JPH07147307A - Test apparatus - Google Patents

Abstract

PURPOSE:To provide an integrated circuit tester comprising a cooling device that minimizes the unevenness in temperature at the surface of a semiconductor chip under test. CONSTITUTION:An integrated circuit tester 1 includes a group of nozzles 9 for spouting coolant against a semiconductor chip 2 under test. The nozzle in the center has a smaller diameter than those outside.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection technique, and more particularly to a technique effective when applied to an inspection device used for electrical inspection of a semiconductor integrated circuit device operated in a cooled state.

[0002]

2. Description of the Related Art In some semiconductor products, a semiconductor integrated circuit device may be used in a cooled state. In the case of this kind of semiconductor integrated circuit device, there is a step of inspecting the electrical characteristics and functions of the semiconductor integrated circuit device in a cooled state.

In the inspection device used for this inspection, normally, the inspection device is equipped with 1
The cooling medium ejected from the nozzle of the book is sprayed on the semiconductor integrated circuit device, and the inspection is performed while the semiconductor integrated circuit device is cooled. After the inspection is completed, the injection of the cooling medium is once stopped, and the semiconductor integrated circuit device to be inspected next is mounted on the inspection device.

Regarding the inspection technology of the semiconductor integrated circuit device, for example, Ohm Co., Ltd., November 3, 1984.
Published on 0th, "LSI Handbook" P649-P667
There is a description in.

[0005]

However, in the above-mentioned technique, with the recent increase in the degree of integration of elements of semiconductor integrated circuit devices and the increase in chip size, the cooling medium ejected from one nozzle is used as a semiconductor. Due to the reason that the inside of the surface of the integrated circuit device cannot be sufficiently covered and the inside of the surface cannot be uniformly cooled, and that only a predetermined portion of the surface of the semiconductor integrated circuit device becomes high temperature, At the time of inspection, a temperature difference occurs in the surface of the semiconductor integrated circuit device,
The present inventor has found that there is a problem that the reliability of the inspection of the semiconductor integrated circuit device decreases.

The present invention has been made in view of the above problems, and an object of the present invention is to obtain a temperature difference in a plane of a semiconductor integrated circuit device when electrically inspecting the semiconductor integrated circuit device in a cooled state. It is to provide a technology that can reduce the

The above and other objects and novel features of the present invention will be apparent from the description of the specification and the accompanying drawings.

[0008]

Of the inventions disclosed in the present application, a representative one will be briefly described below.
It is as follows.

That is, according to the first aspect of the present invention, when the semiconductor integrated circuit device is electrically inspected, the semiconductor integrated circuit device is sprayed with a cooling medium sprayed from a nozzle. An inspection device for inspecting in a cooled state is provided, in which a plurality of nozzles are provided and a control means for controlling the injection state of the cooling medium is provided in the nozzles.

According to a third aspect of the present invention, there is provided an inspection device structure including a main control section for controlling the operation of the control means based on temperature information detected by the temperature detection means provided in the semiconductor integrated circuit device. It is what

According to a fourth aspect of the present invention, there is provided an inspection device structure provided with a main control section for controlling the operation of the control means based on temperature information previously measured for the semiconductor integrated circuit device to be inspected. is there.

According to a fifth aspect of the present invention, in the electrical inspection of the semiconductor integrated circuit device, the semiconductor integrated circuit device is cooled by spraying a cooling medium ejected from a nozzle onto the semiconductor integrated circuit device. An inspection device for inspecting in a state is provided, in which a plurality of nozzles are provided, and a diameter of a predetermined nozzle of the plurality of nozzles is different from a diameter of other nozzles.

[0013]

According to the first aspect of the present invention, in the inspection, the cooling medium sprayed from the plurality of nozzles is sprayed onto the semiconductor integrated circuit device, so that the in-plane of the semiconductor integrated circuit device is cooled substantially uniformly. Because you can
The temperature difference generated in the plane of the semiconductor integrated circuit device can be reduced.

