JPH07130901A - Package of semiconductor device - Google Patents
Package of semiconductor deviceInfo
- Publication number
- JPH07130901A JPH07130901A JP25352393A JP25352393A JPH07130901A JP H07130901 A JPH07130901 A JP H07130901A JP 25352393 A JP25352393 A JP 25352393A JP 25352393 A JP25352393 A JP 25352393A JP H07130901 A JPH07130901 A JP H07130901A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- semiconductor device
- guide pin
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、パワートランジスタモ
ジュールなどを対象とした半導体装置のパッケージに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device package for a power transistor module or the like.
【０００２】[0002]
【従来の技術】頭記したパワートランジスタモジュール
などの半導体装置は、一般に駆動回路，保護回路などを
搭載したプリント配線板に実装して使用され、半導体装
置の樹脂ケース上面に引出したピン端子をプリント配線
板側に装備したコネクタに差し込んで両者間の相互接続
を行うようにしている。2. Description of the Related Art Semiconductor devices such as the power transistor module described above are generally used by mounting them on a printed wiring board on which a driving circuit, a protection circuit, etc. are mounted, and the pin terminals drawn on the upper surface of the resin case of the semiconductor device are printed. It is designed to be plugged into a connector on the wiring board side for mutual connection between the two.
【０００３】また、プリント配線板への半導体装置の取
付けを自動実装機を用いて行う場合に、前記したピン端
子とコネクタとの接続位置決めを確実に行うために、半
導体装置の樹脂ケース側にピン端子列と並べてガイドピ
ンを植設しておき、このガイドピンをプリント配線板側
の位置決め穴に嵌合して両者間の位置合わせを行うよう
にしたものが、例えば実開平３−１１７８４２号の公報
に開示されて公知である。Further, when the semiconductor device is mounted on the printed wiring board by using an automatic mounting machine, in order to ensure the positioning of the connection between the pin terminal and the connector, a pin is provided on the resin case side of the semiconductor device. A guide pin is planted side by side with the terminal row, and the guide pin is fitted into a positioning hole on the printed wiring board side to align the two. For example, in Japanese Utility Model Laid-Open No. 3-117842. It is disclosed in the publication and is publicly known.
【０００４】図６はかかる半導体装置の従来構造を示す
ものであり、図において、１は半導体素子（図示せず）
を組み込んだ樹脂ケース、２は樹脂ケース１の上面側に
突出して並ぶピン端子、３はピン端子列の両側に並べて
樹脂ケース１と一体にモールド成形したガイドピンであ
り、その長さ寸法はピン端子２よりも多少長くしてあ
る。また、４はプリント配線板であり、該プリント配線
板には前記のピン端子２と接続し合うコネクタ５を備え
ており、かつコネクタ５の両側には前記ガイドピン３と
嵌合し合う位置決め穴６が開口している。そして、半導
体装置をプリント配線板４に実装する際には、ガイドピ
ン３をプリント配線板側の位置決め穴６に合わせた上で
ピン端子２を相手側のコネクタ５に差し込んで接続す
る。これにより、ガイドピン３に案内されてピン端子２
がコネクタ５に安定よく嵌合して適正に接続されるよう
になる。FIG. 6 shows a conventional structure of such a semiconductor device. In the figure, 1 is a semiconductor element (not shown).
2 is a pin terminal that projects from the upper surface side of the resin case 1 and is lined up on both sides of the pin terminal row, and 3 is a guide pin molded integrally with the resin case 1. It is slightly longer than terminal 2. Reference numeral 4 denotes a printed wiring board, which is provided with a connector 5 for connecting with the pin terminal 2, and on both sides of the connector 5 a positioning hole for fitting with the guide pin 3. 6 is open. Then, when mounting the semiconductor device on the printed wiring board 4, the guide pins 3 are aligned with the positioning holes 6 on the printed wiring board side, and then the pin terminals 2 are inserted into the mating connectors 5 for connection. As a result, the pin terminal 2 is guided by the guide pin 3.
