JPH07118603B2 - Microwave integrated circuit - Google Patents

Description

TECHNICAL FIELD The present invention relates to a microwave integrated circuit and a wiring structure thereof.

[Conventional technology]

FIG. 4 is a circuit diagram showing a T-branch of a microwave integrated circuit using a coplanar line shown in, for example, IEICE Technical Report MW86-70, in which 1 is a dielectric substrate,
4a, 4b and 4c are signal lines, 5a, 5b and 5c are grounds, and 8a, 8b and 8c are air bridges.

When a coplanar line is used as the basic waveguide of a microwave integrated circuit, the parallel branch circuit has conventionally
Since it is divided into three parts, a, 5b, 5c, the ground is R
In order to keep the F potential at the same potential, these three divided grounds 5a, 5b, 5c were connected by three air bridges 8a, 8b, 8c to obtain a characteristic as a parallel branch circuit.

[Problems to be solved by the invention]

In a microwave integrated circuit using a conventional coplanar line,
Since the T-branch is configured as described above, in the monolithic IC as in the conventional example, an insulating layer is formed and patterned, and then a conductor layer is formed and patterned to form an air bridge. However, the process was complicated and the process was complicated. In the microwave integrated circuit, a method of connecting the ground with a conductor such as a gold ribbon can be considered, but this is an assembly work of a fine portion, and naturally, work must be done so as not to contact the signal line. However, productivity was poor, and there was a problem in uniforming the characteristics.

The present invention has been made to solve the above-mentioned problems, and it is possible to connect the ground at the branching portion without performing a troublesome work such as an air bridge or a gold ribbon which requires a complicated process. The purpose is to obtain a microwave integrated circuit.

[Means for solving problems]

In a microwave integrated circuit in which a coplanar line is formed on a dielectric substrate, a first dielectric substrate and one set of side surfaces of the first dielectric substrate, and both ends thereof are the first side. The first and second wirings formed so as to be at the same height as the upper surface of the dielectric substrate, and the first and second wirings are provided on the first dielectric substrate so as to connect the first and second wirings to each other. Through holes and the above-mentioned 2 of the first dielectric substrate.
Second and third dielectric substrates adhered to one and the other of the two side surfaces so as to form a single substrate having a flat upper surface with these and the first dielectric substrate; Third
Signal line formed on the upper surface of the single substrate made of the dielectric substrate, and the T branch on the upper surface of the single substrate made of the first to third dielectric substrates. A ground formed by being divided into three conductor patterns sandwiching a branched signal wiring, wherein the three conductor patterns of the ground are connected to at least one end of the first and second wirings. The first and second wirings are interconnected with the through hole.

[Action]

In the present invention, because of the above configuration, the signal line and the ground of the coplanar line can be easily and stably intersected with each other without using an air bridge, a gold ribbon, or the like that requires a complicated forming process and forming work. Can be arranged as follows.

〔Example〕

 Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a microwave integrated circuit according to a first embodiment of the present invention. (A) is an external perspective view, (b) is an AA 'sectional view, (c) is a BB' sectional view. is there. In the figure, 1,
3 is a dielectric substrate for a planar circuit (both side substrates) in which circuits are provided on a plane, 2 is a dielectric substrate for a vertical circuit (center substrate) in which circuits are provided on a vertical surface, and 4a, 4b, 4c are signals. Line, 5a, 5
b, 5c are grounds, 6a, 6b are vertical circuit dielectric substrates 2
, The ground connection wiring patterned before bonding with the planar circuit boards 1 and 3, 7 is the ground connection wiring 6
It is a through hole that connects a and 6b.

When a parallel branch circuit is configured by the signal lines 4a, 4b, 4c, the ground is divided into 5a, 5b, 5c in three parts, so that it is necessary to connect each of them in the branch part. In this embodiment, the ground connection wirings 6a, 6 are provided on the vertical surface of the vertical circuit dielectric substrate 2.
b and through holes 7 for connecting the wirings 6a and 6b are formed in the substrate 2, and then the substrate 2 is used as a dielectric substrate for a planar circuit.
It is sandwiched between 1 and 3 and bonded, and film formation and patterning are performed on the planes of the substrates 1 and 3, and the grounds 5a and 5 are divided into three.
b, 5c are connected.