When a predetermined portion in the surface of the semiconductor integrated circuit device becomes high in temperature, the cooling temperature of that portion is controlled by controlling the flow velocity and flow rate of the cooling medium sprayed to that portion. Since it can be further lowered, the temperature difference generated in the plane of the semiconductor integrated circuit device can be reduced.

According to the third aspect of the present invention, by controlling the control means based on the temperature information actually detected by the temperature detection means provided in the semiconductor integrated circuit device, an appropriate place can be appropriately selected. Since it is possible to satisfactorily cool at any time, it is possible to reduce the temperature difference generated in the surface of the semiconductor integrated circuit device during the inspection.

According to the invention described in claim 4, the in-plane temperature information of the semiconductor integrated circuit device to be inspected is measured in advance, and the control means is controlled based on the information. Even in a semiconductor integrated circuit device that does not have a temperature detecting means, it is possible to cool an appropriate place at an appropriate time, so that it is possible to reduce the temperature difference that occurs in the surface of the semiconductor integrated circuit device during inspection. it can.

According to the invention described in claim 5, the diameter of a predetermined nozzle among the plurality of nozzles is changed so that the flow velocity and flow rate of the cooling medium ejected from the nozzle have a predetermined value. By controlling, it is possible to satisfactorily cool a predetermined location such as a high temperature location in the plane of the semiconductor integrated circuit device, and thus it is possible to reduce the temperature difference generated in the plane of the semiconductor integrated circuit device.

[0018]

Embodiments of the present invention will now be described in detail with reference to the drawings.

(Embodiment 1) FIGS. 1 and 2 are explanatory views of an inspection apparatus according to an embodiment of the present invention, and FIG. 3 is an explanation of the inspection apparatus shown in FIGS. 1 and 2 during an inspection process of a semiconductor integrated circuit device. It is a figure.

The inspection apparatus 1 of the present embodiment shown in FIGS. 1 and 2 inspects, for example, the electrical characteristics and functions of a semiconductor integrated circuit formed on the semiconductor chip 2 in a state where the semiconductor chip 2 is cooled. The device has a measurement function unit 1a and a cooling function unit 1b (see FIG. 2).

The semiconductor chip 2 is mounted on the test boat 3 provided in the measurement function unit 1a with its main surface facing upward. The semiconductor chip 2 is made of, for example, silicon (S
i) It is made of a single crystal, and its main surface has, for example, a DRAM.
A predetermined semiconductor integrated circuit such as (Dynamic RAM) or a gate array is formed.

The semiconductor integrated circuit formed on the semiconductor chip 2 has wiring (not shown) formed on the test board 3.
And the probe needle 4 electrically contacted with the end of the wiring.
It is electrically connected to the inspection unit (main control unit) 5 through a. In addition, 4 has shown the probe card.

The inspection section 5 has a control section 5a and a storage section 5b. The controller 5a is a component for controlling the overall operation of the inspection apparatus 1, transmitting an inspection signal to the semiconductor integrated circuit, and measuring the inspection signal transmitted from the semiconductor integrated circuit. is there. The storage unit 5b is a component for storing inspection data transmitted to the semiconductor integrated circuit, storing measured inspection data, and storing a predetermined operation procedure of the inspection apparatus 1.

On the other hand, in the inspection apparatus 1, below the semiconductor chip 2, a cooling function section 1b for cooling the semiconductor chip 2 is installed.

The cooling medium tank 6 provided in the cooling function section 1b is a liquid tank for storing a cooling medium such as Fluorinert liquid. The cooling medium tank 6 is a pipe 7a.
Is mechanically connected to the pump 8 through. Pump 8
Is a mechanism for injecting the cooling medium in the cooling medium tank 6 from the nozzle 9 through the pipe 7b.

In the first embodiment, a plurality of nozzles 9a are provided.
9e are provided in the nozzle arrangement part 10. Each nozzle 9 is arranged so that the cooling medium sprayed from the nozzle 9 is sprayed to the center and the vicinity of the corner of the back surface of the semiconductor chip 2. This allows the cooling medium sprayed from the plurality of nozzles 9 to be sprayed onto the semiconductor chip 2 during the inspection, so that the entire back surface of the semiconductor chip 2 can be cooled substantially uniformly.

