JPH07142023A - Parallel scan type ion implantation device - Google Patents

Parallel scan type ion implantation device

Info

Publication number
JPH07142023A
JPH07142023A JP28803793A JP28803793A JPH07142023A JP H07142023 A JPH07142023 A JP H07142023A JP 28803793 A JP28803793 A JP 28803793A JP 28803793 A JP28803793 A JP 28803793A JP H07142023 A JPH07142023 A JP H07142023A
Authority
JP
Japan
Prior art keywords
deflecting
voltage
raster
board
correction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28803793A
Other languages
Japanese (ja)
Other versions
JP3418229B2 (en
Inventor
Osamu Tsukagoshi
修 塚越
Yuzo Sakurada
勇蔵 櫻田
Koichi Niikura
高一 新倉
Yasuo Mihara
康雄 美原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP28803793A priority Critical patent/JP3418229B2/en
Priority to GB9423009A priority patent/GB2284092B/en
Publication of JPH07142023A publication Critical patent/JPH07142023A/en
Application granted granted Critical
Publication of JP3418229B2 publication Critical patent/JP3418229B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H01J37/147Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1472Deflecting along given lines
    • H01J37/1474Scanning means
    • H01J37/1477Scanning means electrostatic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To uniformize the doze distribution by equalizing traveling speeds of ion beam spots over the whole area on a board when a parallel scan type ion is implanted by using a multipole electrostatic deflecting unit. CONSTITUTION:First and second multipole electrostatic deflecting units 6 and 7 are constituted in a geometric similar figure, and the same raster voltage is impressed on mutually corresponding electrodes from a raster voltage digital control device 9. For example, the same deflecting voltage U'=U, V'=V with raster deflecting voltage U, -U, V, -V, 1/2<1/2>. (U+V) or the like obtained by subtracting offset voltage V0, -V0, V0/2<1/2>, -Vu/2<1/2> or the like from voltage to be impressed on the respective electrodes of the deflecting unit 6 is impressed. A deflecting system is designed by a similar rule. Changing speed of stepping deflecting voltage in the Y direction of a board 8 is set constant, and in the X direction, changing speed of a deflecting electric field in the center of the board is set as 1, and the changing rate on time of the raster deflecting voltage is changed according to a prescribed function. At this time, traveling speeds of beam light spots to form a raster on the board 8 are equalized regardless of a place on the board, so that excellent uniformity of a doze can be obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】 [0001]

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の一実施例を示す概略線図。FIG. 1 is a schematic diagram showing an embodiment of the present invention.

【図2】 理想多重極静電偏向器内の電位分布を有限要
素法によりシュミレートした結果を示す線図。
FIG. 2 is a diagram showing a result of simulating a potential distribution in an ideal multipole electrostatic deflector by a finite element method.

【図3】 第1、第2多重極静電偏向器におけるイオン
の軌道を示す線図。
FIG. 3 is a diagram showing the trajectories of ions in the first and second multipole electrostatic deflectors.

【図4】 第1、第2多重極静電偏向器におけるイオン
の軌道を示す関係立体図。
FIG. 4 is a relational three-dimensional diagram showing trajectories of ions in the first and second multipole electrostatic deflectors.

【図5】 基板上を均一な速度でビームスポットをラス
ターさせるために必要な電場のディジタルスキャン関数
を導く説明図。
FIG. 5 is an explanatory diagram for deriving a digital scan function of an electric field necessary to rasterize a beam spot on a substrate at a uniform speed.

【図6】 ディジタルスキャンにおける基板上のビーム
スポットの位置を例示した説明図。
FIG. 6 is an explanatory diagram illustrating the positions of beam spots on a substrate in digital scanning.

【図7】 ディジタルスキャン用の電圧の発生回路の一
例を示すブロック線図。
FIG. 7 is a block diagram showing an example of a voltage generation circuit for digital scan.

