JPH07131157A - Manufacture of laminated ceramic circuit substrate - Google Patents

Abstract

PURPOSE:To provide the manufacturing method of laminated ceramic circuit substrate capable of easily forming insulating films and stabilized through recessions. CONSTITUTION:The title manufacturing method is composed of the four steps as follows, i.e., (1) the first step of forming insulating films 10a-10e on the surface of a base substance 15 by coating and drying up a glass ceramic made slip material, (2) the second step of forming through recessions 30 passing the insulating films 10a-10e by irradiating the positions to be via hole conductors of the insulating films 10a-10e with laser beams and (3) the third step of forming conductor films 20 to be inner wirings by filling the through recssions with a conductive paste and printing the surfaces of conductors 31 to be via hole conductors and the insulating films 10a-10e with the conductive paste. Furthermore, (4) the fourth step of integrally baking the insulating films 10a-10e, the conductor films 20 to be the inner wirings and the conductors 31 to be the via hole conductors is contained after successively repeating respective steps (1)-(3).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a laminated ceramic circuit board in which insulating layers formed by applying a glass-ceramic slip material are laminated.

[0002]

2. Description of the Related Art A laminated ceramic circuit board is an essential circuit board for miniaturization of electronic devices, communication devices and the like.

Several methods are known as a method for manufacturing a laminated ceramic circuit board in which internal wirings connected by via-hole conductors are arranged between a plurality of laminated insulating layers.

For example, a through hole to be a via hole conductor is formed in a green sheet having a thickness of about 100 to 200 μm, and a conductor to be a via hole conductor is filled in the through hole of the green sheet, and at the same time, an internal wiring is formed on the surface of the green sheet. There is a green sheet multilayer method in which a conductor is printed and formed, a plurality of green sheets subjected to this treatment are laminated, thermocompression bonding is performed, and the green sheet and each conductor (film) are integrally fired.

Further, for example, an insulating paste serving as an insulating film and a conductive paste for forming internal wiring are prepared, and a conductive film serving as internal wiring having a predetermined shape is formed on a heat-resistant substrate such as ceramic. By screen printing, and then by printing the insulating film of a predetermined shape by screen printing an insulating paste so as to expose the connection portion with the upper layer internal wiring, and similarly forming the internal wiring conductor. Alternately screen print the film and the insulating film to be the insulating layer,
There has been a printed multi-layer method in which an insulating film and a conductive film are integrally fired.

Further, as shown in Japanese Patent Laid-Open No. 3-148195, instead of the above-mentioned green sheet or insulating film, an insulating film is formed on a carrier tape such as a film, and this insulating film is formed on the laminated body. There was a carrier tape multilayer method of transferring.

In the green sheet multilayer method as a method for connecting adjacent internal wirings via an insulating layer, a through hole having an opening penetrating both main surfaces of each green sheet is NC.
It must be formed by punching, press punching, etc., and the conductive paste must be filled in the through holes. Therefore, when the opening diameter of the through hole becomes large, the conductive paste cannot be stably held in the through hole, and the conductor may drop out. Therefore, there is an upper limit on the opening diameter of the through hole. In addition, the filling of the conductive paste is performed by printing and filling by placing the green sheet on the sheet of paper, but when separating the sheet of paper and the green sheet, the conductive paste filled in the through holes is spread. It may be robbed by the paper, and the surface of the conductor held in the through hole may be dented, resulting in defective conduction between the internal wirings. Further, there is a problem that a predetermined circuit cannot be achieved without stacking the green sheets described above with high accuracy and alignment.

In the printing multi-layer method, it is not necessary to form a through hole to be a via-hole conductor, but an insulating film having a predetermined shape is printed at the time of printing the insulating paste so that the connecting portion of the conductive film to be the internal wiring is exposed. , Considering the printing sag of the insulating paste, it is not possible to obtain a highly accurate connection part, and there is a limit to the densification of internal wiring.Furthermore, due to the increase in the number of laminated insulating layers and internal wiring, and the internal wiring pattern, Lamination distortion occurs on the printed surface of the insulating film, and stable internal wiring cannot be formed by printing.

In the carrier tape multi-layer method disclosed in Japanese Patent Laid-Open No. 3-148195, the insulating film is transferred from the carrier tape to the upper part of the laminated body, and after the carrier tape is peeled off, the internal wiring existing under the insulating film is formed. A through recess is formed by irradiating a laser beam so that the conductor film is exposed, and the through recess is filled with a conductor serving as a via-hole conductor.

