JPH07148592A - Laser beam machine - Google Patents

Abstract

PURPOSE:To prolong the life of rails by positioning the centroid position of an arm mounted at a processing head on the rail parts disposed in the first axial direction of a laser oscillator. CONSTITUTION:A laser beam 4 outputted from a laser oscillator 16 is reflected by bend mirrors 17a to 17e and is condensed by a processing head 5 installed in the lower part of a Z-axis unit 21. A work piece 6 is irradiated with the condensed light. The Z-axis unit 21 is moved in the Y-axis direction and the Y-arm 18 is moved in the X-axis direction and then, the laser processing head 5 is moved in an arbitrary direction on an X-Y plane and the work piece 6 is subjected to laser beam processing to an arbitrary shape. The Y-arm 18 is formed by making its front end fine and thin in thickness and is so composed that the gravity position of the Y-arm 18 exists between the X-axis rails 24a and 24b regardless of the position where a Z-axis unit 21 exits. As a result, the degradation in processing accuracy by vibration at the time of movement is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical scanning laser processing machine for processing a workpiece by moving a processing head.

[0002]

2. Description of the Related Art FIG.
FIG. 23 is a schematic view showing a conventional cantilever beam type optical scanning laser processing machine shown in Japanese Patent Publication No. 89, and FIG. 23 is a plan view thereof. In the figure, 1 is a Y-arm movable in the Y-axis direction, 2 is a Y-axis rail disposed below the Y-arm 1, 3 is a Y-axis rail receiver for receiving the Y-axis rail 2, 4
Is a laser beam, 5 is a laser beam 4 which is focused on the workpiece 6
A processing head for irradiating the upper part, 7 is a bend mirror (7a ... First bend mirror, 7b ... Second bend mirror) that reflects the laser beam 4 and guides it to the processing head 5, and 8 is an optical path of the Y arm 1. A Y-axis bellows that covers the opening and the drive unit, and the Y-axis rail receiver 3 is attached to 9
A holding plate that holds the arm 1 and its driving portion and is movable in the X-axis direction, 10 is an X-axis rail, 11 is an X-axis rail receiver that is attached to the lower part of the holding plate 9 and receives the X-axis rail 10, 12 is an X-axis bellows that covers the X-axis direction drive unit, 13 is a processing table that holds the workpiece 6, 14 is a pedestal that supports the entire workpiece, 15 is a processing chamber, 16
Is a laser oscillator that outputs the laser beam 4.

Next, the operation will be described. The Y-arm 1 can be moved in the Y-axis direction by a Y-axis rail attached to the lower part of the Y-arm 1 and a Y-axis rail receiver 3 attached to the holding plate 9. Further, the holding plate 9 holds the Y arm 1 and its driving portion, and supports the whole base 14.
It is movable in the X-axis direction by the X-axis rail 10 attached to the and the X-axis rail receiver 11 attached to the lower part of the holding plate 9. On the other hand, the laser light 4 output from the laser oscillator 16 is stored in the Y arm 1 and fixed to the holding plate 9 (thus, even if the Y arm 1 moves in the Y axis direction, it does not move). The second bend mirror 7b is reflected by the bend mirror 7a and the second bend mirror 7b attached to the tip of the Y arm 1.
Is guided to the processing head 5 attached to the lower part of. The laser beam 4 is condensed by the processing head 5, and the pedestal 1
The workpiece 6 held by the processing table 13 fixed on the workpiece 4 is irradiated.

At this time, by moving the Y arm 1 in the Y-axis direction and the holding plate 9 in the X-axis direction, the machining head 5 can be moved in the arbitrary axis direction on the XY plane. The workpiece 6 can be processed into any shape. Further, a Y bellows 8 is provided in the opening and the drive section of the Y arm 1, and an X bellows 1 is provided in the X axis direction drive section.
2 are attached respectively to prevent dust. Also, Y
The processing room 15 covers the movable area of the arm 1 and the entire processing area.
We are taking safety measures.

Since the conventional cantilever structure type optical scanning laser processing machine shown in FIG. 22 is constructed as described above, in order to move the processing head in the Y-axis direction, the Y arm itself is moved. However, since the weight of the moving part becomes large, the vibration of the moving part in the Y-axis direction becomes large, which adversely affects the processing accuracy. Further, since the movement range of the Y-arm in the Y-axis direction is hard to understand, it is easy to collide with a human body or an object, which is a safety problem.

For this reason, a laser processing machine which can solve this problem, that is, a laser processing machine in which a processing head is provided on a Y arm which can move in the X-axis direction and only this processing head is movable in the Y-axis direction. Are disclosed in JP-A-61-2242782 and JP-A-5-77075.

As another conventional example, a laser oscillator for oscillating laser light is provided, and a first plane intersecting with the axis of the laser light, a second plane intersecting with the first plane, and a second plane intersecting with the first plane. A third plane intersecting the plane, a fourth plane intersecting the third plane, and a fifth plane intersecting the fourth plane.
A first bend mirror for receiving a laser beam on the first plane so that an optical axis is formed on each of the first plane and the first bend mirror at the intersection of the first plane and the second plane. A second bend mirror is provided so as to face the mirror, a third bend mirror is provided at an intersection of the second plane and the third plane, and a third bend mirror is provided so as to face the second bend mirror. A fourth bend mirror is provided at the intersection of the plane and the fourth plane so as to face the third bend mirror, and a fourth bend mirror is provided at the intersection of the fourth plane and the fifth plane. Fifth bend mirrors are disposed so as to face each other, and an optical axis distance between the second bend mirror and the third bend mirror and the fourth bend mirror and the fifth bend mirror are provided. A laser processing machine in which the optical axis distance between the two is changed is disclosed in JP-A-63-16.
No. 894, etc.

As another conventional example, a mirror for receiving a linearly polarized laser beam output from a laser oscillator is
A laser processing machine using a circularly polarized mirror is disclosed in JP-A-61-29.
It is disclosed in Japanese Patent No. 6985.

As still another conventional example, by moving a laser processing head having a bend mirror and a condenser lens, the length of the laser beam from the laser oscillator to the processing point for performing laser processing on a workpiece is changed. In a changing laser processing machine, a laser processing machine that makes a diameter of a laser beam and a focal length of a condenser lens substantially constant by providing a collimator device movable by a drive motor between a laser oscillator and a laser processing head. However, JP-A-4-3
It is disclosed in Japanese Patent No. 27394.

