JPH07148663A - Blasting machining method using electrocast mask - Google Patents

Blasting machining method using electrocast mask

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Publication number
JPH07148663A
JPH07148663A JP29525093A JP29525093A JPH07148663A JP H07148663 A JPH07148663 A JP H07148663A JP 29525093 A JP29525093 A JP 29525093A JP 29525093 A JP29525093 A JP 29525093A JP H07148663 A JPH07148663 A JP H07148663A
Authority
JP
Japan
Prior art keywords
mask
electrocast
workpiece
machining
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29525093A
Other languages
Japanese (ja)
Other versions
JP3441129B2 (en
Inventor
Kazumasa Nakayama
一誠 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP29525093A priority Critical patent/JP3441129B2/en
Publication of JPH07148663A publication Critical patent/JPH07148663A/en
Application granted granted Critical
Publication of JP3441129B2 publication Critical patent/JP3441129B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE:To enable machining with high outside dimensional accuracy by applying blasting machining to a workpiece using an electrocast mask as a mask, and machining the workpiece in the depth direction to machine the machined face of the workpiece into the specified shape. CONSTITUTION:An electrocast mask 13 is attached to the plate face of a workpiece 11 using an adhesive 14. The adhesive layer thickness of the adhesive 14 used in this case is as thin as several mum, and the bonding strength is powerful enough not to separate the electrocast mask 13 and a piezoelectric base 11 from each other even if blasting machining is applied to the cladding of the electrocast mask 13 with the workpiece 11. Blasting machining is then applied from the electrocast mask 13 side so as to machine the same shape as the shape of the electrocast mask 13 on the workpiece 11. At this time, the electrocast mask 13, masking material, is machined simultaneously. Upon the termination of blasting machining, the electrocast mask 13 and the adhesive layer of the adhesive 14 are removed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、圧電振動子の微細加工
方法や非磁性材料よりなる薄膜ヘッドの微細加工方法に
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fine processing method for a piezoelectric vibrator and a fine processing method for a thin film head made of a non-magnetic material.

【0002】[0002]

【従来の技術とその課題】圧電振動子の加工方法として
化学エッチングや噴射加工を用いている。化学エッチン
グによって圧電振動子の外形加工を行うと、圧電基板の
結晶軸によってエッチング速度が異なるために、加工し
た断面の形状が垂直にならない。
2. Description of the Related Art Chemical etching and jet processing are used as a method for processing a piezoelectric vibrator. When the piezoelectric vibrator is externally processed by chemical etching, the shape of the processed cross section is not vertical because the etching rate varies depending on the crystal axis of the piezoelectric substrate.

【0003】それに対して噴射加工を用いて圧電振動子
の外形加工を行うと、断面形状が垂直になるという利点
がある。
On the other hand, when the outer shape of the piezoelectric vibrator is machined by using the jet machining, there is an advantage that the sectional shape becomes vertical.

【0004】噴射加工を用いて所定の形状の圧電振動子
を得るためには、基板上に所定の形状のマスキング材を
設置する必要がある。このマスキング材としては、感光
性の樹脂や、金属材料からなる化学的なエッチングによ
り形成した化学エッチングマスクなどを用いる。
In order to obtain a piezoelectric vibrator having a predetermined shape by using jet processing, it is necessary to install a masking material having a predetermined shape on the substrate. As the masking material, a photosensitive resin or a chemical etching mask made of a metal material by chemical etching is used.

【0005】一般に感光性の樹脂はフィルム状になって
おり、その樹脂フィルムの厚さは数10μmから100
μm程度である。そして圧電基板上に感光性樹脂のフィ
ルムを張り付け、露光、現像処理を行って所定形状にマ
スキング材を形成する。しかしながら、感光性樹脂のフ
ィルムの厚さが厚いと、マスキング材の外形寸法精度は
悪くなり、プラスマイナス10μm程度の誤差が生じ
る。
Generally, a photosensitive resin is in the form of a film, and the thickness of the resin film is from several tens of μm to 100.
It is about μm. Then, a film of a photosensitive resin is attached on the piezoelectric substrate, and exposure and development processing is performed to form a masking material in a predetermined shape. However, if the thickness of the photosensitive resin film is large, the accuracy of the external dimensions of the masking material is deteriorated, and an error of about ± 10 μm occurs.