[0010]

In consideration of the accuracy of the via-hole conductor and the control of the diameter of the via-hole conductor, the method disclosed in Japanese Patent Laid-Open No.
It is effective to transfer an insulating film from the carrier tape disclosed in No. 148195 and to form a penetrating recess of a via-hole conductor by a laser beam.

However, particularly in the step of forming the insulating film, the step of applying the insulating slip material to the carrier tape and drying it, the step of coating the laminated film with the insulating film and performing the lamination treatment (thermocompression treatment), the carrier tape. Are required to be peeled off, which makes the whole manufacturing process extremely complicated and makes it difficult to construct a consistent manufacturing line.

Moreover, since such an insulating film is subjected to a lamination treatment, the thickness of the insulating film on the carrier tape and the thickness of the insulating film after being transferred to the upper part of the laminated body are different from each other. It is extremely difficult to set and manage the irradiation conditions of the laser light when forming the through recesses that will become The conductor film of the internal wiring may also be removed by the laser beam.

The present invention has been devised in view of the above-mentioned problems, and has a unique insulating film forming step capable of forming a stable through recess when forming the through recess using a laser beam. A method for manufacturing a multilayer ceramic circuit board is provided.

[0014]

According to the present invention, an insulating film to be a ceramic layer and a conductive film to be an internal wiring are superposed and laminated, and a conductive film adjacent to each other with the insulating film interposed therebetween is the insulating film. A method for manufacturing a laminated ceramic circuit board, comprising forming a laminated body connected through a conductor serving as a via-hole conductor that penetrates through a thickness, and firing the laminated body, the insulating film having a conductor serving as the via-hole conductor, (1) A step of applying and drying a glass / ceramic slip material to form an insulating film, and (2) irradiating the insulating film with a laser beam to penetrate the insulating film. Forming a through hole, and (3) forming and forming a conductor film serving as internal wiring and a conductor serving as a via hole conductor by printing and filling a conductive paste on the surface of the insulating film and inside the through hole. .

Here, the "through hole" has a thickness of the insulating film forming the through hole. The base is exposed from the lower opening of the through hole, and the opening is closed. Since it has a “concave” shape as a whole, it will be referred to as “through concave” hereinafter.

[0016]

According to the present invention, for example, the series of (1) to
In the step (3), after forming the conductor film to be the internal wiring on the insulating film, the insulating film is further formed. By performing the step (1), the insulating film having a uniform thickness is formed on the previous insulating film. can do. In addition, laser beam irradiation (2)
Since the thickness of the insulating film does not change significantly between the steps, the irradiation condition of the laser beam can be performed considering only the thickness of the applied insulating film. It will not be removed, and it will not reach the conductor film that will be the internal wiring.
A stable penetrating recess can be formed in the insulating film.

Further, since the insulating film can be directly formed on the laminated body (base body) without using the carrier tape, the step of forming the insulating film can be particularly simplified and the laminated type can be formed by the consistent production line. Ceramic circuit boards can be manufactured.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a laminated ceramic circuit board according to the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a multilayer ceramic circuit board according to the present invention.
(A)-(g) is a schematic sectional drawing explaining the manufacturing method. Although the description will be given using a laminated ceramic circuit board including five insulating layers, the number of laminated layers can be arbitrarily changed.

In the figure, reference numeral 1 is a laminated body main body, and 1a
1e is an insulating layer, 2 is an internal wiring, 3 is a via-hole conductor,
Reference numeral 4 is surface wiring, and 5 and 6 are electronic components.

The laminated body 1 includes insulating layers 1a to 1e, internal wirings 2 arranged between the insulating layers 1a to 1e, a plurality of internal wirings 2 arranged between different layers, and an internal wiring 2 It is composed of a via-hole conductor 3 for connecting to the surface wiring 4.

The insulating layers 1a-1e are, for example, 850-10.
Glass that enables firing at relatively low temperatures around 50 ° C
Made of ceramic material, its thickness is 40 ~ 120μm
Is. The internal wiring 2 is arranged between the plurality of insulating layers 1a to 1e.

The internal wiring 2 is made of a gold-based, silver-based or copper-based metal material, for example, a silver-based conductor. Further, the internal wiring 2 between the different insulating layers 1a to 1e is connected by the via-hole conductor 3 penetrating the thickness of the insulating layers 1a to 1e.

The via-hole conductor 3 is also made of a gold-based, silver-based, or copper-based metal material, for example, a silver-based conductor, like the internal wiring 2.

