JPH07142023A - Parallel scan type ion implantation device - Google Patents
Parallel scan type ion implantation deviceInfo
- Publication number
- JPH07142023A JPH07142023A JP28803793A JP28803793A JPH07142023A JP H07142023 A JPH07142023 A JP H07142023A JP 28803793 A JP28803793 A JP 28803793A JP 28803793 A JP28803793 A JP 28803793A JP H07142023 A JPH07142023 A JP H07142023A
- Authority
- JP
- Japan
- Prior art keywords
- deflecting
- voltage
- raster
- board
- correction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
- H01J37/1472—Deflecting along given lines
- H01J37/1474—Scanning means
- H01J37/1477—Scanning means electrostatic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】Detailed Description of the Invention
【0001】 [0001]
【図1】 本発明の一実施例を示す概略線図。FIG. 1 is a schematic diagram showing an embodiment of the present invention.
【図2】 理想多重極静電偏向器内の電位分布を有限要
素法によりシュミレートした結果を示す線図。FIG. 2 is a diagram showing a result of simulating a potential distribution in an ideal multipole electrostatic deflector by a finite element method.
【図3】 第1、第2多重極静電偏向器におけるイオン
の軌道を示す線図。FIG. 3 is a diagram showing the trajectories of ions in the first and second multipole electrostatic deflectors.
【図4】 第1、第2多重極静電偏向器におけるイオン
の軌道を示す関係立体図。FIG. 4 is a relational three-dimensional diagram showing trajectories of ions in the first and second multipole electrostatic deflectors.
【図5】 基板上を均一な速度でビームスポットをラス
ターさせるために必要な電場のディジタルスキャン関数
を導く説明図。FIG. 5 is an explanatory diagram for deriving a digital scan function of an electric field necessary to rasterize a beam spot on a substrate at a uniform speed.
【図6】 ディジタルスキャンにおける基板上のビーム
スポットの位置を例示した説明図。FIG. 6 is an explanatory diagram illustrating the positions of beam spots on a substrate in digital scanning.
【図7】 ディジタルスキャン用の電圧の発生回路の一
例を示すブロック線図。FIG. 7 is a block diagram showing an example of a voltage generation circuit for digital scan.
【図8】 図7の回路で得られた基準V電圧波形を示す
図。8 is a diagram showing a reference V voltage waveform obtained by the circuit of FIG.
【図9】 図7の回路で得られた基準U電圧波形を示す
図。9 is a diagram showing a reference U voltage waveform obtained by the circuit of FIG.
【図10】ディジタルスキャンを行なわない従来のパラ
レルスキャンによるイオン注入における基板上のドーズ
分布を示す図。FIG. 10 is a diagram showing a dose distribution on a substrate in ion implantation by a conventional parallel scan that does not perform a digital scan.
【図11】ディジタルスキャンを行なった本発明による
イオン注入における基板上のドーズ分布を示す図。FIG. 11 is a diagram showing a dose distribution on a substrate in ion implantation according to the present invention, which has been subjected to digital scanning.
【図12】従来のパラレルスキャン型イオン注入装置を
示す概略線図。FIG. 12 is a schematic diagram showing a conventional parallel scan type ion implantation apparatus.
【図13】従来のパラレルスキャン型イオン注入装置に
よるイオンビーム操作方法を示す図。FIG. 13 is a view showing an ion beam operating method by a conventional parallel scan type ion implantation apparatus.
【図14】従来のパラレルスキャン型イオン注入装置に
おける八重極静電偏向器の各電極に加えられる電圧を示
す図。FIG. 14 is a diagram showing a voltage applied to each electrode of an octupole electrostatic deflector in a conventional parallel scan type ion implantation apparatus.