【0006】したがって噴射加工を行う際、マスキング
材の外形寸法精度が圧電振動子の外形外形寸法の精度に
も影響を及ぼし、圧電振動子の外形寸法精度もプラスマ
イナス10μm以上となる。この結果、圧電振動子の基
本特性にも悪い影響をおよぼす。
Therefore, when performing the jetting process, the accuracy of the external dimensions of the masking material also affects the accuracy of the external dimensions of the piezoelectric vibrator, and the accuracy of the external dimensions of the piezoelectric vibrator becomes plus or minus 10 μm or more. As a result, the basic characteristics of the piezoelectric vibrator are also adversely affected.

【0007】また、感光性の樹脂をマスクとして利用
し、フォトリソグラフィーの工程を採用するため、製造
工程が複雑になるという課題がある。
Further, since a photosensitive resin is used as a mask and a photolithography process is adopted, there is a problem that the manufacturing process becomes complicated.

【0008】一方、金属材料からなる化学エッチングマ
スクは、圧電基板上に接着剤を用いて固着するため作業
性は良い。
On the other hand, the chemical etching mask made of a metal material has good workability because it is fixed on the piezoelectric substrate using an adhesive.

【0009】金属材料からなる化学エッチングマスクの
製造方法は、薄板の金属材料の両面に感光性の樹脂を形
成し、そして感光性の樹脂をパターニングして、それを
マスクとし、酸からなるエッチング液を用いて金属を溶
かして、所定形状を有する化学エッチングマスクを得
る。
A method of manufacturing a chemical etching mask made of a metal material is such that a photosensitive resin is formed on both surfaces of a thin metal material, and the photosensitive resin is patterned, and the photosensitive resin is used as a mask to form an etching solution containing an acid. Is used to melt the metal to obtain a chemical etching mask having a predetermined shape.

【0010】図2は金属材料からなる化学エッチングマ
スク21を示す断面図である。板厚がt=0.1mm程
度の化学エッチングマスクでは、図の開口寸法dや、開
口幅w加工精度はプラスマイナス20μmになる。
FIG. 2 is a sectional view showing a chemical etching mask 21 made of a metal material. In the case of a chemical etching mask having a plate thickness of about t = 0.1 mm, the opening dimension d and the opening width w processing accuracy in the figure are plus or minus 20 μm.

【0011】以上の説明のように、化学エッチングマス
ク21は、外形寸法精度が約プラスマイナス20μmと
悪いため、化学エッチングマスクを用いて噴射加工を行
った被加工物の外形精度も悪い。
As described above, since the chemical etching mask 21 has a poor external dimension accuracy of about ± 20 μm, the external accuracy of the workpiece that has been sprayed using the chemical etching mask is also poor.

【0012】また、図2に示すように、化学エッチング
マスク21の断面形状も垂直ではないため、砥粒が垂直
に加工物に対して噴射されないため加工物に対してマス
クの形状通りに転写されにくく、所望の外形寸法精度の
水晶片が得られない。
Further, as shown in FIG. 2, since the cross-sectional shape of the chemical etching mask 21 is also not vertical, the abrasive grains are not vertically jetted onto the workpiece, and thus the abrasive grains are transferred to the workpiece in the shape of the mask. It is difficult to obtain a crystal piece having a desired external dimension accuracy.

【0013】つぎに、薄膜ヘッドの浮上面の溝加工に関
しての従来の加工方法やその問題点について述べる。
Next, a conventional processing method for forming a groove on the air bearing surface of a thin film head and its problems will be described.

【0014】薄膜ヘッドの浮上面には所定形状の溝が設
けられている。薄膜ヘッドの浮上面の溝に空気が流れ込
むことにより、薄膜ヘッドとディスクの相対位置を安定
化させるための溝である。
A groove of a predetermined shape is provided on the air bearing surface of the thin film head. This is a groove for stabilizing the relative position between the thin film head and the disk by allowing air to flow into the groove on the air bearing surface of the thin film head.

【0015】薄膜ヘッドの溝は流体工学に基づいて設計
されるため、その外形寸法精度はプラスマイナス5μm
といったきびしい精度が要求される。現在、薄膜ヘッド
の浮上面の溝を加工する手法としてはワイヤソーや噴射
加工法がある。
Since the groove of the thin film head is designed on the basis of fluid engineering, the external dimension accuracy is plus or minus 5 μm.
Such severe accuracy is required. At present, there are a wire saw and a jet processing method as a method for processing the groove on the air bearing surface of the thin film head.