A surface wiring 4 made of a silver-based or copper-based metal material, for example, a copper-based conductor, is formed on the surface of the laminated body 1 and is connected to the via-hole conductor 3 formed in the insulating layer 1a. If necessary, a thick film resistor film 5 or a thick film protective film (not shown) may be formed on the surface wiring 4,
Various electronic components 6 including a plating process and an IC are joined by solder or bonding fine wires.

The above-mentioned laminated ceramic circuit board is shown in FIG.
It is formed by the steps shown in (a) to (g).

First, as shown in FIG. 2A, an insulating film 10e to be the insulating layer 1e is formed on a work substrate 15 (corresponding to a base) made of heat resistant resin, glass, ceramics or the like.

The insulating film 10e is formed by applying and drying a slip material obtained by homogeneously kneading ceramic powder, a glass material, an organic binder, an organic or aqueous solvent, etc. to a thickness of about 40 to 120 μm.

In FIG. 1, since the surface wiring and the like are not formed on the back surface of the laminated body 1, it is not necessary to form a penetrating recess serving as the via-hole conductor 3 in the insulating film 10e. When forming wiring etc., insulating film 1
After forming 0e, it is necessary to perform the step of forming the through recess 30 shown in FIG.

Examples of the above-mentioned ceramic powder include materials such as cristobalite, quartz, corundum (α-alumina), mullite, zirconia and cordierite.
The average particle size of the powder is preferably 1.0 to 6.0 μ.
m, and more preferably 1.5 to 4.0 μm. Two or more kinds of these ceramic materials may be mixed and used.

In particular, the use of corundum is advantageous in terms of cost. The average particle size of the ceramic powder is 1.0 to
The reason for setting 6.0 μm is that if the average particle size is less than 1.0 μm, it becomes difficult to homogeneously mix and slip.
On the contrary, if the average particle size exceeds 6.0 μm, the dense laminated body 1 having high strength cannot be obtained.

The above-mentioned glass material is a glass frit containing a plurality of metal oxides and has a temperature of 850 to 1050 ° C.
After calcination in 1., at least one crystal of cordierite, mullite, anorthite, sergian, spinel, garnite, willemite, dolomite, petalite or a substituted derivative thereof is precipitated.

In particular, when a crystallized glass frit that deposits anorthite or Celsian is used, a laminate body 1 having higher strength can be obtained, and when a crystallized glass frit that can deposit cordierite or mullite is used. Since the coefficient of thermal expansion after firing is low, it is effective as a circuit board for disposing a silicon chip such as an IC on the circuit board.

The most preferable glass materials in consideration of the strength and the coefficient of thermal expansion of the insulating layer are B ₂ O ₃ and Si.
A glass frit containing O ₂ , Al ₂ O ₃ , ZnO, and an alkaline earth oxide. Since such a glass frit has a wide vitrification range and a yield point around 600 to 800 ° C., it is suitable for low temperature firing at about 850 to 1050 ° C., and copper-based and silver to be the internal wiring 2 and the via-hole conductor 3. It is suitable for the sintering behavior of metallic and gold-based conductive materials.

The glass material is mixed in the slip material in a frit state. The average particle size of this frit is
It is 1.0 to 5.0 μm, preferably 1.5 to 3.5 μm. Here, if the average particle size is less than 1.0 μm, it becomes difficult to slip. Conversely, the average particle size is 5.0
When it exceeds μm, the dispersibility is impaired, and specifically, it cannot be uniformly dissolved and dispersed between the ceramic powders which are insulating materials, and the strength is extremely lowered.

The composition ratio of the above-mentioned ceramic material and glass material is such that when firing at a relatively low temperature of 850 to 1050 ° C., the ceramic material is 10 to 50 wt%, preferably 20 to 35 wt%. Is 90-50
wt%, preferably 80-65 wt%.

Here, if the ceramic material is less than 10 wt% and the glass material exceeds 90 wt%, the insulating layer is excessively vitreous, which is inappropriate from the viewpoint of the strength of the insulating layer. Material exceeds 50wt%,
Moreover, if the glass material is less than 50 wt%, the denseness of the insulating layer after firing is also impaired.

In addition to the above-mentioned solid components such as ceramics and glass, the constituent materials of the slip material include an organic binder and an organic solvent which are lost by sintering.

