JPH07119027B2 - Transfer molding method - Google Patents
Transfer molding methodInfo
- Publication number
- JPH07119027B2 JPH07119027B2 JP32660491A JP32660491A JPH07119027B2 JP H07119027 B2 JPH07119027 B2 JP H07119027B2 JP 32660491 A JP32660491 A JP 32660491A JP 32660491 A JP32660491 A JP 32660491A JP H07119027 B2 JPH07119027 B2 JP H07119027B2
- Authority
- JP
- Japan
- Prior art keywords
- transfer film
- transfer
- sprue bush
- molten resin
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14967—Injecting through an opening of the insert
- B29C2045/14975—Injecting through an opening of the insert the injection nozzle penetrating through the insert
Description
【０００１】[0001]
【産業上の利用分野】この発明は転写フィルムと成形品
とを一体に成形する転写成形方法の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a transfer molding method for integrally molding a transfer film and a molded product.
【０００２】[0002]
【従来の技術】例えば、キャリアフィルムに装飾印刷ま
たは回路パターンなどの転写部を形成した転写フィルム
を用いて成形品の射出成形と同時かつ一体に転写部を形
成する、いわゆる転写成形を行う場合には、該転写フィ
ルムは、通常、可動型の型面に配されるが、成形品のゲ
ート位置や突出し等の関係で固定型の型面に配すること
もある。2. Description of the Related Art For example, in the case of so-called transfer molding, in which a transfer portion having a transfer portion such as a decorative print or a circuit pattern formed on a carrier film is used to form the transfer portion simultaneously and integrally with injection molding of a molded product. The transfer film is usually arranged on the mold surface of the movable mold, but it may be arranged on the mold surface of the fixed mold depending on the gate position of the molded product and the protrusion.
【０００３】この転写フィルムを固定型側に配して行う
転写成形の例を図２および図３に示す。図中の符号３１
は固定型、３２は可動型、３３はキャビティ、３４はス
プルブッシュである。この例において、固定型３１の型
面３６に、印刷部または回路パターンなどの形成された
転写フィルム３５が配され可動型３２とともに型締めさ
れる。そして、スプルブッシュ３４を介して前記キャビ
ティ３３内に溶融樹脂４０が注入され、前記転写フィル
ム３５と一体に成形される。2 and 3 show examples of transfer molding performed by placing this transfer film on the fixed mold side. Reference numeral 31 in the figure
Is a fixed type, 32 is a movable type, 33 is a cavity, and 34 is a sprue bush. In this example, a transfer film 35 having a printed portion or a circuit pattern formed thereon is disposed on the mold surface 36 of the fixed mold 31, and the mold is clamped together with the movable mold 32. Then, the molten resin 40 is injected into the cavity 33 through the sprue bush 34 and is molded integrally with the transfer film 35.
【０００４】その際、前記転写フィルム３５には前記ス
プルブッシュ３４からの溶融樹脂４０の注入を妨げない
ように、図のように、ゲート孔３７と対応する位置に透
孔３８が形成されている。At this time, through holes 38 are formed in the transfer film 35 at positions corresponding to the gate holes 37 so as not to hinder the injection of the molten resin 40 from the sprue bush 34, as shown in the figure. .
【０００５】しかしながら、この従来構造では、溶融樹
脂４０をキャビティ内に充填する際に、その充填樹脂圧
によってキャリアフィルム３５の端部３５ａがめくれ上
がり、前記溶融樹脂４０がキャリアフィルム３５のめく
れ上がった端部３５ａより型面３６側に回り込むことが
あった。この樹脂の回り込みは転写フィルムの剥離を困
難にならしめるだけでなく、製品の表面状態および精度
の面でも問題であった。However, in this conventional structure, when the molten resin 40 is filled in the cavity, the end 35a of the carrier film 35 is turned up by the pressure of the filling resin, and the molten resin 40 is turned up of the carrier film 35. There is a case where it wraps around the mold surface 36 side from the end portion 35a. This wraparound of the resin not only makes it difficult to peel off the transfer film, but also poses a problem in terms of surface condition and accuracy of the product.
【０００６】[0006]
【発明が解決しようとする課題】この発明は、上記した
問題点に鑑み提案されたものであって、転写フィルムの
型面側に溶融樹脂の回り込みを生じることなく確実な成
形を行うことができる転写成形方法を提供しようとする
ものである。SUMMARY OF THE INVENTION The present invention has been proposed in view of the above-mentioned problems, and enables reliable molding without causing the molten resin to wrap around the mold surface side of the transfer film. An object of the present invention is to provide a transfer molding method.