Still another conventional example is shown in FIGS.
There is one shown in 5. FIG. 24 shows, for example, Japanese Patent Laid-Open No. 5-69.
FIG. 25 is a plan view showing a conventional optical scanning laser processing machine shown in Japanese Patent Publication No. 170, and FIG. 25 is a front view thereof. In the figure, the laser processing machine is a base 2 provided on the floor surface 103.
7, a first work table 107a and a second work table 107b arranged on both sides of the base 27, and a large number of support pillars 11 are erected upright in a sword mountain shape on their upper portions, The first workpiece W is placed on top of it
a, the second workpiece Wb is placed. Next, the guide rail 24 is attached to the upper surface of the base 27 in the X-axis direction,
An X-axis carriage 115 is provided on the guide rail 24 via a guide 117 so as to be slidable in the X-axis direction.
Next, the X-axis carriage 115 is provided with a hollow hole 129 having a rectangular cross section in the Y-axis direction, and a beam-shaped Y-axis carriage 131 having a rectangular cross section and long in the Y-axis direction is attached thereto. It is slidable in the Y-axis direction via a slide rail 133 and a guide 135. In addition, the first housing 147 is provided at both ends of the Y-axis carriage 131.
a and a second housing 147b are provided, and a first laser processing head 149a and a second laser processing head 149 are provided on the first housing 147a and the second housing 147b.
b is held vertically. On the other hand, the laser oscillator 16 causes the laser beam LB emitted from the floor 103 to be emitted.
Are arranged at a height above the X-axis carriage 115 and guided in the X-axis direction. Telescopic beam conduit 157 (Fig. 2
4, only a part is shown in FIG. A beam splitter 15 including a half mirror 161 for guiding the laser beam LB through the inside of the bracket) and a total reflection bend mirror 165.
9. A beam conduit 157 on the right side for guiding the laser beam LB divided into approximately half here, a first final-stage bend mirror 163a supported by the first housing 147a, and a left side for guiding the laser beam LB on the other half. Beam conduit 157
And a second final-stage bend mirror 163b supported by the second housing 147b, and first and second final-stage bend mirrors 163 for vertically refracting the laser beam LB guided to each.
a, 163b, first and second housings 147 for further guiding
a, 147b, and finally, these laser beams LB are focused and focused on the first workpiece Wa and the second workpiece Wb.
The above-described first and second processing heads 14 for performing laser processing
9a and 149b are installed.

Next, the operation will be described. The X-axis carriage 115 has a guide rail 2 attached to the bottom thereof.
4. It can be moved in the X-axis direction by the guide 117. Further, the Y-axis carriage 131 can be moved in the Y-axis direction by a slide rail 133 and a guide element 135 provided therein. On the other hand, the laser beam LB emitted from the laser oscillator 16 passes through an expandable beam conduit 157 and reaches a beam splitter 159 having a half mirror 161 and a total reflection bend mirror 165. In this beam splitter 159, almost half of the laser beam LB that has entered the half mirror 161 from the X-axis direction is introduced into the first final stage bend mirror 163a supported by the first housing 147a on the right side through the beam conduit 157. , The remaining half of the laser beam LB is transmitted as it is and is incident on the total reflection bend mirror 165 in the beam splitter 159 to the second final stage bend mirror 163b supported by the second housing 147b on the left side.
Introduce through 7. First and second final-stage bend mirror 16
The laser beam LB guided to 3a, 163b is refracted downward in the vertical direction, and is refracted in the first and second housings 147a, 147.
b through the first and second processing heads 149a, 1b.
The light beam is condensed at 49b, and the first workpiece Wa and the second workpiece Wb are collected.
Laser irradiation is performed by irradiating the laser beam in a concentrated manner. At this time, X
By moving the axis carriage 115 in the X-axis direction and moving the Y-axis carriage 131 in the Y-axis direction, it is possible to move the axis carriage 115 in an arbitrary direction on the XY plane. Therefore, the first and second workpieces Wa , Wb can be processed into any shape. In addition, the laser beam LB emitted from one laser oscillator 16 is first and second laser beams by the beam splitter 159.
Since the laser processing heads 149a and 149b are separately introduced, the two first and second workpieces Wa and Wb can be simultaneously and continuously machined in large numbers.

[0012]

The conventional laser beam machine as described above is shown in FIG. 22 as disclosed in JP-A-61-2242782 and JP-A-5-77075. You can eliminate the above disadvantages that you have,
Since the position of the center of gravity of the Y arm is always outside the pair of X-axis rails, the difference in the load applied to each rail and the bending moment are large, and there is a problem in terms of the life of the rail and the rail receiver.

Further, the laser processing machines disclosed in JP-A-63-16894 and JP-A-61-296985 reduce the circular polarization rate while transmitting the circularly polarized laser light to the processing point. There was a problem that it would end up.

Further, in the laser processing machine disclosed in Japanese Patent Application Laid-Open No. 4-327394, it is necessary to move the collimating device by the drive motor, so that the beam diameter change in the movable range of the processing head is reduced. However, there is a problem that the method of becomes complicated.

Further, in the laser processing machine shown in FIGS. 24 and 25, in order to move the processing head in the Y-axis direction, the Y-axis carriage itself must be moved,
Since the weight of the moving part becomes large and the balance is unbalanced, the vibration at the time of moving in the Y-axis direction becomes large, which adversely affects the processing accuracy.

Further, in the laser beam machine shown in FIGS. 24 and 25, since it is intended to process two workpieces simultaneously and continuously in a large number of workpieces having the same shape, different workpieces are processed. The problem that composite processing is not possible, and
Since the laser beam is split in half by the beam splitter, the laser oscillator output is 2
There was a problem that it was required more than twice.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a cantilever structure type laser processing machine capable of extending the life of rails and rail receivers. And

Another object of the present invention is to provide a laser processing machine capable of transmitting circularly polarized laser light to a processing point without lowering the circular polarization rate.

It is another object of the present invention to provide a laser beam machine which has a simple structure and can reduce the change in beam diameter in the movable range of the machining head.

A further object of the present invention is to provide an optical scanning laser processing machine which can eliminate the imbalance of the weight of the Y-axis carriage when the processing head moves in the Y-axis direction and the reduction of the processing accuracy due to vibration.

It is another object of the present invention to provide an optical scanning type laser processing machine capable of carrying out combined processing of a plurality of lines and different kinds of workpieces with one laser processing machine.

It is another object of the present invention to provide an optical scanning type laser processing machine capable of realizing a low output due to laser beam splitting for processing a plurality of lines and an optical path structure for preventing an increase in laser oscillator output due to the laser beam division. To do.

[0023]

The invention according to claim 1 of the present invention is a laser processing machine for processing by moving a processing head for irradiating a laser beam to move the laser beam on a workpiece. In, a laser oscillator, an arm movably provided in a first axial direction on a rail portion arranged in the first axial direction, and a second arm orthogonal to the first axis in a plane. A machining head that is movable in the axial direction, and a first bend mirror and a second bend mirror that receive laser light output from a laser oscillator on the first axis.
A third bend mirror and a fourth bend mirror are provided on the arm, and a fifth bend mirror is provided on the processing head to form a laser optical path, and the barycentric position of the arm is set to the rail portion. It is located above.

According to a second aspect of the present invention, in the laser beam machine according to the first aspect, the first bend mirror that first receives the laser beam output from the laser oscillator is provided with at least a second axis. It is supported so as to be movable in a third axial direction orthogonal to.

The invention according to claim 3 of the present invention is a laser processing machine for processing a laser beam on a workpiece by moving a processing head for irradiating the laser beam. A cantilever arm provided movably in the first axial direction on a rail portion arranged in the first axial direction, and the cantilever arm is orthogonal to the first axis in a plane. A housing provided movably in a second axial direction, and a machining head built in the housing and movable in a direction perpendicular to the plane, wherein the cantilever arm has the first A wing-shaped cantilever beam arm that is substantially symmetrical with respect to an axis about the axis is formed, its center of gravity is positioned on the rail portion, and a plurality of processing lines are provided. .

