JPH07129734A - Ultrasonic ic card - Google Patents

Ultrasonic ic card

Info

Publication number
JPH07129734A
JPH07129734A JP5294435A JP29443593A JPH07129734A JP H07129734 A JPH07129734 A JP H07129734A JP 5294435 A JP5294435 A JP 5294435A JP 29443593 A JP29443593 A JP 29443593A JP H07129734 A JPH07129734 A JP H07129734A
Authority
JP
Japan
Prior art keywords
ultrasonic
card
vibration
integrated circuit
ultrasonic oscillator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5294435A
Other languages
Japanese (ja)
Other versions
JP3315496B2 (en
Inventor
Kazuo Matsuda
一夫 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Priority to JP29443593A priority Critical patent/JP3315496B2/en
Publication of JPH07129734A publication Critical patent/JPH07129734A/en
Application granted granted Critical
Publication of JP3315496B2 publication Critical patent/JP3315496B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Lock And Its Accessories (AREA)

Abstract

PURPOSE:To improve the efficiency of ultrasonic wave generation by giving a medium body for resonance amplification to an ultrasonic oscillator in an IC card. CONSTITUTION:An ultrasonic oscillator 1 which transmits and receives information by an ultrasonic wave, its electrode 11, and a medium body 3 for resonance amplification consisting of a metallic material are laminated in the IC card main body, and dimensions and materials of the ultrasonic oscillator 1 and the medium body 3 for resonance amplification are so selected that Q is high in the natural oscillation mode. The periphery of the ultrasonic oscillator 1 is filled up with an oscillation absorbent for the purpose of preventing unnecessary oscillation from being transmitted to an integrated circuit part. Since the ultrasonic oscillator is provided with the medium body for resonance amplification, the ultrasonic wave is efficiently generated.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、外部との接触によって
あるいは非接触的に、データの読み取りや書き込みが可
能なICを内蔵したID(身分証明用)カードや電子錠
あるいは現金支払い用カードに適したICカードに関
し、情報の授受を超音波にておこなう超音波方式ICカ
ードに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ID (identification) card, an electronic lock or a cash payment card having an IC capable of reading and writing data by contact with the outside or contactlessly. The present invention relates to a suitable IC card, and to an ultrasonic IC card that transmits and receives information by ultrasonic waves.

【0002】[0002]

【従来の技術】ICカードは集積回路を樹脂製カード基
材に埋め込み、記憶機能あるいは判断機能を持たせた多
機能カードである。ICカードリーダ/ライタとの情報
授受は接触式と非接触式がある。接触式としては金属接
点端子を介して情報の授受を行う方式であり、既に広く
製品化されている。また、非接触式としてはコイルを介
して情報授受を行う電磁結合方式、コンデンサを介して
通信を行う静電誘導方式、電波を用いて通信を行う電波
方式、光を用いて通信を行う光結合方式、超音波を用い
て通信を行う超音波方式がある。
2. Description of the Related Art An IC card is a multi-function card in which an integrated circuit is embedded in a resin card base material and has a memory function or a judgment function. Information exchange with the IC card reader / writer includes a contact type and a non-contact type. The contact method is a method of transmitting and receiving information via a metal contact terminal, and has been widely commercialized. In addition, as a non-contact type, an electromagnetic coupling method that exchanges information via a coil, an electrostatic induction method that communicates via a capacitor, a radio wave method that communicates using radio waves, and an optical coupling that communicates using light There is an ultrasonic system that communicates using ultrasonic waves.