Of the plurality of nozzles 9a to 9e, the nozzle 9c arranged at the center has an inner diameter smaller than the inner diameters of the other nozzles 9 around it. As a result, the cooling medium jetted from the central nozzle 9c has a higher flow velocity than the cooling medium jetted from the peripheral nozzles 9. Therefore, the cooling temperature of the portion sprayed with the cooling medium ejected from the nozzle 9c is
It can be lowered more than other parts.

Around the nozzle 9, there is provided a cooling chamber forming wall 11 for forming a cooling chamber at the time of inspection.
The cooling chamber and the cooling medium tank 6 are provided below the cooling chamber forming wall 11.
A pipe 7c that communicates with and is provided.

During the inspection, as shown in FIG. 3, the test board 9 descends so that the cooling chamber 12 is formed by the cooling chamber forming wall 11 and the lower surface of the test board 3. The cooling medium sprayed from the nozzle 9 is blown onto the semiconductor chip 2, and then returns to the cooling medium tank 6 through the pipe 7c.

As described above, according to the first embodiment, the following effects can be obtained.

(1) At the time of inspection, by spraying the cooling medium sprayed from the plurality of nozzles 9 onto the semiconductor chip 2, the entire back surface of the semiconductor chip 2 can be cooled substantially uniformly. It is possible to reduce the temperature difference generated in the back surface of No. 2.

(2) Among the plurality of nozzles 9a to 9e, the inner diameter of a predetermined nozzle 9c is different from the inner diameters of the other nozzles 9, and the flow velocity and flow rate of the cooling medium ejected from the nozzle 9c. By controlling the above, it is possible to satisfactorily cool a predetermined location such as a high temperature location in the back surface of the semiconductor chip 2, so that it is possible to reduce the temperature difference generated in the back surface of the semiconductor chip 2. .

(3) Due to the above (1) and (2), it is possible to improve the reliability of the inspection performed in the state where the semiconductor chip 2 is cooled.

(Embodiment 2) FIG. 4 is a plan view of a main portion of an inspection apparatus according to another embodiment of the present invention, FIG. 5 is a sectional view taken along line VV of FIG. 4, and FIG. 6 is an inspection apparatus of FIG. 7 is a sectional view of an essential part of the inspection device for explaining the operation of FIG. 7, FIG. 7 is a plan view of the essential part of the inspection device for explaining the operation of the inspection device of FIG.
FIG. 11 is a sectional view taken along line II-VIII.

In the inspection apparatus 1 of the second embodiment shown in FIGS. 4 and 5, the nozzle 9 and the sealing member 13 are detachably mounted in the communication hole 10a formed in the nozzle arrangement portion 10. ing.

That is, in the second embodiment, since the nozzle 9 is detachable, the nozzle 9 arranged at a predetermined position of the nozzle arrangement portion 10 has an inner diameter different from that of the nozzle 9 arranged at another position. It is possible to change to a different nozzle 9. In FIG. 5, all nozzles 9
Have the same inner diameter. The nozzle 9 is screwed, for example.

An example in which nozzles 9 having different inner diameters are arranged is shown in FIG. FIG. 6 shows a case where a nozzle 9c having an inner diameter smaller than the inner diameter of the nozzle 9 arranged at another position is arranged at the central position of the nozzle arrangement portion 10.

Further, in the second embodiment, the sealing member 1
By mounting the nozzle 9 instead of 3, it is possible to deal with the change of the size and shape of the semiconductor chip 2.

Here, FIGS. 7 and 8 show a case in which the nozzles 9 are attached to all the communication holes 10a of the nozzle arrangement portion 10. As shown in FIG. 7 and 8 show the case where the nozzles 9 having the same inner diameter are mounted, the nozzles 9 having different inner diameters may be mounted at predetermined positions.

As described above, in the second embodiment, the following effects can be obtained in addition to the effects obtained in the first embodiment.

