JPH07130543A - Manufacture of multilayer inductor part - Google Patents

Abstract

PURPOSE:To make the conductor resistance of a coil pattern very small firing a laminated body containing superposingly laminated the first ceramic insulating film and having a coil-pattern-conductor filled through hole and the second ceramic insulating film having a via-hole conductor filled via hole. CONSTITUTION:Through holes 20b, 20d, 20f and 20h of coil patterns 2b, 2d, 2f and 2h, are formed, coil pattern conductors 21b, 21d, 21f and 21h and filled in the above-mentioned through holes 20b, 20d, 20f and 20h, and the first ceramic insulating films 10b, 10d, 10f and 10h are formed. Then, the second ceramic insulating films, having via hole conductors 31c, 31e and 31g wherein via hole conductor 31c, 31e and 31g is filled, are formed. Then, a multilayer body, which is formed by stacking the above-mentioned insulating films, is fired.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated inductor component in which a ceramic layer formed by applying a glass / ceramic slip material containing a photocurable monomer is laminated, and a coil pattern is provided in the laminated body. The present invention relates to a manufacturing method.

[0002]

2. Description of the Related Art Two manufacturing methods are generally known as a method for manufacturing a laminated inductor component in which a plurality of ceramic layers and a plurality of coil patterns are laminated and adjacent coil patterns are connected via via hole conductors. ing.

One of the methods is to stack a plurality of unfired green sheets each having a conductor serving as a via-hole conductor and a conductor film serving as a coil pattern for about one turn, and integrally firing the laminated body. There was a green sheet multi-layer method to process.

On the heat-resistant substrate, a half turn, for example, L
A conductor film to be a coil-shaped coil pattern is formed by screen-printing a conductive paste, and then an insulating film is screen-printed to have an L-shaped coil pattern so that one end of the conductor film is exposed. Printed and connected to one end of the conductor film that will be the L-shaped coil pattern on the insulating film, and the conductor film that will be the L-shaped coil pattern of the target shape will be connected to that pattern by the conductive paste screen. It is formed by printing, and further, an insulating film is formed by screen printing of an insulating paste so that one end of the conductor film forming the L-shaped coil pattern is exposed, and this process is sequentially repeated to form a laminated body. Then, there was a printing multilayer method in which the insulating film and the conductor film to be each coil pattern were integrally fired.

[0005]

However, in the former green sheet multi-layer method, a via hole having an opening penetrating both main surfaces to be a via hole conductor is formed in each green sheet, and the via hole conductive material is formed in the via hole. It must be filled with a sex paste.

Further, it is difficult to reduce the resistance in the via-hole conductor portion in order to improve the inductance characteristic. This is because, for example, if the opening diameter of the via hole is increased, the conductive paste cannot be filled / held in the via hole, resulting in conductor omission.

Further, the conductive paste is filled and printed by placing a green sheet on a sheet of paper. When the sheet of paper and the green sheet are separated, the conductive paste filled in the through hole is formed. May be taken away by the paper and the surface of the conductive paste held in the through holes may be dented, resulting in defective conduction between the coil patterns. Further, there is a problem that the above-mentioned green sheets must be aligned with high accuracy and stacked.

In the case of the latter printing multi-layer method, basically,
Since the coil pattern is formed for each half turn on the insulating film printed in a predetermined shape with the insulating paste and this is repeated, the number of laminated prints increases to obtain the desired number of coil turns. It was difficult to reduce the height.

In addition, since the insulating film is not printed on the connection portion between the coil patterns, only the conductive paste is printed and overlapped, and the non-connection portion is the alternate printed overlap between the conductive paste and the insulating paste, which is laminated. When the number increases,
Laminate distortion occurs on the surface, making it difficult to print a stable conductive paste or insulating paste.

According to both methods, in consideration of the structure in which the conductor resistance of the coil pattern portion is lowered in order to improve the inductance characteristic, the thickness of the conductor film forming the coil pattern is increased because it is formed by screen printing. , About 20 μm, in order to supplement the thickness of the conductor film,
The width of the conductor film may be increased, but the laminated inductor component as a whole becomes large. Further, in the former green sheet multi-layer system, when the conductor film becomes thick, delamination between layers easily occurs.

The present invention has been devised in view of the above-mentioned problems, and an object thereof is to provide a method of manufacturing a laminated inductor component capable of minimizing the conductor resistance of a coil pattern.

Another object is to minimize the conductor resistance of the coil patterns and the via-hole conductors that connect the coil patterns, and to ensure that the surface of the insulating film is always maintained regardless of the increase in the number of laminated layers and the shape of the coil patterns. Becomes uniform,
Provided is a method for manufacturing a highly reliable laminated inductor component, which can easily form a via-hole conductor and a coil pattern and can suppress the occurrence of delamination between layers.

[0013]

According to a first aspect of the present invention, there is provided a first ceramic insulating film having a coil pattern-shaped through hole formed therein, the coil pattern conductor being filled in the through hole, and a via hole. A method for manufacturing a laminated inductor component, comprising: firing a laminated body including a laminated body in which a second ceramic insulating film in which a via hole conductor is filled is laminated in the via hole.

A second invention is the method for manufacturing a laminated inductor component according to the first invention, wherein the first ceramic insulating film filled with the coil pattern conductor contains (1) a photocurable monomer. Step of applying and drying a glass / ceramic slip material to form an insulating film (2) Selectively exposing and developing the insulating film to form a through hole having a coil pattern shape in the insulating film Step (3) Second step of filling the coil pattern conductor in the through hole and filling the via hole conductor
(4) A step of applying and drying a glass / ceramic slip material containing a photocurable monomer to form an insulating film (5) a selective exposure treatment and a development treatment for the insulating film And (6) a step of filling a via hole in the insulating film to fill the via hole with a via hole conductor.

