JPH07130746A - Bump formation jig - Google Patents

Abstract

PURPOSE:To prevent the generation of punching scrap by forming the upper surface of die punching hole in such a way as to be higher than that of the other die, generating a tensile stress when a material is retained, and making a punching hole larger than the punch diameter due to the tensile stress. CONSTITUTION:The upper surface 9 of a punching hole is formed higher than that of the other die. A material 3 is retained by a material retainer 2 so as to generate a tensile stress. In this state, a punch 1 is moved downward to punch out the material 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a bump forming jig,
The present invention relates to a bump forming jig applicable to mounting a semiconductor element.

[0002]

2. Description of the Related Art In a conventional bump forming jig, as shown in FIG. 2, a solder material 3 is placed on a die 4 whose surface on which the material is placed is flat, and the solder material 3 near a punching hole 7 is placed on the die surface. Solder material 3 with material holder 21 for pressing
The punch 1 is moved vertically while the solder material 3 is punched out.

Further, as disclosed in Japanese Utility Model Laid-Open No. 60-42596, there is a technique of a punching die in which an elastic body for removing punching dust adhering to the tip of the punch is provided in the middle of the punching hole of the die. In this technique, as shown in FIG. 3, a ring-shaped elastic body 10 having a hole smaller than the punch diameter is provided between the first die 41 and the second die 42 to remove the solder scrap 11a attached to the tip of the punch 1. It is sandwiched by the elastic body 10 and removed as punching scraps 11b.

[0004]

In this conventional bump forming jig, since the diameter of the cut surface of the bump material after punching the bump material and the diameter of the punch are the same, the punch after punching is placed on top. The side surface of the punch and the cut surface of the bump material come into contact with each other during the extraction. Therefore, the punch side surface scrapes off the cut surface of the bump material. There is a problem that the scraped off bump material becomes punched scraps and adheres to the punch, resulting in malfunction of the punch.

Further, the method disclosed in Japanese Utility Model Laid-Open No. 60-42596 has a drawback in that it cannot be used for a long time because the elastic body gradually wears.

[0006]

The bump forming jig of the present invention is a die plate having a raised peripheral portion of the die hole, and a material set on the die plate by being driven into and inserted into the die hole. It has a punch for punching and a material presser for pressing the material in the portion lower than the die hole.

[0007]

The present invention will be described below with reference to the drawings.

FIG. 1 is a vertical sectional view showing an embodiment of the present invention. The solder material Pb-60% Sn3 is set on the die 4 in which the periphery of the punching hole 9 of the die is raised,
The material presser 2 presses the solder material Pb-60% Sn 3 and moves the punch 1 downward to punch out the Pb-60% Sn solder material 3.

Pb-60 having a thickness of 100 μm is formed on the die 4.
% Sn Solder material 3 is placed, and Pb-60% with material presser 2.
The Sn solder material 3 is pressed onto the die 4. At this time, since the upper surface of the punched hole portion is higher than the upper surface of the die by H = 50 μm, pulling stress acts when the material is pressed. Punch in this state and move 1 vertically downward to move Pb-60
% Sn solder material 3 is sheared. Next, the punch 1 is moved vertically upward and pulled out. Since the tensile stress acts on the Pb-60% Sn solder material 3, the diameter of the punched section 6 becomes larger than the diameter of the punch 1. Therefore, the punch end portion 5 does not come into contact with the bump material cutting surface 6 and material punching scraps do not occur, so that malfunction of the punch can be prevented.

Then, the bump forming jig of the present invention is used to make Au-S.
A case of punching n material will be described. Au-Sn eutectic solder material 8 having a thickness of 100 μm on the die 4
Then, the Au—Sn eutectic solder material 8 is pressed onto the die 4 by the material presser 2. At this time, the Au—Sn eutectic material 8
Is harder than the Pb-60% Sn material 3, and in order to prevent elastic deformation, the target stress acts on the upper surface of the punched hole portion at a height of H = 30 μm from the upper surface of the die 4. In this state, move the punch 1 vertically downward to move the Au.
-Sn eutectic material 8 is sheared. Next, the punch 1 is moved vertically upward and pulled out. Au-Sn eutectic material 8
Since the pulling stress acts on the punching section 6, the diameter of the punched section 6 becomes larger than the diameter of the punch 1. Therefore, the end 5 of the punch does not come into contact with the Au—Sn eutectic cross section 6 and material punching scraps do not occur, so that malfunction of the punch can be prevented.

[0011]

As described above, according to the present invention, since the punching hole portion of the die is higher than the upper surface of the other die, when the bump material is pressed by the material pressing member, tensile stress is generated.
Since the material is punched out in this state, the diameter of the punched cross section of the material after punching is larger than the diameter of the punch, and when the punch is pulled out, the punch end does not come into contact with the material punched cross section, so punching chips do not occur. Since punching material is not generated, malfunction of the punch can be prevented. In addition, since no wear material such as an elastic body is used, there is no deterioration of the used member, and there is an effect that it can be used for a long time.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view showing a first conventional example.

FIG. 3 is a vertical cross-sectional view showing a second conventional example.

[Explanation of symbols]

 1 Punch 2 Material Presser 3 Pb-60% Sn Solder Material 4 Die 5 Punch Side 6 Punch Cut Surface 7 Punch Hole 8 Au-Sn Eutectic Material 9 Top of Punch Hole

Claims (6)

[Claims] 1. A die plate in which the periphery of a die hole is raised, a punch for punching out material placed on the die plate by being inserted into the die hole by descending from above, and an upper end portion of the die hole. A bump forming jig, comprising: a material presser for pressing a material on a lower portion of the die plate. 2. A punch having a diameter corresponding to a required outer diameter of a bump, a die having a raised portion around a punching hole into which the punch is inserted, and a die which is interlocked with an operation of the punch and supplied onto the die. A bump forming jig for pressing the formed bump forming material onto the die at a portion outside the raised portion. 3. The raised portion has a flat portion having a predetermined height outward from the edge of the punched hole, and descends with a gentle slope from the end of the flat portion to press the material pressing member. The bump forming jig according to claim 2, wherein the bump forming jig has a shape that returns to a flat surface when reaching a portion facing the portion. 4. The bump forming jig according to claim 3, wherein the slob is linear. 5. The height of the flat portion is about 50 when Pb-60% Sn solder is used as a bump forming material.
The bump forming jig according to claim 3, which has a thickness of μm. 6. The height of the flat portion is about 30 μm when Au—Sn eutectic solder is used as a bump forming material.
The bump forming jig according to claim 3, wherein m is m.