The organic binder must have good thermal decomposability. At the same time, since it determines the viscosity of the slip, the wettability with the solid content must be emphasized.According to the study of the present inventor, a carboxyl group such as acrylic acid or methacrylic acid-based polymer and an alcoholic hydroxyl group are determined. The ethylenically unsaturated compounds provided are preferred. The addition amount is preferably 25 wt% or less with respect to the solid content.

As the solvent, an aqueous solvent can be used in addition to the organic solvent. In this case, the organic binder also needs to be water-soluble, and the binder has a hydrophilic functional group such as carboxyl. A group is added. The amount of addition is 2 to 300 when expressed by acid value, preferably 5 to 1
00. If the addition amount is small, the solubility in water and the dispersibility of the powder of the fixed component will be poor, and if it is large, the thermal decomposability will be poor. In consideration of the above, it is appropriately added within the above range.

The organic binder in any of the slip materials must have good thermal decomposability as described above, but specifically, it must be capable of thermal decomposition at 600 ° C. or lower. More preferably, it is 500 ° C. or lower.
When the thermal decomposition temperature exceeds 600 ° C., it remains in the insulating layer, traps as carbon, discolors the substrate in gray, and lowers the insulation resistance of the insulating layer.
Also, it may become void and cause delamination.

Examples of the method of applying the above-mentioned slip material include a doctor blade method (knife coating method), a roll coating method, a printing method and the like. In particular, a doctor blade method or the like is preferable because it makes it easy to flatten the surface of the insulating film after coating. The amount of the solvent added is adjusted according to the coating method to adjust the viscosity to a predetermined value.

As a drying method, a batch-type drying furnace or an in-line-type drying furnace is used, and the drying condition is 120 ° C.
The following is desirable. Also, rapid drying may cause cracks on the surface, so it is important to avoid rapid heating.

Next, as shown in FIG. 2B, the insulating layer 1
The conductor film 20 serving as the inner conductor 2 disposed between the e and the insulating layer 1d is printed in a predetermined shape by screen printing using, for example, an Ag-based conductive paste, and dried. The conductor film preferably has a thickness of about 20 to 30 μm.

As the conductive paste, at least one metal material selected from gold, silver, copper or alloys thereof, for example, silver powder, a low melting point glass component, an organic binder and an organic solvent are homogeneously kneaded. . In particular, since the firing temperature is relatively low at 850 to 1050 ° C, it is important to use a low melting point glass component having a yield point of around 700 ° C in consideration of the sintering behavior of the insulating film.

Next, as shown in FIG. 2C, the insulating film 10d to be the insulating layer 1d is applied and dried using the above-mentioned slip material so as to completely cover the above-mentioned conductor film 20. .

Here, the base body is not the work substrate 15 alone, but the base body including the insulating film 10e and the conductor 20 to be the internal wiring formed before this step.

Next, as shown in FIG. 2D, the insulating layer 1
A through recess 30 is formed by irradiating a laser beam at a predetermined position of the insulating film 10d corresponding to the via-hole conductor 3 penetrating in the thickness direction of d. The upper opening diameter of the through recess 30 is 40
-100 μm, generally about 80 μm. Since the insulating film 10d is gradually burned down from the surface side by the irradiation of the laser light, the actual shape of the through recess 30 has a lower opening diameter smaller than the upper opening diameter.

The laser may be a YAG laser, an excimer laser, a CO ₂ laser, or the like, and the insulating film 10d
A mask or the like (Gullet dry plate) having only the portion to be the through recess 30 opened is placed thereon, and the insulating film 10d is scanned with laser light under a predetermined irradiation condition. The output of laser light is 1.0 to 5.0 W, preferably about 3.0 W.
If the output is too low, the number of beam shots required to penetrate the insulating film 10d in the thickness direction increases, and it takes a lot of time to form the penetrating recess 30.
On the contrary, if the output is too high, the conductor film 20 formed on the insulating film 10e is also destroyed.

The oscillation frequency of the laser light is 1.0
~ 3.0 KHz, scanning speed 5 ~ 50 mm / s
If it is about a certain degree, it is possible to form the complete penetrating recess 30 with good time efficiency and stable pattern accuracy.

Next, as shown in FIG. 2E, the insulating film 1
The conductor 3 to be the via-hole conductor 3 is provided in the through recess 30 of 0d.
1 is formed by filling and drying a conductive paste.
The filling method is, for example, a screen printing method. still,
As shown in the figure, since the side surface of the actual through recess 30 is inclined, the filling property of the conductive paste into the through recess 30 is improved.