【0016】ワイヤーソーでは直線の溝加工しかできな
いが、噴射加工法を用いると曲線の溝加工などが可能と
なるため、流体工学的にも噴射加工を用いて作製した薄
膜ヘッドの方が流体力学的に安定する。
With a wire saw, only straight groove machining is possible, but when using the jet machining method, curved groove machining is possible. Therefore, in terms of fluid mechanics, the thin film head produced by jet machining is more fluid dynamics. Stable.

【0017】噴射加工による薄膜ヘッドの製造工程を以
下に説明する。薄膜ヘッドの材料であるアルミナチタン
カーバイト(Al23 −TiC)上に感光性の樹脂か
らなる厚さ数十μmのフィルムをラミネートし、露光現
像処理をし、感光性の樹脂を所定形状にパターニング
し、それをマスキング材として使用する。
The manufacturing process of the thin film head by jet processing will be described below. Alumina titanium carbide (Al 2 O 3 —TiC), which is the material for the thin film head, is laminated with a film of a photosensitive resin with a thickness of several tens of μm, exposed and developed to form the photosensitive resin into a predetermined shape. Then, it is used as a masking material.

【0018】その後に噴射加工を行い所定形状の溝を得
る。しかしながら、噴射加工による圧電振動子の加工時
と同様にマスキング材の外形寸法精度が、約プラスマイ
ナス10μmと悪い。
After that, injection machining is performed to obtain a groove having a predetermined shape. However, the external dimension accuracy of the masking material is about plus or minus 10 μm, which is bad as in the case of processing the piezoelectric vibrator by the jet processing.

【0019】よって薄膜ヘッドの浮上面の溝の外形寸法
精度は、約プラスマイナス10μmになり、薄膜ヘッド
の浮上面の溝の外形寸法精度に要求される寸法精度に満
たない。したがって、薄膜ヘッドとディスクの相対位置
も不安定な状態になる。
Therefore, the outer dimension accuracy of the groove on the air bearing surface of the thin film head is about ± 10 μm, which is less than the dimension accuracy required for the outer dimension accuracy of the groove on the air bearing surface of the thin film head. Therefore, the relative position between the thin film head and the disk also becomes unstable.

【0020】[0020]

【発明の目的】本発明の目的は、上記の課題を解決し
て、外形寸法精度の高い加工を可能とする噴射加工方法
を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and to provide an injection machining method which enables machining with high accuracy in external dimensions.

【0021】[0021]

【課題を解決するための手段】上記目的を達成するため
本発明の製造方法は下記記載の製造方法を採用する。
In order to achieve the above object, the manufacturing method of the present invention employs the manufacturing method described below.

【0022】本発明の製造方法は、被加工物の加工面上
に電鋳マスクを設置し、電鋳マスクをマスクとし、被加
工物のに対して噴射加工を行い、深さ方向に加工し、被
加工物の加工面を所定の形状に加工することを特徴とす
る。
According to the manufacturing method of the present invention, an electroformed mask is set on the processed surface of the work piece, and the electroformed mask is used as a mask to perform the jetting process on the work piece to perform the processing in the depth direction. The machined surface of the workpiece is machined into a predetermined shape.

【0023】[0023]

【実施例】以下図面により本発明の実施例を説明する。
図1は本発明による電鋳マスクを用いた噴射加工方法を
工程順に示す断面図である。
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a cross-sectional view showing, in the order of steps, a jet processing method using an electroformed mask according to the present invention.

【0024】まず図1(a)に示すように、被加工物で
ある圧電基板11の材料は、厚さ約100μmの水晶の
AT板である。
First, as shown in FIG. 1A, the material of the piezoelectric substrate 11, which is the workpiece, is a quartz AT plate having a thickness of about 100 μm.

【0025】なお被加工物である磁気ヘッドの材料であ
るアルミナチタンカーバイトは、図4に示すように、複
数枚を張り合わせて一枚の基板12とする。
As shown in FIG. 4, a plurality of alumina-titanium carbides, which are the material of the magnetic head which is the object to be processed, are laminated to form a single substrate 12.