Here, in the second and subsequent inventions, the coil pattern-shaped through hole penetrates the first insulating film in the thickness direction of the second insulating film, and the via hole penetrates in the thickness direction of the second insulating film. Is closed by the lower second insulating film and the via-hole conductor film, and the lower opening of the via hole is closed by the coil pattern conductor, and has a “recess” shape as a whole. The through hole and the via hole are referred to as “through recess”.

[0016]

According to the first aspect of the invention, the laminated body has the first ceramic insulating film having the coil pattern-shaped through recess filled with the coil pattern conductor, and the second ceramic insulating film having the through recess filled with the via-hole conductor conductor. , And the ceramic insulating film of FIG. That is, the thickness of the coil pattern conductor is substantially the same as that of the first ceramic insulating film,
By increasing the thickness of the ceramic insulating film, it is possible to easily increase the thickness of the coil pattern conductor, whereby the coil pattern has a low resistance.

According to the second invention, the first ceramic insulating film of the first invention is applied with an insulating slip material containing a photo-curable monomer, dried, and further, a through recess corresponding to the shape of the coil pattern is formed. It is formed by filling the conductive paste after the exposure and development processing for forming. Therefore, even if the conductive paste is filled in the through recess corresponding to the shape of the coil pattern, the filled paste does not flow out from the conductive paste, and the conductor having the same coil pattern thickness as the insulating film can be easily formed. .

That is, by increasing the thickness of the insulating film, it is possible to easily increase the thickness of the conductor film forming the coil pattern, so that it is extremely easy to reduce the conductor resistance of the coil pattern.

A second embodiment having the via-hole conductor of the first invention.
After applying and drying an insulating slip material containing a photo-curable monomer as the ceramic insulating film, and further exposing and developing to form a through recess corresponding to the shape of the via-hole conductor, it is formed by filling with a conductive paste. To be done. Therefore, even when the conductive paste is filled in the through-hole recess corresponding to the shape of the via-hole conductor, the filled paste does not flow out from the conductive paste, and a stable conductor serving as a via-hole conductor can be easily formed.

That is, the shape of the via-hole conductor can be made arbitrary depending on the accuracy of the exposure process, and it becomes extremely easy to reduce the conductor resistance in the via-hole conductor portion.

Since both insulating films are formed by applying a slip material containing a photo-curable monomer, regardless of the condition of the coil pattern conductor or via-hole conductor of the insulating film below the insulating film, The surface can always be made uniform regardless of the number of stacked layers. Therefore,
When an insulating film or the like is formed on the surface, it can be stably and easily formed.

That is, the stacking method by superposition coating can be performed easily and surely. Further, the shape accuracy and formation position of the coil pattern and the via-hole conductor are determined by the exposure process with extremely high position accuracy, so that the manufacturing method has high stacking reliability.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a laminated inductor component according to the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a laminated inductor component according to the present invention, FIG. 2 is a sectional view taken along line XX of FIG. 1, and FIG. 3A is a sectional view taken along line YY of FIG. 3 (b) is a sectional view taken along line ZZ in FIG.

The description will be made using a laminated inductor component composed of nine insulating layers.

1 to 3, 1 is a laminated body, and 4 and 5 are terminal electrodes.

The laminated body 1 is constituted by laminating nine ceramic layers (hereinafter, simply referred to as insulating layers) 1a to 1i, and coil patterns 2b, 2d, 2f, 2 inside thereof.
h, via-hole conductors 3c, 3e, 3g. Specifically, the insulating layers 1b, 1d, 1f, 1h are first insulating layers, and the coil patterns 2b, 2d, 2f, 2h are
The insulating layers 1b, 1d, 1f, and 1h are formed in a predetermined pattern shape that penetrates in the thickness direction. Also, the insulating layers 1c, 1
e and 1g are second insulating layers and are via-hole conductors 3 that connect adjacent coil patterns 2b, 2d, 2f, and 2h.
c, 3e, and 3g are formed in a predetermined shape (for example, diameter) that penetrates the insulating layers 1c, 1e, and 1g in the thickness direction. still,
The insulating layer 1a and the insulating layer 1i are simply a single plate state, and in particular, the insulating layer 1a is called the uppermost insulating layer and the insulating layer 1i is called the lowermost insulating layer.

The insulating layers 1a-1i are, for example, 850-10.
Glass that enables firing at relatively low temperatures around 50 ° C
It is made of a ceramic material, and its thickness is slightly different between the first insulating layers 1b, 1d, 1f, 1h and the second insulating layers 1c, 1e, 1g, and the coil patterns 2b, 2d are different. Insulation layer 1 containing 2f and 2h
b, 1d, 1f, 1h are relatively thick, and the via-hole conductor 3
It is desirable to make the insulating layers 1c, 1e, and 1g in which c, 3e, and 3g are embedded relatively thin. Specifically, the insulating layer 1
b, 1d, 1f, 1h are, for example, 20 to 100 μm, and the insulating layers 1c, 1e, 1g are, for example, 10 to 100 μm.
m.

The coil patterns 2b, 2d, 2f, 2h,
The via-hole conductors 3c, 3e, and 3g are made of a gold-based, silver-based, or copper-based metal material, for example, a silver-based conductor.

In the laminated body 1, the coil pattern 2b, the via-hole conductor 3c, and the coil pattern 2d are formed.
A coil connected in series with the via hole conductor 3e, the coil pattern 2f, the via hole conductor 3g, and the coil pattern 2h is formed.