Next, as shown in FIG. 2F, the insulating layer 1
The conductor film 20 to be the internal wiring 2 disposed between the insulating layer 1c and the insulating layer 1c is printed and dried on the insulating film 10d using a conductive paste. The printing method is, for example, a screen printing method.

Incidentally, the step of filling the above-mentioned penetrating recess 30 with a conductive paste to form the conductor 31 (FIG. 2 (e)),
The step of printing the conductive paste on the insulating film 10d to form the conductor film 20 (FIG. 2F) may be performed in the same printing step.

Next, the insulating film to be the insulating layer 1c is formed as shown in FIG.
2C, the through-recess 30 of the insulating film 10c to be the insulating layer 1c is formed as shown in FIG. 2D, and the through-recess 30 serves as the via-hole conductor 3. 31 is formed as shown in FIG. 2E, and the insulating layer 1c is formed.
2F, the conductor film 20 to be the internal wiring 2 disposed between the insulating layer 1b and the insulating layer 1b is formed.

By repeating this, as shown in FIG. 2 (g), the insulating film 10a to be the uppermost insulating layer 1a is formed,
The through recess 30 is formed in the insulating film 10a, and the conductor 31 to be the via-hole conductor 3 is formed. As a result, the step of laminating the unfired laminated body 1 is completed.

Then, a dividing groove is formed in the laminated body 1 by press molding so as to be divided into individual laminated bodies, and the work substrate 15 and the laminated body 1 are separated.

Next, the insulating films 10a to 10e and the internal wiring 2
The laminated body 1 including the conductor film 20 and the via-hole conductor 3 and the conductor 31 is integrally sintered.

Sintering consists of a binder removal process and a firing process. In the binder removal process, the insulating films 10a to 10e, the conductor film 20 to be the internal wiring 2, and the conductor 3 of the via-hole conductor 3 are used.
This is because the organic component contained in 1 disappears, and for example, 6
It is not higher than 00 ° C.

In the firing process, the insulating films 10a to 10e are used.
By sufficiently softening the glass component of (1) to uniformly fill the grain boundaries of the ceramic powder to achieve a certain strength of the laminated body 1, and at the same time, the silver powder of the conductor film 20 and the conductor 31 is grain-grown. In addition to lowering the resistance, it is integrated with the insulating layer, and is performed at a peak temperature of 850 to 1050 ° C. in an oxidizing atmosphere or a neutral atmosphere.

The surface conductor 4 is baked on the surface of the laminated body 1 that has been sintered. When a copper-based conductor is used for the surface conductor 4, the internal wiring 2 and the via-hole conductor 3 are silver-based conductors. Therefore, in order to avoid the eutectic reaction between silver and copper at the connection portion, As the formation, a copper-based conductive paste that can be burned at a low temperature (for example, 780 ° C. or lower) is used, and baking is performed in a reducing or neutral atmosphere. Further, when a silver-based conductor is used for the surface conductor 4, in addition to FIG. 2G, the silver-based conductive paste is filled in the penetrating recess 30 of the insulating film 10a at the same time as or immediately after that. It can be formed by printing with a paste and baked at the same time as the laminated body 1. From the manufacturing process, it is advantageous to use a silver-based conductor, but since silver has a problem of migration, it is advantageous to use a copper-based conductor from the viewpoint of increasing the density of the surface wiring 4. It can be used properly according to the purpose.

Then, if necessary, the thick film resistor film 5 is formed by baking, and the electronic component 6 such as an IC chip or a chip component is bonded onto the surface conductor 4 and divided individually along the dividing groove. . As a result, the laminated ceramic circuit board shown in FIG. 1 is achieved. Although not shown in the figure, the insulating protective film may be formed subsequent to the formation of the thick film resistor film 5.

According to the above manufacturing method, as shown in FIG. 2C, for example, the insulating film 10d is formed by the work substrate 1
5, the insulating film 10e and the conductor film 20 to be the internal wiring 2 are formed by coating and drying an insulating slip material such as a doctor blade method, so that the insulating film is formed on the carrier tape as in the conventional case. Then, after the drying, the insulating film can be easily formed without transferring to the upper part of the laminated body under a predetermined laminating condition and peeling the carrier tape.

Moreover, the surface of the insulating film that has been applied is
Regardless of the laminated state of the conductor film 20 which becomes the lower internal wiring 2 and the number of laminated insulating films, a uniform surface can always be obtained. Therefore, the conductor film of the internal wiring can be reliably and stably formed on the insulating film.