【0003】図3は従来の超音波結合方式の非接触IC
カード12の一部分の構成を示すICカードの断面図で
ある。集積回路(IC)13が埋め込まれ、電子回路が
構成されたカード基板14に情報を授受するための円板
状の超音波振動子15が構成されている。該超音波振動
子15の両面には電極16、161が蒸着、スパッタリ
ング或は印刷されており、該電極16、161に集積回
路(IC)を含む電子回路から信号電圧を印加し、超音
波振動を起動させ、空中に放射された超音波をICカー
ドリーダ/ライタ装置の超音波送受波部で受ける。超音
波方式は、他の電磁方式等と比較し電力が少なくてすむ
という利点もあるが、電波方式等と比較すると、電力の
効率が悪いという欠点を持っている。すなわち超音波振
動子15の振動を如何に効率良く空中に放射させ得るか
にある。尚、超音波振動子15の不要な振動は、集積回
路を含む電子回路部と該超音波振動子15の間に溝を構
成し、その溝中に緩衝材17を充填して電子回路に伝わ
るのを防いでいた。この溝だけで不要な振動を吸収する
のは不充分であり、この溝を複数設けたり、大きくする
対策も試みられたがカードの強度を弱くする等の問題を
生じさせた。
FIG. 3 shows a conventional ultrasonic coupling type non-contact IC.
3 is a cross-sectional view of an IC card showing the configuration of a part of the card 12. FIG. A disk-shaped ultrasonic transducer 15 for transmitting and receiving information is configured on a card substrate 14 in which an integrated circuit (IC) 13 is embedded and an electronic circuit is configured. Electrodes 16 and 161 are vapor-deposited, sputtered or printed on both surfaces of the ultrasonic vibrator 15, and a signal voltage is applied to the electrodes 16 and 161 from an electronic circuit including an integrated circuit (IC) to vibrate ultrasonic waves. The ultrasonic wave radiated in the air is received by the ultrasonic wave transmitting / receiving unit of the IC card reader / writer device. The ultrasonic method has an advantage that it requires less electric power than other electromagnetic methods, but has a drawback that the electric power efficiency is poor as compared with the radio wave method. That is, how efficiently the vibration of the ultrasonic transducer 15 can be radiated into the air. The unnecessary vibration of the ultrasonic transducer 15 is transmitted to the electronic circuit by forming a groove between the electronic circuit portion including the integrated circuit and the ultrasonic transducer 15 and filling the groove with the cushioning material 17. Was being prevented. It is not enough to absorb unnecessary vibrations only with this groove, and attempts have been made to provide a plurality of grooves or make them larger, but this has caused problems such as weakening the strength of the card.

【0004】[0004]

【発明が解決しようとする課題】従来のICカードにお
いて、接触型は金属接点端子を介するため、摩耗や汚れ
に伴う接触不良や、金属接点端子が露出しているために
起こる静電気による集積回路(IC)の破壊等が発生し
易く、信頼性が低い。また、非接触式はICカードとI
Cカードリーダ/ライタ装置との間に空間が存在するた
めに、例えば電磁結合方式では大形になる欠点と電力を
要する欠点をもち、更に金属片等の遮断物によって誤っ
た情報の授受を行う危険性があるとともに、場合によっ
ては通信が不可能になるという欠点を有している。
In the conventional IC card, since the contact type is via the metal contact terminal, contact failure due to wear and dirt and an integrated circuit due to static electricity caused by the exposed metal contact terminal ( IC) is liable to be destroyed, resulting in low reliability. In addition, the non-contact type is an IC card and I
Since there is a space between the C-card reader / writer device and the C-card reader / writer device, for example, the electromagnetic coupling system has a drawback that it becomes large in size and a defect that requires electric power. Further, erroneous information is exchanged by a shield such as a metal piece. In addition to being dangerous, it has the drawback of not being able to communicate in some cases.

【0005】超音波結合方式は電磁結合方式と比較する
と電力は少なくてすむが、他の非接触方式と比較すると
その効率は悪い。超音波振動子の振動を如何に効率よく
空中に放射するかが大きな課題である。又、従来の超音
波方式の構造ではカード自体に超音波振動子の振動が伝
わるため電気的雑音の原因となったり、内蔵集積回路
(IC)の損傷あるいは、それに接続する配線が断線す
る等の問題があった。
The ultrasonic coupling method requires less electric power as compared with the electromagnetic coupling method, but its efficiency is lower than that of other non-contact methods. A major issue is how to efficiently radiate the vibration of the ultrasonic transducer into the air. Further, in the conventional ultrasonic structure, vibration of the ultrasonic vibrator is transmitted to the card itself, which may cause electrical noise, damage to the built-in integrated circuit (IC), or disconnection of the wiring connected to it. There was a problem.