Further, one end of the coil pattern 2b is led out to the end of the laminated body 1 from the portion corresponding to the thickness of the insulating layer 1b sandwiched between the uppermost insulating layer 1a and the insulating layer 1c, and is connected to the terminal electrode 5. The other end of the coil pattern 2h is led to the end portion of the laminated body 1 from the portion corresponding to the thickness of the insulating layer 1h sandwiched between the lowermost insulating layer 1i and the insulating layer 1g and connected to the terminal electrode 4.

As shown in FIGS. 2 and 3A and 3B, for example, the via-hole conductor 3c connecting the coil patterns 2b and 2d is formed with the via-hole conductor 3e connecting the adjacent coil patterns 2d and 2f. It is slightly displaced from the position. Similarly, it is slightly displaced from the formation positions of the via-hole conductors 3e and 3g. The via-hole conductors 3c and 3g are
They are formed at the same position in plan view.

Further, since the coil patterns 2b and 2h are formed with extended portions at their ends for connecting with the terminal electrodes 4 and 5, the coil patterns 2b, 2d, 2f and 2h.
The shape of h is also slightly different. Specifically, the coil pattern 2b has an approximately half turn shape as shown in FIG.
An extended portion is added, and the coil pattern 2d has a shape of about 1 turn, and one end connected to the via-hole conductor 3e is formed from the center, as shown in FIG. As shown in FIG. 5 (wa), it has a shape of about 1 turn, and one end connected to the via-hole conductor 3g is formed from the end. The coil pattern 2b has a shape of about half turn as shown in FIG. 5 (ya). Then, the extended portion is added, and the coil pattern 2h is about 1 as shown in FIG.
It has a turn shape with an extension.

In the above-mentioned laminated inductor component, the coil patterns 2b, 2d, 2f, 2h substantially have the thickness (2) of the insulating layers 1b, 1d, 1f, 1h which are the first insulating layers.
Since it has a thickness equivalent to 0 to 100 μm), it can be made thicker than the conventional thickness by printing on the surface of the green sheet or the insulating film, for example, 10 μm. Thereby, the coil patterns 2b, 2d, 2f, 2
Since the conductor resistance at h can be minimized, a laminated inductor component having excellent inductance characteristics can be easily formed.

Therefore, since the conductor resistance is small, heat generation can be suppressed and power conversion efficiency can be increased when used in a coil portion of a transformer, and signal attenuation when used in a resonance circuit of a high frequency circuit. Can be reduced to reduce noise, and when used in an LC filter component, insertion loss can be reduced.

The laminated body 1 of the laminated inductor component shown in FIGS. 1 to 3 has the insulating film 10 serving as the insulating layer 1i.
An insulating slip material containing a photo-curable monomer is applied onto the i by a doctor blade method or the like to coat and dry the insulating film 10h, and a through recess corresponding to the shape of the coil pattern 2h is formed. Processing, development processing, printing and filling with a conductive paste to form a conductor film 20h to be a coil pattern 2h, and then an insulating film to be an insulating layer 1g on the insulating film 10h and the conductor film 20h. Is applied and dried, and further, in order to form a through recess corresponding to the shape of the via-hole conductor 3g, a selective exposure process and a development process are performed, and a conductive paste is printed.
A conductor 30g to be the via-hole conductor 3g is formed by filling, and in the same manner, an insulating film to be the insulating layer 1f, a conductor to be the coil pattern 2f, an insulating film to be the insulating layer 1e, and a conductor 30e to be the via-hole conductor 3e. It is formed by integrally forming and firing the laminated body on which the coating is applied.

In detail, based on the manufacturing flow chart shown in FIG. 4, FIGS. 5 (a) to 5 (m) will be described with reference to the drawings for explaining the planar state in the main steps, if necessary.

First, there is a step of preparing the substrate shown in FIG.

The substrate serves as a reference surface on which coating and superposition are performed, and heat resistant resin, glass, ceramics or the like is used.

The next step is to form an insulating film 10i (the insulating film is a film before firing) which will be the lowermost insulating layer 1i shown in FIG.

The insulating film 10i is obtained by homogeneously kneading a ceramic powder, a glass material, a photocurable monomer, an organic binder, and an organic or aqueous solvent, and a slip material is applied and dried to a thickness of, for example, about 100 μm. And the step of exposing the entire surface to light to cause a polymerization reaction of a photocurable monomer to cure the coating film. Even if the insulating film 10i has a thickness of about 100 μm at the time of application, the insulating film 1i is dried and baked to form the insulating layer 1i.
When it becomes, the thickness is about ½ of that. Therefore,
Even if the thickness of the insulating film 10i is 100 μm, the actual thickness of the insulating layer 1i is about 50 μm.

As a result, as shown in FIG. 5A, the insulating film 10i is formed on the substrate (not shown in the figure).

Examples of the above-mentioned ceramic powder include materials such as cristobalite, quartz, corundum (α-alumina), mullite, zirconia, and cordierite.
The average particle size of the powder is preferably 1.0 to 6.0 μ.
m, and more preferably 1.5 to 4.0 μm. Two or more kinds of these ceramic materials may be mixed and used.

In particular, the use of corundum is advantageous in terms of cost. The average particle size of the ceramic powder is 1.0
When the average particle size is less than 1.0 μm, it is difficult to homogeneously mix and slip, and the exposure light is diffusely reflected at the time of exposure, so that sufficient exposure cannot be performed. On the contrary, if the average particle size exceeds 6.0 μm, the dense laminated body 1 having high strength cannot be obtained.

The above-mentioned glass material is a glass frit containing a plurality of metal oxides and has a temperature of 850 to 1050 ° C.
After calcination in 1., at least one crystal of cordierite, mullite, anorthite, sergian, spinel, garnite, willemite, dolomite, petalite or a substituted derivative thereof is precipitated.