【図8】 図7の回路で得られた基準V電圧波形を示す
図。
8 is a diagram showing a reference V voltage waveform obtained by the circuit of FIG.

【図9】 図7の回路で得られた基準U電圧波形を示す
図。
9 is a diagram showing a reference U voltage waveform obtained by the circuit of FIG.

【図10】ディジタルスキャンを行なわない従来のパラ
レルスキャンによるイオン注入における基板上のドーズ
分布を示す図。
FIG. 10 is a diagram showing a dose distribution on a substrate in ion implantation by a conventional parallel scan that does not perform a digital scan.

【図11】ディジタルスキャンを行なった本発明による
イオン注入における基板上のドーズ分布を示す図。
FIG. 11 is a diagram showing a dose distribution on a substrate in ion implantation according to the present invention, which has been subjected to digital scanning.

【図12】従来のパラレルスキャン型イオン注入装置を
示す概略線図。
FIG. 12 is a schematic diagram showing a conventional parallel scan type ion implantation apparatus.

【図13】従来のパラレルスキャン型イオン注入装置に
よるイオンビーム操作方法を示す図。
FIG. 13 is a view showing an ion beam operating method by a conventional parallel scan type ion implantation apparatus.

【図14】従来のパラレルスキャン型イオン注入装置に
おける八重極静電偏向器の各電極に加えられる電圧を示
す図。
FIG. 14 is a diagram showing a voltage applied to each electrode of an octupole electrostatic deflector in a conventional parallel scan type ion implantation apparatus.

【符号の説明】[Explanation of symbols]

1:イオン源 2:質量分離器 3:イオンビーム 4:加速器 5:集束レンズ 6:第1の多重極静電偏向器 7:第2の多重極静電偏向器 8:基板 9:制御装置 1: Ion source 2: Mass separator 3: Ion beam 4: Accelerator 5: Focusing lens 6: First multipole electrostatic deflector 7: Second multipole electrostatic deflector 8: Substrate 9: Controller

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成7年2月17日[Submission date] February 17, 1995

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】請求項1[Name of item to be corrected] Claim 1

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【手続補正2】[Procedure Amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0002[Name of item to be corrected] 0002

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0002】 [0002]

【手続補正3】[Procedure 3]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0004[Correction target item name] 0004

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0004】 [0004]

【手続補正4】[Procedure amendment 4]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0006[Correction target item name] 0006

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0006】 [0006]

【手続補正5】[Procedure Amendment 5]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0008[Correction target item name] 0008

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0008】 [0008]

【手続補正6】[Procedure correction 6]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0010[Correction target item name] 0010

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0010】 [0010]

【手続補正7】[Procedure Amendment 7]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0013[Correction target item name] 0013

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0013】 [0013]

【手続補正8】[Procedure Amendment 8]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0015[Name of item to be corrected] 0015

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0015】 [0015]

【手続補正9】[Procedure Amendment 9]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0016[Correction target item name] 0016

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0016】 [0016]

【手続補正10】[Procedure Amendment 10]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0017[Correction target item name] 0017

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0017】 [0017]

【手続補正11】[Procedure Amendment 11]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0023[Name of item to be corrected] 0023

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0023】 [0023]

【手続補正12】[Procedure Amendment 12]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0024[Name of item to be corrected] 0024

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0024】 [0024]

【手続補正13】[Procedure Amendment 13]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0026[Correction target item name] 0026

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0026】 [0026]

【手続補正14】[Procedure Amendment 14]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0027[Name of item to be corrected] 0027

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0027】 [0027]

【手続補正15】[Procedure Amendment 15]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0030[Name of item to be corrected] 0030

【補正方法】削除[Correction method] Delete

【手続補正16】[Procedure Amendment 16]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0032[Name of item to be corrected] 0032

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0032】 [0032]

【手続補正17】[Procedure Amendment 17]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】図15[Correction target item name] Figure 15

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図15】 FIG. 15

【手続補正18】[Procedure 18]