【0026】つぎに図1(b)に示すように、電鋳マス
ク13の材料はニッケル−リンで形成する。電鋳マスク
13の厚さは約50μmで、ビッカース硬度は約100
0と非常に硬い。電鋳マスク13の外形寸法精度は約プ
ラスマイナス2μmと非常に精度は高い。
Next, as shown in FIG. 1B, the material of the electroformed mask 13 is nickel-phosphorus. The electroformed mask 13 has a thickness of about 50 μm and a Vickers hardness of about 100.
0 is very hard. The external dimension accuracy of the electroformed mask 13 is about ± 2 μm, which is extremely high.

【0027】ここで図1(b)に示す電鋳マスク13の
製造工程を簡単に示すとともに、電鋳マスク13の断面
形状に関して説明する。図3は電鋳マスクの製造工程を
示す断面図である。
Here, the manufacturing process of the electroformed mask 13 shown in FIG. 1B will be briefly described, and the sectional shape of the electroformed mask 13 will be described. FIG. 3 is a cross-sectional view showing the manufacturing process of the electroformed mask.

【0028】まず図3(a)に示すように、平坦な金属
基板31上に厚膜レジスト32を形成する。この場合、
金属基板31には銅などを用いる。厚膜レジスト32の
パターニング精度は約プラスマイナス2μmである。
First, as shown in FIG. 3A, a thick film resist 32 is formed on a flat metal substrate 31. in this case,
Copper or the like is used for the metal substrate 31. The patterning accuracy of the thick film resist 32 is about ± 2 μm.

【0029】つぎに図3(b)に示すように電解メッキ
で金属基板31上に電鋳マスク33を形成する。このと
き、厚膜レジスト32の断面は垂直なので電鋳マスク3
3の断面も垂直となる。なお、このときの電鋳マスク3
3材料には、ニッケル−リンなどが用いられる。
Next, as shown in FIG. 3B, an electroformed mask 33 is formed on the metal substrate 31 by electrolytic plating. At this time, since the cross section of the thick film resist 32 is vertical, the electroformed mask 3
The cross section of 3 is also vertical. The electroformed mask 3 at this time
Nickel-phosphorus or the like is used for the three materials.

【0030】そして図3(c)に示すように、厚膜レジ
スト32を剥離し、金属基板31上に電鋳マスク33を
形成する。
Then, as shown in FIG. 3C, the thick film resist 32 is peeled off, and an electroformed mask 33 is formed on the metal substrate 31.

【0031】最後に図3(d)に示すように、電鋳マス
ク33は溶けず、金属基板31は溶けるようなエッチン
グ溶液を用いて電鋳マスク33を得る。
Finally, as shown in FIG. 3D, the electroformed mask 33 is obtained by using an etching solution that does not dissolve the electroformed mask 33 but does dissolve the metal substrate 31.

【0032】このようにして、断面形状が垂直で、かつ
高精度の電鋳マスク33を得ることができる。
In this way, it is possible to obtain an electroformed mask 33 having a vertical sectional shape and high precision.

【0033】つぎに図1(c)に示すように、図1
(b)に示す電鋳マスク13を、接着剤14を用いて、
図1(a)に示す圧電基板1の板面に張り合わる。ここ
で使用する接着剤14の接着層の厚さは数μmと薄く、
接着強度は電鋳マスク13と圧電基板11を張り合わせ
たものに対して噴射加工を行っても、電鋳マスク13と
圧電基板11は剥離することが無いほど強力である。
Next, as shown in FIG.
The electroformed mask 13 shown in FIG.
It is attached to the plate surface of the piezoelectric substrate 1 shown in FIG. The thickness of the adhesive layer of the adhesive 14 used here is as thin as several μm,
The adhesive strength is so strong that the electroformed mask 13 and the piezoelectric substrate 11 are not separated even when the electroforming mask 13 and the piezoelectric substrate 11 are bonded together by jetting.