According to a fourth aspect of the present invention, in the laser beam machine according to the third aspect, a plurality of lines share one housing which moves on the double-wing cantilever arm. It is a thing.

According to a fifth aspect of the present invention, in the laser beam machine according to the third aspect, each of the plurality of lines is individually provided with a housing that moves on the double-wing cantilever arm. It is a thing.

According to a sixth aspect of the present invention, in the laser beam machine according to the fifth aspect, the optical path of the laser light guided to a plurality of lines can be switched by a beam switching device.

According to a seventh aspect of the present invention, in the laser processing machine according to the fifth aspect, one of the housings has a processing device other than the laser processing.

The invention according to claim 8 of the present invention is the laser processing machine according to any one of claims 1 to 7, wherein a rotary table is provided outside the movable range of the processing head.

According to a ninth aspect of the present invention, in the laser beam machine according to the eighth aspect, means for moving up and down or sliding the rotary table body is provided.

The invention according to claim 10 of the present invention is
In the laser processing machine according to any one of claims 1 to 9, an elevation roller is provided on the processing table.

The invention according to claim 11 of the present invention is
The laser beam machine according to claim 10 is provided with a means for driving the roller body of the elevating roller.

The invention according to claim 12 of the present invention is
A first plane intersecting with the axis of the laser beam, a second plane intersecting with the first plane, and a second plane intersecting with the second plane. A laser beam is received on the first plane so that optical axes are respectively formed on the third plane, the fourth plane intersecting with the third plane, and the fifth plane intersecting with the fourth plane. A first bend mirror is provided at an intersection of the first plane and the second plane, and a second bend mirror is provided so as to face the first bend mirror, the second plane and the third plane. A third bend mirror facing the second bend mirror at the intersection with the second flat mirror, and the third plane and the fourth bend mirror.
A fourth bend mirror so as to face the third bend mirror, and a fourth bend mirror at an intersection between the fourth plane and the fifth plane. Fifth bend mirrors are arranged so as to face each other, and an optical axis distance between the second bend mirror and the third bend mirror and the fourth bend mirror and the fifth bend mirror are provided. In the laser processing machine in which the optical axis distance between the first and second bend mirrors is changed, the first bend mirror is a circular polarization mirror, and the second to fifth bend mirrors cancel the phase shift amount unique to the bend mirror. It is arranged as follows.

The invention according to claim 13 of the present invention is
In the laser beam machine according to claim 12, the first bend mirror is supported by an XY movement adjusting mechanism.

The invention according to claim 14 of the present invention is
In the laser beam machine according to claim 12 or 13, the second to fifth bend mirrors are ES or PS coating mirrors.

[0037]

In the laser beam machine constructed as described above, it is possible to reduce the difference in the load applied to each of the pair of rails supporting the arms and the load moment.

Further, the first bend mirror can be moved according to the height of the optical axis of the laser oscillator.

Further, the unbalance of the arm weight and the deterioration of the processing accuracy due to the vibration during the movement can be eliminated, and a plurality of processing lines can be formed by one laser processing machine.

Further, the processing of a plurality of lines can be efficiently constructed at low cost.

Further, a plurality of lines of work can be processed continuously and efficiently.

Further, the laser beams guided to a plurality of lines can be quickly switched.

Further, for example, if the first line is a tapping primary processing line and the other lines are secondary processing lines for sheet metal by laser processing after primary processing, one unit forming these plural lines The processing system enables the production of high value-added products.

Further, it is possible to perform laser processing on a workpiece having a cylindrical shape while preventing interference with the processing head.

When the workpiece placed on the machining table is large, the rotary table body is retracted so as not to interfere with the loading and unloading of the workpiece.

Further, the work piece placed on the working table can be easily moved.

Further, the loading and unloading of the workpiece placed on the processing table can be automated.

Further, the circularly polarized laser light is transmitted to the processing head without lowering the circular polarization rate.

Further, the laser beam can be made incident on the center of the second bend mirror while maintaining the angle of the first bend mirror where the circular polarization rate becomes good.

Further, the circularly polarized laser light is transmitted to the processing head with a reduced output attenuation during the transmission without a decrease in the circular polarization rate.

[0051]

【Example】

Example 1. Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
Will be explained. 1 is a perspective view showing the entire optical scanning laser processing machine according to the first embodiment of the present invention. In this perspective view, some parts and mechanisms are omitted in order to avoid complicating the drawing. Although not shown, the omitted parts and mechanisms are shown in FIGS. 2 to 5. That is, FIG. 2 is a perspective view showing the details of the X-, Y-, and Z-axis direction moving mechanism of the first bend mirror, FIG. 3 is a front view showing the details of the counter bellows portion of the Y-axis optical path, and FIG. FIG. 5 is a diagram showing the installation of a blower for making the negative pressure negative, and FIG. 5 is a diagram showing details of the elevating type rollers for conveying the work piece in the X-axis direction. Further, FIG. 6 is a perspective view showing an optical path system configuration formed by the first to fifth bend mirrors and a collimation lens, and FIG. 7 is a perspective view for explaining a phase shift amount canceling principle by the bend mirrors. FIG. 8 is a diagram showing beam propagation characteristics when a collimation lens or a collimation mirror is installed.

In the figure, 17a to 17e reflect the laser light outputted from the laser oscillator 16 to reflect the machining head 5
Bend mirror leading to (17a ... 1st bend mirror, 1
7b ... second bend mirror, 17c ... third bend mirror, 17d ... fourth bend mirror, 17e ... fifth bend mirror), and the first bend mirror 17a and the second bend mirror 17b are X. The third bend mirror 17c and the fourth bend mirror 17d are disposed at the ends on the axis.
Is disposed on the Y arm 18, and the fifth bend mirror 17e is disposed on the processing head 5. The bend mirrors 17a to 17e are the first bend mirror 17
a is a circular polarization mirror (+ 90 ° retarder), and the second bending mirror 17a allows the laser light 4 circularly polarized by the first bend mirror 17a to be transmitted to the processing head 5 without decreasing the circular polarization rate. Bend mirror 17b and third
The bend mirror 17c and the fourth bend mirror 17d and the fifth bend mirror 17e are arranged so that the phase shift amounts cancel each other. The principle of canceling the phase shift amount will be described later mainly with reference to FIG. 7. The second bend mirror 17b to the fifth bend mirror 17e are composed of metal mirrors such as commonly used copper mirrors.

Further, as shown in FIG. 6, the collimation lens 39 has a beam waist between the second bend mirror 17b and the third bend mirror 17c and in the vicinity of the intermediate position of the movable range of the processing head 5. It is placed in the position. Further, the first bend mirror 17a has an angle adjusting function, and its details are shown in FIG.
The mechanism is movable in the axial and Z-axis directions. In FIG. 2, 70a, 70b and 70c are lock screws for fixing members to be moved in the X-axis, Y-axis and Z-axis directions, 71
Is a Y-axis direction moving member, and 72 is the Y-axis direction moving member 71.
, 73 is a Z-axis direction moving member, and 74 is a bend block which holds the first bend mirror 17a.