Can be fitted into the connector 5 in a stable manner and properly connected.
【０００５】[0005]
【発明が解決しようとする課題】ところで、前記のよう
に樹脂ケースの上面へ突き出すように一体形成した従来
のガイドピン（樹脂製）は太さが細くて強度も小さく、
かつ樹脂ケースの材料としてＰＰＳ（ポリフェニレンサ
ルファイド）樹脂（機械的な性質として硬度が高くて脆
い）を採用することが多く、このために成形後に行う樹
脂ケース自身の検査，梱包、あるいは樹脂ケースに半導
体素子を組み込む半導体装置の組立工程，およびその後
の製品試験，梱包などの取扱いの際に、樹脂ケースより
突出したガイドピンに不測に物が当たってしばしば折損
し、このことが樹脂ケース，半導体装置の製品良品率を
低下させる原因の一つとなっており、その防止対策が望
まれている。By the way, the conventional guide pin (made of resin) integrally formed so as to project to the upper surface of the resin case as described above has a small thickness and a small strength.
In addition, PPS (polyphenylene sulfide) resin (mechanical property of high hardness and brittleness) is often used as the material of the resin case, and for this reason, inspection of the resin case itself after packaging, packaging, or semiconductor During the assembly process of the semiconductor device incorporating the element and the subsequent product testing, handling such as packaging, the guide pin protruding from the resin case is accidentally hit by an object and is often broken. This is one of the causes of lowering the non-defective product rate, and its preventive measures are desired.
【０００６】本発明は上記の点にかんがみなされたもの
であり、その目的は前記課題を解決してガイドピンの折
損防止が図れるようにした半導体装置のパッケージ、特
にその樹脂ケースに設けたガイドピンの組立構造を提供
することにある。The present invention has been made in view of the above points, and an object thereof is to solve the above-mentioned problems and to prevent breakage of a guide pin of a semiconductor device package, particularly a guide pin provided in a resin case thereof. It is to provide an assembly structure of.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、半導体素子を組み込んだ樹脂ケースの上
面にプリント配線板側のコネクタと接続し合うピン端子
と並置してプリント配線板側の位置決め穴と嵌合し合う
複数本のガイドピンを設けた半導体装置のパッケージに
対し、前記ガイドピンを次記のような構造で樹脂ケース
に組み込むものとする。In order to achieve the above object, the present invention is directed to a printed wiring board which is juxtaposed with a pin terminal which is connected to a connector on the printed wiring board side on the upper surface of a resin case incorporating a semiconductor element. For a package of a semiconductor device having a plurality of guide pins that fit with the positioning holes on the side, the guide pins are incorporated in a resin case with the following structure.
【０００８】（１）ガイドピンを独立部品として樹脂ケ
ースの上面に穿孔した取付穴へ差し込み式に取付けて組
立構成するものとする。 この場合に、前記ガイドピンの差し込み基部，およびガ
イドピン取付穴の周面に余剰接着剤の逃げ路となるスリ
ットを形成するのがよい。 （２）樹脂ケースに植設したガイドピンの根元部を先端
部よりも太くする。(1) The guide pin is assembled as an independent component by inserting the guide pin into a mounting hole formed in the upper surface of the resin case. In this case, it is preferable to form slits, which serve as escape paths for excess adhesive, on the insertion base of the guide pin and the peripheral surface of the guide pin mounting hole. (2) Make the root of the guide pin planted in the resin case thicker than the tip.
【０００９】（３）ガイドピンを金属製ピンとし、該金
属製ガイドピンをインサート部品として樹脂ケースと一
体成形する。また、その実施態様として、金属製ガイド
ピンを芯材としてその周面に樹脂形成を施して構成する
ことができる。 （４）さらに、前記のガイドピンをピン端子列に並べて
ピン端子の間に設けることもできる。(3) The guide pin is a metal pin, and the metal guide pin is integrally molded with the resin case as an insert part. Further, as an embodiment thereof, a metal guide pin may be used as a core material and a resin is formed on its peripheral surface. (4) Further, the guide pins may be arranged in a pin terminal row and provided between the pin terminals.