(1). By making the nozzle 9 detachable, the nozzle 9 arranged at a predetermined position of the nozzle arrangement portion 10
Can be changed to a nozzle 9 having an inner diameter different from that of the nozzle 9 arranged at another position. As a result, even if the high-temperature heat-generating portion changes for each semiconductor chip 2 to be inspected, by changing the nozzle 9 corresponding to that portion,
It is possible to satisfactorily cool the high-temperature heat-generating portion.

(2) By mounting the nozzle 9 instead of the sealing member 13, it becomes possible to cope with the change in size and shape of the semiconductor chip 2.

(3). Due to the above (1) and (2), it becomes possible to deal with various semiconductor chip 2 inspections.

(Embodiment 3) FIG. 9 is an explanatory diagram of an inspection apparatus according to another embodiment of the present invention.

In the third embodiment, a control valve 14 is installed in each nozzle 9 of the inspection device 1. The control valve 14 is
It is a valve for controlling the flow rate, flow velocity, etc. of the cooling medium ejected from the nozzle 9, and its operation is controlled by the inspection unit 5.

That is, in the inspection apparatus 1 of the third embodiment, the flow rate and flow velocity of the cooling medium ejected from the nozzle 9 are controlled by the operation of the control valve 14, so that the back surface of the semiconductor chip 2 can be appropriately adjusted. The place can be cooled well at an appropriate time.

There are the following two methods for controlling the control valve 14, for example.

The first is a method of controlling the operation of the control valve 14 based on the temperature information transmitted from the temperature sensor (not shown) built in the semiconductor chip 2 to the inspection unit 5. According to this method, at the time of inspection, it is possible to satisfactorily cool an appropriate portion of the back surface of the semiconductor chip 2 at an appropriate time.

Second, a method of measuring temperature information on the back surface of the semiconductor chip 2 to be inspected and preliminarily storing it in the storage section 5b of the inspection section 5 and controlling the operation of the control valve 14 based on the information. Is. According to this method, at the time of inspection, it is possible to satisfactorily cool an appropriate portion of the back surface of the semiconductor chip 2 having no temperature sensor at an appropriate time.

As described above, according to the third embodiment, the following effects can be obtained.

(1) A control valve 14 is provided for each nozzle 9, and the flow rate and flow velocity of the cooling medium ejected from the nozzle 9 are controlled by the operation of the control valve 14, so that the back surface of the semiconductor chip 2 can be appropriately controlled. It is possible to satisfactorily cool various places at an appropriate time.

(2). By controlling the operation of the control valve 14 based on the temperature information actually transmitted to the inspection unit 5 from the temperature sensor built in the semiconductor chip 2, the back surface of the semiconductor chip 2 is inspected. It is possible to satisfactorily cool the appropriate place of the item at an appropriate time.

(3). Temperature information on the back surface of the semiconductor chip 2 to be inspected is measured, and the measured information is stored in advance in the storage section 5b of the inspection section 5, and the control valve 14 of the control valve 14 is based on this information. By controlling the operation, at the time of inspection, it becomes possible to satisfactorily cool an appropriate portion of the back surface of the semiconductor chip 2 having no temperature sensor at an appropriate time.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-mentioned Embodiments 1 to 3 and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

For example, in the above-mentioned first to third embodiments, the case where the semiconductor chip is cooled at the time of inspection has been described. However, the present invention is not limited to this, and various modifications can be made. It may be cooled. In addition, a product in a module state in which a plurality of semiconductor chips are mounted may be cooled.

[0056]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1) According to the invention described in claim 1, in the inspection, the cooling medium sprayed from a plurality of nozzles is sprayed onto the semiconductor integrated circuit device, so that the surface of the semiconductor integrated circuit device is almost completely covered. Since it can be cooled uniformly,
The temperature difference generated in the plane of the semiconductor integrated circuit device can be reduced.

When a predetermined portion in the surface of the semiconductor integrated circuit device becomes high in temperature, the cooling temperature of that portion is controlled to another value by controlling the flow velocity and flow rate of the cooling medium blown to that portion. Since the temperature can be lowered below the portion, the temperature difference generated in the plane of the semiconductor integrated circuit device can be reduced.