【0034】つぎに図1(d)に示すように、図1
(c)に示す電鋳マスク13と圧電基板11を張り合わ
せもの対して、電鋳マスク13の側より噴射加工を行
う。噴射ノズル15は電鋳マスク13から数cm離れた
ところにあり、噴射ノズル15より粒径が数μmから数
十μmの砥粒16を数Kgf/cm2 の圧力で噴射す
る。砥粒16の材料は炭化珪素やアルミナなどである。
Next, as shown in FIG.
The electroforming mask 13 and the piezoelectric substrate 11 shown in (c) are bonded to each other, and spraying is performed from the electroforming mask 13 side. The spray nozzle 15 is located several cm away from the electroforming mask 13, and sprays abrasive grains 16 having a particle size of several μm to several tens μm from the spray nozzle 15 at a pressure of several Kgf / cm 2 . The material of the abrasive grains 16 is silicon carbide, alumina, or the like.

【0035】すると電鋳マスク13の形状と同様の形状
を圧電基板11上に加工できる。このとき同時にマスキ
ング材である電鋳マスク13を加工することになるが、
圧電基板11の加工速度は、電鋳マスク13の加工速度
の数倍であるため、圧電基板11を所定の形状に加工し
終えるまで、電鋳マスク13は耐える。
Then, a shape similar to that of the electroformed mask 13 can be processed on the piezoelectric substrate 11. At this time, the electroforming mask 13 which is a masking material is processed at the same time.
Since the processing speed of the piezoelectric substrate 11 is several times the processing speed of the electroformed mask 13, the electroformed mask 13 withstands until the piezoelectric substrate 11 is processed into a predetermined shape.

【0036】つぎに図1(e)に示すように、噴射加工
が終了したら、電鋳マスク13と接着剤14の接着層を
除去する。噴射加工に要する加工時間は約数十分で、圧
電基板11の加工深さは数十μmである。
Next, as shown in FIG. 1 (e), when the spraying process is completed, the adhesive layer of the electroforming mask 13 and the adhesive 14 is removed. The processing time required for the jet processing is about several tens of minutes, and the processing depth of the piezoelectric substrate 11 is several tens of μm.

【0037】電鋳マスク13の外形寸法精度は約プラス
マイナス2μmと精度が良いため、加工後の圧電基板1
1の形状の外形寸法精度も約プラスマイナス2μmと非
常に良い。
Since the external dimension accuracy of the electroformed mask 13 is as good as about ± 2 μm, the piezoelectric substrate 1 after processing is good.
The external dimension accuracy of the shape 1 is about ± 2 μm, which is very good.

【0038】また、電鋳マスク13の断面が垂直である
ことから、噴射ノズル15より噴射される砥粒16は圧
電基板11に垂直に当たるため、電鋳マスク13の形状
通り高精度で加工できる。
Since the cross section of the electroformed mask 13 is vertical, the abrasive grains 16 ejected from the ejection nozzle 15 hit the piezoelectric substrate 11 perpendicularly, so that the electroformed mask 13 can be machined with high precision according to its shape.

【0039】さらに図1(f)に示すように、加工時間
を約1時間と長く設定することにより、圧電基板11の
断面形状はほぼ垂直となる。
Further, as shown in FIG. 1 (f), by setting the processing time as long as about 1 hour, the cross-sectional shape of the piezoelectric substrate 11 becomes substantially vertical.

【0040】図4に示すような、薄膜ヘッドの材料であ
るアルミナチタンカーバイトの基板12を複数枚張り合
わせて一枚の基板とした加工物に対しても、上記工程と
同様の加工工程を採用することにより、薄膜ヘッドの浮
上面の溝の外形加工を約プラスマイナス2μmの精度で
加工することができる。
The same processing steps as those described above are applied to a processed product, as shown in FIG. 4, which is made by laminating a plurality of substrates 12 of alumina titanium carbide, which is a material for a thin film head, into a single substrate. By doing so, the outer shape of the groove on the air bearing surface of the thin film head can be processed with an accuracy of about ± 2 μm.

【0041】また、加工物は圧電基板やアルミナチタン
カーバイトに限らず、セラミックスや、ガラスや、金属
などの基板に対して電鋳マスクを用いた噴射加工を行う
ことにより、所定の形状を約プラスマイナス2μmとい
う高精度で加工できる。
Further, the workpiece is not limited to the piezoelectric substrate and the alumina titanium carbide, but a predetermined shape can be obtained by subjecting the substrate such as ceramics, glass or metal to the jetting process using the electroforming mask. It can be processed with high accuracy of plus or minus 2 μm.