【００１０】[0010]
【作用】前記の（１）項の構成によれば、樹脂ケースと
ガイドピンとを別部品で製作し、両者を分離した状態で
半導体装置の組立，試験を行い、その後に樹脂ケースに
ガイドピンを接着剤で後付けするような製作工程の管理
が可能であり、これにより半完成品状態での取扱い時に
ガイドピンに物が当たって折損するといったトラブルが
回避できる。According to the structure of the above item (1), the resin case and the guide pin are manufactured as separate parts, and the semiconductor device is assembled and tested in a state where the resin case and the guide pin are separated from each other. It is possible to control the manufacturing process such as attaching with an adhesive, and it is possible to avoid the trouble that the guide pin is hit by an object and broken during handling in a semi-finished product state.
【００１１】また、（２）の構成によれば、ガイドピン
自身の強度が増すので外力による折損が防げる。同様に
（３）の構成によりガイドピン自身が堅牢となる。さら
に、（４）の構成によれば、ガイドピンの両側に並ぶピ
ン端子が防護体の役目を果たしてガイドピンに物が突き
当たるのを防ぐので、安全性がより一層高まる。Further, according to the configuration of (2), the strength of the guide pin itself is increased, so that breakage due to an external force can be prevented. Similarly, the structure of (3) makes the guide pin itself robust. Further, according to the configuration of (4), the pin terminals arranged on both sides of the guide pin serve as a protective body and prevent an object from hitting the guide pin, so that the safety is further enhanced.
【００１２】[0012]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。なお、各実施例の図中で図６に対応する同一部材
には同じ符号が付してある。 実施例１：図１は本発明の請求項１に対応する実施例を
示すものであって、ガイドピン３は独立部品として樹脂
ケース１と別個に製作，用意されており、樹脂ケース１
の上面に穿孔した取付穴１ａに差し込んで接着などによ
り後付けされる。そして、樹脂ケース１の検査，半導体
装置の組立，試験工程はガイドピン３を樹脂ケース１に
取付けず、半導体装置の試験後に行う最終組立工程でガ
イドピン３を樹脂ケース１に後付けして製品を完成す
る。Embodiments of the present invention will be described below with reference to the drawings. In the drawings of each embodiment, the same members corresponding to FIG. 6 are denoted by the same reference numerals. Embodiment 1 FIG. 1 shows an embodiment corresponding to claim 1 of the present invention, in which the guide pin 3 is manufactured and prepared separately from the resin case 1 as an independent component.
Is attached to the mounting hole 1a drilled on the upper surface of the and is attached later by adhesion or the like. Then, in the inspection of the resin case 1, the assembly of the semiconductor device, and the test process, the guide pin 3 is not attached to the resin case 1, and the guide pin 3 is attached to the resin case 1 in the final assembly process performed after the test of the semiconductor device. Complete.
【００１３】このように、半導体装置の組立，試験工程
の際にガイドピンを外しておくことにより、これら工程
での取扱時に不測に物が当たってガイドピンが折損する
トラブルが防げる。また、この実施例に対して、図７で
示すように、あらかじめガイドピン３の差し込み基部周
面，および樹脂ケース側に穿孔したピン取付け穴１ａの
内周面に接着剤の逃げ路となるスリット３ｃ，１ｃを形
成しておくことにより、ガイドピン３を取付穴１ａに差
し込んで接着した際に、接合面からはみ出した余剰の接
着剤はスリット１ｂ，３ｃの中に取り込まれる。これに
よりガイドピン３の接着剤による浮き上がりを防ぐとと
もに、接着剤がパッケージの表面にはみ出してパッケー
ジ外観を損ねるといった不具合を回避できる。As described above, by removing the guide pin during the semiconductor device assembling and testing steps, it is possible to prevent the trouble that the guide pin is broken due to an accidental hit during handling in these steps. In addition, in this embodiment, as shown in FIG. 7, slits serving as escape paths for the adhesive are formed on the peripheral surface of the insertion base portion of the guide pin 3 and the inner peripheral surface of the pin mounting hole 1a drilled on the resin case side in advance. By forming 3c and 1c in advance, when the guide pin 3 is inserted into the mounting hole 1a and adhered, the excess adhesive protruding from the joint surface is taken into the slits 1b and 3c. As a result, it is possible to prevent the guide pin 3 from being lifted up by the adhesive, and to avoid the problem that the adhesive sticks out to the surface of the package and impairs the appearance of the package.
