insulating resin or an insulating paint is formed on the exposed electrically connected portion of the IC module, and the accumulated charge at the adjacent portion is passed through the wiring to the IC chip. The purpose of this is to reduce the effect of electrostatic charges by making the structure that does not propagate directly.

[0014]

Means for Solving the Problems I for IC card of the present invention
As described in claim 1, the C module is provided with an external connection terminal on one surface and an IC chip and a wiring pattern connected to the IC chip on the other surface, and the external connection terminal is provided. And a wiring pattern and a through hole for connecting the wiring pattern, and an IC module for an IC card having a convex cross section in which the periphery including the IC chip is resin-molded, at least the wiring pattern and the through hole hole exposed on the substrate It is an IC module for an IC card in which a non-conductive coating layer made of an insulating resin or an insulating paint is formed on a portion including the insulating resin.

Further, as described in claim 2, the wiring pattern includes an IC card IC including a wiring pattern connected to an IC test terminal for inspecting the state of the IC chip.
It is a module.

Further, according to a third aspect of the present invention, there is provided an IC module for an IC card in which the surface of the non-conductive coating layer is roughened.

[0017]

According to the present invention, since the non-conductive coating layer made of the insulating resin or the insulating coating is formed on the wiring pattern and the through hole exposed on the substrate, the IC card substrate in which the IC module is embedded is formed. Accumulated charges generated in the concave portion of the IC module adjacent to the IC module are not directly transmitted to the IC chip, so that the IC chip is prevented from being destroyed, the IC chip malfunctioning, or the data being destroyed.

[0018]

Embodiments of the present invention will be described in detail with reference to the drawings. 1 is a plan view of an IC module for an IC card of the present invention, FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIG. 3 is a terminal portion for external connection of an IC module for an IC card of the present invention. 4 is a plan view of the side, FIG. 4 is a plan view showing another embodiment of the IC module for an IC card of the present invention, and FIG. 5 is an IC card substrate in which the IC module for an IC card having a convex cross section is embedded. 6 is a cross-sectional view of a material, FIG. 6 is a plan view of a conventional IC module for an IC card, and FIG. 7 is a cross-sectional view taken along the line BB of FIG.

First, FIG. 3 shows an IC having an external connection terminal 2 electrically connected to an IC card and an external terminal device.
FIG. 1 is a front view of an IC module for card (hereinafter referred to as an IC module) 10, which is a metal conductor such as copper on a substrate 1 made of a material having excellent flexibility and strength such as glass epoxy resin, BT resin, and polyimide polyester. The external connection terminals 2 formed by patterning the layers are composed of a plurality of terminals electrically connected to the built-in IC chip 3 through the through holes 6. The function of each of these terminals is specified. Each terminal is a power supply terminal (Vcc) for operating the microcomputer, a reset terminal (RST) for initializing the microcomputer, a clock terminal (CLK) for sending a clock signal to the microcomputer, a ground terminal (GND), an external terminal. A terminal (Vpp, currently unused) for writing a program in a memory (for example, E ² PROM), 6 terminals of an input / output terminal (I / O) which is a signal line between an IC card and an external terminal device, Further, the external connection terminal 2 is composed of 8 terminals obtained by adding 2 terminals to the above terminals. By the way, these two terminals are spare terminals (RFU) and are not used at present, but are prepared for future function expansion. In addition,
Reference numeral 7 in the figure denotes a through hole hole 7 of the opening of the through hole 6 exposed to the external connection terminal 2. And the IC of the present invention
The module 10 is embedded in a rectangular IC card substrate 21 made of a synthetic resin such as polyvinyl chloride resin as shown in FIG. 5 so that the external connection terminals 2 are exposed to form an IC card.

Next, as shown in the plan view of FIG. 1 and the sectional view of FIG. 2, a substrate 1 made of a material such as glass epoxy resin, BT resin, polyimide polyester, etc. having excellent flexibility and strength, and this substrate. 1. An external connection terminal 2 formed by patterning a metal conductor layer such as a copper foil laminated on one surface on 1 and further plated with hard gold, and a 1-chip type microcomputer on the other surface. Which forms a predetermined circuit for electrically connecting the IC chip 3 to the outside by arranging the following IC chip 3 and patterning a metal conductor layer such as a copper foil laminated on the substrate 1 and performing gold plating IC chip 3 by pattern 4 and wire bonding method or lead bonding method
And the wiring pattern 4 and the bonding wire 5, the wiring pattern 4 and the external connection terminal 2 are connected, the substrate 1 and the external connection terminal 2 are penetrated, and electroless copper plating, electrolytic copper plating, etc. are applied to enable conduction. Through holes 6 are formed. A resin mold 9 is formed around the wiring pattern 4 including the IC chip 3 and the bonding wires 5 with a molding resin such as epoxy resin, silicon resin, phenol resin, and BT resin.