【0006】[0006]

【課題を解決するための手段】本発明は、超音波振動子
の振動エネルギーを空中に効率よく放射させるために超
音波振動子に金属薄板からなる共鳴増幅用媒質体を前記
超音波振動子に密着させる構造とした。更に超音波振動
子からの振動がカードに内蔵した集積回路または、それ
に接続する配線に伝わる事を防止するためシリコン樹脂
を基材とした振動吸収材を超音波振動子の周辺に配し
た。
According to the present invention, in order to efficiently radiate the vibrational energy of an ultrasonic oscillator into the air, the ultrasonic oscillator is provided with a medium for resonance amplification made of a thin metal plate. Adopted a structure for close contact. Further, in order to prevent the vibration from the ultrasonic vibrator from being transmitted to the integrated circuit built in the card or the wiring connected to the card, a vibration absorbing material based on silicon resin is arranged around the ultrasonic vibrator.

【0007】[0007]

【作用】金属薄板からなる共鳴増幅用媒質体は超音波振
動子の振動のQを高くし、すなわち振動エネルギーを効
率よく空中に放射する。上述の手段により、集積回路及
び電子回路の周辺の超音波による振動を振動吸収材で遮
断し、内蔵した集積回路(IC)または、それに接続す
る配線に振動が伝わる事を防止し、授受する情報の品質
を向上し、一方、ICカードの信頼性を向上する。
The medium for resonance amplification made of a thin metal plate increases the Q of vibration of the ultrasonic oscillator, that is, radiates vibration energy efficiently into the air. By the above-mentioned means, the vibration due to ultrasonic waves around the integrated circuit and the electronic circuit is blocked by the vibration absorbing material to prevent the vibration from being transmitted to the built-in integrated circuit (IC) or the wiring connected to the integrated circuit (IC). Quality of the IC card, while improving the reliability of the IC card.

【0008】[0008]

【実施例】本発明の一実施例について図面を参照して説
明する。図1は、本発明の一実施例の超音波方式ICカ
ードの断面図を示し、ICカード本体9に内蔵した超音
波振動子1の上に共鳴増幅用媒質体3を設け、さらにそ
の上に薄い保護シート7を設け保護している。図2は同
じく本発明の一実施例を示し、超音波振動子1とその電
極11、共鳴増幅用媒質体3の積層した部分だけを拡大
した断面図である。超音波振動子1は、ディスク状の電
気機械結合係数の高いジルコチタン酸鉛系の材料から構
成され、振動駆動するための電圧は、電極11と共鳴増
幅用媒質体3に印加される。超音波振動子1には無数に
存在する振動モードのうち、ある特定の一つの振動モー
ドになるように、超音波振動子及び共鳴増幅用媒質体3
の寸法材質を選択する。特に直径と厚さの比並びに材質
が重要要素となる。これらの諸定数を求めるには、イン
ピーダンス/ネットワークアナライザーを使用し直視し
ながら最適定数を求める。理論的振動モードを求める式
にて求める方法が先ず必要であるが、超音波振動子がプ
ラスチックカード基材5、6に埋め込んであるため、振
動モードが単純に決まらずそのため誤差が多く、前記の
測定器による直視により諸定数を求めるのが実際的であ
る。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of an ultrasonic IC card according to an embodiment of the present invention, in which a resonance amplification medium 3 is provided on an ultrasonic oscillator 1 built in an IC card body 9, and further on top of that. A thin protective sheet 7 is provided for protection. FIG. 2 also shows an embodiment of the present invention, and is an enlarged cross-sectional view of only the portion where the ultrasonic transducer 1, the electrode 11 thereof, and the resonance amplification medium body 3 are laminated. The ultrasonic vibrator 1 is made of a disk-shaped lead zirco titanate-based material having a high electromechanical coupling coefficient, and a voltage for driving vibration is applied to the electrode 11 and the resonance amplification medium body 3. The ultrasonic oscillator and the resonance amplifying medium body 3 are set so that one of the vibration modes existing in the ultrasonic oscillator 1 is infinite.
Select the dimension material of. In particular, the ratio of diameter to thickness and the material are important factors. To find these constants, use an impedance / network analyzer and look directly at the optimum constants. First, a method of obtaining the theoretical vibration mode is required, but since the ultrasonic vibrator is embedded in the plastic card substrates 5 and 6, the vibration mode cannot be determined simply, and therefore there are many errors. It is practical to obtain various constants by looking directly at the measuring instrument.