Reference numeral 18 denotes a Y arm which is fixed in the Y axis direction and movable in the X axis direction, and which includes a third bend mirror 17c and a fourth bend mirror 17c.
The bend mirror 17d is supported at its base as shown in FIG. Further, the Z-axis unit 21 including the processing head 5
The Y arm 18 for movably mounting on the Y axis has a thin tip portion and a thin wall thickness, so that the center of gravity of the Y arm 18 is the same as that of the X axis rail 24a described later regardless of the position of the Z axis unit 21. It is configured to be located between 24b. 19a and 19b are the Y arms 18
The pair of Y-axis rails 20a and 20b arranged on the upper side are Y
A pair of Y-axis rail receivers for receiving the shaft rails 19a, 19b, 21 is provided with Y-axis rail receivers 20a, 20b,
A Z-axis unit movable on the Y-arm 18 in the Y-axis direction and having a function of moving the machining head 5 up and down supports a fifth bend mirror 17e on the upper part thereof.

Reference numeral 22 is a dust-proof Y-axis bellows for covering a Y-axis drive portion (not shown) including the Y-axis rails 19a, 19b and Y-axis rail receivers 20a, 20b, and 23 is a Y-axis optical path (fourth bend mirror). A dust-proof Y-axis optical path bellows that covers between 17d and the fifth bend mirror 17e), and the details of this portion are configured as shown in FIG. That is, as shown in FIG. 3, the fifth bend mirror 17e is covered with a box 34, and a counter bellows 35 fixed by a fixing metal fitting 36 on the side opposite to the Y-axis optical path bellows 23 across the box 34 is continuous in the internal space. In this state, when the Z-axis unit moves in the Y direction, the pressure inside the bellows does not change, thereby preventing the ambient air from being sucked into the bellows.

Further, 24a and 24b are a pair of X axis rails arranged on the X axis, 25a and 25b are attached to the lower surface of the end of the Y arm 18, and X axis rail receivers for receiving the X axis rails 24a and 24b, 26 is an X-axis rail 24a, 24b
And an X-axis drive (not shown) including the X-axis rail receivers 25a and 25b, and an X-axis optical path (second bend mirror 17b).
And the third bend mirror 17c) between the dustproof X
A shaft bellows, 27 is a pedestal on which the X-axis rails 24a and 24b are arranged, and which supports all of the above-mentioned components as a whole, and 28 is a rotary table for holding and rotating a workpiece 29 mainly having a cylindrical shape, which is large. It is arranged outside the movable range of the processing head 5 on the processing table 31 so as not to interfere with the loading and unloading of the workpiece 6, and is supported by an actuator 75 such as an air cylinder so as to be able to move up and down. The rotary table 28 may be configured to slide in the retreating direction without being moved up and down, or may be separated from the processing table 31 by providing a dedicated mount for the rotary table 28.

Further, 30 is a knife-edge-like support which mainly holds the flat plate-like workpiece 6, 31 is a working table, and FIG.
As shown in, by providing the blower 48 for making the inside of the processing table 31 a negative pressure, dust generated during processing,
It is configured to be able to suck and discharge fume and the like. Further, since the laser processing machine is an optical scanning type and the processing table 31 is a fixed type that does not move independently, the processing table 31 can be arbitrarily changed according to the shape, size, etc. of the workpiece 6. . Further, as shown in FIG. 5, an actuator 76 such as an air cylinder is mounted on the machining table 31 so that the workpiece 6 can be lifted after the machining is completed and the workpiece 6 can be lifted from the knife edge support 30 and manually moved in the X direction. An elevating roller 49 is provided so that it can be moved up and down. The lifting roller 49 has a free bear structure so that the workpiece 6 can be moved in any horizontal direction.

Next, the operation and action of this cantilever beam type optical scanning laser processing machine will be described. That is, in FIG. 1, the Y-arm 18 does not move in the Y-axis direction, and the Z-axis unit 21 moves in the Y-axis direction by the Y-axis rail receivers 20a and 20b. 19
Move on b. Further, the Y-arm 18 has X-axis rail receivers 25a and 25b installed on the lower surface of the end thereof, and is movable in the X-axis direction on the X-axis rails 24a and 24b arranged on the mount 27. On the other hand, the laser beam 4 output from the laser oscillator 16 is reflected by the bend mirrors 17a to 17e, collected by the processing head 5 installed below the Z-axis unit 21, and held by the knife edge support 30. The workpiece 6 is irradiated. At this time, by moving the Z-axis unit 21 in the Y-axis direction and moving the Y arm 18 in the X-axis direction, the laser processing head 5 is moved to the XY direction.
Since it can be moved in any direction on the plane, the workpiece 6 can be laser processed into any shape.

In this laser processing machine, the Z-axis unit 21 including the processing head 5 is mounted so as to be movable in the Y-axis direction.
The arm 18 is configured such that its center of gravity is located between the X-axis rails 24a and 24b regardless of the position where the Z-axis unit 21 is present by making the tip portion thin and thin. Therefore, the load applied to the Y arm 18 or the like is applied to the X-axis rail 24a and the X-axis rail 24b substantially evenly, and the X-axis rail receiver 2
5a and the X-axis rail receiver 25b are almost evenly applied.

Further, the workpiece 2 mainly having a cylindrical shape
A turntable 28 capable of holding and rotating 9
Is installed, the workpiece 29 mainly having a cylindrical shape can be held and similarly processed while rotating. At this time, since the processing height is higher than that of the plate-shaped workpiece 6, the Z-axis unit 21 raises the processing head 5 to perform processing. Further, the rotary table 28 is arranged outside the movable range of the processing head 5 so as not to obstruct the loading and unloading of the large workpiece 6, and is further lifted in the retreating direction by the actuator 75 such as an air cylinder. Or it is supported so that it can slide. Therefore, in the case of laser processing that does not use the rotary table 28, the rotary table 28 does not interfere. It should be noted that the rotary table 28 is not completely movable even if it is arranged outside the movable range of the machining head 5 without being made movable up and down or slidably, but it does not prevent the large workpiece 6 from being carried in and out. be able to.

Further, as shown in FIG. 5, the processing table 31 is provided with an elevating roller 49 which is moved up and down by an actuator 76 such as an air cylinder. If the workpiece 6 is lifted from the knife edge-shaped support 30, the workpiece 6 can be easily moved manually in the X-axis direction. Also,
When the workpiece 6 is carried in, if the elevating roller 49 is raised to a position where the roller portion is higher than the tip of the knife edge support 30, the workpiece 6 can be easily carried in.

This laser processing machine also adjusts the circular polarization rate,
The first bend mirror 17a for facilitating optical axis adjustment and the like.
Is a circular polarization mirror (+ 90 ° retarder). During this laser processing, the laser beam 4 circularly polarized by the first bend mirror 17a can be transmitted to the processing head 5 without being reduced in circular polarization rate.
In the bend mirrors 17b to 17e, the second bend mirror 17b and the third bend mirror 17c and the fourth bend mirror 17d and the fifth bend mirror 17e cancel the phase shift amount. The laser beam 4 circularly polarized by the first bend mirror 17a is transmitted to the processing head 5 without lowering the circular polarization rate.