1:イオン源 2:質量分離器 3:イオンビーム 4:加速器 5:集束レンズ 6:第1の多重極静電偏向器 7:第2の多重極静電偏向器 8:基板 9:制御装置 1: Ion source 2: Mass separator 3: Ion beam 4: Accelerator 5: Focusing lens 6: First multipole electrostatic deflector 7: Second multipole electrostatic deflector 8: Substrate 9: Controller
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成7年2月17日[Submission date] February 17, 1995
【手続補正1】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項1[Name of item to be corrected] Claim 1
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【手続補正2】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0002[Name of item to be corrected] 0002
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0002】 [0002]
【手続補正3】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0004[Correction target item name] 0004
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0004】 [0004]
【手続補正4】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0006[Correction target item name] 0006
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0006】 [0006]
【手続補正5】[Procedure Amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0008[Correction target item name] 0008
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0008】 [0008]
【手続補正6】[Procedure correction 6]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0010[Correction target item name] 0010
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0010】 [0010]
【手続補正7】[Procedure Amendment 7]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0013[Correction target item name] 0013
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0013】 [0013]
【手続補正8】[Procedure Amendment 8]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0015[Name of item to be corrected] 0015
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0015】 [0015]
【手続補正9】[Procedure Amendment 9]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0016[Correction target item name] 0016
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0016】 [0016]
【手続補正10】[Procedure Amendment 10]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0017[Correction target item name] 0017
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0017】 [0017]
【手続補正11】[Procedure Amendment 11]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0023[Name of item to be corrected] 0023
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0023】 [0023]
【手続補正12】[Procedure Amendment 12]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0024[Name of item to be corrected] 0024
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0024】 [0024]
【手続補正13】[Procedure Amendment 13]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0026[Correction target item name] 0026
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0026】 [0026]
【手続補正14】[Procedure Amendment 14]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0027[Name of item to be corrected] 0027
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0027】 [0027]
【手続補正15】[Procedure Amendment 15]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0030[Name of item to be corrected] 0030
【補正方法】削除[Correction method] Delete
【手続補正16】[Procedure Amendment 16]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0032[Name of item to be corrected] 0032
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0032】 [0032]
【手続補正17】[Procedure Amendment 17]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図15[Correction target item name] Figure 15
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図15】 FIG. 15
【手続補正18】[Procedure 18]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図7[Name of item to be corrected] Figure 7
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図7】 [Figure 7]
【手続補正19】[Procedure Amendment 19]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図14[Name of item to be corrected] Fig. 14
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図14】 FIG. 14
【手続補正20】[Procedure amendment 20]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図15[Correction target item name] Figure 15
【補正方法】追加[Correction method] Added
【補正内容】[Correction content]
【図15】 FIG. 15
フロントページの続き (72)発明者 美原 康雄 神奈川県茅ケ崎市萩園2500番地 日本真空 技術株式会社内Front page continuation (72) Inventor Yasuo Mihara 2500 Hagien, Chigasaki, Kanagawa Japan Vacuum Technology Co., Ltd.
Claims (2)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28803793A JP3418229B2 (en) | 1993-11-17 | 1993-11-17 | Parallel scan type ion implanter |
GB9423009A GB2284092B (en) | 1993-11-17 | 1994-11-15 | Parallel scan type ion implanter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28803793A JP3418229B2 (en) | 1993-11-17 | 1993-11-17 | Parallel scan type ion implanter |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07142023A true JPH07142023A (en) | 1995-06-02 |
JP3418229B2 JP3418229B2 (en) | 2003-06-16 |
Family
ID=17725015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28803793A Expired - Fee Related JP3418229B2 (en) | 1993-11-17 | 1993-11-17 | Parallel scan type ion implanter |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3418229B2 (en) |
GB (1) | GB2284092B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100434972B1 (en) * | 1998-10-26 | 2004-06-09 | 에텍시스템즈인코포레이티드 | Raster scan gaussian beam writing strategy and method for pattern generation |
WO2006090787A1 (en) * | 2005-02-24 | 2006-08-31 | Ulvac, Inc. | Ion implantation device control method, control system thereof, control program thereof, and ion implantation device |
JP2008527638A (en) * | 2005-01-04 | 2008-07-24 | アクセリス テクノロジーズ インコーポレーテッド | Ion beam scanning control method and system for uniform ion implantation |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012000650A1 (en) * | 2012-01-16 | 2013-07-18 | Carl Zeiss Microscopy Gmbh | METHOD AND DEVICE FOR ABRASING A SURFACE OF AN OBJECT WITH A PARTICLE BEAM |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4593200A (en) * | 1984-03-06 | 1986-06-03 | Mcguire Iii Edward L | Scan controller for ion implanter device |
US4736107A (en) * | 1986-09-24 | 1988-04-05 | Eaton Corporation | Ion beam implanter scan control system |
GB2216714B (en) * | 1988-03-11 | 1992-10-14 | Ulvac Corp | Ion implanter system |
DE69019772T2 (en) * | 1989-03-22 | 1995-10-12 | Ulvac Corp | Ion implantation device. |
-
1993
- 1993-11-17 JP JP28803793A patent/JP3418229B2/en not_active Expired - Fee Related
-
1994
- 1994-11-15 GB GB9423009A patent/GB2284092B/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100434972B1 (en) * | 1998-10-26 | 2004-06-09 | 에텍시스템즈인코포레이티드 | Raster scan gaussian beam writing strategy and method for pattern generation |
JP2008527638A (en) * | 2005-01-04 | 2008-07-24 | アクセリス テクノロジーズ インコーポレーテッド | Ion beam scanning control method and system for uniform ion implantation |
WO2006090787A1 (en) * | 2005-02-24 | 2006-08-31 | Ulvac, Inc. | Ion implantation device control method, control system thereof, control program thereof, and ion implantation device |
TWI405237B (en) * | 2005-02-24 | 2013-08-11 | Ulvac Inc | Ion implantation device, control method therefor, control system therefor, and control program therefor |
Also Published As
Publication number | Publication date |
---|---|
GB2284092B (en) | 1998-02-25 |
GB9423009D0 (en) | 1995-01-04 |
GB2284092A (en) | 1995-05-24 |
JP3418229B2 (en) | 2003-06-16 |
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