【0009】共鳴増幅用媒質体3の材質は、ステンレス
の薄板であり、外径/厚さの寸法並びにその材質の硬度
は前記したようにある固有振動モードでQが高くなるよ
うに選ぶ。ディスク状ステンレスにジルコチタン酸鉛系
材料を印刷、あるいは薄いディスク板状ジルコチタン酸
鉛系材料を、表面を粗に荒したステンレス表面に熱圧着
して形成する。更に共鳴増幅用媒質体3を付設した面と
異なる他の面には印刷等で銀系の電極パターンを印刷す
る。この構成でジルコチタン酸鉛系材料を分極し、超音
波振動子の機能を持たせる。このようにして構成した超
音波振動子1をプラスチックカード基材5、6にシリコ
ン系樹脂を利用して埋め込む。振動吸収材4のシリコン
系樹脂は超音波振動子1から発生する不要な振動を吸収
するのと同時に超音波振動子を固定する役目も持ってい
る。
The material of the resonance amplifying medium 3 is a thin stainless plate, and the dimensions of the outer diameter / thickness and the hardness of the material are selected so that the Q is high in a certain natural vibration mode as described above. The lead-shaped zirco titanate-based material is printed on the disc-shaped stainless steel, or the thin disc-plate-shaped lead zirco-titanate-based material is thermocompression-bonded to the roughened stainless surface. Further, a silver-based electrode pattern is printed by printing or the like on another surface different from the surface provided with the resonance amplification medium body 3. With this structure, the lead zirco titanate-based material is polarized to have the function of an ultrasonic vibrator. The ultrasonic transducer 1 configured in this manner is embedded in the plastic card substrates 5 and 6 by using a silicone resin. The silicon-based resin of the vibration absorbing material 4 has a role of absorbing unnecessary vibration generated from the ultrasonic vibrator 1 and fixing the ultrasonic vibrator at the same time.

【0010】図1に示すようにICカードリーダ/ライ
タ装置の超音波送受波部8を共鳴増幅用媒質体3の上部
の保護シート7に軽く接触し情報の授受を行う。
As shown in FIG. 1, the ultrasonic wave transmitting / receiving unit 8 of the IC card reader / writer device is lightly contacted with the protective sheet 7 on the resonance amplifying medium 3 to exchange information.

【0011】[0011]

【発明の効果】本発明は、以上説明したように構成され
ているので、ICカードの汚れ、摩耗、更に、金属片等
の遮断物に関係なく情報の授受が可能であり、超音波振
動を効率よく、空中に放射することができる。又、超音
波振動子における不要な振動から、内蔵した集積回路
(IC)の損傷または、それに接続する配線の断線を防
止できる。
EFFECTS OF THE INVENTION Since the present invention is constructed as described above, it is possible to send and receive information regardless of dirt and wear of the IC card, and even if there is a blocking object such as a metal piece, and ultrasonic vibration is applied. It can be efficiently radiated into the air. Further, it is possible to prevent damage to the built-in integrated circuit (IC) or disconnection of the wiring connected to the integrated circuit (IC) from unnecessary vibration in the ultrasonic vibrator.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明になる超音波方式ICカードの一実施例
を示す断面図である。
FIG. 1 is a sectional view showing an embodiment of an ultrasonic IC card according to the present invention.