In particular, the use of a crystallized glass frit which deposits anorthite or sergian gives a laminated body having higher strength, and the use of a crystallized glass frit which deposits cordierite or mullite,
Since the coefficient of thermal expansion after firing is low, it is effective for forming a predetermined circuit on this laminated inductor component and arranging a silicon chip such as an IC.

The most preferable glass materials in consideration of the strength and the coefficient of thermal expansion of the insulating layer are B ₂ O ₃ and Si.
A glass frit containing O ₂ , Al ₂ O ₃ , ZnO, and an alkaline earth oxide. Since such a glass frit has a wide vitrification range and a yield point around 600 to 800 ° C., it is suitable for low temperature firing at about 850 to 1050 ° C., and the coil patterns 2b, 2d, 2f, 2h, and the via-hole conductor 3c. It is suitable for the sintering behavior of copper-based, silver-based, and gold-based conductive materials of 3e and 3g.

The glass material is mixed in the slip material in a frit state. The average particle size of this frit is
It is 1.0 to 5.0 μm, preferably 1.5 to 3.5 μm. If the average particle size is less than 1.0 μm, it is difficult to make slipping, and the exposure light is diffusely reflected at the time of exposure, and sufficient exposure cannot be performed. Conversely, the average particle size is 5.0μ
When it exceeds m, the dispersibility is impaired, and specifically, it cannot be uniformly dissolved and dispersed between the ceramic powders which are the insulating materials, and the strength is extremely lowered.

The composition ratio of the above-mentioned ceramic material and glass material is such that when firing at a relatively low temperature of 850 to 1050 ° C., the ceramic material is 10 to 60 wt%, preferably 30 to 50 wt%. Is 90-40
wt%, preferably 70 wt% to 50 wt%.

Here, if the ceramic material is less than 10 wt% and the glass material exceeds 90 wt%, the insulating layer is excessively vitreous, which is inappropriate from the viewpoint of the strength of the insulating layer. Material exceeds 60wt%,
Further, if the glass material is less than 40 wt%, the exposure light is diffusely reflected during the exposure and sufficient exposure can be performed, and the denseness of the insulating layer after firing is also impaired.

In addition to the above-mentioned solid components such as ceramics and glass, the constituent material of the slip material is a photocurable monomer that is lost by sintering, an organic binder,
Contains an organic solvent.

The photo-curable monomer is excellent in thermal decomposability in order to cope with a low temperature and short-time baking process. As the photo-curable monomer, a slip material is applied by exposure after coating and drying. It is necessary to photopolymerize, free radical formation, chain growth addition polymerization are possible, and a monomer having a secondary or tertiary carbon is preferable, for example, butyl acrylate having at least one polymerizable ethylene group. Alkyl acrylates and their corresponding alkyl methacrylates are effective.

Further, there may be mentioned polyethylene glycol diacrylates such as tetraethylene glycol diacrylate and their corresponding methacrylates.

The photo-curable monomer is added in a predetermined amount so that the insulating film 10e is cured by the exposure treatment and the portion other than the exposed portion can be easily removed by the development treatment. For example, it is 5 to 15 wt% or less with respect to the solid component (ceramic material and glass material).

The organic binder must have good thermal decomposability like the photocurable monomer. At the same time, since it determines the viscosity of the slip, the wettability with the solid content must be emphasized.According to the study of the present inventor, a carboxyl group such as acrylic acid or methacrylic acid-based polymer and an alcoholic hydroxyl group are determined. The ethylenically unsaturated compounds provided are preferred. Addition amount is 25 based on solid content
Wt% or less is preferable.

As the solvent, in addition to the organic solvent, an aqueous solvent can be used. In this case, the photocurable monomer and the organic binder must be water-soluble, and the monomer and the binder should be used. , Hydrophilic functional groups such as carboxyl groups are added. The amount of addition is 2 to 300, preferably 5 to 100, when expressed by acid value. If the addition amount is small, the solubility in water and the dispersibility of the powder of the fixed component will be poor, and if it is large, the thermal decomposability will be poor. In consideration of the above, it is appropriately added within the above range.

In any type of slip material, the photo-curable monomer and the organic binder must have good thermal decomposability as described above, but specifically, 60
It must be capable of thermal decomposition below 0 ° C. More preferably, it is 500 ° C. or lower.

When the thermal decomposition temperature exceeds 600 ° C., it remains in the insulating layer and is trapped as carbon, which causes the substrate to turn gray and the insulating resistance of the insulating layer to decrease. Also, it may become void and cause delamination.

If desired, a sensitizer, a photoinitiator material, etc. may be added to the slip material. For example, examples of the photoinitiator-based material include benzophenones and acyloin ester compounds.

The coating method of the slip material described above is applied to the insulating film 1
This is because it is used for making the surface on 0i uniform, for example, a doctor blade method (knife coating method),
A roll coating method, a printing method and the like can be mentioned. In the doctor blade method, since the surface of the insulating film is exposed by the blade regardless of the surface condition of the substrate, the insulating film 10 after coating is applied.
The surface of i can be flattened.

As a drying method, a batch-type drying furnace or an in-line-type drying furnace is used, and the drying condition is 120 ° C.
The following is desirable. Also, rapid drying may cause cracks on the surface, so it is important to avoid rapid heating.

In the exposure process, the insulating film 10i is photo-cured so that the insulating film 1d is developed at the time of developing the insulating film 10d which will be described later.
0i is prevented from being attacked, and the insulating film 10i
Low-pressure, high-pressure, and ultra-high-pressure mercury lamp-based exposure light over the entire surface of, for example, an intensity of about 10 to ²⁰ mJ / cm ² and a time of 15 to 30
Irradiate for about a second.