【補正対象書類名】図面[Document name to be corrected] Drawing

【補正対象項目名】図7[Name of item to be corrected] Figure 7

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図7】 [Figure 7]

【手続補正19】[Procedure Amendment 19]

【補正対象書類名】図面[Document name to be corrected] Drawing

【補正対象項目名】図14[Name of item to be corrected] Fig. 14

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図14】 FIG. 14

【手続補正20】[Procedure amendment 20]

【補正対象書類名】図面[Document name to be corrected] Drawing

【補正対象項目名】図15[Correction target item name] Figure 15

【補正方法】追加[Correction method] Added

【補正内容】[Correction content]

【図15】 FIG. 15

フロントページの続き (72)発明者 美原 康雄 神奈川県茅ケ崎市萩園2500番地 日本真空 技術株式会社内Front page continuation (72) Inventor Yasuo Mihara 2500 Hagien, Chigasaki, Kanagawa Japan Vacuum Technology Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 1. 【請求項2】 2.
JP28803793A 1993-11-17 1993-11-17 Parallel scan type ion implanter Expired - Fee Related JP3418229B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP28803793A JP3418229B2 (en) 1993-11-17 1993-11-17 Parallel scan type ion implanter
GB9423009A GB2284092B (en) 1993-11-17 1994-11-15 Parallel scan type ion implanter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28803793A JP3418229B2 (en) 1993-11-17 1993-11-17 Parallel scan type ion implanter

Publications (2)

Publication Number Publication Date
JPH07142023A true JPH07142023A (en) 1995-06-02
JP3418229B2 JP3418229B2 (en) 2003-06-16

Family

ID=17725015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28803793A Expired - Fee Related JP3418229B2 (en) 1993-11-17 1993-11-17 Parallel scan type ion implanter

Country Status (2)

Country Link
JP (1) JP3418229B2 (en)
GB (1) GB2284092B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100434972B1 (en) * 1998-10-26 2004-06-09 에텍시스템즈인코포레이티드 Raster scan gaussian beam writing strategy and method for pattern generation
WO2006090787A1 (en) * 2005-02-24 2006-08-31 Ulvac, Inc. Ion implantation device control method, control system thereof, control program thereof, and ion implantation device
JP2008527638A (en) * 2005-01-04 2008-07-24 アクセリス テクノロジーズ インコーポレーテッド Ion beam scanning control method and system for uniform ion implantation

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012000650A1 (en) * 2012-01-16 2013-07-18 Carl Zeiss Microscopy Gmbh METHOD AND DEVICE FOR ABRASING A SURFACE OF AN OBJECT WITH A PARTICLE BEAM

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4593200A (en) * 1984-03-06 1986-06-03 Mcguire Iii Edward L Scan controller for ion implanter device
US4736107A (en) * 1986-09-24 1988-04-05 Eaton Corporation Ion beam implanter scan control system
GB2216714B (en) * 1988-03-11 1992-10-14 Ulvac Corp Ion implanter system
DE69019772T2 (en) * 1989-03-22 1995-10-12 Ulvac Corp Ion implantation device.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100434972B1 (en) * 1998-10-26 2004-06-09 에텍시스템즈인코포레이티드 Raster scan gaussian beam writing strategy and method for pattern generation
JP2008527638A (en) * 2005-01-04 2008-07-24 アクセリス テクノロジーズ インコーポレーテッド Ion beam scanning control method and system for uniform ion implantation
WO2006090787A1 (en) * 2005-02-24 2006-08-31 Ulvac, Inc. Ion implantation device control method, control system thereof, control program thereof, and ion implantation device
TWI405237B (en) * 2005-02-24 2013-08-11 Ulvac Inc Ion implantation device, control method therefor, control system therefor, and control program therefor

Also Published As

Publication number Publication date
GB2284092B (en) 1998-02-25
GB9423009D0 (en) 1995-01-04
GB2284092A (en) 1995-05-24
JP3418229B2 (en) 2003-06-16

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