【０００７】[0007]
【課題を解決するための手段】すなわち、この発明は、
転写フィルムを固定型面に配して型締めした後スプルブ
ッシュを介してキャビティ内に溶融樹脂を注入して前記
転写フィルムと一体に成形品を成形するに際して、前記
転写フィルムのスプルブッシュ先端部に対応する位置に
透孔を形成するとともに、前記スプルブッシュ先端部を
前記転写フィルムの透孔を経て前記キャビティ内部に突
出させて溶融樹脂を注入し成形することを特徴とする転
写成形方法に係る。That is, the present invention is
When the transfer film is placed on the fixed mold surface and the mold is clamped, molten resin is injected into the cavity through the sprue bush to form a molded product integrally with the transfer film, at the end of the sprue bush of the transfer film. A transfer molding method is characterized in that a through hole is formed at a corresponding position, and the sprue bush tip portion is projected into the cavity through the through hole of the transfer film to inject a molten resin for molding.
【０００８】[0008]
【実施例】以下添付の図面に従ってこの発明を詳細に説
明する。図１はこの発明の一実施例を示す要部拡大断面
図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is an enlarged sectional view of an essential part showing an embodiment of the present invention.
【０００９】図１に示されるように、この発明の転写成
形方法は、公知の転写成形用金型の固定型１１の型面１
４に印刷部や回路パターンなどの転写部を有する転写フ
ィルム２０が配され、前記固定型１１と可動型１２とが
型締めされる。符号１３は成形品形状を規定するキャビ
ティである。そして、前記固定型１１に設けられたスプ
ルブッシュ１５を介して前記キャビティ１３内に溶融樹
脂３０が導入され、前記転写フィルム２０と一体に成形
される。なお、この例ではゲート処理を不要とするため
に公知の３プレート金型構造を採っている。As shown in FIG. 1, according to the transfer molding method of the present invention, a mold surface 1 of a fixed mold 11 of a known transfer molding mold is used.
A transfer film 20 having a printing portion and a transfer portion such as a circuit pattern is arranged on the surface 4, and the fixed die 11 and the movable die 12 are clamped. Reference numeral 13 is a cavity that defines the shape of the molded product. Then, the molten resin 30 is introduced into the cavity 13 through the sprue bush 15 provided in the fixed mold 11, and is molded integrally with the transfer film 20. In this example, a known three-plate mold structure is adopted to eliminate the need for gate processing.
【００１０】この時、前記スプルブッシュ１５はその先
端部１６を前記固定型１１の型面１４からキャビティ１
３内部に若干突出させて形成されている。前記先端部１
６の突出長さは後述する転写フィルム２０の厚みよりや
や長く突出させることが好ましく、この実施例では１ｍ
ｍに形成されている。At this time, the tip portion 16 of the sprue bush 15 is moved from the mold surface 14 of the fixed mold 11 to the cavity 1
3 is formed so as to slightly project inside. The tip 1
The protrusion length of 6 is preferably slightly longer than the thickness of the transfer film 20 described later, and in this embodiment, it is 1 m.
It is formed in m.
【００１１】転写フィルム２０は２５〜２００μの厚み
を有するキャリアフィルム２１の少なくとも一面に離型
剤などを介して印刷部や回路パターンなどの転写部が形
成されたものである。この転写フィルム２０には前記ス
プルブッシュ１５の先端部１６と対応する位置に透孔２
５が形成されている。The transfer film 20 comprises a carrier film 21 having a thickness of 25 to 200 .mu., And a transfer portion such as a printed portion or a circuit pattern formed on at least one surface of the carrier film 21 via a release agent or the like. The transfer film 20 has a through hole 2 at a position corresponding to the tip portion 16 of the sprue bush 15.
5 is formed.
【００１２】前記透孔２５は、前記固定型１１の型面１
４に前記転写フィルム２０を配置する際に、スプルブッ
シュ１５の先端部１６と当接し前記先端部１６と嵌合し
て転写フィルム２０の位置決め固定を行うとともに、溶
融樹脂３０の型面１４への回り込みを防ぐためのもの
で、前記スプルブッシュ先端部１６の外形状とほぼ同じ
かわずかに大きく形成されている。The through hole 25 is the mold surface 1 of the fixed mold 11.