【図2】本発明になる超音波方式ICカードの超音波振
動子部分の断面図である。
FIG. 2 is a sectional view of an ultrasonic transducer portion of the ultrasonic IC card according to the present invention.

【図3】従来の超音波方式ICカードの部分断面図であ
る。
FIG. 3 is a partial cross-sectional view of a conventional ultrasonic IC card.

【符号の説明】[Explanation of symbols]

1 超音波振動子 2 集積回路(IC) 3 共鳴増幅用媒質体 4 振動吸収材 5 プラスチックカード基材(上蓋) 6 プラスチックカード基材(下蓋) 7 保護シート 8 ICカードリーダ/ライタ装置の超音波送受波部 9 ICカード本体 11 電極 12 非接触ICカード 13 集積回路(IC)を含む電子回路部 14 カード基板 15 従来の超音波振動子 16、161 従来の方法による電極 17 緩衝材 1 Ultrasonic Transducer 2 Integrated Circuit (IC) 3 Resonance Amplification Medium 4 Vibration Absorber 5 Plastic Card Base (Upper Lid) 6 Plastic Card Base (Lower Lid) 7 Protective Sheet 8 IC Card Reader / Writer Sound wave transmitting / receiving unit 9 IC card body 11 Electrode 12 Non-contact IC card 13 Electronic circuit unit including integrated circuit (IC) 14 Card substrate 15 Conventional ultrasonic transducer 16, 161 Conventional electrode 17 Buffer material

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ICカードリーダ/ライタ装置の超音波
送受波部を接触させ、情報の授受を行う超音波振動子を
具備した超音波方式ICカードにおいて、超音波振動子
に金属薄板からなる共鳴増幅用媒質体を前記超音波振動
子に密接させる構造としたことを特徴とする超音波方式
ICカード。
1. An ultrasonic type IC card equipped with an ultrasonic transducer for transmitting and receiving information by contacting an ultrasonic wave transmitting / receiving unit of an IC card reader / writer device, wherein the ultrasonic transducer is a resonance formed of a thin metal plate. An ultrasonic IC card, characterized in that the amplifying medium body is brought into close contact with the ultrasonic transducer.
【請求項2】 超音波振動子からの振動がICカードに
内蔵した集積回路または、それに接続する配線に伝わる
事を防止するため、シリコン樹脂を基材とした振動吸収
材を超音波振動子の周辺に配した事を特徴とする請求項
1記載の超音波方式ICカード。
2. In order to prevent the vibration from the ultrasonic vibrator from being transmitted to the integrated circuit built in the IC card or the wiring connected thereto, a vibration absorber made of silicon resin is used as the ultrasonic vibrator. The ultrasonic IC card according to claim 1, wherein the ultrasonic IC card is arranged in the periphery.
JP29443593A 1993-10-29 1993-10-29 Ultrasonic type IC card Expired - Lifetime JP3315496B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29443593A JP3315496B2 (en) 1993-10-29 1993-10-29 Ultrasonic type IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29443593A JP3315496B2 (en) 1993-10-29 1993-10-29 Ultrasonic type IC card

Publications (2)

Publication Number Publication Date
JPH07129734A true JPH07129734A (en) 1995-05-19
JP3315496B2 JP3315496B2 (en) 2002-08-19

Family

ID=17807737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29443593A Expired - Lifetime JP3315496B2 (en) 1993-10-29 1993-10-29 Ultrasonic type IC card

Country Status (1)

Country Link
JP (1) JP3315496B2 (en)

Also Published As

Publication number Publication date
JP3315496B2 (en) 2002-08-19

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