In the microwave integrated circuit having such a configuration, the ground connection wirings 6a and 6b are previously formed on the vertical circuit substrate 2 by the normal patterning and through hole forming processes.
By forming the through-hole 7 and the through-hole 7, no special process for connecting the divided grounds is required after the planar circuit is formed. Obtainable.

FIG. 2 shows a microwave integrated circuit according to a second embodiment of the present invention, which is an example of a directional coupler using a coplanar line. (A) is an external perspective view, and (b) is an AA 'sectional view.

In the second embodiment, the line for connecting the ground divided by the signal line in the parallel branch circuit by the coplanar line is embedded by using the vertical circuit substrate 2 in the first embodiment. In contrast to the above, the coupling line which is a part of the signal line 4 is connected to the lines 10a, 10
and the ground 5 between the four input / output terminals of each signal is connected in a planar circuit by sandwiching the substrate 2 between the planar circuit dielectric substrates 1 and 3. is there. In the second embodiment, the thickness T of the vertical circuit dielectric substrate 2, the dimension S from the plane to the coupling lines 10a and 10b, and the line width C of the coupling lines 10a and 10b are set to predetermined values. By doing so, a desired binding amount can be obtained. At this time, when a signal is applied from the terminal, the combined signal is obtained at the terminal, and the combined signal (through) is obtained at the terminal. The terminal is an isolation terminal.

In the directional coupler having such a configuration, since the coupling lines 10a and 10b of the signal line 4 are embedded by using the vertical circuit dielectric substrate 2, it is possible to connect the ground 5 with a planar circuit. A complicated labor for connection can be saved, and an inexpensive directional coupler can be obtained.

3A and 3B show a microwave integrated circuit according to a third embodiment of the present invention, wherein FIG. 3A is an external perspective view and FIG. 3B is a sectional view taken along the line CC '. This is a hybrid circuit that is a 3 dB directional coupler and is composed of coplanar lines. Generally, in a hybrid circuit, it is often desired to arrange the combined signal output terminal and the combined signal output (through) terminal on the same side surface, and the third embodiment is intended to meet such a requirement. . In the third embodiment, the coupled lines 11a and 11b are divided into two at the central portion thereof, and the ones located on the diagonal line of the coupled lines 11a and 11b are the dielectric plate 2
Conductor pattern 12a formed from the side surface to the upper surface of the same, or a conductor pattern 12b formed from the side surface to the lower surface
It is connected through. Where the conductor pattern 12
A and 12b are formed at the same time in the process of forming the ground 5 or the signal line 4 after assembling the dielectric substrates 1 to 3. Further, with this configuration, there is an advantage that the step of forming the through hole can be omitted as compared with the case of forming the through hole in the dielectric substrate 2 in order to obtain the same configuration as the above configuration.

Also in the 3 dB directional coupler having such a configuration, since the coupling lines 11a and 11b of the signal line 4 are embedded by using the dielectric substrate 2 for the vertical circuit, it is simple as in the second embodiment. It is possible to obtain an inexpensive 3 dB directional coupler by various processes and operations.

〔The invention's effect〕

According to the present invention, in a microwave integrated circuit in which a coplanar line is formed on a dielectric substrate, a first dielectric substrate and one side surface and another surface side of the pair of first dielectric substrates are provided. First and second wirings formed so that both ends are at the same height as the upper surface of the first dielectric substrate,
A through hole provided on the first dielectric substrate to connect the first and second wirings to each other;
Second and third dielectrics adhered to one and the other of the two side surfaces of the dielectric substrate so that they and the first dielectric substrate form a single substrate whose upper surface is a flat surface. A substrate, a T-branch-shaped signal line formed on the upper surface of the single substrate composed of the first to third dielectric substrates, and a structure composed of the first to third dielectric substrates. A ground formed by dividing the signal wiring of the T-branch on the upper surface of a single substrate into three conductor patterns, wherein the three conductor patterns of the ground are the first and second wirings. Since it is assumed that the air bridge is connected to at least one of the ends and is interconnected by the first and second wirings and the through hole, an air bridge that requires a complicated forming step and forming operation. Without using gold ribbon Easily and stably can be arranged to intersect the signal lines and ground coplanar line together, the result, excellent in mass production, there is an effect that it is possible to obtain an inexpensive and stable microwave integrated circuit.