As a result, it is possible to improve the reliability of the inspection performed in the state where the semiconductor integrated circuit device is cooled.

(2) According to the invention of claim 3, by controlling the control means on the basis of the temperature information actually detected by the temperature detection means provided in the semiconductor integrated circuit device, an appropriate location can be obtained. Therefore, the temperature difference generated in the plane of the semiconductor integrated circuit device at the time of inspection can be reduced. As a result, it is possible to improve the reliability of the inspection performed while the semiconductor integrated circuit device is cooled.

(3) According to the invention described in claim 4, in-plane temperature information of the semiconductor integrated circuit device to be inspected is measured in advance, and the control means is controlled based on the information. As a result, even in a semiconductor integrated circuit device that does not have a temperature detecting means, it is possible to favorably cool an appropriate place at an appropriate time, so that the temperature difference that occurs in the plane of the semiconductor integrated circuit device at the time of inspection can be reduced. be able to. As a result, even in the inspection of the semiconductor integrated circuit device that does not have the temperature detecting means, the reliability of the inspection can be improved.

(4) According to the fifth aspect of the invention, of the plurality of nozzles, the diameter of a predetermined nozzle is changed, and the flow velocity, flow rate, etc. of the cooling medium jetted from the nozzle have predetermined values. By controlling in this way, it is possible to satisfactorily cool a predetermined location such as a hot spot in the surface of the semiconductor integrated circuit device, so that the temperature difference generated in the surface of the semiconductor integrated circuit device can be reduced. . As a result, it is possible to improve the reliability of the inspection performed while the semiconductor integrated circuit device is cooled.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an inspection apparatus that is an embodiment of the present invention.

FIG. 2 is an explanatory diagram of an inspection apparatus that is an embodiment of the present invention.

FIG. 3 is a view of FIG. 1 during an inspection process of a semiconductor integrated circuit device.
FIG. 3 is an explanatory diagram of the inspection device of FIG. 2.

FIG. 4 is a plan view of a main part of an inspection device according to another embodiment of the present invention.

5 is a cross-sectional view taken along line VV of FIG.

6 is a cross-sectional view of a main part of the inspection device for explaining the operation of the inspection device of FIG.

FIG. 7 is a plan view of a main part of the inspection device for explaining the operation of the inspection device of FIG.

8 is a cross-sectional view taken along the line VIII-VIII of FIG.

FIG. 9 is an explanatory diagram of an inspection apparatus according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 inspection device 1a measurement function unit 1b cooling function unit 2 semiconductor chip 3 test board 4 probe card 4a probe needle 5 inspection unit (main control unit) 5a control unit 5b storage unit 6 cooling medium tank 7a to 7c pipe 8 pump 9, 9a-9e Nozzle 10 Nozzle arrangement part 10a Communication hole 11 Cooling chamber forming wall 12 Cooling chamber 13 Sealing member 14 Control valve (control means)

Claims (5)

[Claims] 1. An inspection apparatus for inspecting a semiconductor integrated circuit device in a cooled state by spraying a cooling medium jetted from a nozzle onto the semiconductor integrated circuit device during an electrical inspection of the semiconductor integrated circuit device. An inspection apparatus, wherein a plurality of the nozzles are provided, and a control means for controlling the injection state of the cooling medium is provided in the nozzles. 2. The inspection apparatus according to claim 1, wherein the control means is a control valve installed at a predetermined position of the nozzle. 3. A main control section for controlling the operation of the control means based on temperature information detected by a temperature detection means provided in the semiconductor integrated circuit device. Inspection device according to 2. 4. The inspection according to claim 1, further comprising a main control unit for controlling the operation of the control means based on temperature information measured in advance for the semiconductor integrated circuit device to be inspected. apparatus. 5. An inspection apparatus for inspecting the semiconductor integrated circuit device in a cooled state by spraying a cooling medium sprayed from a nozzle onto the semiconductor integrated circuit device during the electrical inspection of the semiconductor integrated circuit device. An inspection apparatus, wherein a plurality of the nozzles are provided and a diameter of a predetermined nozzle of the plurality of nozzles is different from a diameter of other nozzles.