【００１４】実施例２：図２は本発明の請求項２に対応
する実施例を示すものであり、樹脂ケース１と一体成形
された樹脂製のガイドピン３は、その根元部が先端部よ
りも太く成形されている。これにより、ガイドピン自身
の強度が増し、半導体装置の組立，試験工程などの取扱
時に物が当たっても簡単に折損することがなくなる。Embodiment 2 FIG. 2 shows an embodiment corresponding to claim 2 of the present invention. The resin guide pin 3 integrally molded with the resin case 1 has a root portion from the tip end portion. Is also thickly formed. As a result, the strength of the guide pin itself is increased, and even if an object is hit during handling such as assembling and testing processes of the semiconductor device, it is not easily broken.
【００１５】実施例３：図３は本発明の請求項３に対応
する実施例を示すものであり、この実施例ではガイドピ
ンに金属製ガイドピン３０を採用し、樹脂ケース１を成
形する際に金属製ガイドピン３０を金型にインサートし
て一体成形により固定する。このようにガイドピンとし
て金属製のピンを採用すれば、樹脂製のピンと比べて堅
牢であり、組立，試験工程の際に物が突き当たっても折
損することがない。Embodiment 3 FIG. 3 shows an embodiment corresponding to claim 3 of the present invention. In this embodiment, when the metal guide pin 30 is adopted as the guide pin and the resin case 1 is molded. Then, the metal guide pin 30 is inserted into the mold and fixed by integral molding. If a metal pin is used as the guide pin in this way, it is more robust than a resin pin and will not break even if an object hits it during the assembly and test process.
【００１６】実施例４：図４は本発明の請求項４に対応
する実施例を示すものであり、ガイドピン３は金属製の
ピン３ａを芯材としてその周面を樹脂３ｂで覆うように
樹脂ケース１と一体成形されている。この実施例によっ
ても先記の実施例２と同様に堅牢なガイドピンが得られ
る。Embodiment 4 FIG. 4 shows an embodiment corresponding to claim 4 of the present invention, in which the guide pin 3 has a metal pin 3a as a core and its peripheral surface is covered with a resin 3b. It is integrally molded with the resin case 1. Also in this embodiment, a robust guide pin can be obtained as in the above-mentioned second embodiment.
【００１７】実施例５：図５は本発明の請求項５に対応
する実施例を示すものであり、ガイドピン３は樹脂ケー
ス１の上面に並ぶピン端子２の間に挟まれる形でピン端
子列の中間に設けてある。かかる構成によれば、ガイド
ピン３がピン端子２により防護され、半導体装置の組
立，試験などの取扱時に物が直接ガイドピン３に突き当
たって折損するのを防止できる。Embodiment 5: FIG. 5 shows an embodiment corresponding to claim 5 of the present invention, in which the guide pin 3 is sandwiched between the pin terminals 2 arranged on the upper surface of the resin case 1. It is located in the middle of the row. With such a configuration, the guide pin 3 is protected by the pin terminal 2, and it is possible to prevent an object from directly hitting the guide pin 3 and being broken during handling such as assembling and testing of the semiconductor device.
【００１８】[0018]
【発明の効果】以上述べたように、本発明の構成を採用
することにより、半導体装置の組立，試験などの工程で
ガイドピンに物が突き当たって不測に折損するようなト
ラブルを防ぐことができ、これにより製品の良品率が向
上する。As described above, by adopting the configuration of the present invention, it is possible to prevent a trouble such as an accidental breakage due to an object hitting a guide pin in a process of assembling and testing a semiconductor device. As a result, the yield rate of products is improved.