Next is a step of forming the insulating film 10h which is the first insulating film shown in FIG.

The insulating film 10h is a process of applying and drying the above slip material on the insulating film 10i (see FIG. 5B).
And a process of forming a solubilized portion 20h 'of the through recess by selectively performing an exposure process corresponding to the shape of the coil pattern 2h formed on the insulating layer 1h (see FIG. 5C), and a development process thereof. To remove the solubilized portion 20h ′, and to remove the through recess 2
It is formed by the process of forming 0h (see FIG. 5D).

The application / drying is performed by controlling the interval of the blade from the insulating film 10i, applying a slip material with a thickness of 150 μm, and drying under the above-mentioned drying conditions. Even when the slip material is coated with a thickness of 150 μm, the thickness of the dried and fired insulating layer 1i is about 75 μm.

In the exposure process, since the photo-curable monomer of the insulating film 10h is a negative type which is photo-polymerized, the through recess 20h is formed.
A photo target having a predetermined pattern is placed on or close to the surface of the insulating film 10h so that only the solubilized portion 20′h that is to be exposed to the exposure light is exposed to low-pressure, high-pressure, and ultra-high-pressure mercury lamp-based exposure light. For example, irradiation is performed with an intensity of about 10 to 20 mJ / cm ² and a time of about 15 to 30 seconds. By this exposure process, the portion of the insulating film 10h other than the through recess 20h causes a photopolymerization reaction of the photocurable monomer. still,
The exposure apparatus may be a general one used in so-called photolithography technology.

The developing treatment is carried out by applying a developing solution such as chlorocene, 1,1,1-trichloroethane or an alkaline developing solvent to the solubilized portion 20'h of the exposed insulating film 10h by, for example, a spray developing method or a paddle developing method. The developing process is performed by spraying or contacting. As a developing condition, spraying is performed by spraying for about 30 seconds. This developing process is performed by the solubilized portion 20'h formed by the exposure process.
Is gradually removed, and the lower layer is a photo-curing insulating film 1
This is performed until 0i is exposed from the through recess 20h. Then, if necessary, washing and drying are performed.

As a result, the insulating film 10h corresponding to the shape of the coil pattern 2h and having the penetrating recess 20h with its thickness removed is formed.

Next is the step of forming the coil pattern conductor 21h to be the coil pattern 2h shown in FIG.

The coil pattern conductor 21h is subjected to screen printing once or a plurality of times in a predetermined shape by using, for example, an Ag-based conductive paste to form the through recess 20h.
And then dried and formed by photocuring by an exposure process (see FIG. 5E).

The conductive paste is a homogeneous mixture of at least one metal material of gold, silver, copper or alloys thereof, for example, a powder of silver, a low melting point glass component, a photocurable monomer, an organic binder and an organic solvent. What is done is used. In particular, since the firing temperature is relatively low at 850 to 1050 ° C., it is important to use a low melting point glass component having a sag point of 700 ° C. to 800 ° C. in consideration of the sintering behavior of the insulating film.

In the exposure process, the photo-curable monomer of the conductor 21h is photo-polymerized, and when the insulating film 10g described later is developed,
This conductor 21h is prevented from being attacked, and the entire surface of the conductor 21h is exposed under the above-mentioned exposure conditions.

As a result, the insulating film 1 is formed in the insulating film 10h.
The conductor 21h having a thickness substantially equal to the thickness of 0h is formed.

Next is a step of forming the insulating film 10g which is the second insulating film shown in FIG.

The insulating film 10g is a process of applying and drying the above-mentioned slip material on the insulating film 10h (see FIG. 5 (to)).
And a process of forming a solubilized portion 30g 'of the through recess by selectively performing an exposure process corresponding to the shape of the via-hole conductor 3g formed on the insulating layer 1 (see FIG. 5G), and developing the same. Through the treatment, the solubilized portion 30g 'is removed to remove the through recess 3
It is formed by the process of forming 0 g (see FIG. 5C).

The application / drying is performed by controlling the distance between the blades from the surface of the insulating film 10h, applying a slip material with a thickness of 100 μm, and drying under the above-mentioned drying conditions.

In the exposure processing and the development processing, since the thickness of the insulating film 10g is thinner than that of the insulating film 10h, compared with the above-mentioned exposure conditions and development conditions, a short time, or a relatively weak strength, a relatively low strength. It is also possible to carry out at a low concentration.

In the developing process, the solubilized portion 30g 'formed by the photo-curing process is gradually removed, the entire thickness of the insulating film 10g is removed, and the conductor 2 is removed from the bottom surface of the through recess 30g.
It is performed until 1h is exposed. Then, if necessary, washing and drying are performed.

As a result, the insulating film 10g corresponding to the shape of the via-hole conductor 3g and having the penetrating recess 30g with its thickness removed is formed.

Next is a step of forming the conductor 31g to be the via-hole conductor 3g shown in FIG.

The conductor 31g is screen-printed into a predetermined shape one or more times by using, for example, an Ag-based conductive paste, is filled in the penetrating recess 30g, is dried, and is photo-cured by an exposure process. Then, it is formed (see FIG. 5 (i)).

The conductive paste was homogeneously kneaded with silver powder, a low melting point glass component, a photocurable monomer, an organic binder and an organic solvent, similarly to the one used for the conductor 21h to form the coil pattern 2h. Things are used,
In addition, the exposure process is performed under the above-mentioned exposure conditions as in the conductor film 21h.

As a result, the insulating film 1 is formed in the insulating film 10g.
A conductor 3 that becomes a via-hole conductor 3g that penetrates a thickness of 0 g.
1 g will be formed.