The principle of cancellation is as shown in FIG.
The laser beam 4 immediately after being circularly polarized by the first bend mirror has a phase difference of 90 ° between the S wave component and the P wave component, but is reflected by the second bend mirror and the direction thereof is changed. Then, due to the peculiar phase shift amount ΔPS ° of the bend mirror, the phase of the P wave component is further advanced by ΔPS °. However, the third bend mirror, on the contrary, has the S wave component of ΔPS °.
If it is arranged so that the phase is advanced by PS °,
The direction-converted laser light 4 reflected by the third bend mirror has an S-wave component of 0 ° + ΔPS ° and a P-wave component of 90 ° + ΔPS °, and is between the S-wave component and the P-wave component. The phase difference is 90 ° and does not lower the circular polarization rate. Due to such a principle of cancellation, the laser beam 4 circularly polarized by the first bend mirror 17a in the mirror structure of the present invention is transmitted to the processing head 5 without lowering the circular polarization rate. In the first embodiment, the laser beam 4 circularly polarized by the first bend mirror 17a and having a phase difference of 90 ° between the S wave component and the P wave component is transmitted to the second bend mirror 17b. When reflected and converted in direction, the p-wave component is advanced in phase by ΔPS ° due to the peculiar phase shift amount ΔPS ° of the bend mirror.
When the light is reflected by the mirror and the direction is changed, the P-wave component is further increased by ΔP due to the inherent phase shift amount ΔPS ° of the bend mirror.
Although the phase is advanced by S °, the fourth bend mirror 17d is arranged so that the S wave component is advanced by ΔPS °, and the fifth bend mirror 17e is arranged by the S bend component. Are arranged so that the phase is further advanced by ΔPS °. That is, the S-wave component of the laser light 4 reflected by the fifth bend mirror 17e and having its direction changed is 0.
The phase difference between the so-called S wave component and the P wave component is 90 so that the P wave component becomes 90 ° + 2ΔPS °.
The fourth bend mirror 17d and the fifth bend mirror 17e are arranged so as to be at .degree ..

Further, the first bend mirror 17a has an angle adjusting function, and as shown in detail in FIG.
Since the mechanism is movable in the axial, Y-axis, and Z-axis directions, the lock screw 70a is loosened when adjusting the angle of the first bend mirror 17a for adjusting the circular polarization rate. By moving the lock screw 70b in the X-axis direction and by loosening the lock screw 70b.
Can be moved in the Y-axis direction, so that the second bend mirror 1 can be moved in a state where the angle with the best circular polarization is maintained.
The laser light 4 can be made incident on the center of 7b.

Since the first bend mirror 17a is supported by a mechanism movable in the Z-axis direction as shown in FIG. 2 in detail, the lock screw 70c is loosened so that the laser oscillator 16 of the laser oscillator 16 is released. After installation, the first bend mirror 17a can be easily adjusted up and down according to the height center of the laser beam 4.

In this laser processing machine, as shown in FIG. 6, the collimation lens 39 is provided between the second bend mirror 17b and the third bend mirror 17c and at an intermediate position in the movable range of the processing head 5. Since it is arranged in a position having a beam waist in the vicinity, as shown in FIG. 8, the beam diameter change in the movable range of the processing head 5 is very small.

Example 2. In the first embodiment described above, the second bend mirror 17b to the fifth bend mirror 17 are provided.
The laser beam 4 circularly polarized by the first bend mirror 17a is obtained by setting e as the above-described arrangement configuration that cancels all the phase shift amounts specific to the second bend mirror 17b to the fifth bend mirror 17e. Is transmitted to the processing head 5 without lowering the circular polarization rate. For this reason, in this configuration, as the second bend mirror 17b to the fifth bend mirror 17e, a metal mirror such as a copper mirror that is generally used is used as compared with a metal mirror that is generally used although the amount of phase shift is large. ES (ENHANCED SILVER) with high reflectance
Coating mirror or PS (PROTECTED)
Even if the mirror is replaced with a SILVER coating mirror, the laser beam 4 circularly polarized by the first bend mirror 17a
Can be transmitted to the processing head 5 without reducing the circular polarization rate (due to the principle of canceling the amount of phase shift explained in FIG. 7) and reducing the output attenuation during transmission.

Incidentally, the second bend mirror 17b to the fifth bend mirror 17e arrangement configuration cancels all the phase shift amounts peculiar to the second bend mirror 17b to the fifth bend mirror 17e. If not,
Second bend mirror 17b to fifth bend mirror 17e
As a result, when the metal mirror is changed to the ES coating mirror or the PS coating mirror, the output attenuation during the transmission can be reduced, but since the phase shift amount of the ES coating mirror or the PS coating mirror is large, it is transmitted to the processing head 5. The circular polarization rate drops significantly on the way.

Example 3. Further, in the above-described Example 1, as shown in FIG. 6, the collimation lens 39 is
The second bend mirror 17b and the third bend mirror 17c
, And at a position having a beam waist near the intermediate position of the movable range of the processing head 5, as shown in FIG. 9, instead of the collimation lens 39, a plane mirror 40 and a collimation 41 are provided. , When the beam waist is arranged between the second bend mirror 17b and the third bend mirror 17c and near the middle position of the movable range of the processing head 5, as shown in FIG. The change in beam diameter in the movable range of the head 5 can be extremely reduced.

Example 4. Further, by providing a concave lens 42 between the second bend mirror 17b and the collimation lens 39 as shown in FIG. 10, or by using a convex mirror 43 instead of the plane mirror 40 as shown in FIG. , As shown in FIG.
By increasing the beam waist in the vicinity of the intermediate position of the movable range of the processing head 5, it is possible to reduce the change in the beam diameter in the movable range of the processing head 5 and to condense the beam because the beam diameter is large. The diameter can be reduced.

Example 5. In addition, as shown in FIG. 13, the positions of the first bend mirror 17a and the second bend mirror 17b are moved in the Y direction, and a pair of reversing mirrors is provided between the first bend mirror 17a and the third bend mirror 17c which are reversed. 37a,
An inverted mirror storage box 38 accommodating 37b is provided,
If the Y arm 18 is moved in the same direction by ½ of the X direction moving distance, the transmission distance of the laser beam 4 from the first bend mirror 17a to the fourth bend mirror 17d can be made constant. Yes, in this case Y-arm 1
There is no change in the beam diameter of the laser light 4 due to the movement of the laser beam 8 in the X direction.

Example 6. Further, by making the Y arm 18 a material having a high mechanical strength or a structure having a high mechanical strength, the processing head 5 is for a three-dimensional machine provided with a biaxial rotation mechanism having rotation shafts 44 and 45 as shown in FIG. Processing head, or processing head for welding or surface modification as shown in FIG. 15 (for example, parabolic mirror processing head, beam scanner processing head, integration mirror processing head, polygon mirror processing head, kaleidoscope) Type processing head, etc.). In the case of this embodiment, since it can be replaced with a three-dimensional processing head having a two-axis rotating mechanism, it becomes possible to process a three-dimensionally shaped workpiece, and a welding or surface modification processing head. Since it can be replaced, the workpiece can be welded and the surface can be modified.
It should be noted that FIG. 15 shows a parabolic mirror type processing head among the welding or surface modifying processing heads. In the figure, the laser beam 4 reflected by the plane mirror 46 is a parabolic mirror 47.
The light is focused by and is irradiated onto the workpiece.