【0042】[0042]

【発明の効果】上記の説明のように本発明の製造方法に
よれば、噴射加工のマスクとして高精度の電鋳マスクを
被加工物上に設置することにより、圧電基板やアルミナ
チタンカーバイト基板から振動子の外形加工や薄膜ヘッ
ドの浮上面の溝の外形加工をプラスマイナス2μmとい
う高精度で加工することが可能となる。
As described above, according to the manufacturing method of the present invention, a piezoelectric substrate or an alumina titanium carbide substrate is provided by installing a high-precision electroformed mask as a mask for jet processing on a workpiece. Therefore, it is possible to perform the outer shape processing of the vibrator and the outer shape processing of the groove on the air bearing surface of the thin film head with high accuracy of plus or minus 2 μm.

【0043】さらにまた、本発明の製造方法では、マス
キング材もフォトリソグラフィー工程を用いず形成する
ことができるため、工程を簡素化でき工程数も少なくす
ることが可能であるという利点も付加的に生じる。
Furthermore, in the manufacturing method of the present invention, since the masking material can be formed without using the photolithography process, the process can be simplified and the number of processes can be reduced. Occurs.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例における電鋳マスクを用いた噴
射加工方法を工程順に示す断面図である。
FIG. 1 is a cross-sectional view showing, in the order of steps, an injection processing method using an electroformed mask according to an embodiment of the present invention.

【図2】金属製のエッチングマスクを示す断面図であ
る。
FIG. 2 is a cross-sectional view showing an etching mask made of metal.

【図3】電鋳マスクの製造工程を工程順に示す断面図で
ある。
FIG. 3 is a cross-sectional view showing the process of manufacturing an electroformed mask in the order of processes.

【図4】本発明の実施例における電鋳マスクを用いた噴
射加工方法を示す断面図である。
FIG. 4 is a cross-sectional view showing an injection processing method using an electroformed mask in an example of the present invention.

【符号の説明】[Explanation of symbols]

11 圧電基板 13 電鋳マスク 14 接着剤 15 噴射ノズル 16 砥粒 31 金属基板 33 電鋳マスク 11 Piezoelectric Substrate 13 Electroforming Mask 14 Adhesive 15 Injection Nozzle 16 Abrasive Grains 31 Metal Substrate 33 Electroforming Mask

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 被加工物の加工面上に電鋳マスクを設置
し、電鋳マスクをマスクとし、被加工物に対して噴射加
工を行い、被加工物を深さ方向に加工して被加工物の加
工面を所定の形状に加工することを特徴とする電鋳マス
クを用いた噴射加工方法。
1. An electrocast mask is set on a processed surface of a workpiece, and the electrocast mask is used as a mask to perform jet processing on the workpiece to machine the workpiece in a depth direction. An injection machining method using an electroformed mask, characterized in that the machined surface of a workpiece is machined into a predetermined shape.
【請求項2】 被加工物は、圧電振動子あるいは磁気ヘ
ッドであることを特徴とする電鋳マスクを用いた噴射加
工方法。
2. A jet processing method using an electroforming mask, wherein the work piece is a piezoelectric vibrator or a magnetic head.
JP29525093A 1993-11-25 1993-11-25 Injection processing method using electroformed mask Expired - Fee Related JP3441129B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29525093A JP3441129B2 (en) 1993-11-25 1993-11-25 Injection processing method using electroformed mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29525093A JP3441129B2 (en) 1993-11-25 1993-11-25 Injection processing method using electroformed mask

Publications (2)

Publication Number Publication Date
JPH07148663A true JPH07148663A (en) 1995-06-13
JP3441129B2 JP3441129B2 (en) 2003-08-25

Family

ID=17818162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29525093A Expired - Fee Related JP3441129B2 (en) 1993-11-25 1993-11-25 Injection processing method using electroformed mask

Country Status (1)

Country Link
JP (1) JP3441129B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002028867A (en) * 2000-07-18 2002-01-29 Sendai Nikon:Kk Blasting method
JP2003048160A (en) * 2001-08-09 2003-02-18 Tokyo Denki Univ Minute groove machining method and device therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002028867A (en) * 2000-07-18 2002-01-29 Sendai Nikon:Kk Blasting method
JP2003048160A (en) * 2001-08-09 2003-02-18 Tokyo Denki Univ Minute groove machining method and device therefor

Also Published As

Publication number Publication date
JP3441129B2 (en) 2003-08-25

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