Thereafter, the first insulating film forming step, the coil film forming conductive film forming step, the second insulating film forming step, and the via hole conductor forming step shown in FIG. And repeat a predetermined number of times.

For example, the insulating film 10f which is the first insulating film.
Of the slip material, drying (see FIG. 5 (n)), and selective exposure treatment for forming the solubilized portion 20f ′ (see FIG. 5).
(See (L)) and the coil pattern 2 formed by a developing process (see FIG. 5C) for forming the through recess 20f.
The conductor 21f to be f is formed by filling the conductive paste and curing treatment (see FIG. 5C), and the insulating film 10e that is the second insulating film is applied with a slip material and dried (FIG. 5F).
Via the via-hole conductor. Selective exposure processing for forming the solubilized portion 30e '(see FIG. 5 (yo)) and development processing for forming the penetrating recess 30e (see FIG. 5 (ta)). The conductor 31e to be 3e is formed by filling the conductive paste and curing the paste (see FIG. 5 (re)), and the insulating film 10d as the first insulating film is applied with a slip material and dried (FIG. 5 (so)). Selective exposure process for forming the solubilized portion 20d '(see FIG. 5 (T)), the through recess 20d
And a conductor 21d to be the coil pattern 2d are formed by a conductive paste filling process and a curing process (see FIG. 5A). The insulating film 10c, which is an insulating film, is coated with a slip material, dried (see FIG. 5A), selectively exposed to form a solubilized portion 30c ′ (see FIG. 5M), and the penetrating recess 30c. Conductor 31 which is formed by a development process for forming a via hole (see FIG. 5C) and becomes the via-hole conductor 3c.
Insulating film 10b, which is the first insulating film, is formed by filling conductive paste with a conductive paste and hardening treatment (see FIG. 5 (ヰ)).
Of the slip material, drying (see FIG. 5C), and selective exposure treatment for forming the solubilized portion 20b ′ (see FIG. 5C).
(See (e)) and the coil pattern 2 formed by the developing process (see FIG. 5C) for forming the penetrating recess 20b.
The conductor 21b to be b is formed by filling the conductive paste and curing the paste (see FIG. 5A).

Next is a step of forming the insulating film 10a to be the uppermost insulating layer 1a shown in FIG.

The insulating film 10a is formed by applying a slip material onto the insulating film 10b and the conductor 21b to be the coil pattern 2b.
It is formed by drying (see FIG. 5 (m)). This insulating film 1
Since 0a is formed to protect the conductor film 21b from an external impact, it is sufficient that its thickness is, for example, about 100 μm, like the insulating film 10i.

Further, since the insulating film 10a is simply a single plate state, it is not necessary to perform selective exposure processing or development processing.

Next is the step of separating the substrate shown in FIG.
By this separation, an unfired laminated body is achieved. The above process may be formed so that a plurality of parts can be extracted, and at this time, the dividing groove may be formed according to the shape of each part.

Next is the step of integral firing shown in FIG.

Insulating films 10a to 10i, coil pattern 2
b, 2d, 2f, 2h conductors 21b, 21d, 21
The above-mentioned laminated body including f, 21h, via-hole conductors 3c, 3e, 3g and conductors 31c, 31e, 31g is integrally fired.

Firing consists of a binder removal process and a sintering process. In the debinding process, the conductors 21 that become the insulating films 10a to 10i and the coil patterns 2b, 2d, 2f, and 2h are formed.
b, 21d, 21f, 21h and the via-hole conductor 3c,
This is because organic components contained in 3e and 3g and the conductors 31c, 31e, and 31g disappear, and the temperature is, for example, 600 ° C. or lower. In the sintering process, the glass components of the insulating films 10a to 10i are sufficiently softened to uniformly fill the grain boundaries of the ceramic powder to achieve the constant strength of the laminated body 1, and at the same time, the conductors 21b and 21d. , 21f, 21h and conductor 31
c, 31e, and 31g of silver-based powder are grain-grown to lower the resistance and to be integrated with the insulating layer.
Peak temperature of 850 to 10 in oxidizing or neutral atmosphere
Perform at 50 ° C.

As a result, the insulating films 10a to 10i become the insulating layers 1a to 1i, and the conductors 21b, 21d, 21f and 2 are formed.
1h becomes coil patterns 2b, 2d, 2f, 2h,
The conductors 31c, 31e, 31g are the via-hole conductors 3c, 3g.
e becomes 3 g, and the laminated body 1 is formed. afterwards,
The sintered laminated body 1 is divided along the dividing grooves as needed to form individual laminated inductor components.

Next is the step of forming the terminal electrodes shown in FIG.

The terminal electrodes 4 and 5 are the laminated body 1 that has been fired, and the silver-based conductive paste is baked on the other end of the coil pattern 2b and the end where one end of the coil pattern 2h extends. Further, a plating layer is further deposited on the surface thereof.

In the above-described method for manufacturing a laminated inductor component, since the insulating films 10a to 10i are formed by applying the slip material, and the laminated body 1 is overlapped by repeating the application, the conventional green sheet multi-layer structure is obtained. It is not necessary to previously form the green sheet, and the green sheet can be easily formed by a series of in-line manufacturing steps.

Further, the thickness of the insulating films 10a to 10i can be controlled accurately by the height of the blade or the like. Therefore, the first insulating films 10b, 10d, 10f, 10 that regulate the thickness of the coil patterns 2b, 2d, 2f, 2h.
h is relatively thick, and the via-hole conductors 3c, 3e,
A second insulating film 10c that regulates the length of 3g in the thickness direction,
The thickness of 10e and 10g can be made relatively thin,
It is possible to easily achieve the thickness of the insulating films 10a to 10I according to the purpose (considering the conductor resistance, the exposure condition, the developing condition, etc.).