Example 7. In addition, as shown in FIG.
Safety cover 32 that covers the arm 18 and the processing table 31
Is provided to absorb the laser light so that the carry-in / carry-out portion of the workpiece 6 or 29 can be internally observed and reflected light from the workpiece that is generated during processing can be prevented from being emitted to the outside. A transparent door 33 made of a material such as an acrylic material may be used. In this case, the work 6 or 29 is loaded and unloaded by the transparent doors 33a and 33b.
Can be carried out by sliding in the direction of the arrow in the figure and accommodating the transparent door 33c in a stacked manner. Also,
In the safety measure shown in FIG. 16, an interlock that the machine cannot operate when the transparent door 33 is open may be provided. Further, when the transparent door 33 cannot be provided, as shown in FIG. 17, the photoelectric tube 51 is attached to the tip of the Y arm 18, and the holding stay 52 is provided with a light receiving sensor 53 for receiving the light of the photoelectric tube 51. When an operator accidentally enters the movable range of
An interlock structure in which the machine stops depending on whether or not the light receiving sensor 53 receives light may be used.

Example 8. Further, in the first embodiment, as shown in FIG.
As shown in FIG.
7 is provided and the motor 77 drives the roller via the chain 78, the workpiece 6 can be automatically conveyed.

Example 9. Next, a ninth embodiment according to the present invention will be described with reference to FIGS. 19 to 21, the laser processing machine is a pedestal 2 provided on the floor surface 103.
7 and a first processing table 107a and a second processing table 107b arranged on both sides of the pedestal 27, and a large number of support columns 111 are erected in a sword-like shape on the upper side of the first processing table 107a with their tips facing upward. Then, the first workpiece Wa is placed on the upper portion thereof, and the second workpiece Wb is placed on the second processing table 107b by the workpiece fixing jig 108. next,
An X-axis rail 24 is attached in the X-axis direction on the upper surface of the mount 27, and a Y-axis arm 115 is provided on the X-axis rail 24 so as to be slidable in the X-axis direction via a guide 117.
Further, the Y-axis arm 115 forms a double-wing cantilever beam arm that is substantially symmetrical with respect to an axis centered on the X-axis, and the center of gravity is located approximately at the center between the two X-axis rails 24. As a result, the load on each X-axis rail 24 is made substantially equal. Next, a housing 147 is provided on the Y-axis arm 115 via a Y-axis guide rail 133 attached in the Y-axis direction and a guide element 135, and is slidable in the Y-axis direction. 147 is shared by two processing lines. The housing 147 holds the laser processing head 5 vertically and is movable in the vertical direction. On the other hand, the laser oscillator 16 is arranged on the floor surface 103 at a height above which the laser beam LB emitted from the floor 16 is guided in the X-axis direction. The laser beam LB is applied to the first and second bend mirrors 170, which are installed on the pedestal 27.
It is reflected and guided by 171 and further guided vertically upward by a third bend mirror 172 installed below the Y-axis arm 115, and in the Y-axis direction by a fourth bend mirror 173 installed above the Y-axis arm 115. The bend block 17 installed at the upper end of the Y-axis arm is guided through the beam conduit 157.
4 and the fifth and sixth bend mirrors 17 held by them.
Inverted by 180 by 5,176, and the beam conduit 1
The laser beam LB passes through 57 and is refracted vertically downward by the seventh bend mirror 163 supported on the housing 147. Finally, the laser beam LB is condensed and the first,
The processing heads 5 held by the housing 147 for performing concentrated irradiation / laser processing on the second workpieces Wa and Wb are installed.

Next, the operation of this double-wing cantilever type laser processing machine will be described. The Y-axis arm 115 is movable in the X-axis direction by an X-axis rail 24 and a guide 117 attached to the lower part of the Y-axis arm 115. Further, the housing 147 can be moved in the Y-axis direction by the Y-axis guide rail 133 and the guide 135 mounted on the Y-axis arm 115 in the Y-axis direction. On the other hand, the laser beam LB emitted from the laser oscillator 16 receives the first and second bend mirrors 170, 1
71 is reflected and guided, and further is guided vertically upward by a third bend mirror 172 installed under the Y-axis arm 115,
A fourth bend mirror 173 installed above the Y-axis arm 115 guides it in the Y-axis direction, and a bend block 174 is installed at the upper end of the Y-axis arm, and fifth and sixth bend mirrors 175, 175 held by the bend block 174. The laser beam LB is inverted 180 degrees by 176 and is vertically vertically refracted by the seventh bend mirror 163 supported on the housing 147, and the processing head 5 held by the housing 147 focuses the laser beam LB. First and second workpiece W
Laser processing is performed by intensively irradiating a and Wb respectively. At this time, by moving the Y-axis arm 115 in the X-axis direction and moving the housing 147 in the Y-axis direction, the X-
Since it can be moved in an arbitrary axial direction on the Y plane, the first and second workpieces Wa and Wb can be processed into arbitrary shapes. Further, the first and second workpieces Wa and Wb can be combined with each other, for example, flat plates, flat plates, flat plates and pipes, pipes and pipes, etc., so that two-line combined machining can be performed. FIG. 19 shows a case where a flat plate and a pipe are combined with the first and second workpieces Wa and Wb.

Example 10. Also, as shown in FIG.
First and second housings 147a, 1 for each of the two lines
47b and the first and second processing heads 5 held by 47b
By providing a and 5b, it is possible to process continuously and efficiently. At that time, each of the first and second housings 147a and 147b and the first and second processing heads 5
The laser beam LB guided to a and 5b is the beam switching device 1
Since it is necessary to quickly switch at 59, the third bend mirror 172 attached to the lower part of the Y-axis arm 115.
When the laser beam LB guided vertically upward from the beam reaches the beam switching device 159, in order to guide it to the processing line on the right side of FIG. 20 (referred to as the first processing line), the fourth bend mirror 173a and the beam conduit 157 are used. After passing through, the beam is guided to the fifth bend mirror 175a on the first housing 147a, condensed by the first processing head 5a, and focused on the first workpiece Wa, whereby the line 1 can be processed. On the other hand, when the second processing line on the left side is processed after the processing of the first processing line, the laser beam LB changes the beam switching device 15.
When it reaches 9, when the fourth bend mirrors 173a and 173b fixed thereto are moved by a driving device such as an air cylinder 177 so as to be movable only in the X-axis direction,
In order to switch to the fourth bend mirror 173b, the laser beam LB passes through the beam conduit 157, is guided to the fifth bend mirror 175b on the second housing 147b, is converged by the second processing head 5b, and is then reflected by the second processing head 5b. The workpiece Wb is intensively irradiated and the second processing line can be processed.

Example 11. Further, in the tenth embodiment described above, as shown in FIG. 21, by directing the laser beam LB to only the first processing line, a laser processing dedicated line is provided. On the other hand, in the second processing line, for example, the first processing line is provided. If the 2 housing 147b is replaced with a tapping processing device or the like, it is possible to manufacture a product with a high added value by using one processing system that configures these 2 lines.