4, when the transfer film 20 is arranged, the transfer film 20 is positioned and fixed by abutting against the tip portion 16 of the sprue bush 15 and fitting with the tip portion 16, and the molten resin 30 is fixed to the mold surface 14. It is for preventing wraparound, and is formed to have substantially the same shape as or slightly larger than the outer shape of the sprue bush tip portion 16.
【００１３】このように、前記転写フィルム２０の透孔
２５は、前記スプルブッシュ１５の先端部１６によって
塞がれているので、注入された溶融樹脂３０が型面１４
側に回り込むということはない。As described above, since the through hole 25 of the transfer film 20 is closed by the tip portion 16 of the sprue bush 15, the injected molten resin 30 is filled with the mold surface 14.
There is no turning around.
【００１４】[0014]
【発明の効果】以上図示し説明したように、この発明の
転写成形方法によれば、転写フィルムの表面側への溶融
樹脂の回り込みを完全に防ぐので、転写フィルムの剥離
が容易になるとともに、製品の精度を一層向上させるこ
とができる。As shown and described above, according to the transfer molding method of the present invention, since the molten resin is completely prevented from wrapping around to the surface side of the transfer film, the transfer film can be easily peeled off. The accuracy of the product can be further improved.
【図１】この発明の一実施例を示す要部拡大断面図であ
る。FIG. 1 is an enlarged sectional view of an essential part showing an embodiment of the present invention.
【図２】従来の転写成形の一例を示す要部拡大断面図で
ある。FIG. 2 is an enlarged sectional view of an essential part showing an example of conventional transfer molding.
【図３】同じく従来の転写成形の一例を示す要部拡大断
面図である。FIG. 3 is an enlarged sectional view of an essential part showing an example of conventional transfer molding.
１１ 固定型 １２ 可動型 １３ キャビティ １５ スプルブッシュ １６ 先端部 ２０ 転写フィルム ２５ 透孔 ３０ 溶融樹脂 11 Fixed Type 12 Movable Type 13 Cavity 15 Sprue Bushing 16 Tip 20 Transfer Film 25 Through Hole 30 Molten Resin
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｌ 31:34 (72)発明者 渡辺 昭比古 福島県福島市田沢字桜台12−３ (56)参考文献 特公 昭43−2577（ＪＰ，Ｂ１)─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Reference number within the agency FI Technical display location // B29L 31:34 (72) Inventor Akiko Watanabe 12-3 Sakuradai Tazawa, Fukushima City, Fukushima Prefecture (56) ) References Japanese Patent Publication Sho 43-2577 (JP, B1)
Claims (1)
した後スプルブッシュを介してキャビティ内に溶融樹脂
を注入して前記転写フィルムと一体に成形品を成形する
に際して、 前記転写フィルムのスプルブッシュ先端部に対応する位
置に透孔を形成するとともに、前記スプルブッシュ先端
部を前記転写フィルムの透孔を経て前記キャビティ内部
に突出させて溶融樹脂を注入し成形することを特徴とす
る転写成形方法。1. When a transfer film is placed on a fixed mold surface and clamped, a molten resin is injected into a cavity through a sprue bush to form a molded product integrally with the transfer film, A transfer characterized by forming a through hole at a position corresponding to the sprue bush tip and projecting the sprue bush tip into the cavity through the through hole of the transfer film and injecting a molten resin for molding. Molding method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32660491A JPH07119027B2 (en) | 1991-11-13 | 1991-11-13 | Transfer molding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32660491A JPH07119027B2 (en) | 1991-11-13 | 1991-11-13 | Transfer molding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05131496A JPH05131496A (en) | 1993-05-28 |
| JPH07119027B2 true JPH07119027B2 (en) | 1995-12-20 |
Family
ID=18189673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32660491A Expired - Lifetime JPH07119027B2 (en) | 1991-11-13 | 1991-11-13 | Transfer molding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07119027B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985198A (en) * | 1997-07-30 | 1999-11-16 | Ford Motor Company | Method for molding a film-covered article |
| US6221304B1 (en) | 1997-07-30 | 2001-04-24 | Visteon Global Technologies, Inc. | Method of manufacturing a film coated article |
| JP4578707B2 (en) * | 2001-03-23 | 2010-11-10 | 吉田プラ工業株式会社 | Synthetic resin lid |
| JP5244426B2 (en) * | 2008-03-12 | 2013-07-24 | カルソニックカンセイ株式会社 | Skin material insert molding apparatus and molding method |
-
1991
- 1991-11-13 JP JP32660491A patent/JPH07119027B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05131496A (en) | 1993-05-28 |
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