Further, during the superimposing step, the conductor 21 is formed such that the uppermost insulating film becomes the lower insulating films 10b to 10i and the coil patterns 2b, 2d, 2f, 2h.
b, 21d, 21f, 21h and via-hole conductors 3c, 3
Since a uniform surface can always be obtained irrespective of the structure and laminated state of the conductors 31c, 31e, and 31g that are e and 3g, the surface is never distorted due to an increase in the number of layers as in the conventional printed multilayer. Therefore, the treatment can be surely performed on the insulating film, and the number of stacked layers can be arbitrarily increased.

In particular, the coil patterns 2b, 2d, 2f,
The conductors 21b, 21d, 21f and 21h which are 2h and the conductors 31c and 31 which are the via hole conductors 3c, 3e and 3g.
e, 31g are penetrated recesses 20b, 20
Even if the insulating films 10b to 10h are slightly deviated from d, 20f, 20h, 30c, 30e, and 30g, they can be absorbed and the surface of the insulating film located in the uppermost layer can be made a uniform surface.

The coil patterns 2b, 2d, 2f,
2h, coil patterns 2b, 2d, 2f, 2h
The conductors 21b, 21d, 21f, and 21h to be the through holes 20b and 20 having a predetermined shape penetrate the entire thickness of the insulating films 10b, 10d, 10f, and 10h that are the first insulating films.
It is formed by printing and filling conductive paste on d, 20f, and 20h.

Therefore, the through recesses 20b, 20d, 20
Depending on the shapes of f and 20h, coil patterns 2b and 2
Since the shapes of d, 2f, and 2h are restricted, the insulating layer 1b,
The coil patterns 2b, 2d, 2 having a low conductor resistance and a predetermined shape and having a thickness substantially the same as the thicknesses of 1d, 1f, 1h.
f and 2h can be easily formed.

Further, the through recesses 20b, 20d, 20f,
Since 20h is formed by the selective exposure process and the development process, the through recesses 20b, 20d, 20f, 20h having a predetermined shape can be formed by the exposure process with high positional accuracy. In addition, the development process is performed on the lower layer via-hole conductor 3
Since the process is performed until the surfaces of the conductors 31c, 31e, and 31g to be c, 3e, and 3g are exposed, the coil pattern 2b,
2d, 2f, 2h and the via-hole conductors 3c, 3e, 3g can be reliably connected.

Further, the through recesses 20b, 20 having a predetermined shape are formed.
Since the d, 20f, and 20h are filled with the conductive paste, there is no printing sag generated by the conventional screen printing, the conductive paste does not flow out, and the high density of the coil patterns 2b, 2d, 2f, and 2h. It can be easily adapted to.

Regarding the via-hole conductors 3c, 3e, 3g, the shapes of the via-hole conductors 3c, 3e, 3g are restricted by the shapes of the through recesses 30c, 30e, 30g, as in the coil patterns 2b, 2d, 2f, 2h. Therefore, the insulating layers 1c, 1e, 1g have a relatively large shape.
By making the thickness relatively small, the via-hole conductors 3c, 3e, 3g having a low conductor resistance and a predetermined shape can be easily formed.

Further, since the penetrating recesses 30c, 30e, 30g are formed by the selective exposure process and the developing process and the conductive paste is filled in the penetrating recesses 30c, 30e, 30, the accuracy of the shape and the position is improved. Is high, the connection reliability with the coil patterns 2b, 2d, 2f, 2h is improved,
There is no outflow of the conductive paste, and it is possible to easily handle high density.

Such coil patterns 2b, 2d,
The combination of 2f, 2h and the via-hole conductors 3c, 3e, 3g provides a laminated inductor component having extremely low conductor resistance and excellent inductance characteristics.

In the above-described manufacturing method, the first insulating film is formed by applying a slip material, and thereafter, selective exposure processing is performed according to the coil pattern shape, and development processing is performed to form the penetrating recesses. Forming a conductor film, and then forming a second insulating film on the surface by applying a slip material, and then subjecting it to a selective exposure treatment according to the via-hole conductor shape and a development treatment to form a through recess, Although the conductor to be the via-hole conductor is formed, the step of forming the through-hole recess corresponding to the coil pattern shape and the step of forming the through-hole recess corresponding to the via-hole conductor shape are combined with a pair of the first insulating film and the first insulating film. Two insulating films may be formed at the same time. Of course, at this time, the through-hole concave portion for the via-hole conductor is exposed from the through-hole concave portion for the coil pattern, so that the first insulating film is superposed on the second insulating film.

Similarly, the step of filling the through-hole recess corresponding to the shape of the coil pattern with the conductive paste and the step of filling the through-hole recess depending on the shape of the via-hole conductor with the conductive paste may be formed simultaneously. Absent.

The outline of this manufacturing method is that the second insulating film is formed by applying a slip material, and thereafter, selective exposure processing is performed according to the shape of the via-hole conductor. Subsequently, a first insulating film is formed by applying a slip material, and then an exposure process is selectively performed according to the coil pattern shape. Then, the first insulating film is formed on the upper layer and both insulating films are formed on the lower layer as the second insulating film, and a development process is collectively performed to form a penetrating recess corresponding to the coil pattern shape from the first insulating film. Then, a through recess corresponding to the via hole conductor shape is formed from the second insulating film from the through recess for the coil pattern. Then, a conductive film serving as a coil pattern and a conductor serving as a via-hole conductor are filled in the penetrating recess with a conductive paste.

The through recesses may be formed in separate steps, and the conductor film to be the coil pattern and the conductor to be the via hole conductor may be formed in the same step.