As shown in the plan view of FIG. 1, a predetermined circuit for conducting the IC chip 3 to the outside, which is formed by patterning a metal conductor layer such as a copper foil laminated on the substrate 1 and gold plating. Insulating material such as polyimide, epoxy, BT resin or phenol resin, polyvinyl alcohol,
A non-conductive coating layer 8 is formed by coating or coating with a non-conductive material made of an insulating paint such as polyurethane, silicone resin or oil varnish. These insulative materials or insulative coatings are formed on the non-conductive coating layer 8 I
Heat resistance, deterioration resistance, oil resistance, chemical resistance, dryness, flexibility when the C module is placed on the IC card substrate,
Depending on conditions such as heat conductivity and adhesiveness with an adhesive, it can be appropriately selected, and it is a substance having an insulating property other than the listed materials, and if it is suitable for the above-mentioned conditions. It goes without saying that it can be used.

The non-conductive coating layer 8 may be formed by a known printing method such as an offset printing method, a gravure printing method or a silk screen printing method using a coating liquid containing a non-conductive material, a roll coating method or a knife edge method. Methods such as a coating method, a transfer method using a transfer sheet including a transfer layer having the above-mentioned non-conductive material, and an ink jet method in which the ink mixed with the above-mentioned non-conductive material is sprayed onto a substrate. The above method can be appropriately selected according to the manufacturing quantity.

Further, the wiring pattern 4 is exposed through the adhesive layer as a seal formed by forming a heat-sensitive adhesive or pressure-sensitive adhesive on one or both sides having the non-conductive coating layer made of the above-mentioned non-conductive material. It can also be attached to the marked part. In particular, if the seal has adhesive on both sides, I
Since it is not necessary to newly apply an adhesive when disposing the C module 2 in the concave portion 22, the manufacturing process is simplified.

Further, as shown in FIG. 4, the non-conductive coating layer 8 may be formed on the entire surface of the substrate including the exposed portion of the wiring pattern 4. In this case, it is preferable to form the non-conductive coating layer 8 so as to include at least a boundary portion that is in contact with the resin mold portion.

In particular, since the IC module used for the IC card is extremely small, the non-conductive coating layer 8 is preliminarily provided with the non-conductive coating layer 8 at the predetermined terminal portion or the IC after the wiring is completed at the time of manufacturing a substrate in which a plurality of IC module substrates are multi-faced.
The manufacturing process can be simplified by forming the non-conductive coating layer 8 at a predetermined portion of the module and then separately processing each IC module.

Further, by roughening the surface of the non-conductive coating layer 8 formed on the exposed portion of the wiring pattern 4 which constitutes a predetermined circuit for electrically connecting the IC chip 3 to the outside, the IC card is obtained. It is possible to improve the adhesive strength when adhering to a substrate.

As described above, the present invention provides the IC module 1
By forming a non-conductive coating layer 8 made of an insulating resin or an insulating coating on a portion including the wiring pattern and the through hole exposed on the substrate 1 of No. IC formed
The charging of the recess for embedding of the module 10, that is, the accumulated charge is not directly transmitted to the IC chip.

This prevents malfunctions such as destruction of the IC chip built into the IC module, data errors due to noise, and runaway, and data errors and malfunctions of external terminal equipment due to the action of the electrostatic charges charged on the IC card. can do.

[0029]

As described above, according to the present invention, since the wiring pattern and the through hole exposed on the substrate are formed with the non-conductive coating layer made of the insulating resin or the insulating paint, the IC module is formed. Accumulated charges generated in the recessed portion of the embedded IC card base material in the vicinity of the IC module are not directly transmitted to the IC chip, and destruction of the IC chip, malfunction of the IC chip, and data destruction are prevented. Also,
Higher insulation can be ensured by covering the substrate surface of the IC module exposed in the recess of the IC card base with a non-conductive coating layer made of an insulating resin or an insulating paint in the same manner.

[Brief description of drawings]

FIG. 1 is a plan view of an IC module for an IC card according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a plan view of the external connection terminal portion side of the IC module for an IC card of the present invention.

FIG. 4 is a plan view of an IC module for an IC card according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view of an IC card base material in which an IC module for an IC card having a convex cross section is embedded.

FIG. 6 is a plan view of a conventional IC module for an IC card.

7 is a cross-sectional view taken along the line BB of FIG.

[Explanation of symbols]

1, 11 Substrate 2, 12 External connection terminal 3, 13 IC chip 4, 14 Wiring pattern 5, 15 Bonding wire 6, 16 Through hole 7, 17 Through hole hole 8 Non-conductive coating layer 9, 19 Resin mold 10, 20 IC Modules 11 and 12 Electrostatic Charge Removing Terminals 21 IC Card Base Material 22 Recesses 23 Recesses in which a Substrate is Arranged 24 Recesses in which a Resin Mold Including an IC Chip is Arranged

Claims (3)

[Claims] 1. An external connection terminal is provided on one surface, and an IC chip and a wiring pattern to be connected to the IC chip are provided on the other surface to connect the external connection terminal and the wiring pattern. In an IC module for an IC card having a convex section in which a substrate including a through hole and a periphery including the IC chip are resin-molded, an insulating resin is provided at least in a portion including a wiring pattern and a through hole hole exposed on the substrate. Alternatively, an IC module for an IC card, characterized in that a non-conductive coating layer made of an insulating paint is formed. 2. The IC card I according to claim 1, wherein the wiring pattern includes a wiring pattern connected to an IC test terminal for inspecting a state of an IC chip.
C module. 3. The IC module for an IC card according to claim 3, wherein the surface of the non-conductive coating layer is roughened.