Further, in the above-mentioned Examples 9 to 11,
In any of the above optical path configurations, the laser beam LB emitted from the oscillator 16 is not configured to be guided to each line by laser beam splitting as shown in the conventional example, and therefore, even when the same processing is performed, a large amount of laser beam is generated. No oscillator output is required, and higher output machining is possible with the same oscillator output. Further, in the above-mentioned Examples 9 to 11, the number of lines is set to 2, but it may be 3 or more,
In particular, if the number of lines is even, it is easy to balance the left and right weights, which is preferable. Furthermore, the present invention can be configured by a laser processing machine of not only the optical scanning type but also another type, or can be configured by appropriately combining another processing device.

[0080]

As described above, according to the present invention, the laser oscillator, the arm provided on the rail portion arranged in the first axial direction so as to be movable in the first axial direction, and the arm above this arm are provided. And a processing head provided on the rail disposed on the first axis so as to be movable in a second axis direction orthogonal to the first axis on a plane, and further output from the laser oscillator on the first axis. First bend mirror and second bend mirror for receiving the generated laser beam
A third bend mirror and a fourth bend mirror on the arm, and a fifth bend mirror on the machining head to form a laser optical path, and the position of the center of gravity of the arm is set to the first position. Since it is located between a pair of rails arranged on the axis of, the difference in the load applied to each of the pair of rails supporting the arm and the load moment can be reduced, and the life of the rail and the rail receiver is improved. Can be achieved.

Further, since the first bend mirror that first receives the laser beam output from the laser oscillator is movably supported in at least the third axis direction orthogonal to the second axis, the first bend mirror is provided. Can be moved according to the height of the optical axis of the laser oscillator, which in turn makes it easier to set the installation level of the laser oscillator, and it is also possible to easily cope with different output and different heights of the optical axis. .

Further, the laser oscillator, the cantilever arm provided on the pair of rails arranged in the X-axis direction so as to be movable in the X-axis direction, and the rail arranged on this arm,
A housing provided so as to be movable in a Y-axis direction orthogonal to the X-axis on a plane and a machining head portion built in the housing and movable in a direction perpendicular to the plane (workpiece); The cantilever beam arm is a double-wing cantilever beam arm that is substantially symmetrical with respect to an axis centered on the X axis, and the center of gravity is approximately at the center between the rails in the X axis direction. Since the load on each rail is made almost equal and multiple processing lines are provided, the weight imbalance, which is a drawback of the cantilever arm, and the deterioration of processing accuracy due to vibration during movement are reduced. This can be eliminated, and since one laser processing machine can form a plurality of processing lines, complex processing of different kinds of workpieces can be performed.

Further, since the plurality of lines share the one housing that runs on the double-wing cantilever arm, the processing of the plurality of lines can be efficiently configured at low cost.

Further, since the housing running on the double-wing cantilever arm is provided for each of the plurality of lines,
It is possible to continuously and quickly process a plurality of lines of a workpiece.

Further, since the laser beam guided to a plurality of lines is realized by the beam switching device, the laser beam guided to a plurality of lines can be switched quickly.

Further, since one of the housings is provided with a processing device other than laser processing, for example, the first line is a tapped primary processing line and the other lines are laser-processed sheet metal after primary processing. If the second processing line is used, it is possible to manufacture a high value-added product by using one processing system that configures the plurality of lines.

Further, since the rotary table is provided outside the movable range of the processing head, it becomes possible to easily laser-process a cylindrical workpiece while preventing interference with the processing head. Further, there is also an effect that the rotary table does not narrow the processing area at the time of flat plate processing.

Further, since the means for raising and lowering or sliding the rotary table body is provided, when the workpiece to be placed on the processing table is large, the rotary table body should not interfere with the loading and unloading of the workpiece. It has the effect of being able to evacuate.

Further, since the working table is provided with the elevating type rollers, there is an effect that the workpiece placed on the working table can be easily moved.

Further, since the means for driving the roller main body of the elevating type roller is provided, it becomes possible to automate loading and unloading of the work piece placed on the working table, and thus the present laser processing machine is used in the FA production line. The effect is that it can be configured as a part of.

Further, a laser oscillator for oscillating linearly polarized laser light is provided, and a first plane intersecting with the axis of the laser light, a second plane intersecting with the first plane, and a second plane intersecting with the first plane. A third plane intersecting the plane, a fourth plane intersecting the third plane, and a fifth plane intersecting the fourth plane.
A first bend mirror for receiving a laser beam on the first plane so that an optical axis is formed on each of the first plane and the first bend mirror on the intersection of the first plane and the second plane. A second bend mirror is provided so as to face the bend mirror, and a third bend mirror is provided at an intersection of the second plane and the third plane so as to face the second bend mirror. A fourth bend mirror is provided at the intersection of the third plane and the fourth plane so as to face the third bend mirror, and a fourth bend mirror is provided at the intersection of the fourth plane and the fifth plane. Fifth bend mirrors are arranged so as to face the bend mirrors of No. 3, and the optical axis distance between the second bend mirror and the third bend mirror, the fourth bend mirror and the fifth bend mirror, respectively. In the laser processing machine in which the optical axis distance from the bend mirror changes, the first bend Since the mirror is a circular polarization mirror and the second to fifth bend mirrors are arranged so as to cancel the phase shift amount peculiar to the bend mirror, the circular polarization rate adjustment, the optical axis adjustment, etc. can be facilitated. Therefore, the laser beam circularly polarized by the first bend mirror can be transmitted to the processing head without lowering the circular polarization rate.

Further, since the first bend mirror is supported by the XY movement adjusting mechanism, it is possible to make the laser beam incident on the center of the second bend mirror while maintaining an angle with a good circular polarization rate. There is an effect that can be done.

Further, since the second to fifth bend mirrors are ES or PS coating mirrors, the output attenuation during transmission of the circularly polarized laser light is reduced without lowering the circular polarization rate. The effect that can be transmitted to the processing head.

[Brief description of drawings]

FIG. 1 is a perspective view showing an entire optical scanning laser processing machine according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing details of an X-, Y-, and Z-axis direction moving mechanism of the first bend mirror according to the first embodiment of the present invention.

FIG. 3 is a front view showing details of the counter bellows portion of the Y-axis optical path according to the first embodiment of the present invention.

FIG. 4 is a diagram showing the installation of a blower that makes a negative pressure inside the processing table according to the first embodiment of the present invention.

FIG. 5 is a diagram showing details of a lifting type roller that conveys a work piece according to the first embodiment of the present invention in the X-axis direction.

FIG. 6 is a perspective view showing a configuration of an optical path system formed by first to fifth bend mirrors and a collimation lens according to the first embodiment of the present invention.

FIG. 7 is a diagram for explaining the principle of canceling the phase shift amount by the bend mirror according to the present invention.

FIG. 8 is a diagram showing beam propagation characteristics when a collimation lens or a collimation mirror according to the present invention is installed.

FIG. 9 is a perspective view showing an optical path system configuration when a collimation mirror according to a third embodiment of the present invention is installed.

FIG. 10 is a perspective view showing an optical path system configuration when a concave lens is installed between an oscillator beam outlet and a collimation lens according to a fourth embodiment of the present invention.