The outline of this manufacturing method is that the second insulating film is formed by applying a slip material, and then a selective exposure process is performed according to the shape of the via-hole conductor, and a through recess for the via-hole conductor is formed by a developing process. Subsequently, a first insulating film is formed by applying a slip material, and then, a selective exposure process is performed according to the coil pattern shape, and a through recess for the coil pattern is formed by a developing process. At this time, the via-hole conductor through-recess is present in the coil-pattern through-recess, and the first insulating film that has entered the via-hole conductor through-recess is also removed when the coil pattern through-recess is formed. be able to. Then, a conductive film serving as a coil pattern and a conductor serving as a via-hole conductor are filled in the penetrating recess with a conductive paste.

In such a manufacturing method, since the step of forming the through recess and the step of filling the conductive paste can be integrated, the manufacturing method can be simplified.

Further, in the manufacturing method shown in FIGS. 4 and 5, a conductive film which becomes a conductor film which becomes a coil pattern and a conductor which becomes a via hole conductor is made of a conductive paste containing a photo-curable monomer, and each of them is penetrated. After filling the concave portion, the entire conductor film and conductor are photo-cured by an exposure process. This is because if a conductive paste having a composition that does not corrode the conductive film and the conductor when developing is performed to form a through recess in the insulating film formed on the upper part of the conductive film, the No curing process is required.

Although the most basic laminated inductor component has been described in the above embodiment, through holes are formed in the thickness direction of the laminated body to form the coil patterns 2b, 2d, 2f, 2h.
You may insert an E-type ferrite core member in the center part of.

Further, although the terminal electrodes 4 and 5 are formed at the end portions of the laminated body 1, the terminal electrodes 4 and 5 may be formed on the front surface or the back surface of the laminated body. In this case, this is achieved by extending via-hole conductors from both ends of the coil patterns connected in series to the main surface of the laminate body 1.

Further, a plurality of coil patterns 2 may be formed on the laminate body 1, and the plurality of coil patterns 2 may be capacitively coupled to each other to form an LC filter circuit, a resonance circuit, A transformer may be configured.

Further, internal wirings connected to the coil pattern 2 may be provided in a part of the laminated body main body, or surface wirings connected to the coil pattern 2 may be formed on the surface.

Further, in the above-mentioned embodiment, as the ceramic component of the slip material, a predetermined amount of ferrite magnetic powder such as Fe ₂ O ₃ may be added to control the magnetic permeability to a predetermined value.

[0119]

As described above, according to the first invention, since the coil pattern can have the same thickness as the thickness of the first insulating layer, the laminated inductor component which can minimize the conductor resistance is simple. Can be formed into

Further, in the second invention, the via-hole conductor for connecting the cor pattern and the coil pattern, which has a low conductor resistance, can be easily formed. Moreover, since the shape of the through-hole recess formed by the via-hole conductor and the coil pattern being selectively exposed and developed determines the shape accuracy, it is also easy to fill the through-hole recess with the conductive paste. Easy to do.

Further, regardless of the increase in the number of laminated layers and the shape of the coil pattern, the surface of the insulating film is always uniform, and the via hole conductor and the coil pattern can be easily formed.

[Brief description of drawings]

FIG. 1 is an external perspective view of a laminated inductor component according to the present invention.

FIG. 2 is a sectional view taken along line XX in FIG.

3 (a) is a sectional view taken along the line YY in FIG.
(B) is the ZZ sectional view taken on the line in FIG.

FIG. 4 is a flow chart for explaining a manufacturing process of the laminated inductor component of the present invention.

5A to 5C are plan views of main steps in manufacturing.

[Explanation of symbols]

1a to 1i ... Insulating layer 1b, 1d, 1f, 1h ... First insulating layer 1c, 1e, 1g ... Second insulating layer 10a to 10i ... Insulating film 10b First insulating film 10c, 10e, 10g ... Second insulating film 2b, 2d, 2f, 2h ... Coil pattern 21b, 21d, 21f, 21h .... Coil pattern conductors 3c, 3e, 3g ..... Via hole conductors 31c, 31e, 31g ..... Via hole conductors 20b, 20d, 20f, 20h30c , 30e, 30
g ... Penetration recess 4, 5 ... Terminal electrode

Front page continuation (72) Inventor Sakahiro Satoshi Hiroshi 1-1 Yamashita-cho, Kokubun-shi, Kagoshima Kyocera stock company Kagoshima Kokubun factory (72) Inventor Kazuma Kobashi 1-1 Yamashita-cho, Kokubun-shi Kagoshima Kyocera stock-type Company Kagoshima Kokubun Plant (72) Inventor Hiroshi Suenaga 1-1 Yamashita-cho, Kokubun City, Kagoshima Prefecture Kyocera Stock Company Kagoshima Kokubun Plant

Claims (2)

[Claims] 1. A first ceramic insulating film having a coil pattern-shaped through hole formed therein, the through hole being filled with a coil pattern conductor, and a via hole, wherein the via hole is filled with a via hole conductor. A method of manufacturing a laminated inductor component, comprising: firing a laminated body including a laminated body of the ceramic insulating film of No. 2 and a laminated body. 2. The method for manufacturing a laminated inductor component according to claim 1, wherein the first ceramic insulating film filled with the coil pattern conductor is (1) a glass-ceramic containing a photocurable monomer. Step of applying and drying a slip material to form an insulating film (2) Step of selectively exposing and developing the insulating film to form a through hole having a coil pattern shape in the insulating film (3) A second step of filling the through hole with a coil pattern conductor and filling the via hole conductor;
(4) A step of applying and drying a glass / ceramic slip material containing a photocurable monomer to form an insulating film (5) a selective exposure treatment and a development treatment for the insulating film And (6) a step of filling a via hole in the insulating film to fill the via hole with a via hole conductor.