【図１】本発明の実施例１によるガイドピンの取付け構
造図FIG. 1 is a mounting structure diagram of a guide pin according to a first embodiment of the present invention.
【図２】本発明の実施例２によるガイドピンの構造図FIG. 2 is a structural diagram of a guide pin according to a second embodiment of the present invention.
【図３】本発明の実施例３によるガイドピンの構造図FIG. 3 is a structural diagram of a guide pin according to a third embodiment of the present invention.
【図４】本発明の実施例４によるガイドピンの構造図FIG. 4 is a structural diagram of a guide pin according to a fourth embodiment of the present invention.
【図５】本発明の実施例５によるガイドピンとピン端子
との配列を表す図FIG. 5 is a diagram showing an arrangement of guide pins and pin terminals according to a fifth embodiment of the present invention.
【図６】プリント配線板とともに表した従来における半
導体装置のパッケージ構成図FIG. 6 is a package configuration diagram of a conventional semiconductor device shown together with a printed wiring board.
【図７】図１の応用実施例を示す図であり、（ａ）はガ
イドピンの構造図、（ｂ）は樹脂ケースに穿孔したピン
取付穴の構造図7A and 7B are views showing an application example of FIG. 1, in which FIG. 7A is a structural diagram of a guide pin, and FIG. 7B is a structural diagram of a pin mounting hole formed in a resin case.
１ 樹脂ケース １ａ ピン取付穴 １ｂ スリット ２ ピン端子 ３ ガイドピン ３ａ 金属ピン ３ｂ 樹脂 ３ｃ スリット ４ プリント配線板 ５ コネクタ ３０ 金属製ガイドピン 1 Resin Case 1a Pin Mounting Hole 1b Slit 2 Pin Terminal 3 Guide Pin 3a Metal Pin 3b Resin 3c Slit 4 Printed Wiring Board 5 Connector 30 Metal Guide Pin
Claims (6)
に、プリント配線板側のコネクタと接続し合うピン端子
と並置してプリント配線板側の位置決め穴と嵌合し合う
複数本のガイドピンを設けた半導体装置のパッケージに
おいて、前記ガイドピンを独立部品として樹脂ケースの
上面に穿孔した取付穴へ差し込み式に取付けたことを特
徴とする半導体装置のパッケージ。1. A plurality of guide pins, which are juxtaposed with pin terminals for connecting to a connector on the printed wiring board side and fitted into positioning holes on the printed wiring board side, are provided on the upper surface of a resin case incorporating a semiconductor element. A package of a semiconductor device provided, wherein the guide pin is attached as a stand-alone component to a mounting hole formed on an upper surface of a resin case by insertion.
ドピンの差し込み基部，およびガイドピン取付穴の周面
に余剰接着剤の逃げ路となるスリットを形成したことを
特徴とする半導体装置のパッケージ。2. A package of a semiconductor device according to claim 1, wherein a slit serving as an escape path for the excess adhesive is formed on the guide pin insertion base and the peripheral surface of the guide pin mounting hole.
に、プリント配線板側のコネクタと接続し合うピン端子
と並置してプリント配線板側の位置決め穴と嵌合し合う
複数本のガイドピンを設けた半導体装置のパッケージに
おいて、前記ガイドピンの根元部を先端部よりも太くし
たことを特徴とする半導体装置のパッケージ。3. A plurality of guide pins, which are juxtaposed with pin terminals for connecting to a connector on the printed wiring board side and fitted into positioning holes on the printed wiring board side, are provided on the upper surface of a resin case incorporating a semiconductor element. In the provided semiconductor device package, a root portion of the guide pin is thicker than a tip portion thereof.