[Brief description of drawings]

1 (a) is an external perspective view showing a microwave integrated circuit according to a first embodiment of the present invention, FIG. 1 (b) is a sectional view taken along the line AA ', and FIG. 1 (c) is a sectional view taken along the line BB'. FIG. 2 (a) is an external perspective view showing a microwave integrated circuit according to a second embodiment of the present invention, FIG. 2 (b) is a sectional view taken along line AA ', and FIG. 3 (a) is the present invention. Is a perspective view showing an external appearance of a microwave integrated circuit according to a third embodiment of the present invention, FIG. 4B is a sectional perspective view taken along the line CC ', and FIG. 4 is a plan view showing a conventional microwave integrated circuit. In the figure, 1 and 3 are dielectric substrates for planar circuits, 2 are dielectric substrates for vertical circuits, 4,4a, 4b and 4c are signal lines, 5, 5a, 5b and 5c are grounds, and 6a and 6b are ground connections Wiring, 10a, 10b, 11a, 1
1b is a coupled line and 7 is a through hole. The same reference numerals in the drawings indicate the same or corresponding parts.

Claims (2)

[Claims] 1. A microwave integrated circuit having a coplanar line formed on a dielectric substrate, comprising: a first dielectric substrate; and a pair of side surfaces of the first dielectric substrate on one side and the other side thereof. The first and second wirings formed so that the parts are at the same height as the upper surface of the first dielectric substrate; and the first wiring and the second wiring on the first dielectric substrate. Through holes provided so as to connect the wirings to each other, and one and the other of the two side surfaces of the first dielectric substrate, and the upper surface of these and the first dielectric substrate becomes a flat surface. Second and third glued to form a single substrate
Of the dielectric substrate, the T-branch-shaped signal line formed on the upper surface of the single substrate composed of the first to third dielectric substrates, and the first to third dielectric substrates. A ground formed by being divided into three conductor patterns with the T-branch-shaped signal wiring interposed therebetween on the upper surface of the single substrate, and the three conductor patterns of the ground are
And connected to at least one of the ends of the second wiring,
A microwave integrated circuit characterized by being interconnected by the first and second wirings and the through hole. 2. A coplanar line is formed on a dielectric substrate.
In a microwave integrated circuit which is a 3 dB directional coupler, a first dielectric substrate and one side and the other of a pair of side faces of the first dielectric substrate, both ends of which are the first dielectric substrate. The first and second wirings formed so as to be at the same height as the upper surface of the first dielectric substrate, and the first and second wirings on the side surface of the first dielectric substrate on which the first wirings are formed. A second dielectric substrate adhered to form a single substrate whose upper surface is a flat surface with the body substrate, and these on the side surface of the first dielectric substrate on which the second wiring is formed. A third dielectric substrate bonded to the first dielectric substrate so as to form a single substrate having a flat upper surface; and a first wiring provided on the second dielectric substrate. And two terminals respectively connected to both ends of the And two terminals respectively connected to respective ends of the wiring, wherein the first and second wirings are each divided into two at the central portion thereof and are located on a diagonal line of both wirings. Are connected via a third wiring formed from the side surface to the upper surface of the first dielectric substrate, or a fourth wiring formed from the side surface to the lower surface, to the second dielectric substrate. One of the two terminals provided is electrically connected to the other of the two terminals provided on the third dielectric substrate on the diagonal line thereof, and the other is on the diagonal line thereof. The ground is electrically connected to one of the two terminals provided on the third dielectric substrate, and the ground is on the upper surface of the single substrate, the first to fourth wirings, and the fourth wiring. Formed in an area different from the area where the two terminals are formed. Microwave integrated circuit, characterized in that is.