Further, the thickness of the insulating film can be arbitrarily set by controlling the distance between the blade at the time of applying the slip material and the upper portion of the laminated body already laminated, and moreover, the through recess 30
The thickness does not change even before the formation of. Therefore, when the through recess 30 is formed by laser light irradiation, the laser light irradiation condition can be set in consideration of the controlled thickness of the insulating film, the accuracy of the through recess 30 is improved, and Damage to the exposed conductor film 20 which becomes the internal wiring 2 in the lower layer is not suppressed,
The connection reliability between the internal wiring 2 by the via-hole conductor 3 is improved.

Further, since a stable penetrating recess of a via hole conductor can be easily formed without using a carrier tape, it is possible to perform an insulating film forming step, a penetrating recess forming step to be a via hole conductor, and a selective printing of a conductive paste. A method of manufacturing a laminated ceramic circuit board that enables a conductor manufacturing process that fills up the conductors that will be via-hole conductors, forms internal wiring, and further forms an insulating film ... Becomes

Although the surface wiring 4 and the various electronic components 5 and 6 are formed only on one main surface of the laminated body 1 in the above-described embodiment, the surface wiring is formed on the other main surface of the laminated body 1 as well. Conductor 4,
Various electronic components 5 and 6 may be formed. in this case,
2B, after forming the insulating film 10e,
It is necessary to perform the step of forming the through recess 30 shown in (d) and the step of filling the conductor 31 to be the via-hole conductor 3 shown in FIG. 2 (f).

Further, as the work substrate 15, a fired ceramic substrate having internal wiring printed thereon may be used. In this case, it is not necessary to separate the work board 15.

As the internal wiring 2, Au system, Ag
Insulating layer 1a because a low-melting metal material such as Cu-based or Cu-based is used
Although a material containing glass ceramic as a main component is used also for 1f, a high melting point metal material such as tungsten or molybdenum may be used for the internal wiring 2. in this case,
Since the sintering temperature is around 1300 ° C., the composition of the glass component in the insulating layer that is similar to the sintering behavior of the metal material such as tungsten and molybdenum can be changed, the glass component,
The composition ratio of the ceramic component, for example, the glass component may be less than 10% by weight.

[0068]

As described above, according to the manufacturing method of the present invention, the insulating film having a predetermined thickness can be easily formed, and the surface thereof is uniform, so that the insulating film can be stably formed on the insulating film even if the number of laminated layers increases. It is possible to easily form a conductor film that will become the internal wiring,
The through-hole recess serving as a via-hole conductor for connecting the conductor film can be accurately, easily, and reliably formed by irradiating the optimum laser beam according to the thickness of the insulating film, and the conduction reliability between the internal wirings can be improved. It is an improved multilayer ceramic circuit board.

Further, since the insulating film can be directly formed on the laminated body (base) without using the carrier tape, the step of forming the insulating film can be simplified, and the laminated type can be formed by the consistent manufacturing line. Ceramic circuit boards can be manufactured.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a multilayer ceramic circuit board according to the present invention.

2A to 2G are cross-sectional views of schematic steps for explaining the manufacturing method of the present invention.

[Explanation of symbols]

 1a to 1e ... Insulating layer 10a to 10e ... Insulating film 2 ... Internal wiring 20 ... Internal conductor 3 ... Via hole conductor 31.・ ・ ・ Conductor member that becomes via-hole conductor 30 ・ ・ ・ Penetration recess 4 ・ ・ ・ ・ ・ Surface wiring 5 ・ ・ ・ Thick film resistor film 6 ・ ・ ・ ・ ・・ Electronic components 15 ・ ・ ・ ・ ・ ・ Supporting substrate

Claims (1)

[Claims] 1. A conductor serving as a via-hole conductor in which an insulating film to be a ceramic layer and a conductor film to be an internal wiring are superposed and laminated, and conductor films adjacent to each other with the insulating film interposed therebetween are via-hole conductors penetrating the thickness of the insulating film. To form a laminate that is connected via
A method of manufacturing a multilayer ceramic circuit board, which comprises subjecting the multilayer body to a firing process, comprising: forming an insulating film having the via-hole conductor and a conductive film overlapping the insulating film by the following steps. Manufacturing method of ceramic circuit board. (1) A step of applying and drying a glass / ceramic slip material to form an insulating film, (2) A step of irradiating the insulating film with a laser beam to form a through hole penetrating the insulating film, (3) ) A step of printing and filling a conductive paste on the surface of the insulating film and in the through holes to form a conductor film to be internal wiring and a conductor to be via hole conductors.