FIG. 11 is a diagram showing beam propagation characteristics when a convex mirror is installed between the oscillator beam outlet and the collimation lens according to the fourth embodiment of the present invention.

FIG. 12 is a diagram showing beam propagation characteristics when a concave lens or a convex mirror is installed between the oscillator beam outlet and the collimation lens or the collimation mirror according to the fourth embodiment of the present invention.

FIG. 13 is a perspective view showing an optical path system configuration with a constant optical path length according to Example 5 of the present invention.

FIG. 14 is a diagram showing a three-dimensional processing head including a biaxial rotation mechanism according to a sixth embodiment of the present invention.

FIG. 15 is a diagram showing a parabolic mirror machining head for welding according to a sixth embodiment of the present invention.

FIG. 16 is a perspective view showing installation of a safety cover according to a seventh embodiment of the present invention.

FIG. 17 is a diagram showing a modified example of the seventh embodiment of the present invention.

FIG. 18 is a diagram showing details of an elevating-type roller that conveys a work piece according to an eighth embodiment of the present invention in the X-axis direction.

FIG. 19 is a perspective view showing an entire optical scanning laser processing machine according to Embodiment 9 of the present invention.

FIG. 20 is a perspective view showing an entire optical scanning laser processing machine according to Embodiment 10 of the present invention.

FIG. 21 is a perspective view showing an entire optical scanning laser processing machine according to Embodiment 11 of the present invention.

FIG. 22 is a front view showing a conventional cantilever structure type optical scanning laser processing machine.

FIG. 23 is a plan view showing a conventional cantilever structure type optical scanning laser processing machine.

FIG. 24 is a plan view showing another conventional optical scanning laser processing machine.

FIG. 25 is a front view showing another conventional optical scanning laser processing machine.

[Explanation of symbols]

4 laser light, 5 processing head, 6 plate-shaped workpiece, 16 laser oscillator, 17 bend mirror, 17a
1st bend mirror, 17b 2nd bend mirror,
17c Third bend mirror, 17d Fourth bend mirror, 17e Fifth bend mirror, 18 Y arm,
19a, 19b Y-axis rail, 20a, 20b Y-axis rail receiver, 21 Y-axis unit, 22 Y-axis bellows,
23 Y-axis optical path bellows, 24a, 24b X-axis rail, 25a, 25b X-axis rail receiver, 26 X-axis bellows, 27 mount, 28 rotary table, 29 cylindrical work piece, 30 knife edge support, 31 processing table , 32 safety cover, 33 transparent door, 34 box, 35 counter bellows, 36 fixing metal fittings, 3
7 pairs of reversing mirrors, 38 reversing mirrors storage box,
39 collimation lens, 40 plane mirror, 41
Collimation mirror, 42 concave lens, 43 convex mirror, 44, 45 rotating shaft, 46 plane mirror, 47 parabolic mirror, 48 blower, 49 lifting roller, 50 work piece, 70a, 70b, 70c lock screw, 71 Y
Axial movement member, 72 holder, 73 Z-axis direction movement member, 74 bend block, 75 actuator, 10
7a 1st processing table, 107b 2nd processing table, 115 Y-axis arm, 117 guider, 133Y
Axial guide rail, 135 guide, 147 housing, 157 beam conduit, 159 beam switching device, 1
63 7th bend mirror, 170 1st bend mirror, 171 2nd bend mirror, 172 3rd bend mirror, 173 4th bend mirror, 174 bend block, 175 5th bend mirror, 176 6th
Bend mirror.

Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location B23K 37/02 B

Claims (14)

[Claims] 1. A laser processing machine for moving a processing head for irradiating laser light to move the laser light on a workpiece to perform processing. A laser oscillator and a rail portion arranged in a first axial direction. An arm movably provided on the upper side in a first axial direction, and a processing head movably provided on the arm in a second axial direction orthogonal to the first axis on a plane, A first bend mirror for receiving a laser beam output from the laser oscillator on the first axis, and a second bend mirror
A third bend mirror and a fourth bend mirror are provided on the arm, and a fifth bend mirror is provided on the processing head to form a laser optical path, and the barycentric position of the arm is set to the rail portion. A laser processing machine characterized by being positioned above. 2. A first bend mirror that first receives a laser beam output from a laser oscillator is movably supported in at least a third axis direction orthogonal to the second axis. The laser processing machine according to 1. 3. A laser beam machine for moving a laser beam on a workpiece by moving a laser beam irradiating head, wherein a laser oscillator and a rail portion arranged in a first axial direction are provided. A cantilever arm provided on the upper side so as to be movable in the first axial direction, and provided on the cantilever arm so as to be movable in a second axial direction orthogonal to the first axis on a plane. And a processing head provided in the housing, wherein the cantilever arm is substantially symmetric with respect to an axis about the first axis. And a center of gravity thereof is located on the rail portion, and a plurality of processing lines are provided. 4. The laser beam machine according to claim 3, wherein the plurality of lines share a single housing that moves on the double-wing cantilever arm. 5. The laser beam machine according to claim 3, wherein each of the plurality of lines is individually provided with a housing that moves on the double-wing cantilever arm. 6. The laser beam machine according to claim 5, wherein the optical path of the laser light guided to the plurality of lines is switched by a beam switching device. 7. The laser processing machine according to claim 5, wherein one of the housings has a processing device other than laser processing. 8. The laser processing machine according to claim 1, wherein a rotary table is provided outside the movable range of the processing head. 9. The laser processing machine according to claim 8, further comprising means for moving up and down or sliding the rotary table body. 10. The laser processing machine according to claim 1, wherein the processing table is provided with a lifting roller. 11. The laser beam machine according to claim 10, further comprising means for driving a roller body of the elevating roller. 12. A laser oscillator for oscillating linearly polarized laser light, comprising: a first plane intersecting with the axis of the laser light; a second plane intersecting with the first plane; and a second plane. The first plane so that optical axes are respectively formed on a third plane intersecting with the plane, a fourth plane intersecting with the third plane and a fifth plane intersecting with the fourth plane. A first bend mirror for receiving the laser beam, a second bend mirror at the intersection of the first plane and the second plane so as to face the first bend mirror, and a second bend mirror for the second bend mirror. A third bend mirror is provided at an intersection of the plane and the third plane so as to face the second bend mirror.
At the intersection of the plane and the fourth plane, a fourth bend mirror is provided so as to face the third bend mirror, and at the intersection of the fourth plane and the fifth plane, A fifth bend mirror is arranged so as to face the fourth bend mirror, and an optical axis distance between the second bend mirror and the third bend mirror and the fourth bend mirror are arranged. In the laser processing machine in which the optical axis distance between the fifth bend mirror and the fifth bend mirror changes, the first bend mirror is a circular polarization mirror, and the second to fifth bend mirrors are unique to the bend mirror. A laser beam machine, which is arranged so as to cancel the amount of phase shift. 13. The laser beam machine according to claim 12, wherein the first bend mirror is supported by an XY movement adjusting mechanism. 14. The laser processing machine according to claim 12 or 13, wherein the second to fifth bend mirrors are ES or PS coating mirrors.