に、プリント配線板側のコネクタと接続し合うピン端子
と並置してプリント配線板側の位置決め穴と嵌合し合う
複数本のガイドピンを設けた半導体装置のパッケージに
おいて、前記ガイドピンを金属製のピンとし、該金属製
ガイドピンをインサート部品として樹脂ケースと一体成
形したことを特徴とする半導体装置のパッケージ。4. A plurality of guide pins, which are juxtaposed with pin terminals for connecting to a connector on the printed wiring board side and fitted into positioning holes on the printed wiring board side, are provided on the upper surface of a resin case incorporating a semiconductor element. A package of a semiconductor device, wherein the guide pin is a metal pin, and the metal guide pin is integrally molded with a resin case as an insert part.
製ピンを芯材としてその周面に樹脂成形を施したことを
特徴とする半導体装置のパッケージ。5. A package of a semiconductor device according to claim 3, wherein a metal pin is used as a core material and a peripheral surface thereof is resin-molded.
て、ガイドピンをピン端子列と並べてピン端子の間に設
けたことを特徴とする半導体装置のパッケージ。6. A package for a semiconductor device according to claim 1, wherein the guide pins are arranged between the pin terminals in a line with the pin terminal row.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25352393A JP3129058B2 (en) | 1993-09-08 | 1993-10-12 | Semiconductor device package |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22267693 | 1993-09-08 | ||
| JP5-222676 | 1993-09-08 | ||
| JP25352393A JP3129058B2 (en) | 1993-09-08 | 1993-10-12 | Semiconductor device package |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000191329A Division JP3540985B2 (en) | 1993-09-08 | 2000-06-26 | Semiconductor device package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07130901A true JPH07130901A (en) | 1995-05-19 |
| JP3129058B2 JP3129058B2 (en) | 2001-01-29 |
Family
ID=26525004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25352393A Expired - Lifetime JP3129058B2 (en) | 1993-09-08 | 1993-10-12 | Semiconductor device package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3129058B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11168168A (en) * | 1997-12-04 | 1999-06-22 | Fuji Electric Co Ltd | Package for semiconductor device and manufacturing method therefor |
| JP2002151647A (en) * | 2000-11-14 | 2002-05-24 | Mitsubishi Electric Corp | Power module |
| JP2007292581A (en) * | 2006-04-25 | 2007-11-08 | Chugoku Electric Power Co Inc:The | Watt-hour meter inspection apparatus |
| JP2009059925A (en) * | 2007-08-31 | 2009-03-19 | Mitsubishi Electric Corp | Semiconductor device |
| JP2009135745A (en) * | 2007-11-30 | 2009-06-18 | Nippon Dempa Kogyo Co Ltd | Piezoelectric device for surface mounting |
| WO2010090092A1 (en) * | 2009-02-06 | 2010-08-12 | 日立オートモティブシステムズ株式会社 | Power converter |
-
1993
- 1993-10-12 JP JP25352393A patent/JP3129058B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11168168A (en) * | 1997-12-04 | 1999-06-22 | Fuji Electric Co Ltd | Package for semiconductor device and manufacturing method therefor |
| JP2002151647A (en) * | 2000-11-14 | 2002-05-24 | Mitsubishi Electric Corp | Power module |
| JP2007292581A (en) * | 2006-04-25 | 2007-11-08 | Chugoku Electric Power Co Inc:The | Watt-hour meter inspection apparatus |
| JP4738244B2 (en) * | 2006-04-25 | 2011-08-03 | 中国電力株式会社 | Energy meter inspection device |
| JP2009059925A (en) * | 2007-08-31 | 2009-03-19 | Mitsubishi Electric Corp | Semiconductor device |
| JP2009135745A (en) * | 2007-11-30 | 2009-06-18 | Nippon Dempa Kogyo Co Ltd | Piezoelectric device for surface mounting |
| WO2010090092A1 (en) * | 2009-02-06 | 2010-08-12 | 日立オートモティブシステムズ株式会社 | Power converter |
| JP2010183750A (en) * | 2009-02-06 | 2010-08-19 | Hitachi Automotive Systems Ltd | Power conversion apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3129058B2 (en) | 2001-01-29 |
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